SMDH160

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Technical content

PolySwitch Resettable Devices– Surface-mount Devices 131

• Smaller size saves board space and cost
• Many product choices give engineers more design flexibility
• Compatible with high-volume electronics assembly
• Assists in meeting regulatory requirements
• Higher voltage ratings allow use in new applications
• RoHS compliant
• Broadest range of resettable devices available in the industry
• Current ratings from 0.05 to 3A
• Voltage ratings from 6V computer and electronic applications to 60V telecom applications
• Agency recognition: UL, CSA, TÜV
• Small footprint
• Fast time-to-trip
• Low resistance
• Computer
• Portable electronics
• Multimedia Benefits Features

Applications

• Game machines
• Telephony and broadband
• Mobile phones
• Automotive
• Industrial controls
• Battery PolySwitch surface-mount devices are the preferred circuit protection method for computer, consumer, multimedia, portable, and automotive electronics applications. In an effort to reduce the size and cost of surface mount devices, we introduced the miniSMD product series in 1995. Subsequently, we developed the microSMD, nanoSMD and picoSMD family of products. The picoSMD series reduced the device size to a 2012mm (0805 mils) foot print, one fourth the size of the popular miniSMD series. Recent additions to the PolySwitch surface-mount series include 24V miniSMD 4532mm (1812 mils), 60V decaSMD 5050mm (2018 mils), and 2.0A microSMD 3225mm (1210 mils) devices. PolySwitch Resettable Devices Surface-mount Devices

RoHS Compliant, ELV Compliant Protection Application Selection Table for Surface-mount Devices AC adapter input power use w/ Zener & triac SMD250F SMD250F SMD200F Battery pack protection nanoSMDC150F miniSMDC260F miniSMDE190F Charger protection nanoSMDC050F miniSMDC110F/16 nanoSMDC075F CPU/IC protection nanoSMDC110F nanoSMDC150F nanoSMDC075F Data acquisition/sensor microSMD005F - microSMD005F DC input/output power ≤6V nanoSMDC075F nanoSMDC150F nanoSMDC050F/13.2 ≤12V miniSMDC075F miniSMDC110F/16 miniSMDC075F DDC nanoSMDC075F nanoSMDC110F nanoSMDC050F/13.2 Device Bay system DB12, DB20 miniSMDC200F miniSMDC260F miniSMDC200F DB32 miniSMDC260F SMD300F miniSMDC200F Ethernet/Lan nanoSMDC050F/13.2 miniSMDC110F/16 nanoSMDC075F Fan microSMD035F microSMD050F microSMD035F HDMI picoSMD035F picoSMD035F picoSMD035F IEEE 802.3af VOIP decaSMDC050F/60 decaSMDC050F/60 decaSMDC050F/60 IEEE-1394 power provider SMD100F/33 SMD185F SMD100F/33 alt. power provider SMD185F SMD185F SMD150F/33 self-powered SMD185F SMD185F SMD150F/33 LCD inverter nanoSMDC050F/13.2 miniSMDC110F/16 nanoSMDC075F LCD screen power nanoSMDC050F/13.2 nanoSMDC050F/13.2 microSMD035F LNB (Low Noise Block) SMD075F SMD075F SMD050F Motor ≤6V nanoSMDC110F nanoSMDC150F microSMD075F ≤13.2V miniSMDC075F miniSMDC110F/16 miniSMDC075F PS/2 mouse/keyboard nanoSMDC075F nanoSMDC110F nanoSMDC050F/13.2 Signal - data communication ≤6V nanoSMDC075F nanoSMDC075F nanoSMDC075F ≤13.2V miniSMDC050F miniSMDC075F miniSMDC020F ≤30V SMD030F-2018 SMD075F SMD050F SCSI nanoSMDC110F nanoSMDC150F nanoSMDC075F Smart card reader microSMD010F microSMD035F microSMD005F Telecom - modem Digital line OC miniSMDC014F miniSMDC014F miniSMDC014F OV TVBxxx(N)SC-L* TVBxxx(N)SC-L* TVBxxx(N)SC-L* Telecom - PBX Subscriber OC miniSMDC014F miniSMDC014F miniSMDC014F Temperature sensor CPU nanoSMDC050F/13.2 nanoSMDC075F nanoSMDC050F/13.2 USB Individual Port nanoSMDC075F nanoSMDC110F nanoSMDC050F/13.2 2 port ganged nanoSMDC150F miniSMDC150F miniSMDC125F 3 port ganged miniSMDC200F miniSMDC200F miniSMDC200F Note :This list is not exhaustive. Tyco Electronics welcomes our customers’ input for additional application ideas for PolySwitch resettable devices. *Refer to the SiBar product section for more information. Protection Application Additional Comments PolySwitch Resettable Devices - Key Selection Criteria FastTime-to-trip Small Size Low Resistance (T emperature Protection)

