SMD3225-24 LUGUANG | Alldatasheet
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SPECIFICATION REQUREMENTS FOR CRYSTAL 晶 体 产 品 要 求 □ 电气参数 Electrical Characteristic: 1. Model No. SMD3225（4pin） 2. Nominal Frequency(FN) 24.0000MHz 3. Oscillation Mode ■Fundamental □3RD overtone □5th overtone 4. Frequency Tolerance(△F) ±40ppm (ref. at 25℃) 5. Operation Temperature -30℃to+85℃ 6.Storage Temperature -40℃to+85℃ 7. Frequency stability(Tol) ±10ppm 8. Load Capacitance( CL ) 10PF 9. Series Resistance(ESR) 50Ω 10. Drive Level 100uW 11.Shunt Capacitance (Co) 7.0PF 12. Aging Rate Per Year ±3ppm/year 13. Insulation Resistance 500MΩ min. at DC 100V±10V 14. Test Circuit. Measured by S&A 250B 15. Marking 24.0000 MHZ. 24.0000M SMD3225 http://www.lgesemi .com mail:lge@lgesemi.comRevision:20160808-P1
LGE 产品结构、尺寸 3.2± 0.1 0.8MAX 2.5± 0.1
- Mechanical Dimensions 外型尺寸 UNIT(单位）：mm（毫米） 0.9 TYP0.8 0.7 1.2 0.1 1 2 2.1 1.7 1.3 1.3 4 3 1.2 0.7 suggested solder pad layout Note) #2,#4 is connected with a cover (Please connect with a GND or a power supply) NO. NAME CAN BASE LEAD BLANK RESIN 名称 外壳 基座 焊点 晶片 导电胶 24.0000M SMD3225 http://www.lgesemi .com mail:lge@lgesemi.comRevision:20160808-P1
LGE 包装要求 F E P T N A B C D NC-49SMD 8045 7050 6035 5032 4025 3225 W 12.00±0.05 E 1.75±0.10 F 5.5±0.10 T 0.30±0.05 P 8.00±0.10 P0 4.00±0.10 P2 2.00±0.10 D0 Φ1.50±0.10 D1 Φ1.50MIN A0 2.85±0.10 K0 0.85±0.10 B0 3.55±0.10 A Φ178±2.00 B 2.00±0.50 C Φ13.2±0.20 D Φ20±0.50 N Φ60.5±1.00 W1 12.5±0.20 T1 1.80±0.20 24.0000M SMD3225 http://www.lgesemi .com mail:lge@lgesemi.comRevision:20160808-P1
LGE 可靠性实验规范 LGE X'TAL RELIABILITY SPECIFICATION 序号 RELIABILITY 试验名称 JTC RELIABILITY CONDITIONS 可靠度试验条件 SPECIFICATION 规格说明 ELECTRODE TERMINAL PULL 电极端子拉力 1KG FORCE IN AXES OF ELECTRODE TERMINATION 10±1sec 1KG 力垂直施于电极端子上 10±1 秒 1.GLASS HERMETICITY & VISUAL. 玻璃密封性和外观检视 2. LEAD CRACKED or BROKEN NOT ALLOWED' 不允许引线断裂或破裂 ELECTRODE WIRE-LEAD BEND 电极端子弯曲拉力 SOLDER:235 ± 5 ℃ ,DIPPING:5 ± 0.5sec. 焊接温度:235±5℃,浸渍时间:5±0.5 秒
3 SOLDERABILITY
