SMF3.3 LITTELFUSE | Alldatasheet

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Technical content

Features

Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation at T A=25ºC (Note 1) 8/20µs PPPM 1200 W 10/1000µs 200 W Thermal Resistance Junction- to- Ambient R θJA 220 °C/W Thermal Resistance Junction- to- Lead RθJL 100 °C/W Operating Temperature Range TJ -55 to 150 °C Storage Temperature Range TSTG -55 to 150 °C Notes: 1 . Non-repetitiv e current pulse, per Fig. 4 & 6 and derated above TJ (initial) =25ºC per Fig. 3. SMF3.3 is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.

Applications

SMF3.3 devices are ideal for the protection of portable devices/hard drives, notebooks, VCC busses, POS terminal, SSDs, power supplies, monitors, and vulnerable circuit used in other consumer applications. 0W peak pulse power capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01% 200W peak pulse power capability at 8/20us waveform

  • Excellent clamping capability Compatible with industrial st andard package SOD- 123FL L ow profile: maximum height of 1 .08mm. F or surface mounted applications to optimize board space T ypical failure mode is short from over-specified voltage or current Whisk er test is conducted based on JEDEC JESD201A per its table 4a and 4c IEC-61 000-4-2 ESD 30kV(Air), 30kV (Contact) ESD protection of dat a lines in accordance with IEC 61000-4-2 EFT protection of dat a lines in accordance with IEC 61000-4-4 F ast response time: typically less than 1 .0ns from 0 Volts to V BR min High temperat ure soldering: 260°C/40 seconds at terminals
  • Built-in strain relief Meet MSL le vel1, per J-STD-020C, LF maximun peak of 260°C Mat te tin lead–free plated
  • Halogen-free and RoHS compliant
  • Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/ JEDEC J-STD-609A.01) SMF3.3 Functional Diagram Bi-directional Uni-directional Cathode Anode Electrical Characteristics (TA=25°C unless otherwise noted) Part Number Marking Code Breakdown Voltage VBR (Volts) @ IT Test Current IT (mA) Reverse Stand off Voltage VR (V) Maximum Reverse Leakage @ VR IR (µA) Maximum Peak Pulse Current (10/1000μS) Ipp (A) Maximum Clamping Voltage @Ipp (10/1000μS) VC (V) Maximum Peak Pulse Current (8/20μS) Ipp (A) Maximum Clamping Voltage @Ipp (8/20μS) VC (V)MIN MAX Notes: 1. VBR measured after IT applied for 300µs, IT = sequare wave pulse or equivalent. 2. Surge current waveform per 10/1000µs exponential wave and derated per Fig.2. 3. All terms and symbols are consistent with ANSI/IEEE C62.35. 4. Surge current waveform per 8/20µs exponential wave and derated per Fig.6. AGENCY AGENCY FILE NUMBER E230531 Agency Approvals Uni-directional

Revised: 07/28/16 ©2016 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diodes Surface Mount – 200W > SMF3.3 Series Part Numbering System VR VOLTAGE SMF 3.3 SERIES Part Marking System

33 Marking Code

Y:Year Code M: Month Code Dimensions - SOD-123FL Package A B C D EE F H G 1.4 (0.055) Mounting Pad Layout Cathode T ape and Reel Specification 0.31 (8.0) 0.157 (4.0) 0.157 (4.0) 0.33 (8.5) 0.80 (20.2) Arbor Hole Dia. Optional 7” 7 .0 (178) Dimensions are in inches (and millimeters). Direction of Feed 0.059 DIA(1.5) Cover tape Packaging Options Part number Component Package Quantity Packaging Option Packaging Specification SMF3.3 SOD-123FL 3000 Tape & Reel – 8mm tape/7” reel EIA RS-481 Dimensions Millimeters Inches Min Max Min Max A 2.90 3.10 0.114 0.122 B 3.50 3.90 0.138 0.154 C 0.85 1 .05 0.033 0.041 D 1 .70 2.00 0.067 0.079 E 0.43 0.83 0.017 0.033 F 0.10 0.25 0.004 0.010 G 0.00 0.10 0.000 0.004 H 0.90 1 .08 0.035 0.043