• The table below lists PolySwitch devices and SiBar devices typically used in these applications.
• Specifications for the suggested PolySwitch surface-mount device part numbers can be found in this section.
• Once a part has been selected, the user should evaluate and test each product for the intended application. Overcurrent Overvoltage

Maximum AmbientT emperature Part Number -40°C -20°C 0°C 20°C 25°C 40°C 50°C 60°C 70°C 80°C 85°C 125°C picoSMD Series Size 2012 mm/0805 mils nanoSMDC Series Size 3216 mm/1206 mils * Data is preliminary PolySwitch Resettable Devices– Surface-mount Devices 133 RoHS Compliant, ELV Compliant picoSMD nanoSMD microSMD miniSMD midSMD SMD SMD2 miniSMDE decaSMD Size mm (mils) 2012 (0805) 3216 (1206) 3225 (1210) 4532 (1812) 5050 (2018) 7555 (2920) 8763 (3425) 11550 (4420) 5050 (2018) Hold Current (A) -- - - - - - - - 0.350 6VDC /1.40Ω 16VDC /1.35Ω 6VDC /1.30Ω -- -- - - 1.100 -6 V DC /0.20Ω 6VDC /0.21Ω 8V DC /0.21Ω -- - - - Product Series: Size, Current Rating, Voltage Rating/Maximum Resistance for Surface-mount DevicesTable S1 Thermal Derating for Surface-mount Devices [Hold Current (A) at Ambient Temperature (°C)] Table S2 coming soon

RoHS Compliant, ELV Compliant Thermal Derating for Surface-mount Devices [Hold Current (A) at Ambient Temperature (°C)] ... Cont’dTable S2 Maximum AmbientT emperature Part Number -40°C -20°C 0°C 20°C 25°C 40°C 50°C 60°C 70°C 80°C 85°C 125°C microSMD Series Size 3225 mm/1210 mils miniSMDC Series Size 4532 mm/1812 mils miniSMDE Series Size 11550 mm/4420 mils midSMD Series Size 5050 mm/2018 mils SMD Series Size 7555 mm/2920 mils SMD2 Series Size 8763 mm/3425 mils NEW NEW

PolySwitch Resettable Devices– Surface-mount Devices 135 RoHS Compliant, ELV Compliant Electrical Characteristics for Surface-mount Devices at Room TemperatureTable S3 picoSMD Series Size 2012 mm/0805 mils nanoSMDC Series Size 3216 mm/1206 mils microSMD Series Size 3225 mm/1210 mils miniSMDC Series Size 4532 mm/1812 mils * Data is preliminary Part Number IH (A) IT (A) V MAX (VDC ) IMAX (A) PD MAX (W) Max.Time-to-T rip (A) (S) RMIN (Ω) R1MAX (Ω) Figure for Dimensions coming soon % of rated hold and trip current Ambient Temperature (˚C) 200 180 160 140 120 100 -40 -20 0 20 40 60 80 1 001 20 B A A B C C Figure S1A= picoSMD / nanoSMD / microSMD / miniSMD / decaSMD and SMD B= miniSMDE190F C= SMDH120 and SMDH160 Thermal Derating Curve for Surface-mount DevicesFigure S1 NEW

