SMD0603 UNSEMI | Alldatasheet

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Revision March 1,2022 www.unsemi.com.tw For technical questions, contact: tech@unsemi.com.tw Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information.1/5 SMD0603 Series Surface Mount Resettable PTCs Electrical Parameters Part Number I trip (A) I hold (A) V max (Vdc) I max (A) Pdtyp. (W) Maximum Time To Trip Resistance Time (Sec.) Current (A) R min (Ω) Marking R 1max (Ω) The SMD0603 Series PTC provides surface mount over-current protection for applications where space is at a premium and reset table protection is desired.  RoHS compliant, Lead-Free and Halogen-Free  Faster tripping, 0603 Dimension  Compact design saves board space  Compatible with high temperature solders  Agency recognition: UL  Low-profile  Battery PCM  PDAs & Charger, Analog & digital line card  Digital cameras  General electronics  USB peripherals  Power ports I hold= Hold current: maximum current device will pass without tripping in 25°C still air. I trip= Trip current: minimum current at which the device will trip in 25°C still air. V max= Maximum voltage device can withstand without damage at rated current (Imax) I max= Maximum fault current device can withstand without damage at rated voltage (Vmax) Pdtyp.= Power dissipated from device when in the tripped state at 25°C still air. R min= Minimum resistance of device in initial (un-soldered) state. R max= Maximum resistance of device in initial (un-soldered) state. R 1max= Maximum resistance of device at 25°C measured one hour after tripping.

Revision March 1,2022 www.unsemi.com.tw For technical questions, contact: tech@unsemi.com.tw ROHS Surface Mount Resettable PTCs Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information. SMD0603 Series Temperature Rerating Chart – I hold (A) SMD0603-003 SMD0603-004 SMD0603-005 SMD0603-010 SMD0603-020 SMD0603-025 SMD0603-030 SMD0603-035 SMD0603-040 SMD0603-050 0.042 0.056 0.070 0.140 0.280 0.350 0.420 0.470 0.540 0.670 0.038 0.050 0.063 0.125 0.250 0.310 0.380 0.440 0.500 0.630 0.035 0.046 0.058 0.115 0.230 0.290 0.350 0.390 0.450 0.560 0.030 0.040 0.050 0.100 0.200 0.250 0.300 0.350 0.400 0.500 0.026 0.034 0.043 0.085 0.170 0.210 0.260 0.300 0.340 0.430 0.021 0.028 0.035 0.070 0.140 0.180 0.210 0.270 0.310 0.390 0.018 0.024 0.030 0.060 0.120 0.150 0.180 0.240 0.270 0.340 0.015 0.020 0.025 0.050 0.100 0.130 0.150 0.200 0.230 0.290 0.011 0.014 0.018 0.035 0.070 0.090 0.110 0.140 0.160 0.200 Ambient Operation Temperature Part Number Hold Current (A) Test Procedures and Requirement Test Item Test Conditions Accept/Reject Criteria RMIN ≤ R ≤ R1MAX T ≤ Maximum Time to Trip No trip No arcing or burning No arcing or burning In still air at 25°C Specified current, VMAX, 25°C 30min, at IH, 25°C VMAX, Imax, 100cycles VMAX, 1 hour Initial Resistance Time to Trip Hold Current Trip Cycle Life Trip Endurance Physical Characteristics Terminal Materials Tin-Plated Nickle-copper Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.Soldering Zone Environmental Specifications Test Item Test Conditions Resistance Change 85°C ,1000 hours 85°C/85%RH.1000 hours MIL-STD-202,Method 107G +85 °C/-40°C ,20 times MIL-STD-202,Method 215 ML-STD-883C,Test Condition A Passive Aging Humidity Aging Thermal Shock Solvent Resistance Vibration ±10% typical ±5% typical -30% typical No change No change

Revision March 1,2022 www.unsemi.com.tw For technical questions, contact: tech@unsemi.com.tw ROHS Surface Mount Resettable PTCs Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information.3/5 SMD0603 Series Soldering Parameters ROHS Part Numbering System SMD 0603 XXX X/ Max Voltage Rating Holding current Rating SMD  Recommended reflow methods: IR , vapor phase oven, hot air oven, N2 environment for lead-free.  Devices are not designed to be wave soldered to the bottom side of the board.  Recommended maximum paste thickness is 0.25mm(0.010inch).  Devices can be cleaned using standard industry methods and solvents.  Soldering temperature profile meets RoHs lead free process. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements Lead–free assembly 150°C 200°C 60 -120 Seconds 3°C/second max 3°C/second max 217°C 60 -150 Seconds 260 +0/-5°C

