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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 7

Technical content

Features

 Compact 8 pin DIP/SMD package  Built in active discharge circuit for fast turn-off  Fast Turn-On  Optional Parallel or Serial Output Connections  12V Gate Drive Voltage  High Input-to-Output Isolation (up to 5kV RMS)  Long Life / High Reliability  RoHS / Pb-Free / REACH Compliant SM8029

© 2013 Solid State Optronics • San José, CA Page 2 of 7 SM8029 /H/S/TR Rev 2.00 (11/12/2013) 001730 SM8029 Optically Coupled Dual MOSFET Driver w/Discharge Circuit Parameter Symbol Min. Typ. Max. Units Test Conditions Input Specifications LED Forward Voltage V F - 1.4 1.8 V I F = 10mA LED Reverse Voltage BV R 5 - - V I R = 10μA Reverse Leakage Current I InRleak - - 10 A VR = 5V Turn-On Current I F - 5 10 mA V OUT = 5V Turn-Off Current I F(OFF) - 0.5 - mA V OUT = 2V Output Specifications Open Circuit Voltage V OC 12 14 - V I F = 10mA Short Circuit Voltage I SC 10 15 - A IF = 10mA Isolation Specifications Isolation Voltage VISO 3750 - - VRMS RH ≤ 50%, t=1min (-H Option) 5000 - - Input-Output Resistance R I-O - 10 -  VI-O = 500VDC Electrical Characteristics, TA = 25°C (unless otherwise specified)

© 2013 Solid State Optronics • San José, CA Page 3 of 7 SM8029 /H/S/TR Rev 2.00 (11/12/2013) 001730 SM8029 Optically Coupled Dual MOSFET Driver w/Discharge Circuit Process Step Description Parameter A Preheat Start Temperature (ºC) 150ºC B Preheat Finish Temperature (ºC) 180ºC C Preheat Time (s) 90 - 120s D Melting Temperature (ºC) 230ºC E Time above Melting Temperature (s) 30s F Peak Temperature, at Terminal (ºC) 260ºC G Dwell Time at Peak Temperature (s) 10s H Cool-down (ºC/s) <6ºC/s SM8029 Solder Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Su rface temperature of device package should not exceed 250ºC: A B C D F E G H (2) Wave Solder: (3) Hand Solder: Maximum Temperature: 260ºC (at terminal) Maximum Time: 10s Pre-heating: 100 - 150ºC (30 - 90s) Single Occurrence Maximum Temperature: 350ºC (at tip of soldering iron) Maximum Time: 3s Single Occurrence Figure 1

© 2013 Solid State Optronics • San José, CA Page 4 of 7 SM8029 /H/S/TR Rev 2.00 (11/12/2013) 001730 SM8029 Optically Coupled Dual MOSFET Driver w/Discharge Circuit All dimensions in inches [“] with millimeters in parenthesis ()

© 2013 Solid State Optronics • San José, CA Page 5 of 7 SM8029 /H/S/TR Rev 2.00 (11/12/2013) 001730 SM8029 Optically Coupled Dual MOSFET Driver w/Discharge Circuit 8 PIN SMD Surface Mount Package (-S) Note: All dimensions in inches [“] with millimeters in parenthesis ()

© 2013 Solid State Optronics • San José, CA Page 6 of 7 SM8029 /H/S/TR Rev 2.00 (11/12/2013) 001730 SM8029 Optically Coupled Dual MOSFET Driver w/Discharge Circuit

8 PIN SMD Tape & Reel (-STR) Note: All dimensions in millimeters

© 2013 Solid State Optronics • San José, CA Page 7 of 7 SM8029 /H/S/TR Rev 2.00 (11/12/2013) 001730 SM8029 Optically Coupled Dual MOSFET Driver w/Discharge Circuit Note: All weights above are in GRAMS, and include packaging materials where applicable Device Single Unit Full Tube (50pcs) Full Pouch (10 tubes) Full Reel (1000pcs) SM8029(-H) 0.54 43 450 - SM8029-(H)S 0.53 42 440 - SM8029-(H)STR 0.53 - - 952 Solid State Optronics (SSO) makes no warranties or representations with regards to the completeness and accuracy of this document. SSO reserves the right to make changes to product description, specifications at any time without further notices. SSO shall not assume any liability arising out of the application or use of any product or circuit described herein. Neither circuit patent licenses nor indemnity are expressed or implied. Except as specified in SSO’s Standard Terms & Conditions, SSO disclaims liability for consequential or other damage, and we make no other warranty, expressed or implied, including merchantability and fitness for particular use. DISCLAIMER SSO does not authorize use of its devices in life support applications wherein failure or malfunction of a device may lead to personal injury or death. Users of SSO devices in life support applications assume all risks of such use and agree to indemnify SSO against any and all damages resulting from such use. Life support devices are defined as devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when used properly in accordance with instructions for use can be reasonably expected to result in significant injury to the user, or (d) a critical component of a life support device or system whose failure can be reasonably expected to cause failure of the life support device or system, or to affect its safety or effectiveness. LIFE SUPPORT POLICY Date Code Pin 1 SM8029 YYWW