SMF5.0A TSC | Alldatasheet

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Technical content

SMF5.0A SMF100A Tai wan Semiconductor Version: C 810 W V V Surface Mount Transient Voltage Suppressor

FEATURES

Photo Glass passivated junction Low power loss, high efficiency Ideal for automated placement Excellent clamping capability Typical I R less than 1μA above 10V 00 watts peak pulse power capability with a 10 / 1000 μs waveform V WM V , P PPM = 175W Compliant to RoHS d irective 2011/65/EU and in accordance to WEEE 2002/96/EC Halogen free according to IEC 61249

APPLICATIONS

Switching mode power supply (SMPS) Adapters Lighting application On board DC/DC converter MECHANICAL DATA Case: SOD W Molding compound meets UL 94V 0 flammability rating Moisture sensitivity level: level 1, per J STD 020 Terminal: Matte tin plated leads, solderable per J STD 002 Meet JESD 201 class whisker test Polarity: Uni directional Weight: mg (approximately) KEY PARAMETERS P ARAMETER VALUE UNIT V WM V V BR (uni directional) 117 V P PPM 200 W T J MAX 175 Package SOD 123W Configuration Single die SOD 123W ABSOLUTE M AXIMUM RATINGS T A unless otherwise noted P ARAMETER S YMBOL VALUE UNIT Non repetitive peak impulse power dissipation with 10/1000us waveform P PPM 200 W Steady state power dissipation at T L P tot W Forward Voltage @ I F A for Uni directional only (3) V F V Junction t emperature T J 55 to +1 Storage temperature T STG 55 to +1 Notes Non repetitive Current Pulse Per Fig. 3 and d erated above TA=25°C Per Fig. 2 Units mounted on PCB ( mm x mm Cu pad test board Pulse test with PW= 0.3 ms

SMF5.0A SMF100A Tai wan Semiconductor Version: C 810 THERMAL PERFORMANCE P ARAMETER S YMBOL TYP UNIT Junction to l ead t hermal r esistance per diode R Ө J L Junction to a mbient thermal r esistance per diode R Ө J A 100 Junction to c ase thermal r esistance per diode R Ө JC Thermal Performance Note Units mounted on PCB ( mm x mm Cu pad test board ELECTRICAL SPECIFICATIONS T A unless otherwise noted Part number Marking code Breakdown voltage V BR T (V) (Note 1) Test current I T (mA) Working stand off voltage V WM (V) Maximum reverse leakage current I R WM µ (Note 1) Maximum peak impulse current I PPM (A) tp =10/1000 μ s Maximum clamping voltage V C PPM (V) tp =10/1000 μ s Uni Uni Min. Max. SMF5.0A 2W5P0 6.4 800 21.7 9.2 SMF6.0A 2W6P0 6.67 7.37 800 19.4 10.3 SMF6.5A 2W6P5 7.22 7.98 6.5 500 17.9 11.2 SMF7.0A 2W7P0 7.78 8.6 7.0 200 16.7 12.0 SMF7.5A 2W7P5 8.33 9.21 7.5 100 15.5 12.9 SMF8.0A 2W8P0 8.89 9.83 8.0 14.7 13.6 SMF8.5A 2W8P5 9.44 10.5 8.5 13.9 14.4 SMF9.0A 2W9P0 10.0 11.1 9.0 13.0 15.4 SMF10A 2W010 11.1 12.3 11.8 17.0 SMF11A 2W011 12.2 13.5 11.0 18.2 SMF12A 2W012 13.3 14.7 10.1 19.9 SMF13A 2W013 14.4 15.9 9.3 21.5 SMF14A 2W014 15.6 17.2 8.6 23.2 SMF15A 2W015 16.7 18.5 8.2 24.4 SMF16A 2W016 17.8 19.7 7.7 26.0 SMF17A 2W017 18.9 20.9 7.2 27.6 SMF18A 2W018 20.0 22.1 6.8 29.2 SMF20A 2W020 22.2 24.5 6.2 32.4 SMF22A 2W022 24.4 26.9 5.6 35.5 SMF24A 2W024 26.7 29.5 5.1 38.9 SMF26A 2W026 28.9 31.9 4.8 42.1 SMF28A 2W028 31.1 34.4 4.4 45.4 SMF30A 2W030 33.3 36.8 4.1 48.4 SMF33A 2W033 36.7 40.6 3.8 53.3 SMF36A 2W036 40.0 44.2 3.4 58.1 SMF40A 2W040 44.4 49.1 3.1 64.5 SMF43A 2W043 47.8 52.8 2.9 69.4 SMF45A 2W045 50.0 55.3 2.8 72.7 SMF48A 2W048 53.3 58.9 2.6 77.4 SMF51A 2W051 56.7 62.7 2.4 82.4 SMF54A 2W054 60.0 66.3 2.3 87.1 SMF58A 2W058 64.4 71.2 2.1 SMF60A 2W060 66.7 73.7 1.8 96.8 SMF64A 2W064 71.1 78.6 1.7 103 SMF70A 2W070 77.8 1.5 113 SMF75A 2W075 83.3 92.1 1.4 121 SMF78A 2W078 86.7 95.8 1.4 126 SMF85A 2W085 94.4 104 1.3 137 SMF90A 2W090 100 111 146 SMF100A 2W100 111 123 100 1.08 162 Note Pulse test with PW= ms

