SMCJ-HR

SMCJ-HR LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

The SMCJ-HR High Reliability series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.

Description

Parameter Symbol Value Unit Peak Pulse Power Dissipation at TA=25ºC by 10/1000µs waveform (Fig.1)(Note 1), (Note 2) PPPM 1500 W Power Dissipation on infinite heat sink at TL=50OC PM(AV) 6.5 W Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) IFSM 200 A Maximum Instantaneous Forward Voltage at 100A for Unidirectional only (Note 4) VF 3.5/5.0 V Operating Junction and Storage Temperature Range TJ, TSTG -65 to 150 °C Typical Thermal Resistance Junction to Lead RuJL 15 °C/W Typical Thermal Resistance Junction to Ambient RuJA 75 °C/W Notes: 1 . Non-repetitive current pulse , per Fig. 3 and derated above TA = 25OC per Fig. 2. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional component only, duty cycle=4 per minute maximum. Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Agency Approvals AGENCY AGENCY FILE NUMBER E230531 Functional Diagram Bi-directional Uni-directional Cathode Anode SMCJ-HR Series Bi-directional Uni-directional

• SMT for minimal board footprint
• Low profile package
• Built-in strain relief
• VBR @TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT :Temperature Coefficient)
• Glass passivated chip junction
• 1500W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%
• Fast response time: typically less than 1 .0ps from 0V to BV min
• Excellent clamping capability
• Low incremental surge resistance
• Typical IR ≤ 1µA for VR > 11 .10V
• High Temperature soldering guaranteed: 260°C/40 seconds at terminals
• UL Recognized compound meeting flammability rating V-0
• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
• Matte tin lead–free plated
• Halogen free and RoHS compliant
• 2nd level interconnect is Pb-free per IPC/JEDEC J-STD-609A.01 SMCJ-HR components are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic RoHS e3Pb

T ransient Voltage Suppression Diodes © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/28/18 Surface Mount – 1500W > SMCJ-HR Series

Electrical Characteristics

(Uni) Part Number (Bi) Marking Reverse Stand off Voltage VR (Volts) Breakdown Voltage VBR (Volts) @ IT Test Current IT (mA) Maximum Clamping Voltage VC @ Ipp (V) Maximum Peak Pulse Current Ipp (A) Maximum Reverse Leakage IR @ VR (µA) Agency Approval UNI BI MIN MAX Note: 1 . For bidirectional type having VR of 10 volts and less, the IR limit is double. 2. 100% High Temperature Storage Life test and Reflow Simulation. 3. 100% HTRB(High Temperature Reverse Bias). For Unidirectional, 150C/100%VR/96hours, for Bidirectional, 150C/100%VR/192hrs(96hours for each direction for Bidirectional). 4. Each lot of parts will pass group B test requirement.

T ransient Voltage Suppression Diodes © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/28/18 Surface Mount – 1500W > SMCJ-HR Series I-V Curve Characteristics Vc VBR VR IR IT Ipp V Uni-directional VF Vc VBR VR IR IT Ipp V VcVBRVR Ipp IR IT Bi-directional PPPM Peak Pulse Power Dissipation (IPP x VC) -- Max power dissipation VR Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation VBR Breakdown Voltage -- Maximum voltagethat flows though the TVS at a specified test current (IT) VC Clamping Voltage -- Peak voltage measured across the suppressor at a specified Ippm (peak impulse current) IR Reverse Leakage Current -- Current measured at VR VF Forward Voltage Drop for Uni-directional Group B T est Requirement Screen Method Condition Requirement Surge test 10/1000 µs Peak Pluse Waveform Maximum Clamping Voltage (VC) @ Peak Plus Current (IPP) Sample size 45 perform 10x Accept 0 failures Burn - In (HTRB) MIL -STD-750, Method 1038.5 Applied Voltage 100% VR@150°C Sample size 45 340 hours (680 hours for bi-direction products, each direction 340 hours) Accept 0 failures Electrical test -- IR@VR, V(BR)@IT Sample size 45 Accept 0 failures Screen Process 100% vision inspection MIL -STD-750 method 207 4 100%High T emperature Storage Life (168hrs,150C) MIL -STD-750 method 1031 100% X-RA Y inspection MIL -STD-750 method 2076 100% T emperature cycle test (-55-150C, 20 cycles, dwell time 15 min) MIL -STD-750 method 1051 100% Reflow (2X) JEDEC J-STD-020 100% surge test (2x) MIL -STD-750 method 4066 100% HTRB(150C, Bias=VR(80% breakdown voltage), 96hrs),for Bi- direction products, 96hrs for each direction MIL–STD–750 method 1038 Final electrical test( 100% 3 sigma limit, 100% dynamic test and PAT limit) MIL -STD-750 method 4016.4021 .4011 Note: Up-screen program can be specified by customer’s request via contacting Littlefuse service

T ransient Voltage Suppression Diodes © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/28/18 Surface Mount – 1500W > SMCJ-HR Series Physical Specifications Weight 0.007 ounce, 0.21 grams Case JEDEC DO214AB. Molded plastic body over glass passivated junction Polarity Color band denotes positive end (cathode) except Bidirectional. T erminal Matte Tin-plated leads, Solderable per JESD22-B102 Soldering Parameters Temperature (T Time (t) Ts(min) Ts(max) TL TP ts Preheat tL tp Ramp-up Critical Zone TL to TP Ramp-down t 25˚C to Peak 25˚C Reflow Condition Lead–free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 280°C Environmental Specifications High T emp. Storage JESD22-A103 HTRB JESD22-A108 Thermal Shock JESD22-A106 MSL JEDEC-J-STD-020, Level 1 H3TRB JESD22-A101 RSH JESD22-B106 100 120 140 160 180 200 11 0 100 Number of Cycles at 60 Hz IFSM - Peak Forward Surge Current (A) Figure 7 - Maximum Non-Repetitive Peak Forward Surge Current Uni-Directional Only

T ransient Voltage Suppression Diodes © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/28/18 Surface Mount – 1500W > SMCJ-HR Series Part Numbering System Packaging Part number Component Package Quantity Packaging Option Packaging Specification SMCJxxxXX-HR DO-214AB 500 Tape & Reel – 16mm tape/7” reel EIA STD RS-481 Part Marking System VOLTAGE BI-DIRECTIONAL 5% VOLTAGE TOLERANCE SERIES SMCJ -HR XXX CA HIGH RELIABILITY T ape and Reel Specification 0.63 (16.0) 0.315 (8.0) 0.157 (4.0) 0.65 (16.4) 0.80 (20.2) Arbor Hole Dia. 7.0 (187) Dimensions are in inches (and millimeters). Direction of Feed 0.059 DIA(1.5) Cover tape Cathode F XXXX YMXXX Marking Code Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code Littelfuse Logo Cathode Band Dimensions Dimensions Inches Millimeters Min Max Min Max A 0.114 0.126 2.900 3.200 B 0.260 0.280 6.600 7. 11 0 C 0.220 0.245 5.590 6.220 D 0.079 0.103 2.060 2.620 E 0.030 0.060 0.760 1 .520 F 0.002 0.008 0.051 0.203 G 0.305 0.320 7 .750 8.130 H 0.006 0.012 0.152 0.305 I 0.129 - 3.300 - J 0.094 - 2.400 - K - 0.165 - 4.200 L 0.094 - 2.400 - DO-214AB (SMC J-Bend) B F G H E C D A Cathode Band (for Uni-directional products only) (all dimensions in mm) I LKJ Solder Pads