SM72238TDE-3.0/NOPB

SM72238_14 TI1 | Alldatasheet

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www.ti.com SNVS694C –JANUARY 2011–REVISED APRIL 2013 MicropowerVoltageRegulator Check forSamples: SM72238 1FEATURES DESCRIPTION The SM72238 isa micropowervoltageregulatorwith 2• Renewable Energy Grade verylow quiescentcurrent(75µA typ.)and verylow• High-AccuracyOutput Voltage dropoutvoltage(typ.40mV atlightloadsand 380mV

• Ensured 100mA Output Current at 100mA). Itis ideallysuitedforuse in battery- powered systems.Furthermore,thequiescentcurrent• ExtremelyLow QuiescentCurrent of the SM72238 increasesonly slightlyin dropout,• Low Dropout Voltage prolongingbatterylife.
• ExtremelyTightLoad and LineRegulation The SM72238 is availablein the surface-mountD-• Very Low Temperature Coefficient Pak package.
• Use as Regulatoror Reference Carefuldesign of the SM72238 has minimizedall• Needs Minimum CapacitanceforStability contributionstotheerrorbudget.Thisincludesa tight
• Currentand Thermal Limiting initialtolerance(.5% typ.),extremelygood loadand lineregulation(.05% typ.)and a very low output• StableWith Low-ESR Output Capacitors voltage temperaturecoefficient,making the part(10mΩ to6Ω) usefulas a low-powervoltagereference. Block Diagram and TypicalApplications Figure1. SM72238 Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2011–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNVS694C –JANUARY 2011–REVISED APRIL 2013 www.ti.com Connection Diagrams FrontView Figure2. PFM Package See Package Number NDP0003B These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) InputSupplyVoltage −0.3to+30V Power Dissipation InternallyLimited JunctionTemperature(TJ) +150°C AmbientStorageTemperature −65° to+150°C SolderingDwellTime,Temperature Wave 4 seconds,260°C Infrared 10 seconds,240°C Vapor Phase 75 seconds,219°C ESD Rating Human Body Model(3) 2500V (1) AbsoluteMaximum Ratingsarelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsareconditionsunderwhich operationofthedeviceisensured.OperatingRatingsdo notimplyensuredperformancelimits.Forensuredperformancelimitsand associatedtestconditions,see theElectricalCharacteristicstables. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (3) Human Body Model 1.5kΩ inserieswith100pF. OperatingRatings(1) Maximum InputSupplyVoltage 30V JunctionTemperatureRange, (TJ)(2) −40° to+125°C (1) AbsoluteMaximum Ratingsarelimitsbeyond whichdamage tothedevicemay occur.OperatingRatingsareconditionsunderwhich operationofthedeviceisensured.OperatingRatingsdo notimplyensuredperformancelimits.Forensuredperformancelimitsand associatedtestconditions,see theElectricalCharacteristicstables. (2) Junction-to-casethermalresistanceforthePFM package is5.4°C/W.

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www.ti.com SNVS694C –JANUARY 2011–REVISED APRIL 2013 ElectricalCharacteristics(1) Parameter Conditions(1) Typ Tested Limit(2) Design Limit(3) Units 3V Versions OutputVoltage TJ = 25°C 3.0 3.030 V max

2.970 V min

−25°C ≤ TJ ≤ 85°C 3.0 3.045 V max

2.955 V min

FullOperatingTemperatureRange 3.0 3.060 V max

2.940 V min

OutputVoltage 100µA ≤ IL ≤ 100mA, 3.0 3.072 V max TJ ≤ TJMAX 2.928 V min 3.3VVersions OutputVoltage TJ = 25°C 3.3 3.333 V max

3.267 V min

−25°C ≤ TJ ≤ 85°C 3.3 3.350 V max

3.251 V min

FullOperatingTemperatureRange 3.3 3.366 V max

3.234 V min

OutputVoltage 100µA ≤ IL ≤ 100mA 3.3 3.379 V max TJ ≤ TJMAX 3.221 V min 5.0VVersions OutputVoltage TJ = 25°C 5.0 5.05 V max

