SM802109 MICREL | Alldatasheet

Document overview

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Technical content

Features

(1.875MHz to 20MHz): 105fs Industrial temperature range (–40 °C to +85°C)

  • Green, RoHS, and PFOS compliant
  • Available in 24-pin 4mm × 4mm QFN package

Applications

  • PCI-Express Block Diagram
  • Generate s four HCSL cl perating ran• 2.5V or 3.3V o
  • Typical phase jitter @ 1

Micrel, Inc. SM802109 September 2011 2 M9999-092911-B hbwhelp@micrel.com or (408) 955-1690 g Inf ion (1) arki Shipping Temperature R Package Orderin ormat Part Number M ng ange SM802109UMG 802109 Tube –40°C to +85°C 24-Pin QFN SM802109UMGTR 802109 Tape and Reel –40°C to +85°C 24-Pin QFN Note: 1. Devices are Green, RoHS, and PFOS compliant. Pin Configuration Pin Description Pin Number Nam Pin 4-Pin QFN Top View) Pin e Type Pin Level Pin Function 16, 17 /Q0, Q0 1, Q1 O, (DIF) ck Outputs from Bank 1 100MHz 20, 21 /Q HCSL Differential Clo 23, 24 3, 4 /Q2, Q2 /Q3, Q3 O, (DIF) HCSL Differential Clock Outputs from Bank 2 100MHz

1 VDDO2 PWR Power Supply for Output Bank 2

2 VSSO2 PWR Power Supply Ground for Output Bank 2

5 PLL_BYPASS I, (SE) LVCMOS

PLL Bypass, Selects Output Source 0 = Normal PLL Operation 1 = Output from Input Reference Clock or Crystal 45KΩ pulldown

6 XTAL_SEL I, (SE) LVCMOS

Selects PLL Input Reference Source 0 = REF_IN, 1 = XTAL, 45KΩ pullup

Micrel, Inc. SM802109 September 2011 3 M9999-092911-B hbwhelp@micrel.com or (408) 955-1690 iption (Con ber me Pin Typ Level Pin Function Pin Descr tinued) Pin Num Pin Na e Pin 7, 12, 15, 19 TEST Factory Test pins, Do not connect anything to these pins.

8 D PWR pply VD Core Power Su

13, 14 VSS osed Pa PWR pply Ground. The exposed pad must e connected to the VSS ground plane. (Exp d) Core Power Su b

18 PWR t Bank 1 VDDO1 Power Supply for Outpu

22 VSSO1 PWR Power Supply Ground for Output Bank 1

9 F_IN I, (SRE E) LVCMOS Reference Clock Input

10 XTAL_IN I, (SE) Crystal Crystal Reference Input, no load caps needed (see

Figure 5).

11 XTAL_OUT (SE) rystal Crystal Reference Output, no load caps needed (see

Figure 5). O, C Truth Table PLL_BYPASS XTAL_SEL INPUT OUTPUT 0 − − PLL 1 − − XTAL/REF_IN − 0 REF_IN − − 1 XTAL −

Micrel, Inc. SM802109 September 2011 4 M9999-092911-B hbwhelp@micrel.com or (408) 955-1690 o V –40°C to +85°C QFN (ψJB) acteri (4) O ±5 ±5% or 2.5V ±5% = −40°C rameter ion Min. Typ. Max. Units Absolute Maximum Ratings(1) DD + 0.5V 260°C 15°C QFN ( θJA) Operating Ratings(2) Junction Thermal Resistance(3) VDD = VDD 1/2 = 3.3V ±5% or 2.5V % VDD = 3.3V ±5%, VDDO1/2 = 3.3V TA to +85°C. Symbol Pa Condit VDD, VDDO1 o .37 2.5 2.625 V /2 2.5V Operating V ltage 2 5 VDD, VDDO1/2 3.3V Operating Voltage 3.135 3.3 3.465 V IDD XTAL_SEL = 0 Outputs 50Ω to VSS 140 175 mA REF_IN Supply current VDD + VDDO IDD Supply current VDD + XTAL VDDO XTAL_SEL = 1 Outputs 50Ω to VSS 150 185 mA HCSL D ha acteristics(4) ± ± in Typ. Max. Units C Electrical C r V = VDD DDO1/2 = 3.3V 5% or 2.5V 5% VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5% TA = −40°C to +85°C. RL = 50Ω to VSS Symbol Parameter Condition M VOH Output High Voltage 660 700 850 mV VOL Output Low Voltage -150 0 27 mV VCROSS Crossing Point Voltage 250 350 550 mV Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if t he device is operated beyond the operating ratings. 3. Package thermal resistance assumes exposed pad is soldered (o r equivalent) to the devices most negative potential on the PCB. 4. The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established.

