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Technical content

Features

The SMCJ series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.

Description

Parameter Symbol Value Unit Peak Pulse Power Dissipation at TA=25ºC by 10/1000µs Waveform (Fig.2)(Note 1), (Note 2), (Note 5) PPPM 1500 W Power Dissipation on Infinite Heat Sink at T L=50OC PD 6.5 W Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) I FSM 200 A Maximum Instantaneous Forward Voltage at 100A for Unidirectional Only (Note 4) V F 3.5/5.0 V Operating Temperature Range TJ -65 to 150 °C Storage Temperature Range TSTG -65 to 175 °C Typical Thermal Resistance Junction to Lead R θJL 15 °C/W Typical Thermal Resistance Junction to Ambient R θJA 75 °C/W Notes: 1 . Non-repetitive current pulse , per Fig. 4 and derated above TJ (initial) =25OC per Fig. 3. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum. 4. VF < 3.5V for single die parts and VF< 5.0V for stacked-die parts. 5. The PPPM of stacked-die parts is 2000W and please contact littelfuse for the detail stacked-die parts. Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Agency Approvals AGENCY AGENCY FILE NUMBER E230531

  • 1500W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%
  • Excellent clamping capability
  • Low incremental surge resistance
  • Typical I R less than 1μA when VBR min>12V
  • For surface mounted applications to optimize board space
  • Low profile package
  • Built-in strain relief
  • Typical failure mode is short from over-specified voltage or current
  • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
  • IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
  • ESD protection of data lines in accordance with IEC 61000-4-2
  • EFT protection of data lines in accordance with IEC 61000-4-4
  • Fast response time: typically less than 1 .0ps from 0V to BV min
  • Glass passivated chip junction
  • High temperature to reflow soldering guaranteed: 260°C/40sec
  • V BR @ TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT :Temperature Coefficient, typical value is 0.1%)
  • Plastic package is flammability rated V-0 per Underwriters Laboratories
  • Meet MSL level1, per J-STD-020, LF maximun peak of 260
  • Matte tin lead–free plated
  • Halogen free and RoHS compliant
  • Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD- 609A.01) SMCJ Series Uni-directional Bi-directional Functional Diagram Bi-directional Uni-directional Cathode Anode RoHS Pb e3 Datasheet Additional Infomarion Resources Samples

T ransient Voltage Suppression Diodes © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 Surface Mount – 1500W > SMCJ series Electrical Characteristics (TA=25°C unless otherwise noted) Part Number (Uni) Part Number (Bi) Marking Reverse Stand off Voltage VR (Volts) Breakdown Voltage VBR (Volts) @ IT Test Current IT (mA) Maximum Clamping Voltage VC @ Ipp (V) Maximum Peak Pulse Current Ipp (A) Maximum Reverse Leakage IR @ VR (µA) Agency Approval UNI BI MIN MAX For parts without A , the VBR is ± 10% and VC is 5% higher than with A parts For bidirectional type having VR of 10 volts and less, the IR limit is double.

T ransient Voltage Suppression Diodes © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 Surface Mount – 1500W > SMCJ series Physical Specifications Weight 0.007 ounce, 0.21 grams Case JEDEC DO214AB. Molded plastic body over glass passivated junction Polarity Color band denotes positive end (cathode) except Bidirectional. T erminal Matte Tin-plated leads, Solderable per JESD22-B102 Dimensions Soldering Parameters Temperature (T Time (t) Ts(min) Ts(max) TL TP ts Preheat tL tp Ramp-up Critical Zone TL to TP Ramp-down t 25˚C to Peak 25˚C Reflow Condition Lead–free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus Temp (TA) to peak 3°C/second max TS(max) to TA - Ramp-up Rate 3°C/second max Reflow - Temperature (TA) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Dimensions Inches Millimeters Min Max Min Max A 0.114 0.126 2.900 3.200 B 0.260 0.280 6.600 7. 11 0 C 0.220 0.245 5.590 6.220 D 0.079 0.103 2.060 2.620 E 0.030 0.060 0.760 1 .520 F - 0.008 - 0.203 G 0.305 0.320 7 .750 8.130 H 0.006 0.012 0.152 0.305 I 0.129 - 3.300 - J 0.094 - 2.400 - K - 0.165 - 4.200 L 0.094 - 2.400 - Environmental Specifications High T emp. Storage JESD22-A103 HTRB JESD22-A108 T emperature Cycling JESD22-A104 MSL JEDEC-J-STD-020, Level 1 H3TRB JESD22-A101 RSH JESD22-A111 (all dimensions in mm) I LKJ Solder Pads DO-214AB (SMC J-Bend) B F G H E C D A Cathode Band (for Uni-directional products only)

T ransient Voltage Suppression Diodes © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 Surface Mount – 1500W > SMCJ series Part Numbering System Packaging Part number Component Package Quantity Packaging Option Packaging Specification SMCJxxxXX DO-214AB 3000 Tape & Reel - 16mm tape/13” reel EIA STD RS-481 Part Marking System VR VOLTAGE BI-DIRECTIONAL 5% VBR VOLTAGE TOLERANCE SERIES SMCJ XXX CA F XXX YMXXX Marking Code Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code Littelfuse Logo Cathode Band (for Uni-directional products only) T ape and Reel Specification 0.63 (16.0) 0.315 (8.0) 0.157 (4.0) 0.65 (16.4) 0.80 (20.2) Arbor Hole Dia. 13.0 (330) Dimensions are in inches (and millimeters). Direction of Feed 0.059 DIA(1.5) Cover tape Cathode