SMD030L HUAXINAN | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
Features
RoHS Compliant & Halogen Free faster tripping, 2920 Dimension, Surface mountable, Solid state Operation Current: 0.30A~3.0A Maximum Voltage: 6V~60Vdc Operating Temperature:-40℃ to +85℃ Agency recognition: Dimensions(7555mm/ 2920 mils) Unit: mm Terminalpadmaterials :Tin-Plated Nickle-copper Terminalpadsolderability :Meets EIAspecification RS186-9EandANSI/J-STD-002 Category3. Specificationsaresubjecttochangewithoutnotice 1 Tel: +86-755-27465585 HUAAN LIMITED www.huaandz.com Email: sales@huaandz.com Part number Marking A B C D E Certification DeliveryTime Min max Min Max Min Max Min Min UL TUV in stock Produce
ThermalDeratingChart-IH(A) Maximumambient operatingtemperatures ℃ Part Number -40℃ -20℃ 0℃ 25℃ 40℃ 50℃ 60℃ 70℃ 85℃ Electrical characteristics(25℃) Part Number I Hold I Trip Vmax Imax Pd Max Maximum Time to Trip Resistance(Ω) Certification Delivery Time A A DC A W Current (A) Time (S) Rimin R1max UL TUV in stock Produce Specificationsaresubjecttochangewithoutnotice 2 Tel: +86-755-27465585 HUAAN LIMITED www.huaandz.com Email: sales@huaandz.com
Electrical characteristics(25℃) Ihold =HoldCurrent.Maximum currentdevice will nottrip in 25°Cstill air. Itrip =TripCurrent. Minimumcurrentatwhichthe devicewillalways tripin 25°Cstill air. Vmax =Maximum operatingvoltage devicecanwithstand without damageatrated current(Imax). Imax =Maximumfaultcurrentdevice canwithstand without damageatrated voltage (Vmax). Pd=Maximumpower dissipationwhen deviceis inthe tripped statein25°Cstill airenvironmentatrated voltage. Rimin/max =Minimum/Maximum deviceresistance priortotripping at25°C. R1max =Maximum deviceresistanceis measuredonehour postreflow. PartnumberSystem SMD -XXX-L
2920 Dimension
Test Procedures and Requirements Test TestConditions Accept/RejectCriteria Resistance Instill air@25℃ Rmin ≤R≤Rmax TimetoTrip Specifiedcurrent,Vmax,25℃ TmaximumTimetoTrip Hold Current 30min,atIH Notrip TripCycleLife Vmax,Imax,100cycles Noarcing orburning TripEndurance Vmax,1hours Noarcing orburning PhysicalCharacteristicsandEnvironmentalSpecifications PhysicalCharacteristics Terminal materials : Tin-Plated Nickle-copper Soldering zone Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3. EnvironmentalSpecifications Test Conditions Resistancechange Passiveaging +85℃,1000hours ±10% Humidityaging +85℃/85%R.H.1000hours ±5% Thermalshock MIL-STD-202,Method 107G,+85℃/-40℃,20times -30%typical resistancechange SolventResistance MIL-STD-202,Method 215 Nochange Vibration ML-STD-883C,TestConditionA Nochange Specificationsaresubjecttochangewithoutnotice 3 Tel: +86-755-27465585 HUAAN LIMITED www.huaandz.com Email: sales@huaandz.com
RecommendedPadlayout(mm) Solderreflowconditions ProfileFeature Pb-FreeAssembly Averageramp-uprate(TSmaxtoTP) 3℃/second max. Preheat -TemperatureMin(TSmin) -TemperatureMax (TSmax) -Time(minto max)(TSmin toTSmax) 150℃ 200℃ 60-180seconds Timemaintainedabove: -Temperature(TL) -Time(tL) 217℃ 60-150 seconds PeakTemperature(TP) 260℃ Timewithin5℃ofactualPeakTemperature (tP) 20-40seconds Ramp-down Rate 3℃/second max. Time25℃toPeakTemperature 8minutes max. StorageCondition 0℃~35℃,≤70%RH
- Recommended reflowmethods: IR,vaporphaseoven, hotairoven, N2environmentforlead-free Specificationsaresubjecttochangewithoutnotice 4 Tel: +86-755-27465585 HUAAN LIMITED www.huaandz.com Email: sales@huaandz.com
- Devices are notdesignedto bewave soldered tothe bottom side ofthe board.
