SMD03 SECOS | Alldatasheet

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Any changing of specification will not be informed individual SMD03 THRU SMD36 300W TVS DIODE RoHS Compliant Product http://www.SeCoSGmbH.com Elektronische Bauelemente ELECTRICAL CHARACTERISTICS PER LINE @ 25ºC Unless otherwise specified STAND OFF VOLTAGE VWM VOLTS BREAKDOWN VOLTAGE VBR @1 mA VOLTS CLAMPING VOLTAGE VC @ 1 Amp (FIGURE 2) VOLTS CLAMPING VOLTAGE VC @ 5 Amp (FIGURE 2) VOLTS LEAKAGE CURRENT ID @ VWM µA CAPACITANCE @0V, 1 MHz C Pin 1-3 pF PART NUMBER DEVICE MARKING MIN MAX MAX MAX MAX SMD03 X03 3.3 4-5 7 8.5 100 350 X05 5.0 6.1-7.4 9.8 11 12 210 X12 12.0 13.3-16.3 19 24 0.5 75 X15 15.0 16.7-20.4 24 30 0.5 50 SMD24 X24 24.0 26.7-32.6 43 55 0.5 30 SMD36 X36 36.0 40.0-47.0 60 75 0.5 30 NOTE: Transient Voltage Suppression (TVS) product is normally selected based on its stand off Voltage V . Product SMD05 SMD15 SMD12 WM selected voltage should be equal to or greater than the continuous peak operating voltage of the circuit to be protected. MAXIMUM RATING SAND ELECTRICAL CHARACTERISTICS

FEATURES

‧SC59 package for surface mount appllcation ‧Protects 3.3V up through 36V components ‧Protects two unidirectional line or one bidirection line ‧Provides electrically is olated protection ‧ESD>10KV ‧300W Peak Power Protection( tp=8/2 us) MECHANICAL DATA ‧Molded: SC59 Surface Mount ‧Body marked with marking code. ‧Mounting Position: Any ‧Weight: 0.008 grams (approx.)

APPLICATIONS

‧Cellular Handsets and Accessories ‧Portable Electronics ‧Industrial Controls ‧Set -Top Box ‧Servers, Notebook, and Desktop PC K J C H L A B S GV 1 2 D Top View Dim Min Max A 2.700 3.100 B 1.500 1.700 C 0.900 1.150 D 0.350 0.500 G 1.700 2.100 H 0.013 0.100 J 0.100 0.200 K 0.350 0.550 L 0.900 1.000 S 2.600 3.000 V 0.500 0.600 All Dimension in mm SC-59 Rating Symbol Value Units Peak ulse Power (tp=8/20us) Ppk 300 Watts T h e r m a l R e s i s t a n c e , J u n c t i o n t o A m b i e n t Rq J A 5 5 6 ℃/ W Lead Soldering Temperature TL 260 (10 sec.) ℃ Operating Temperature TJ -55 to +125 ℃ Storage Temperature TSTG -55 to +150 ℃ 16-Oct.-2008 Rev. D Page 1 of 2

Any changing of specification will not be informed individual http://www.SeCoSGmbH.com Elektronische Bauelemente 0. 01 0.1 0.1 1 10 100 1000 Pulse Duration - tp (us) Peak Puse Power - P PP (kW) Non-Repetitive Peak Pulse Power vs. Pulse Time SMD03 THRU SMD36 300W TVS DIODE 100 110 0 25 50 75 100 125 150 Ambient Te mperature - TA (oC) % of Rated Power or I PP Power Derating Curve 100 110 0 5 10 15 20 25 30 Time (u s) Percent of IPP e-t td = IPP /2 Wave form Paramete rs: tr = 8 s td = 20 s Pulse Waveform A p p l i c a t i o n s I n f o r m a t i o n D e v i c e C o n n e c t i o n O p t i o n s T h e S M s e r i e s i s d e s i g n e d t o p r o t e c t o n e u n i d i r e c t i o n a l d a t a o r l / O l i n e s o p e r a t i n g a t 5 t o 3 6 v o l t s . C o n n e c t i o n o p t i o n s a r e a s f o l l o w s : ‧Un i d i r e c t i o n a l : D a t a l i n e s a r e c o n n e c t e d t o p i n 1 a n d P i n 3 i s c o n n e c t e d t o g r o u n d . F o r b e s t r e s u l t s , t h i s p i n s h o u l d b e c o n n e c t e d d i r e c t l y t o a g r o u n d p la n e o n t h e b o a r d . T h e p a t h l e n g h s h o u l d b e k e p t a s s h o r t a s p o s s i b l e t o m i n i m i z e p a r a s i t i c i n d u c t a n c e. C i r c u i t B o a r d L a y o u t R e c o m m e n d a t i o n s f o r s u p p r e s- s i o n o f E S D . G o o d c i r c u i t b o a r d l a y o u t i s c r i t i c a l f o r t h e s u p p r e s s i o n o f f a s t r i s e-t i m e t r a n s i e n t s s u c h a s E S D . T h e f o l l o w i n g g u i d e l i n e s a r e r e c o m m e n d e d ( R e f e r t o a p p l i c a t i o n n o t e S l 9 9 . 0 1 f o r m o r e d e t a i le d i n f o r m a t i o n ) : ‧P l a c e t h e T V S n e a r t h e i n p u t t e r m i n a l s o r c o n n e c- t o r s t o r e s t r i c t t r a n s i e n t c o u p l i n g . ‧M i n i m i z e t h e p a t h l e n g t h b e t w e e n t h e T V S a n d t h e p r o t e c t e d l i n e . ‧M i n i m i z e a l l c o n d u c t i v e l o o p s i n c l u d i n g p o w e r a n d g r o u n d l o o p s . ‧T h e E S D t r a n s i e n t re t u r n p a t h t o g r o u n d s h o u l d b e k e p t a s s h o r t a s p o s s i b l e . ‧N e v e r r u n c ri t i c a l s i g n a l s n e a r b o a r d e d g e s ‧U s e g r o u n d p l a n e s w h e n e v e r p o s s i b | e . N u m b e r 1 . 4 4 . 0 m m 1 . 2 0 . 9 0 . 9 5 2 . 6 Suggested Solder Pad Layout 0.9 1.4 16-Oct.-2006 Rev. B Page 2 of 2 16-Oct.-2008 Rev. D Page 2 of 2