RoHS Compliant, ELV Compliant Electrical Characteristics for Surface-mount Devices at Room Temperature... Cont’dTable S3 miniSMDC Series Size 4532 mm/1812 mils miniSMDE Series Size 11550 mm/4420 mils midSMD Series Size 5050 mm/2018 mils SMD Series Size 7555 mm/2920 mils SMD2 Devices Size 8763 mm/3425 mils Part Number IH (A) IT (A) V MAX (VDC ) IMAX (A) PD MAX (W) Max.Time-to-T rip (A) (S) RMIN (Ω) R1MAX (Ω) Figure for Dimensions Dimension Figures for Surface-mount DevicesFigure S2-S6 C A B ED Figure S2 C AB ED Figure S3 BH C F G A D E Figure S5 C AB DD Figure S6 B F A D E C Figure S4 NEW

PolySwitch Resettable Devices– Surface-mount Devices 137 RoHS Compliant, ELV Compliant Dimensions for Surface-mount Devices in Millimeters (Inches)Table S4 picoSMD Series Size 2012 mm/0805 mils nanoSMDC Series Size 3216 mm/1206 mils microSMD Series Size 3225 mm/1210 mils miniSMDC Series Size 4532 mm/1812 mils * Data is preliminary coming soon Part Number A Min. Max. H Min. Figure B Min. Max. C Min. Max. D Min. Max. E Min. Max. F Min. Max. G Min. Max.

RoHS Compliant, ELV Compliant Dimensions for Surface-mount Devices in Millimeters (Inches) ... Cont’dTable S4 miniSMDC Series Size 4532 mm/1812 mils miniSMDE Series Size 11550 mm/4420 mils midSMD Series Size 5050 mm/2018 mils SMD Series Size 7555 mm/2920 mils Part Number A Min. Max. H Min. Figure B Min. Max. C Min. Max. D Min. Max. E Min. Max. F Min. Max. G Min. Max. NEW NEW

PolySwitch Resettable Devices– Surface-mount Devices 139 RoHS Compliant, ELV Compliant Typical Time-to-trip Curves at 20°C for Surface-mount DevicesFigure S7-S13 Time-to-trip (s) Fault Current (A) 0.1 0.01 0.001 0.1 1 10010 A A B B C D D E E F F G G H H Figure S8nanoSMDCxxxF A= nanoSMDC012F B= nanoSMDC016F C= nanoSMDC020F D= nanoSMDC035F E= nanoSMDC050F/13.2 F= nanoSMDC075F G= nanoSMDC110F H= nanoSMDC150F Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 0.1 1 10010 A A Figure S7picoSMDxxxF A = picoSMD035F Dimensions for Surface-mount Devices in Millimeters (Inches) ... Cont’dTable S4 SMD2 Devices Size 8763 mm/3425 mils Part Number A Min. Max. H Min. Figure B Min. Max. C Min. Max. D Min. Max. E Min. Max. F Min. Max. G Min. Max.

RoHS Compliant, ELV Compliant Typical Time-to-trip Curves at 20°C for Surface-mount Devices ... Cont’dFigure S7-S13 Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 0.1 1 10010 B B A A C C D D E E Figure S11midSMD A= SMD030F-2018 B= decaSMDC050F/60 C= SMD100F-2018 D= SMD150F-2018 E= SMD200F-2018 Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 100.1 1 100 A A B C D E F G I J K BC D E F G H H IJ K Figure S10 miniSMDCxxxF and miniSMDExxxF A= miniSMDC014F B= miniSMDC020F C= miniSMDC050F D= miniSMDC075F , miniSMDC075F/24 E= miniSMDC100F , miniSMDC110F , miniSMDC110F/16, miniSMDC110F/24 F= miniSMDC125F , miniSMDC125F/16 G= miniSMDC150F , miniSMDC150F/12, miniSMDC150F/16, miniSMDC150F/24 H= miniSMDC160F I= miniSMDC200F , miniSMDC200S J= miniSMDE190F K= miniSMDC260F , miniSMDC260F/12, miniSMDC260F/13.2, miniSMDC260F/16 Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 0.1 1 10 100 A A B B C CD E F G H I D E F G H I Figure S9 microSMDxxxF A= microSMD005F B= microSMD010F C= microSMD035F D= microSMD050F E= microSMD075F F= microSMD110F G= microSMD150F H= microSMD175F I= microSMD200F