30 Seconds

3°C/second max 8 minutes Max 260°C Reflow Condition Pre Heat -Temperature Min (Ts(min)) -Temperature Max (Ts(max)) - Time (min to max) (TS) Average ramp up rate ( Liquidus Temp TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Time (min to max) (TS) Peak Temperature (TP) Do not exceed Time 25°C to peak Temperature (TP) Time within 5°C of actual peak Temperature (TP) Ramp-down Rate TimeTime to peak temperature (t25℃ to peak) Preheat Ts(min) Ts(max) TL TL TP temperature Ramp-up Ramp-down Critical Zone TL toTP TP Ts Caution: 1aIf reflow temperatures exceed the recommended profile, devices may not meet the performance requirements 2aOperation beyond the specified rating may result in damage and possible arcing and flame. 3aPPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated.

Surface Mount Resettable PTCs Revision March 1,2022 www.unsemi.com.tw For technical questions, contact: tech@unsemi.com.tw ROHS Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information.4/5 SMD0603 Series Dimensions Unit: mm Layout Dimensions Unit: mm ROHS SMD0603-003 SMD0603-004 SMD0603-005 SMD0603-010 SMD0603-020 SMD0603-025 SMD0603-030 SMD0603-035 SMD0603-040 SMD0603-050 SMD0603 Series 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.85 1.85 1.85 1.85 1.85 1.85 1.85 1.85 1.85 1.85 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 1.05 1.05 1.05 1.05 1.05 1.05 1.05 1.05 1.05 1.05 0.40 0.40 0.40 0.40 0.40 0.40 0.40 0.40 0.50 0.50 0.90 0.90 0.75 0.75 0.75 0.75 0.75 0.75 1.20 1.20 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.40 0.40 0.40 0.40 0.40 0.40 0.40 0.40 0.40 0.40 Part Number Part Number F Normal Value Normal Value Normal Value G H A B C D E C A MarkingB D E F F H G

Surface Mount Resettable PTCs Revision March 1,2022 www.unsemi.com.tw For technical questions, contact: tech@unsemi.com.tw ROHS Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information.5/5 SMD0603 Series

Ordering Information

Tape Specification and Reel Specifications Coverning Specifications EIA 481-1(Unit:mm) ELA Tape Component Dimentions EIA Reel Dimentions ROHS Part Number Quantity SMD0603-003 SMD0603-004 SMD0603-005 SMD0603-010 SMD0603-020 SMD0603-025 SMD0603-030 SMD0603-035 SMD0603-040 SMD0603-050 W F T Leader min. Traile min. 8.00±0.10 4.00±0.10 4.00±0.10 2.00±0.05 0.95±0.10 1.85±0.10 1.55±0.05 3.50±0.05 1.75±0.10 0.20±0.02 390 160 5,000 pcs/Reel 5,000 pcs/Reel 5,000 pcs/Reel 5,000 pcs/Reel 5,000 pcs/Reel 5,000 pcs/Reel 5,000 pcs/Reel 5,000 pcs/Reel 4,000 pcs/Reel 4,000 pcs/Reel Reel Dimensions A N 178±1.0 59±1.0 8.5 + 1.0/-0.2 12.0±1.0 T D0 WF Cover tape Embossment A W2(measured) W1(measured) N(hud die.) Cover tape Camier tape Embossed cavity

Revision March 1,2022 www.unsemi.com.tw For technical questions, contact: tech@unsemi.com.tw ROHS Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information. Disclaimer ROHS UNSEMI RESERVES THE RIGHT TO MAKE CHANGE ON OUR PRODUTS , PRODUCTS SPECIFICATION AND DATA WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. UN SEMICONDUCTOR LIMITED its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “UNSEMI”)does not give any representations or warranties for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. In no event shall UNSEMI be liable for any indirect, incidental, punitive, special or consequential damages (including any and all implied warranties, warranties of fitness for particular purpose, non-infringement and merchantability.) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Statements regarding the suitability of products for certain types of applications are based on UNSEMI knowledge of typical requirements that are often placed on UNSEMI products in generic applications. Such statements are not binding, statements about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer's technical experts. Product specifications do not expand or otherwise modify UNSEMI's terms and conditions of purchase, including but not limited to the warranty expressed therein. Unless otherwise agreed in writing, UNSEMI product is not designed, authorized or warranted to be suitable for use in medical life-saving, or life-sustaining application , nor in applications where failure or malfunction of a UNSEMI product can reasonably be expected to result in personal injury, death or severe property or environmental damage. UNSEMI and its suppliers accept no liability for inclusion or use of UNSEMI products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. All referenced brands, product names, service names and trademarks are the property of their respective owners.