SMDA05_06 SEMTECH | Alldatasheet
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1 www.semtech.com PROTECTION PRODUCTS SMDA05 through SMDA24 Unidirectional TVS Array for Protection of Four Lines Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20µs) Undirectional protection Small SO-8 package Protects four I/O lines Working voltages: 5V, 12V, 15V and 24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology Description Features Schematic & PIN Configuration Revision 08/15/06
Applications
Mechanical Characteristics The SMDAxx series of TVS arrays are designed to provide undirectional protection for sensitive electronics from damage or latch-up due to ESD, lightning, and other voltage-induced transient events. Each device will protect four data or I/O lines. They are available with operating voltages of 5V, 12V, 15V and 24V. TVS diodes are solid-state devices designed specifically for transient suppression. They offer desirable charac- teristics for board level protection including fast re- sponse time, low operating and clamping voltage and no device degradation. The low profile SO-8 package allows the user to protect up to four independent lines with one package. The SMDAxx series is suitable protection for sensitive semiconductors components such as micropro- cessors, ASICs, transceivers, transducers, and CMOS memory. The SMDAxx series devices may be used to meet the ESD immunity requirements of IEC 61000-4-2, level 4 for air and contact discharge. SO-8 (Top View) JEDEC SO-8 package Molding compound flammability rating: UL 94V-0 Marking : Part number, date code, logo Packaging : Tube or Tape and Reel per EIA 481 RS-232 data lines Microprocessor based equipment Notebooks, Desktops, and Servers Instrumentation LAN/WAN equipment Peripherals Serial and Parallel Ports
2 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTSPROTECTION PRODUCTS SMDA05 through SMDA24 Absolute Maximum Rating Electrical Characteristics (T=25oC) gnitaRl obmySe ulaVs tinU t(rewoPesluPkaeP p )sµ02/8=P kp 003s ttaW )2-4-00016CEIrepMBH(egatloVDSEV DSE 52>V k erutarepmeTgniredloSdaeLT L ).ces01(062C ° erutarepmeTgnitarepOT J 521+ot55-C ° erutarepmeTegarotST GTS 051+ot55-C ° 50ADMS retemaraPl obmySs noitidnoCm uminiMl acipyTm umixaMs tinU egatloVffO-dnatSesreveRV MWR 5V egatloVnwodkaerBesreveRV RB It Am1=6 V tnerruCegakaeLesreveRI R V MWR C°52=T,V5=0 2A µ egatloVgnipmalCV C I PP t,A1= p sµ02/8=8 .9V egatloVgnipmalCV C I PP t,A5= p sµ02/8=1 1V tnerruCesluPkaePI PP tp sµ02/8=7 1A ecnaticapaCnoitcnuJC j VR zHM1=f,V0=0 04F p 21ADMS retemaraPl obmySs noitidnoCm uminiMl acipyTm umixaMs tinU egatloVffO-dnatSesreveRV MWR 21V egatloVnwodkaerBesreveRV RB It Am1=3 .31V tnerruCegakaeLesreveRI R V MWR C°52=T,V21=1 A µ egatloVgnipmalCV C I PP t,A1= p sµ02/8=9 1V egatloVgnipmalCV C I PP t,A5= p sµ02/8=4 2V tnerruCesluPkaePI PP tp sµ02/8=2 1A ecnaticapaCnoitcnuJC j VR zHM1=f,V0=0 51F p