Micrel, Inc. SM802109 September 2011 5 M9999-092911-B hbwhelp@micrel.com or (408) 955-1690 TAL_SEL) DC Electrical Characteristics(4) D ±5% A 40°C to +85°C. ymbo Condition Min. Ty Max. Units LVCMOS (PLL_BYPASS, X S l Parameter p. VIH o 2 V DD + 0.3 V Input High V ltage VIL o −0.3 0.8 V Input Low V ltage IIH Input High Current V DD = VIN = 3.465V 150 μA IIL Input Low Current V DD = 3.465V, VIN = 0V −150 μA REF_IN DC Electrical Characteristics(4) VDD = 3.3V ±5%, or 2.5V ± Symbol Pa ter Min. Ty Max. Units 5%, TA = −40°C to +85°C. rame Condition p. VIH Input High Voltage 1.1 V DD + 0.3 V VIL Input Low Voltage −0.3 0.6 V XTAL_SEL = VIL, VIN = 0V D − 5 μA to VD 5 I IN Input Current VIH, VIN = VDD 20 µA XTAL_SEL = Crystal Characteristics Parameter Condition Min. Typ. Max. Units Mode of Oscillation 10pF to 12pF Load Fundamental, Parallel Resonant Frequency 25 MHz Equivalent Series Resistance (ESR) 50 Ω Shunt Capacitor, C0 1 5 pF Correlation Drive Level 10 100 µW

Micrel, Inc. SM802109 September 2011 6 M9999-092911-B hbwhelp@micrel.com or (408) 955-1690 tics(4, 5) −40 0Ω to VS mbol Pa Condition Typ. Max. Units AC El ical Charectr acteris .5V ±5% VDD = VDDO1/2 = 3.3V ±5% or 2 VDD = 3 VDDO1/2 = 3 TA = °C to +85°C. RL = 5 S Sy rameter Min. FOUT uency 100 MHz Output Freq FREF t Freque 25 MHz Reference Inpu ncy TR/TF Output Rise/Fall Time 20% – 80% 150 300 450 ps LVPECL ODC Output Duty Cycle 48 50 52 % TSKEW utput Skew 45 ps Output-to-O Note 6 TLOCK PLL Lock Time 20 ms Tjit(∅) RMS Phase Jitter Integration Ran(7) 100MHz ge (1.875MHz – 20MHz) 105 250 fs Integration Range (12kHz – 20MHz) Spurious Noise Components 25MHz −95 dBc Notes: 5. All phase noise measurements were taken with an Agilent 5052B phase noise system. 6. Defined as skew between outputs at the same supply voltage and with equal load conditions; measured at the output differential crossing points. 7. Measured using 25MHz crystal as the i nput reference source. If using an external reference input, use a low phase noise source. With an external reference, the phase noise will follow the input source phase noise up to about 1MHz.

Micrel, Inc. SM802109 September 2011 7 M9999-092911-B hbwhelp@micrel.com or (408) 955-1690 ormation ting with a crystal input reference, do not ut as p ssible plies al load capacitance is built inside the die no Selecting a Family of Precision Synthesizers application note for details. Contact Micrel’s HBW applic ations group if you need assistance on selecting a suitable crystal fo our application at: hbwhelp@micrel.com Application Inf Input Reference When opera apply a switching signal to REF_IN. Crystal Layo Keep the layers under the crystal as open and do not place switching signals or noisy sup under the crystal. Cryst o so external capacitance is needed. See the Quartz crystal for the Cloc kworks Flex I further r y ed with 50Ω to VSS. For oad all outputs. If you want to AC- couple or change the termination, contact Micrel’s application group: hbwhelp@micrel.com HCSL Outputs HCSL outputs are to be terminat best performance l

Micrel, Inc. SM802109 September 2011 8 M9999-092911-B hbwhelp@micrel.com or (408) 955-1690 Phase Noise Plots Phase Noise Plot: 100MHz, 1.875MHz − 20MHz 104fS Phase Noise Plot: 100MHz, 12kHz − 20MHz 242fS

Micrel, Inc. SM802109 September 2011 11 M9999-092911-B hbwhelp@micrel.com or (408) 955-1690

Package Information

MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408 08) 474-1000 WEB http://www.micrel.com) 944-0800 FAX +1 (4 Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This information is not intended as a warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry, specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Micrel’s terms and conditions of sale for such products, Micrel assumes no liability whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2011 Micrel, Incorporated.