SMF LITTELFUSE | Alldatasheet

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Technical content

Features

Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation at TA=25ºC by 10/1000µs (Note 1) PPPM 200 W Thermal Resistance Junction- to- Ambient R θJA 220 °C/W Thermal Resistance Junction- to- Lead R θJL 100 °C/W Operating Temperature Range TJ -65 to 150 °C Storage Temperature Range TSTG -65 to 175 °C Notes: 1 . Non-repetitive current pulse, per Fig. 4 and derated above TJ (initial) =25ºC per Fig. 3. The SMF series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. SMF package is 50% smaller in footprint when compare to SMA package and deliverying one of the low height profiles (1 .1mm) in the industry.

Applications

SMF devices are ideal for the protection of I/O interfaces, VCC bus and other vulnerable circuit used in cellular phones, portable devices, business machines, power supplies and other consumer applications.

  • 200W peak pulsepower capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01%
  • Compatible with industrial standard package SOD-123FL
  • Low profile: maximum height of 1 .1mm.
  • Low inductance, excellent clamping capability
  • For surface mounted applications to optimize board space
  • High temperature to reflow soldering guaranteed: 260°C/40sec
  • Typical failure mode is short from over-specified voltage or current
  • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
  • IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
  • ESD protection of data lines in accordance with IEC 61000-4-2
  • EFT protection of data lines in accordance with IEC 61000-4-4
  • Fast response time: typically less than 1 .0ns from 0 Volts to V BR min
  • Glass passivated junction
  • Built-in strain relief
  • Plastic package is flammability rated V-0 per Underwriters Laboratories
  • Meet MSL level1, per J-STD-020, LF maximun peak of 260
  • Matte tin lead–free plated
  • Halogen-free and RoHS compliant
  • Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/ JEDEC J-STD- 609A.01) AGENCY AGENCY FILE NUMBER E230531 Agency Approvals SMF Series Functional Diagram Bi-directional Uni-directional Cathode Anode Uni-directional RoHS Pb e3 Datasheet Additional Infomarion Resources Samples

T ransient Voltage Suppression Diodes © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/06/17 Surface Mount – 200W > SMF Series Electrical Characteristics (TA=25°C unless otherwise noted) Part Number Marking Code Breakdown Voltage VBR (Volts) @ IT Test Current IT (mA) Reverse Stand off Voltage VR (V) Maximum Reverse Leakage @ VR IR (µA) Maximum Peak Pulse Current Ipp (A) Maximum Clamping Voltage @Ipp VC (V) Agency Approval MIN MAX Notes: 1. V BR measured after IT applied for 300µs, IT = square wave pulse or equivalent. 2. Surge current waveform per 10/1000µs exponential wave and derated per Fig.2. 3. All terms and symbols are consistent with ANSI/IEEE C62.35.

T ransient Voltage Suppression Diodes © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/06/17 Surface Mount – 200W > SMF Series Physical Specifications Case SOD-123FL plastic over glass passivated junction Polarity Color band denotes cathode except bipolar T erminal Matte tin-plated leads, solderable per JESD22-B102 Environmental Specifications High T emp. Storage JESD22-A103 HTRB JESD22-A108 T emperature Cycling JESD22-A104 MSL JEDEC-J-STD-020, Level 1 H3TRB JESD22-A101 RSH JESD22-A111 Soldering Parameters Temperature (T Time (t) Ts(min) Ts(max) TL TP ts Preheat tL tp Ramp-up Critical Zone TL to TP Ramp-down t 25˚C to Peak 25˚C Reflow Condition Lead–free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus Temp (TA) to peak 3°C/second max TS(max) to TA - Ramp-up Rate 3°C/second max Reflow - Temperature (TA) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Dimensions - SOD-123FL Package Dimensions Millimeters Inches Min Max Min Max A 2.50 2.90 0.0984 0.1142 B 3.40 3.90 0.1339 0.1535 C 0.70 1 .20 0.0275 0.0472 D 1 .50 2.00 0.0591 0.0787 E 0.35 0.90 0.0138 0.0354 F 0.05 0.26 0.0020 0.0102 G 0.00 0.10 0.000 0.0039 H 0.95 1. 10 0.037 4 0.0433 A B C D EE F H G 1.4 (0.055) Mounting Pad Layout

T ransient Voltage Suppression Diodes © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/06/17 Surface Mount – 200W > SMF Series Part Numbering System VR VOLTAGE 5% VBR VOLTAGE TOLERANCE SMF xx A SERIES Part Marking System Packaging Options Part number Component Package Quantity Packaging Option Packaging Specification SMFXXX SOD-123FL 3000 Tape & Reel – 8mm tape/7” reel EIA RS-481 SMFXXX-T13 SOD-123FL 10000 Tape & Reel – 8mm tape/13” reel EIA RS-481 XX Marking Code e BanddohtaCLF YM Trace Code Marking Y:Year Code M: Month Code (for uni-directional products only) Cathode T ape and Reel Specification 0.31 (8.0) 0.157 (4.0) 0.157 (4.0) 0.33 (8.5) 0.80 (20.2) Arbor Hole Dia. 7.0 (178) Dimensions are in inches (and millimeters). Direction of Feed 0.059 DIA(1.5) Cover tape Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.