- Recommended maximum pastethicknessis 0.25mm(0.010 inch)
- Devicecan be cleanedusing standardindustry methods and solvents.
- Soldering tempratureprofile meetsRoHsleadfree process. Note:Ifreflowtemperatures exceedthe recommended profile,devices maynotmeetthe performance Requirements TapeSpecificationandReelDimensions Tape Symbol Dimensions(mm) W 16.00±0.30 F 7.50±0.1 E 1.75±0.10 D0 1.55±0.05 D1 1.50(MIN) P0 4.00±0.10 P1 8.00±0.10 P2 2.00±0.10 A0 5.74±0.10 B0 8.02±0.10 T 0.30±0.10 Leadermin 390 Trailermin 160 Reel C Φ180±3.0 D Φ60.0±0.5 H 19.5±1.0 W 17.0±0.2 PackagingQuantity Part Number Quantity Part Number Quantity Part Number Quantity SMD030L 2000PCS SMD150L 2000PCS SMD260L 2000PCS SMD050L 2000PCS SMD185L 1500PCS SMD300L-6 2000PCS SMD075L 2000PCS SMD200L 2000PCS SMD300L-16 1500PCS SMD100L 2000PCS SMD200L-24 1500PCS -- -- SMD125L 2000PCS SMD250L 2000PCS -- -- Specificationsaresubjecttochangewithoutnotice 5 Tel: +86-755-27465585 HUAAN LIMITED www.huaandz.com Email: sales@huaandz.com
Resettable Fuse PTC SMD2920 Series Storage Themaximumambient temperature shallnotexceed38℃.Storagetemperatures higherthan 38℃ couldresultin the deformation ofpackagingmaterials.Themaximum relativehumidityrecommended forstorage is60%.Highhumiditywith hightemperaturecanaccelerate the oxidationofthe solderplatingon the termination andreducethe solderabilityof the components.Sealedplastic bags with desiccantshallbe used toreduce the oxidationof the termination andshallonly be opened priorto use.Theproductsshallnotbestoredinareaswhereharmfulgasescontainingsulfurorchlorinearepresent. Warning
- UsePPTCbeyondthe maximum ratings orimproperuse mayresult indevicedamage and possibleelectrical arcing and flame.
- PPTCare intendedforprotection againstoccasionalovercurrentorovertemperaturefaultconditions andshouldnot be usedwhen repeated faultconditions orprolongedtrip eventsare anticipated.
- Deviceperformance canbe impactednegativelyifdevices are handled inamannerinconsistent with recommended electronic,thermal,andmechanicalproceduresforelectronic components.
- UsePPTCwith alarge inductancein circuitwillgenerate acircuitvoltage(Ldi/dt)above therated voltage ofthe PPTC.
- AvoidimpactPPTCdeviceitsthermalexpansionlikeplacedunderpressureorinstalledinlimitedspace.
- ContaminationofthePPTCmaterialwith certainsiliconbasedoilsorsomeaggressivesolventscanadverselyimpactthe performanceofthe devices.PPTCSMDcan be cleanedby standard methods.
- Requests thatcustomerscomply with ourrecommendedsolderpadlayouts andrecommendedreflowprofile.Improper board layoutsorreflowprofilecould negativelyimpactsolderability performanceofourdevices. Notes Thespecificationis intendedtopresentapplication,productandtechnical data toassistthe userin selecting PPTCcircuit production devices,However,usersshouldimdependently evaluateand testthe suitability ofeachproduct.HUAANmakes onwarranties as tothe acduracyorcompleteness ofthe informationanddisclaimsany liatilityresultingform itsuse, HUAAN’sonlyobligations arethoseim theHUAANStandardRermsandConditionsofSaleandinnocasewillHUAANbe liableforany incidental,imdirect,orconsequentialdamagesarisingfrom the sale,resale,ormisuesof its products.HUAAN reservesthe right tochangeofupdate, withoutnotice,any informationcontained inthis specification. Specificationsaresubjecttochangewithoutnotice 6 Tel: +86-755-27465585 HUAAN LIMITED www.huaandz.com Email: sales@huaandz.com