SMD2018 SUNMATE | Alldatasheet
Document overview
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Technical content
0.3A to 2.0A.This series is suitable for
applications
60V. l I(hold): 0.3~2.0A l Very high voltage surge capabilities l Available in lead-free version l Fast response to fault current l RoHS compliant, Lead-Free and Halogen-Free l Low resistance l Compact design saves board space l Compatible with high temperature solders l USB peripherals l Disk drives l CD-ROMs l General electronics l Disk drives l Set-top-box and HDMI l Mobile Internet Device (MID) l PDAs / digital cameras l Game console port protection l Plug and play protection for motherboards and peripherals l Mobile phones - battery and port protection Environmental Specifications Test Conditions Resistance change Passive aging +85℃,1000 hrs ±5% typical Humidity aging +85℃，85%R.H.,168 hours ±5% typical Thermal shock +85℃ to -40℃，20times ±33% typical Resistance to solvent MIL-STD-202，Method 215 No change Vibration MIL-STD-202，Method 201 No change Ambient operating conditions : - 40 °C to +85 °C Maximum surface temperature of the device in the tripped state is 125 °C - / - F10 2 P Surface Mount Device Current Rating Device size code T XXD MS X Polytronics Symbol T: Thin Version (Optional) Special Voltage Rating (Optional) F: Lead-free SMD2018P Series POSITIVE THERMAL COEFFICIENT(PTC) Part Number Code
Description
Ihold Itrip Vmax Max. Time to Trip Imax Pd typ Rimin R1max Package A A VDC Current A Tmax S A W Ω Ω 2 4 10 8 2.4 35 1.1 0.03 0.10 2018 V max = Maximum operating voltage device can withstand without damage at rated current (Imax). I max = Maximum fault current device can withstand without damage at rated voltage (V max). I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. Thermal Derating Chart-Ih(A) Part Number Ambient Operation Temperature -40 ºC -20 ºC 0 ºC 25 ºC 40 ºC 50 ºC 60 ºC 70 ºC 85 ºC SMD2018P030TF SMD2018P050TF SMD2018P075TF SMD2018P100TF SMD2018P100TF/33 SMD2018P150TF SMD2018P200TF Type Number SMD2018P030TF SMD2018P050TF SMD2018P075TF SMD2018P100TF SMD2018P100TF/33 SMD2018P150TF SMD2018P200TF
Thermal Derating Curve Average Time-Current Curve Soldering Parameters Reflow Condition Pb - Free assembly Pre Heat -Temperature Min (Ts(min)) 150°C -Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 -180 Seconds Average ramp up rate ( Liquids Temp TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflo w - Temperature (TL) (Liquids) 217°C - Time (min to max) (ts) 60 -150 Seconds Peak Temperature (TP) 260 +0/-5°C Time within 5°C of actual peak Temperature (tp) 20 - 40 Seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max Do not exceed 260°C Lead style code Recommended Pad Layout (mm.) Ramp-down Preheat Critical Zone TL to TP Time to peak temperature (t 25℃ to peak) TP TL TS(max) TS(min) Temperature Ramp-up Time -40 - 20 0 20 40 60 80 Temperature (°C) 160 140 120 100 Percentage of Derated Current Time In Seconds Derating Curves for SMD2018 Series Current in Amperes Average Time Current Curves 100 0.1 0.01 0.1 1 10 100 0.30A 0.55 0.75 1.10A 1.50A 2.00A
Package Dimensions (mm) Package Dimensions (in) A B C D A B C D min max min max min max min min max min max min max min Taping and Reel Specifications Symbol Millimeters Inches W 12±0.20 0.472±0.008 D1(max.) 178.0 7.007 D2(min.) 50 1.969 Part Number Halogen Free Packaging Option Quantity Quantity & Packaging Codes SMD2018P030,050TF Yes Tape and Reel 1500 YR Other Yes Tape and Reel 2500 YR SMD2018P030TF SMD2018P050TF SMD2018P075TF SMD2018P100TF SMD2018P100TF/33 SMD2018P150TF SMD2018P200TF