SMF05C_04 SEMTECH | Alldatasheet

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1 www.semtech.com PRELIMINARYPROTECTION PRODUCTS SMF05C TVS Diode Array For ESD and Latch-Up Protection Description Features Circuit Diagram Schematic & PIN Configuration Revision 08/04/04 The SMF series TVS arrays are designed to protect sen- sitive electronics from damage or latch-up due to ESD and other voltage-induced transient events. They are designed for use in applications where board space is at a premium. Each device will protect up to five lines. They are unidirectional devices and may be used on lines where the signal polarities are above ground. TVS diodes are solid-state devices designed specifically for transient suppression. They feature large cross-sec- tional area junctions for conducting high transient cur- rents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The SMF series devices may be used to meet the immu- nity requirements of IEC 61000-4-2, level 4. The small SC70 package makes them ideal for use in portable elec- tronics such as cell phones, PDA’s, notebook comput- ers, and digital cameras. 134 56

Applications

Mechanical Characteristics ‹ Cellular Handsets and Accessories ‹ Cordless Phones ‹ Personal Digital Assistants (PDA’s) ‹ Notebooks and Handhelds ‹ Portable Instrumentation ‹ Digital Cameras ‹ Peripherals ‹ MP3 Players ‹ ESD protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) ‹ Small package for use in portable electronics ‹ Protects five I/O lines ‹ Working voltage: 5V ‹ Low leakage current ‹ Low operating and clamping voltages ‹ Solid-state silicon-avalanche technology ‹ EIAJ SC70-6L package ‹ Molding compound flammability rating: UL 94V-0 ‹ Marking : Marking Code ‹ Packaging : Tape and Reel per EIA 481 SC70-6L (Top View)

2 2004 Semtech Corp. www.semtech.com PRELIMINARYPROTECTION PRODUCTS SMF05C Absolute Maximum Rating

Electrical Characteristics

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3 2004 Semtech Corp. www.semtech.com PROTECTION PRODUCTS PRELIMINARYPROTECTION PRODUCTS SMF05C Typical Characteristics 0.01 0.1 0.1 1 10 100 1000 Pulse Duration - tp (µs) Peak Pulse Power - Ppk (kW) Non-Repetitive Peak Pulse Power vs. Pulse Time 100 110 0 25 50 75 100 125 150 Ambient Temperature - T A (oC) % of Rated Power or IPP Power Derating Curve Clamping Voltage vs. Peak Pulse Current Capacitance vs. Reverse Voltage ESD Clamping Characteristics (8kV Contact Discharge per IEC 61000-4-2) 100 120 140 0123456 Reverse Voltage - V R (V) Capacitance - Cj (pF) f = 1MHz 02468 1 0 Peak Pulse Current - I PP (A) Clamping Voltage - VC (V) Waveform Parameters: tr = 8µs td = 20µs Pulse Waveform 100 110 0 5 10 15 20 25 30 Time (µs) Percent of IPP e td = IPP/2 Waveform Parameters: tr = 8µs td = 20µs

4 2004 Semtech Corp. www.semtech.com PRELIMINARYPROTECTION PRODUCTS SMF05C 134 56 SMF05C Circuit Diagram Protection of Five Unidirectional Lines Device Connection for Protection of Five Data Lines The SMF05C is designed to protect up to five unidirec- tional data lines. The device is connected as follows: 1. Unidirectional protection of five I/O lines is achieved by connecting pins 1, 3, 4, 5 and 6 to the data lines. Pin 2 is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the SMF05C near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the SMF05C and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Applications Information

5 2004 Semtech Corp. www.semtech.com PROTECTION PRODUCTS PRELIMINARYPROTECTION PRODUCTS SMF05C Typical Applications

6 2004 Semtech Corp. www.semtech.com PRELIMINARYPROTECTION PRODUCTS SMF05C Land Pattern - SC70 6L Outline Drawing - SC70 6L ccc C 2X N/2 TIPS 2X E/2 N EI E .083 BSC .026 BSC .004 .045 .079 .049 .083 .006 - 0.10 1.25 2.10

2.10 BSC

0.65 BSC

.053 1.15 2.00 .012 0.15 1.35 0.30- 1.90.075 DIM bbb ccc e aaa N L c E D b A NOM MILLIMETERS DIMENSIONS INCHES MIN NOM MAX MIN MAX .012 .004 .010 .003 (.017) .014 .028 .000 .035 0.10 0.30 8° 0° - 8° 0.90 (0.42) 0.36.018 .009 0.26 0.08 .043 .039 .004 0.00 0.70 0.22 0.46 0.10 1.10 1.00 1.30 BSC.051 SEATING aaa C bbb C A-B D A bxN D A e1 D e B CPLANE DETAIL L (L1) 0.15 PLANE GAGE c A H SEE DETAIL A SIDE VIEW REFERENCE JEDEC STD MO-203, VARIATION AB.4. 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. -B- CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DATUMS AND TO BE DETERMINED AT DATUM PLANE NOTES: 2. -A- -H- THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. NOTES: Z X .033 .039 (.073) DIMENSIONS INCHES Y Z DIM G P X C MILLIMETERS .016 .026 .106 DIMENSIONS INCHES Y Z DIM G P X C MILLIMETERS (1.85) 0.40 0.85 2.70 1.00 0.65C P G Y

7 2004 Semtech Corp. www.semtech.com PROTECTION PRODUCTS PRELIMINARYPROTECTION PRODUCTS SMF05C Contact Information Semtech Corporation Protection Products Division

200 Flynn Road, Camarillo, CA 93012

Phone: (805)498-2111 FAX (805)498-3804 Marking Codes

Ordering Information

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