SMF5.0A SMF100A Tai wan Semiconductor Version: C 810

ORDERING INFORMATION

(Note 1 , 2 PACKAGE PACKING SMFxxxAHRVG SOD 123W 3,000 / 7 Plastic reel SMFxxxAHRQG SOD 123W 10,000 / 13 Plastic reel SMFxxxA RVG SOD 123W 3,000 / 7 Plastic reel SMFxxxA RQG SOD 123W 10,000 / 13 Plastic reel Note: x " defines voltage from V SMF5.0A ) to 100 V ( SMF100A H means AEC Q101 qualified

SMF5.0A SMF100A Tai wan Semiconductor Version: C 810 CHARACTERISTICS CURVES A = 25°C unless otherwise noted) Fig.1 Pulse Power or Current vs. Initial Junction Temperature Fig.2 Steady State Power Derating Fig.3 C lamping P ower P ulse W aveform Fig.4 T ypical J unction C apacitance 100 100 125 150 175 T J INITAL TEMPERATURE 0.5 1.5 100 125 150 175 Heat sink 5mm x 5mm Cu pad test board 100 1000 10000 100 BR ), BREAKDOWN VOLTAGE (V) f=1.0MHz Vsig=50mVp p SMF6.0A SMF12A SMF22A SMF26A SMF51A 100 120 140 0.5 1.5 2.5 I PPM PEAK PULSE CURRENT (%) t, TIME (ms) td Peak value I PPM Rise time tr=10μs to 100% of I PPM Half value I PPM 10/1000μs, waveform as defined by R.E.A. Pulse width(td) is defined as the point where the peak current decays to 50% of I PPM CAPACITANCE (pF) PEAK PULSE POWER (P PPM ) OR CURRENT ( I PP DERATING IN PERCENTAGE, % LEAD TEMPERATURE ( o Ptot Total Power Dissipation (W)

SMF5.0A SMF100A Tai wan Semiconductor Version: C 810 PACKAGE OUTLINE DIMENSIONS SOD 123W SUGGESTED PAD LAYOUT MARKING DIAGRAM DIM. Unit (mm) Unit (inch) Min Max Min Max B 1.70 1.90 0.067 0.075 C 2.60 2.90 0.102 0.114 D 0.10 0.22 0.004 0.009 E 0.90 1.02 0.035 0.040 F 0.90 1.05 0.035 0.041 G 3.60 3.80 0.142 0.150 H 0.50 0.85 0.020 0.033 I 0.00 0.10 0.000 0.004 Symbol Unit (mm) Unit (inch) A 1.4 0.055 B 1.2 0.047 C 3.1 0.122 D 1.9 0.075 E 4.3 0.169 P/N =Marking Code YW Date Code F Factory Code

SMF5.0A SMF100A Tai wan Semiconductor Version: C 810 Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for suc h products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life saving, or life sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale.