SM72238 TI | Alldatasheet
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www.ti.com SNVS694C –JANUARY 2011–REVISED APRIL 2013 MicropowerVoltageRegulator Check forSamples: SM72238 1FEATURES DESCRIPTION The SM72238 isa micropowervoltageregulatorwith 2• Renewable Energy Grade verylow quiescentcurrent(75µA typ.)and verylow• High-AccuracyOutput Voltage dropoutvoltage(typ.40mV atlightloadsand 380mV
- Ensured 100mA Output Current at 100mA). Itis ideallysuitedforuse in battery- powered systems.Furthermore,thequiescentcurrent• ExtremelyLow QuiescentCurrent of the SM72238 increasesonly slightlyin dropout,• Low Dropout Voltage prolongingbatterylife.
- ExtremelyTightLoad and LineRegulation The SM72238 is availablein the surface-mountD-• Very Low Temperature Coefficient Pak package.
- Use as Regulatoror Reference Carefuldesign of the SM72238 has minimizedall• Needs Minimum CapacitanceforStability contributionstotheerrorbudget.Thisincludesa tight
- Currentand Thermal Limiting initialtolerance(.5% typ.),extremelygood loadand lineregulation(.05% typ.)and a very low output• StableWith Low-ESR Output Capacitors voltage temperaturecoefficient,making the part(10mΩ to6Ω) usefulas a low-powervoltagereference. Block Diagram and TypicalApplications Figure1. SM72238 Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2011–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNVS694C –JANUARY 2011–REVISED APRIL 2013 www.ti.com Connection Diagrams FrontView Figure2. PFM Package See Package Number NDP0003B These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) InputSupplyVoltage −0.3to+30V Power Dissipation InternallyLimited JunctionTemperature(TJ) +150°C AmbientStorageTemperature −65° to+150°C SolderingDwellTime,Temperature Wave 4 seconds,260°C Infrared 10 seconds,240°C Vapor Phase 75 seconds,219°C ESD Rating Human Body Model(3) 2500V (1) AbsoluteMaximum Ratingsarelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsareconditionsunderwhich operationofthedeviceisensured.OperatingRatingsdo notimplyensuredperformancelimits.Forensuredperformancelimitsand associatedtestconditions,see theElectricalCharacteristicstables. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (3) Human Body Model 1.5kΩ inserieswith100pF. OperatingRatings(1) Maximum InputSupplyVoltage 30V JunctionTemperatureRange, (TJ)(2) −40° to+125°C (1) AbsoluteMaximum Ratingsarelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsareconditionsunderwhich operationofthedeviceisensured.OperatingRatingsdo notimplyensuredperformancelimits.Forensuredperformancelimitsand associatedtestconditions,see theElectricalCharacteristicstables. (2) Junction-to-casethermalresistanceforthePFM package is5.4°C/W.
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www.ti.com SNVS694C –JANUARY 2011–REVISED APRIL 2013 ElectricalCharacteristics(1) Parameter Conditions(1) Typ Tested Limit(2) Design Limit(3) Units 3V Versions OutputVoltage TJ = 25°C 3.0 3.030 V max
2.970 V min
−25°C ≤ TJ ≤ 85°C 3.0 3.045 V max
2.955 V min
FullOperatingTemperatureRange 3.0 3.060 V max
2.940 V min
OutputVoltage 100µA ≤ IL ≤ 100mA, 3.0 3.072 V max TJ ≤ TJMAX 2.928 V min 3.3VVersions OutputVoltage TJ = 25°C 3.3 3.333 V max
3.267 V min
−25°C ≤ TJ ≤ 85°C 3.3 3.350 V max
3.251 V min
FullOperatingTemperatureRange 3.3 3.366 V max
3.234 V min
OutputVoltage 100µA ≤ IL ≤ 100mA 3.3 3.379 V max TJ ≤ TJMAX 3.221 V min 5.0VVersions OutputVoltage TJ = 25°C 5.0 5.05 V max
4.95 V min
−25°C ≤ TJ ≤ 85°C 5.0 5.075 V max
4.925 V min
FullOperatingTemperatureRange 5.0 5.1 V max
4.9 V min
OutputVoltage 100µA ≤ IL ≤ 100mA 5.0 5.12 V max TJ ≤ TJMAX 4.88 V min AllVoltageOptions OutputVoltage See (4) 50 150 ppm/°C TemperatureCoefficient LineRegulation(5) (VO NOM + 1)V ≤ Vin≤ 30V (6) 0.04 0.2 % max 0.4 % max Load Regulation(5) 100µA ≤ IL ≤ 100mA 0.1 0.2 % max 0.3 % max DropoutVoltage(7) IL = 100µA 80 mV max 50 150 mV max IL = 100mA 450 mV max 380 600 mV max (1) UnlessotherwisespecifiedalllimitsensuredforVIN = (VONOM + 1)V,IL = 100µA and C L = 1µF.Limitsappearinginboldfacetypeapply overtheentirejunctiontemperaturerangeforoperation.LimitsappearinginnormaltypeapplyforTA = TJ = 25°C. (2) Ensuredand 100% productiontested. (3) Ensuredbutnot100% productiontested.These limitsarenotused tocalculateoutgoingAQL levels. (4) Outputorreferencevoltagetemperaturecoefficientisdefinedas theworstcase voltagechange dividedby thetotaltemperaturerange. (5) Regulationismeasured atconstantjunctiontemperature,usingpulsetestingwitha lowdutycycle.Changes inoutputvoltagedue to heatingeffectsarecoveredunderthespecificationforthermalregulation. (6) ForIL = 100µA and TJ = 125°C, lineregulationisensuredby designto0.2%.See TypicalPerformanceCharacteristicsforlineregulation versustemperatureand loadcurrent. (7) DropoutVoltageisdefinedas theinputtooutputdifferentialatwhichtheoutputvoltagedrops100 mV belowitsnominalvalue measured at1V differential.Atverylowvaluesofprogrammed outputvoltage,theminimum inputsupplyvoltageof2V (2.3Vover temperature)must be takenintoaccount. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SM72238
SNVS694C –JANUARY 2011–REVISED APRIL 2013 www.ti.com ElectricalCharacteristics(1)(continued) Parameter Conditions(1) Typ Tested Limit(2) Design Limit(3) Units Ground Current IL = 100µA 75 120 µA max 140 µA max IL = 100mA 8 12 mA max 14 mA max DropoutGround Current Vin= (VO NOM − 0.5)V, 110 170 µA max IL = 100µA 200 µA max CurrentLimit Vout= 0 160 200 mA max 220 mA max ThermalRegulation See (8) 0.05 0.2 %/W max OutputNoise, C L = 1µF (5V Only) 430 µV rms
10 Hz to100 kHz C L = 200µF 160 µV rms
C L = 3.3µF 100 µV rms (Bypass= 0.01µF) (8) Thermalregulationisdefinedas thechange inoutputvoltageata timeT aftera change inpower dissipationisapplied,excludingload orlineregulationeffects.Specificationsarefora 50mA loadpulseatVIN = 30V (1.25W pulse)forT = 10ms.
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www.ti.com SNVS694C –JANUARY 2011–REVISED APRIL 2013 TypicalPerformance Characteristics QuiescentCurrent Dropout Characteristics Figure3. Figure4. InputCurrent InputCurrent Figure5. Figure6. Output Voltage vs. Temperature of3 RepresentativeUnits QuiescentCurrent Figure7. Figure8. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SM72238
SNVS694C –JANUARY 2011–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) QuiescentCurrent QuiescentCurrent Figure9. Figure10. QuiescentCurrent ShortCircuitCurrent Figure11. Figure12. Dropout Voltage LineTransientResponse Figure13. Figure14.
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www.ti.com SNVS694C –JANUARY 2011–REVISED APRIL 2013 TypicalPerformance Characteristics(continued) Load TransientResponse Load TransientResponse Figure15. Figure16. Output Impedance RippleRejection Figure17. Figure18. RippleRejection RippleRejection Figure19. Figure20. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SM72238
SNVS694C –JANUARY 2011–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) Shutdown ThresholdVoltage LineRegulation Figure21. Figure22. Maximum Rated Output Current Thermal Response Figure23. Figure24. Output CapacitorESR Range Figure25.
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www.ti.com SNVS694C –JANUARY 2011–REVISED APRIL 2013 APPLICATION HINTS EXTERNAL CAPACITORS A 1.0µF (orgreater)capacitorisrequiredbetween theoutputand groundforstability.Withoutthiscapacitorthe partwilloscillate.Most typesoftantalumor aluminum electrolyticswork finehere;even filmtypeswork butare notrecommended forreasonsofcost.Many aluminum electrolyticshave electrolytesthatfreezeatabout−30°C, so solidtantalumsarerecommended foroperationbelow −25°C. The importantparametersofthecapacitorare an ESR of about 5Ω or lessand a resonantfrequencyabove 500kHz. The valueof thiscapacitormay be increasedwithoutlimit. Ceramic capacitorswhose valueisgreaterthan 1000pF shouldnot be connecteddirectlyfrom the SM72238 outputtoground.Ceramic capacitorstypicallyhave ESR valuesintherange of5 to10m Ω,a valuebelow the lowerlimitforstableoperation(seeFigure25). The reason forthe lowerESR limitisthatthe loopcompensationof the partrelieson the ESR of the output capacitorto providethe zero thatgivesadded phase lead.The ESR of ceramiccapacitorsisso low thatthis phase leaddoes not occur,significantlyreducingphase margin.A ceramicoutputcapacitorcan be used ifa seriesresistanceisadded (recommended valueofresistanceabout0.1Ω to2Ω). At lowervaluesofoutputcurrent,lessoutputcapacitanceisrequiredforstability.The capacitorcan be reduced to0.33µF forcurrentsbelow10mA or0.1µF forcurrentsbelow1mA. Unlikemany otherregulators,theSM72238 willremainstableand inregulationwithno loadinadditiontothe internalvoltagedivider.ThisisespeciallyimportantinCMOS RAM keep-aliveapplications. A 1µF tantalum,ceramicoraluminum electrolyticcapacitorshouldbe placedfromtheSM72238 inputtoground ifthereismore than10 inchesofwirebetween theinputand theAC filtercapacitororifa batteryisused as the input. REDUCING OUTPUT NOISE Inreferenceapplicationsitmay be advantageoustoreducetheAC noisepresentattheoutput.One method isto reducetheregulatorbandwidthby increasingthesizeoftheoutputcapacitor.Thisistheonlyway noisecan be reducedbutisrelativelyinefficient,as increasingthecapacitorfrom1µF to220µF onlydecreasesthenoisefrom 430µV to160µV rms fora 100kHz bandwidthat5V output. TypicalApplications *Minimum input-outputvoltagerangesfrom40mV to400mV, dependingon loadcurrent.Currentlimitistypically 160mA. Figure26. 5 VoltCurrentLimiter Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SM72238
SNVS694C –JANUARY 2011–REVISED APRIL 2013 www.ti.com Schematic Diagram
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www.ti.com SNVS694C –JANUARY 2011–REVISED APRIL 2013
REVISION HISTORY
Changes from RevisionB (April2013)toRevisionC Page Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SM72238
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) SM72238TD-3.3/NOPB Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.3 SM72238TD-3.3/NOPB.B Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.3 SM72238TD-5.0/NOPB Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR -40 to 125 S72238 SM72238TD-5.0/NOPB.B Active Production TO-252 (NDP) | 3 75 | TUBE Yes SN Level-2-260C-1 YEAR -40 to 125 S72238 SM72238TDE-3.3/NOPB NRND Production TO-252 (NDP) | 3 250 | SMALL T&R Yes SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.3 SM72238TDE-5.0/NOPB NRND Production TO-252 (NDP) | 3 250 | SMALL T&R Yes SN Level-2-260C-1 YEAR -40 to 125 S72238 SM72238TDX-3.3/NOPB NRND Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.3 SM72238TDX-5.0/NOPB NRND Production TO-252 (NDP) | 3 2500 | LARGE T&R Yes SN Level-2-260C-1 YEAR -40 to 125 S72238 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Addendum-Page 1
www.ti.com 23-May-2025 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SM72238TDE-3.3/NOPB TO-252 NDP 3 250 208.0 191.0 35.0 SM72238TDE-5.0/NOPB TO-252 NDP 3 250 208.0 191.0 35.0 SM72238TDX-3.3/NOPB TO-252 NDP 3 2500 356.0 356.0 36.0 SM72238TDX-5.0/NOPB TO-252 NDP 3 2500 356.0 356.0 36.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) SM72238TD-3.3/NOPB NDP TO-252 3 75 508 20 4165.6 3.1 SM72238TD-3.3/NOPB.B NDP TO-252 3 75 508 20 4165.6 3.1 SM72238TD-5.0/NOPB NDP TO-252 3 75 508 20 4165.6 3.1 SM72238TD-5.0/NOPB.B NDP TO-252 3 75 508 20 4165.6 3.1 Pack Materials-Page 3
www.ti.com PACKAGE OUTLINE C 10.42 9.40 6.73 6.35 6.22 5.97 1.27 0.88 5.46 4.96 2.285 4.57 1.02 0.64 3X 0.88 0.64
2.55 MAX
0.88 0.46 1.14 0.89 0.60 0.46 0.17
0.51 MIN
4.32 MIN
(2.345) (2.5) TO-252 - 2.55 mm max heightNDP0003B TRANSISTOR OUTLINE 4219870/A 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-252.
0.25 C A B
TOP & BOTTOM PKG OPTIONAL SEATING PLANE SCALE 1.500 A B
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
(4.57) 2X (1.3) 2X (2.15) (5.7) (5.5) (2.285)(4.38) (R0.05) TYP TO-252 - 2.55 mm max heightNDP0003B TRANSISTOR OUTLINE 4219870/A 03/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers 5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 8X SYMM PKG SEE SOLDER MASK DETAIL EXPOSED METAL METAL EDGE SOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAIL EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN 2X (2.15) 2X (1.3) (4.57) (4.38) (1.32) TYP (1.35) TYP (0.26) (R0.05) TYP 16X (1.12) 16X (1.15) TO-252 - 2.55 mm max heightNDP0003B TRANSISTOR OUTLINE 4219870/A 03/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. PKG SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 8X
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