产品可焊性 SOLDER:235 ± 5 ℃ ,DIPPING:5 ± 0.5sec. 焊接温度:235±5℃,浸渍时间:5±0.5 秒 AT LEAST 95% COATING. 至少覆盖率为 95%
4 RESISTANCE TO
产品可焊耐热时间 SOLDER:260+5 ℃ ,DIPPING:10 ± 1sec. 焊接温度:260±5℃,浸渍时间:10±1 秒 Max260℃ 200℃ Max150℃ 1.max 180 sec 2.max 10 sec 3.max 80 sec 4.max 90 sec 1.AT LEAST 95% COATING. 至少覆盖率为 95% 2. △ F/F ≤ ± 5ppm △ F/Rr ≤ ± 10% or 2 Ω BETTER,20%
5 VIBRATION TEST
振动测试 10g,10 ～55 ～10hz 1MINUTE,X 、Y 、Z PLANE EACH 2hrs. 10G, 10～55～10 赫兹 1 分钟,X、Y、Z 水 平面,每 2 小时 △ F/F ≤ ± 5ppm △ F/Rr ≤ ± 10% or 2 Ω BETTER,20%
6 DROP TEST
跌落测试 75CM HIGH,3 TIMES ON HARD BOARD 75 厘米高，3 次坠落在硬木质板上 F/F≤±5ppm △F/Rr ≤±10% Oor 2 Ω BETTER,20%
7 AGING TEST
老化测试 85℃ Dynamic 1000hrs 85℃ 动态测试1000 小时 F/F≤±5ppm △ F/Rr ≤ ± 10% or 2 Ω BETTER,20% CCELERATED AGING 加速老化测试 125 ℃ ± 3 ℃ ,TIME:168 hrs. Dynamic 125℃±3℃,的动态下:168 小时. F/F≤±5ppm △ F/Rr ≤ ± 10% or 2 Ω BETTER,20%
9 SALT SPRAY
盐水喷雾试验 5%NaCL 35 ℃±2 ℃CHAMBER,48hrs.PH 值:6.5~7.2 5% NaCL(碳酸钠),35℃±2℃的温箱里,48 小时 PH 值:6.5～7.2 1.NO CORROSION ON LEAD&CAN 1.基座和外壳无腐蚀 F/F≤±5ppm △ F/Rr ≤ ± 10% or 2 Ω BETTER,20% 24.0000M SMD3225 http://www.lgesemi .com mail:lge@lgesemi.comRevision:20160808-P1
120 SEC
10 SEC
- 150℃ 60--120Sec Max 2. 200℃ 20--30Sec Max 3. 260℃ 10Sec Max HIGH-LOW TEM. STORAGE(STATIC) 高低温储存（静态测 HIGH TEM:125℃±2℃,1000hrs 高温:125℃±2℃,1000 小时 LOW TEM:-40℃±3℃,1000hrs 低温:-40℃±3℃,1000 小时 F/F≤±5ppm △ F/Rr ≤ ± 10% or 2 Ω BETTER,20% HIGH TEM. & HUM. STORAGE TEST 高温高湿储存试验 TEM:40℃±2℃ HUM:83%-88%,96hrs 小时 F/F≤±5ppm △ F/Rr ≤ ± 10% or 2 Ω BETTER,20% TEM. & HUM. CYCLING TEST 温湿度循环测试 cycle' HUM:93±3% 5 cycles 3%, 24 小时为 1 循环, 运行5 个循环 F/F≤±5ppm △ F/Rr ≤ ± 10% or 2 Ω BETTER,20% HIGH-LOW TEM. OPERATING TEST 高-低温运行测试 HIGH TEM:85℃±2℃,2hrs 高温:85℃±2℃,运行 2 小时 LOW TEM:-30℃±2℃,2hrs 低温:-30℃±2℃运行 2 小时 F/F≤±5ppm △ F/Rr ≤ ± 10% or 2 Ω BETTER,20% FREQUENCY/Rr V.S OPERATING TEM.. 频率/电阻在操作温 度下之变化测试 0℃～70℃ 'MEASURE POINT: EVERY 10℃ DEVIATION. 0℃～70℃ 测试点:依每 10℃测试一值 AS SPECIFICATION 依客户要求 HIGH LOW SHOCK 高低温冲击 SPECIFICATION 规格说明: △F/F≤±5ppm △F/Rr≤±10% or 2Ω BETTER,20% 260℃ MAX 150 ± 24.0000M SMD3225 http://www.lgesemi .com mail:lge@lgesemi.comRevision:20160808-P1