PolySwitch Resettable Devices– Surface-mount Devices 141 RoHS Compliant, ELV Compliant Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 100.1 1 100 A A B C D E BCDE Figure S13 SMD2xxxF A= SMD150F , SMD150F/33 B= SMDH160 C= SMD185F D= SMD200F E= SMD250F Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 0.1 1 10 100 B B A A C C D D E E F G H FGH Figure S12 SMDxxxF A= SMD030F B= SMD050F C= SMD075F , SMD075F/60 D= SMDH120 E= SMD100F , SMD100F/33 F= SMD125F G= SMD260F H= SMD300F Typical Time-to-trip Curves at 20°C for Surface-mount Devices ... Cont’dFigure S7-S13 Physical Characteristics and Environmental Specifications for Surface-mount Devices Operating temperature range -40°C to 85°C, -40°C to 125°C for SMDH120 and SMDH160Table S5 Physical Characteristics Terminal pad material 100% matte tin with nickel underplate; gold with nickel underplate for picoSMD Soldering characteristics ANSI/J-STD-002 Category 3 for picoSMD, nanoSMD, microSMD and miniSMD series ANSI/J-STD-002 Category 1 for SMD series Solder heat withstand per IEC-STD 68-2-20, Test Tb, Section 5, Method 1A Flammability resistance per IEC 695-2-2 Needle Flame Test for 20 sec. Recommended storage conditions 40°C max, 70% R.H. max; devices may not meet specified ratings if storage conditions are exceeded. Environmental Specifications T est T est Method Conditions Resistance Change Storage life Raychem PS300, Section 5.3.2 60°C, 1000 hours ±3% typical 85°C, 1000 hours ±5% typical Humidity aging Raychem PS300, Section 5.3.1 85°C, 85% RH, 100 hours ±1.2% typical Thermal shock MIL-STD-202, Method 107G 85°C, -40°C (20 times) -33% typical 125°C, -55°C (10 times) -33% typical Vibration MIL-STD-883C per MIL-STD-883C No change Solvent resistance Raychem PS300, Section 5.2.2 Freon No change Trichloroethane No change Hydrocarbons No change

RoHS Compliant, ELV Compliant Packaging and Marking Information for Surface-mount DevicesTable S6 picoSMD Series Size 2012 mm/0805 mils nanoSMDC Series Size 3216 mm/1206 mils microSMD Series Size 3225 mm/1210 mils miniSMDC Series Size 4532 mm/1812 mils miniSMDE Series Size 11550 mm/4420 mils midSMD Series Size 5050 mm/2018 mils * Data is preliminary Part Number T ape & Reel Quantity Standard Package Part Marking Dimension A (Nom.) Dimension B (Nom.) Dimension C (Nom.) Agency Recognition Recommended Pad Layout Figures [mm(In.)] coming soon NEW NEW

PolySwitch Resettable Devices– Surface-mount Devices 143 RoHS Compliant, ELV Compliant A B CB Recommended Pad Layout for Surface-mount DevicesFigure S14 Packaging and Marking Information for Surface-mount Devices ... Cont’dTable S6 SMD Series Size 7555 mm/2920 mils SMD2 Devices Size 8763 mm/3425 mils Part Number T ape & Reel Quantity Standard Package Part Marking Dimension A (Nom.) Dimension B (Nom.) Dimension C (Nom.) Agency Recognition Recommended Pad Layout Figures [mm(In.)] Agency Recognition for Surface-mount Devices UL File # E74889 for all surface-mount devices CSA File # CA78165 for all surface-mount devices TÜV Certificate # R72072068 for picoSMD series Certificate # R72041439 for nanoSMD series Certificate # R72041438 for microSMD and miniSMD series Certificate # R72090019 for decaSMD series Certificate # R72041427 for SMD series Certificate # R72072048 for SMDH series

