DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Revised: July 17, 2012 TVS Diode Arrays (SPA™ Family of Products) T ransient Voltage Suppression Diodes SMF Series ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.Littelfuse.com/series/SMF.html for current information. Surface Mount – 200W > SMF Series

Description

FeaturesMaximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation at TA=25ºC by 10x1000µs (Note 1) PPPM 200 W Thermal Resistance Junction- to- Ambient R THJ-A 220 °C/W Thermal Resistance Junction- to- Lead R THJ-L 100 °C/W Operating and Storage Temperature Range T J,TSTG -55 to 150 °C Notes: 1 . Non-repetitiv e current pulse, per Fig. 4 and derated above TA=25ºC per Fig. 3. The SMF series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. SMF package is 50% smaller in footprint when compare to SMA package and deliverying one of the lowest height profiles (1 .1mm) in the industry.

Applications

SMF devices are ideal for the protection of I/O interfaces, VCC bus and other vulnerable circuit used in cellular phones, portable devices, business machines, power supplies and other consumer applications.

  • Compatible with industrial standard package SOD-123 F or surface mounted applications to optimize board space L ow profile: maximum height of 1 .1mm.
  • T ypical failure mode is short from over-specified voltage or current Whisk er test is conducted based on JEDEC JESD201A per its table 4a and 4c IEC-61 000-4-2 ESD 15kV(Air), 8kV (Contact) ESD protection of dat a lines in accordance with IEC 61000-4-2 (IEC801-2) EFT protection of dat a lines in accordance with IEC 61000-4-4 (IEC801-4)
  • Low inductance, excellent clamping capability 0W peak pulsepower capability at 10 x 1000µs waveform, repetition rate (duty cycle): 0.01% F ast response time: typically less than 1 .0ns from 0 Volts to V BR min High temperat ure soldering: 260°C/40 seconds at terminals
  • Glass passivated junction
  • Built-in strain relief Mat te tin lead–free plated
  • Halogen-free and RoHS compliant HF RoHS SMF Series RoHSSMF Series

Revised: July 17, 2012 TVS Diode Arrays (SPA™ Family of Products) T ransient Voltage Suppression Diodes SMF Series ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.Littelfuse.com/series/SMF.html for current information. Surface Mount – 200W > SMF Series Electrical Characteristics (TA=25°C unless otherwise noted) Part Number Marking Breakdown Voltage VBR (Volts) @ IT Test Current IT (mA) Reverse Stand off Voltage VR (V) Maximum Reverse Leakage @ VR IR (µA) Maximum Peak Pulse Current Ipp (A) Maximum Clamping Voltage @Ipp VC (V)Code MIN MAX SMF10A AX 11. 1 12.3 1 10 2.5 11. 8 17 SMF11A AZ 12.2 13.5 1 11 2.5 11 18.2 SMF16A BP 1 7. 8 19.7 1 16 1. 0 7. 7 26 Notes: 1. VBR measured after IT applied for 300µs, IT = sequare wave pulse or equivalent. 2. Surge current waveform per 10 x 1000µs exponential wave and derated per Fig.2. 3. All terms and symbols are consistent with ANSI/IEEE C62.35.

Revised: July 17, 2012 TVS Diode Arrays (SPA™ Family of Products) T ransient Voltage Suppression Diodes SMF Series ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.Littelfuse.com/series/SMF.html for current information. Surface Mount – 200W > SMF Series Physical Specifications Case SOD-123 plastic over glass passivated junction Polarity Color band denotes cathode e xcept bipolar T erminal Matte tin-plated leads, solderable per JESD22-B102D Environmental Specifications T emperature Cycle JESD22-A104 Pressure Cooker JESD22-A102 High T emp. Storage JESD22-A103 HTRB JESD22-A108 Thermal Shock JESD22-A106 Soldering Parameters Temperature (T) Time (t) Ts(min) Ts(max) TL TP ts Preheat tL tp Ramp-up Critical Zone TL to TP Ramp-down t 25˚C to Peak 25˚C Reflow Condition Lead–free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C

Revised: July 17, 2012 TVS Diode Arrays (SPA™ Family of Products) T ransient Voltage Suppression Diodes SMF Series ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.Littelfuse.com/series/SMF.html for current information. Surface Mount – 200W > SMF Series Dimensions - SOD-123 Package Dimensions Millimeters Inches Min Max Min Max A 2.50 2.90 0.0984 0.1142 B 3.40 3.90 0.1339 0.1535 C 0.70 1 .20 0.0275 0.0472 D 1 .50 2.00 0.0591 0.0787 E 0.35 0.90 0.0138 0.0354 F 0.05 0.26 0.0020 0.0102 G 0.00 0.10 0.0000 0.0039 H 0.95 1. 10 0.037 4 0.0433 A B C D EE F H G 1.4 (0.055) Mounting Pad Layout Part Numbering System VR VOLTAGE 5% VBR VOLTAGE TOLERANCE SMF xx A SERIES Part Marking System Packaging Part number Component Package Quantity Packaging Option Packaging Specification SMFXXX SOD-123 3000 Tape & Reel – 8mm/7” tape EIA RS-481 XX Marking Code e Band d o h t a CLF YM Trace Code Marking Y:Year Code M: Month Code Cathode T ape and Reel Specification 0.31 (8.0) 0.157 (4.0) 0.157 (4.0) 0.33 (8.5) 0.80 (20.2) Arbor Hole Dia. 7 .0 (178) Dimensions are in inches (and millimeters). Direction of Feed 0.059 DIA(1.5) Cover tape