3 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTS SMDA05 through SMDA24 51ADMS retemaraPl obmySs noitidnoCm uminiMl acipyTm umixaMs tinU egatloVffO-dnatSesreveRV MWR 51V egatloVnwodkaerBesreveRV RB It Am1=7 .61V tnerruCegakaeLesreveRI R V MWR C°52=T,V51=1 A µ egatloVgnipmalCV C I PP t,A1= p sµ02/8=4 2V egatloVgnipmalCV C I PP t,A5= p sµ02/8=0 3V tnerruCesluPkaePI PP tp sµ02/8=0 1A ecnaticapaCnoitcnuJC j VR zHM1=f,V0=0 01F p 42ADMS retemaraPl obmySs noitidnoCm uminiMl acipyTm umixaMs tinU egatloVffO-dnatSesreveRV MWR 42V egatloVnwodkaerBesreveRV RB It Am1=7 .62V tnerruCegakaeLesreveRI R V MWR C°52=T,V42=1 A µ egatloVgnipmalCV C I PP t,A1= p sµ02/8=3 4V egatloVgnipmalCV C I PP t,A5= p sµ02/8=5 5V tnerruCesluPkaePI PP tp sµ02/8=5 A ecnaticapaCnoitcnuJC j VR zHM1=f,V0=0 6F p Electrical Characteristics (Continued)
4 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTSPROTECTION PRODUCTS SMDA05 through SMDA24 Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 100 110 0 5 10 15 20 25 30 Time (µs) Percent of IPP e-t td = I PP /2 W ave form Parameters: tr = 8µs td = 20µs Pulse Waveform ESD Pulse Waveform (IEC 61000-4-2) 100 110 0 25 50 75 100 125 150 Ambient Temperature - T A (oC) % of Rated Power or IPP 0.01 0.1 0.1 1 10 100 1000 Pulse Duration - tp (µs) Peak Pulse Power - Ppk (kW) IEC 61000-4-2 Discharge Parameters leveLt sriF kaeP tnerruC )A( kaeP tnerruC sn03ta )A( kaeP tnerruC sn06ta )A( tseT egatloV tcatnoC( )egrahcsiD )Vk( tseT egatloV riA( )egrahcsiD )Vk( 15 .748 2 2 25 184 4 4 35 .222 166 8 40 36 18 8 5 1
5 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTS SMDA05 through SMDA24 Circuit Diagram I/O Line Protection Device Connection for Protection of Four Data Lines The SMDAxx series of devices are designed to protect up to four data lines. The devices are connected as follows: z The SMDAxx are unidirectional devices and are designed for use on lines where the normal operat- ing voltage is above ground. Pins 1, 2, 3, and 4 are connected to the protected lines. Pins 5, 6, 7, and 8 are connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Ground From Connector To Protected Device Typical Connection Applications Information
6 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTSPROTECTION PRODUCTS SMDA05 through SMDA24 Land Pattern - SO-8 Outline Drawing - SO-8 bxN 2X N/2 TIPS SEATING aaa C E/22X N A D bbb C A-B D ccc C e/2 SEE DETAIL A SIDE VIEW A B C De DETAIL A c L (L1) 01 0.25 GAGE PLANE h h H PLANE 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. -B- CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DATUMS AND TO BE DETERMINED AT DATUM PLANE NOTES: 2. -A- -H- REFERENCE JEDEC STD MS-012, VARIATION AA.4. .050 BSC .236 BSC .010 .150 .189 .154 .193 .012 - 0.25
1.27 BSC
6.00 BSC
3.90 4.90 .157 .197 3.80 4.80 .020 0.31 4.00 5.00 0.51 (.041) .004 .008 .028 .016 .007 .049 .004 .053 8° 0° 0.20 0.10 - 8° 0.40 0.17 1.25 0.10 .041 .010 .069 .065 .010 1.35 (1.04) 0.72 1.04 0.25 - 1.75 1.65 0.25 N bbb aaa ccc A b D E L h e c DIM MIN MILLIMETERS NOM DIMENSIONS INCHES MIN MAX MAX NOM E (.205) (5.20) ZG Y P (C) 3.00.118 1.27.050 0.60.024 2.20.087 7.40.291 X INCHES DIMENSIONS Z P Y X DIM C G MILLIMETERS THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. NOTES: REFERENCE IPC-SM-782A, RLP NO. 300A.2.
7 2005 Semtech Corp. www.semtech.com PROTECTION PRODUCTS SMDA05 through SMDA24 Contact Information Semtech Corporation Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
Ordering Information
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