RoHS Compliant, ELV Compliant Solder Reflow

• Recommended reflow methods: - IR - Hot air - Nitrogen
• Recommended maximum paste thickness: 0.25mm (0.010 inch)
• Devices can be cleaned using standard methods and aqueous solvents.
• We believe the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.
• Customer should validate that the solder paste amount and reflow recommendations meet its application.
• We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices. Rework
• picoSMD, nanoSMD, microSMD and miniSMD series: standard industry practices. Please also avoid direct contact to the device.
• SMD series: rework should be confined to removal of the installed product and replacement with a fresh device. Solder Reflow and Rework Recommendation for Surface-mount Devices Critical Zone TL to TpRamp up t 25˚C to Peak Reflow Profile Time Ramp down ts Preheat TsMAX TL Tp tp TsMIN tL Te mperature Figure S15 Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp up rate (TsMAX toTp) 3°C/second max. 3°C/second max. Preheat
• Temperature min. (TsMIN ) 100°C 150°C
• Temperature max. (TsMAX ) 150°C 200°C
• Time (tsMIN to tsMAX ) 60-120 seconds 60-180 seconds Time maintained above:
• Temperature (T L) 183°C 217°C
• Time (tL) 30-70 seconds 30-70 seconds Peak/Classification temperature (Tp) 240°C 260°C Time within 5°C of actual peak temperature Time (tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25°C to peak temperature 6 minutes max. 8 minutes max. Note:All temperatures refer to topside of the package, measured on the package body surface.

PolySwitch Resettable Devices– Surface-mount Devices 145 RoHS Compliant, ELV Compliant Tape and Reel Specifications for Surface-mount Devices (in Millimeters)Table S7 Leader min. 390 390 390 390 400 400 400 400 Trailer min. 160 160 160 160 160 160 160 160

Description

Tape and Reel Specifications for Surface-mount Devices (in Millimeters)Table S8 miniSMDC014F~075F miniSMDC100F~110F/16 miniSMDC125F~150F/16 miniSMDC160F~260F miniSMDC075F/24 miniSMDC110F/24 miniSMDC260F/12 miniSMDC260F/13.2 miniSMDC260F/16 miniSMDC150F/24 decaSMDC050F/60 Reel Dimensions for Surface-mount Devices (in Millimeters)Table S9 A max. 185 185 330 330 330 330 N min. 50 50 60 50 50 50 pico/nano/microSMD miniSMDC miniSMDE190 midSMD SMD SMD2 microSMD200F All microSMD series except microSMD200F nanoSMDC012F nanoSMDC016F All nanoSMDC series except nanoSMDC012F nanoSMDC016FpicoSMD035F picoSMDC EIA 481-1 EIA Referenced Taped Component Dimensions for Surface-mount DevicesFigure S16 F W P2D0 T Cover tape Embossment Center lines of cavity

RoHS Compliant, ELV Compliant Part Numbering System for Surface-mount Devices SMD 150 F /33 -RB -2 Packaging 2 = Tape and Reel Rx = Resistance Range (Limited part number availability) Alternative Voltage Rating (If applicable) Lead Free Hold Current Indicator Product Series EIA Referenced Reel Dimensions for Surface-mount DevicesFigure S17 ACover tape Embossed cavity Carrier tape N (hub dia.) W2 (measured at hub) W1 (measured at hub) Warning :

• Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
• These devices are intended for protection against damage caused by occasional overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated.
• Contamination of the PPTC material with certain silicone-based oils or some aggressive solvents can adversely impact the performance of the devices.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components.
• PPTC devices are not recommended for installation in applications where the device is constrained such that its PTC properties are inhibited, for example in rigid potting materials or in rigid housings, which lack adequate clearance to accommodate device expansion.
• Operation in circuits with a large inductance can generate a circuit voltage (Ldi/dt) above the rated voltage of the device.