4.95 V min

−25°C ≤ TJ ≤ 85°C 5.0 5.075 V max

4.925 V min

FullOperatingTemperatureRange 5.0 5.1 V max

4.9 V min

OutputVoltage 100µA ≤ IL ≤ 100mA 5.0 5.12 V max TJ ≤ TJMAX 4.88 V min AllVoltageOptions OutputVoltage See (4) 50 150 ppm/°C TemperatureCoefficient LineRegulation(5) (VO NOM + 1)V ≤ Vin≤ 30V (6) 0.04 0.2 % max 0.4 % max Load Regulation(5) 100µA ≤ IL ≤ 100mA 0.1 0.2 % max 0.3 % max DropoutVoltage(7) IL = 100µA 80 mV max 50 150 mV max IL = 100mA 450 mV max 380 600 mV max (1) UnlessotherwisespecifiedalllimitsensuredforVIN = (VONOM + 1)V,IL = 100µA and C L = 1µF.Limitsappearinginboldfacetypeapply overtheentirejunctiontemperaturerangeforoperation.LimitsappearinginnormaltypeapplyforTA = TJ = 25°C. (2) Ensuredand 100% productiontested. (3) Ensuredbutnot100% productiontested.These limitsarenotused tocalculateoutgoingAQL levels. (4) Outputorreferencevoltagetemperaturecoefficientisdefinedas theworstcase voltagechange dividedby thetotaltemperaturerange. (5) Regulationismeasured atconstantjunctiontemperature,usingpulsetestingwitha lowdutycycle.Changes inoutputvoltagedue to heatingeffectsarecoveredunderthespecificationforthermalregulation. (6) ForIL = 100µA and TJ = 125°C, lineregulationisensuredby designto0.2%.See TypicalPerformanceCharacteristicsforlineregulation versustemperatureand loadcurrent. (7) DropoutVoltageisdefinedas theinputtooutputdifferentialatwhichtheoutputvoltagedrops100 mV belowitsnominalvalue measured at1V differential.Atverylowvaluesofprogrammed outputvoltage,theminimum inputsupplyvoltageof2V (2.3Vover temperature)must be takenintoaccount. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:SM72238

SNVS694C –JANUARY 2011–REVISED APRIL 2013 www.ti.com ElectricalCharacteristics(1)(continued) Parameter Conditions(1) Typ Tested Limit(2) Design Limit(3) Units Ground Current IL = 100µA 75 120 µA max 140 µA max IL = 100mA 8 12 mA max 14 mA max DropoutGround Current Vin= (VO NOM − 0.5)V, 110 170 µA max IL = 100µA 200 µA max CurrentLimit Vout= 0 160 200 mA max 220 mA max ThermalRegulation See (8) 0.05 0.2 %/W max OutputNoise, C L = 1µF (5V Only) 430 µV rms

10 Hz to100 kHz C L = 200µF 160 µV rms

C L = 3.3µF 100 µV rms (Bypass= 0.01µF) (8) Thermalregulationisdefinedas thechange inoutputvoltageata timeT aftera change inpower dissipationisapplied,excludingload orlineregulationeffects.Specificationsarefora 50mA loadpulseatVIN = 30V (1.25W pulse)forT = 10ms.

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www.ti.com SNVS694C –JANUARY 2011–REVISED APRIL 2013 TypicalPerformance Characteristics QuiescentCurrent Dropout Characteristics Figure3. Figure4. InputCurrent InputCurrent Figure5. Figure6. Output Voltage vs. Temperature of3 RepresentativeUnits QuiescentCurrent Figure7. Figure8. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:SM72238

SNVS694C –JANUARY 2011–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) QuiescentCurrent QuiescentCurrent Figure9. Figure10. QuiescentCurrent ShortCircuitCurrent Figure11. Figure12. Dropout Voltage LineTransientResponse Figure13. Figure14.

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www.ti.com SNVS694C –JANUARY 2011–REVISED APRIL 2013 TypicalPerformance Characteristics(continued) Load TransientResponse Load TransientResponse Figure15. Figure16. Output Impedance RippleRejection Figure17. Figure18. RippleRejection RippleRejection Figure19. Figure20. Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:SM72238

SNVS694C –JANUARY 2011–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) Shutdown ThresholdVoltage LineRegulation Figure21. Figure22. Maximum Rated Output Current Thermal Response Figure23. Figure24. Output CapacitorESR Range Figure25.

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www.ti.com SNVS694C –JANUARY 2011–REVISED APRIL 2013 APPLICATION HINTS EXTERNAL CAPACITORS A 1.0µF (orgreater)capacitorisrequiredbetween theoutputand groundforstability.Withoutthiscapacitorthe partwilloscillate.Most typesoftantalumor aluminum electrolyticswork finehere;even filmtypeswork butare notrecommended forreasonsofcost.Many aluminum electrolyticshave electrolytesthatfreezeatabout−30°C, so solidtantalumsarerecommended foroperationbelow −25°C. The importantparametersofthecapacitorare an ESR of about 5Ω or lessand a resonantfrequencyabove 500kHz. The valueof thiscapacitormay be increasedwithoutlimit. Ceramic capacitorswhose valueisgreaterthan 1000pF shouldnot be connecteddirectlyfrom the SM72238 outputtoground.Ceramic capacitorstypicallyhave ESR valuesintherange of5 to10m Ω,a valuebelow the lowerlimitforstableoperation(seeFigure25). The reason forthe lowerESR limitisthatthe loopcompensationof the partrelieson the ESR of the output capacitorto providethe zero thatgivesadded phase lead.The ESR of ceramiccapacitorsisso low thatthis phase leaddoes not occur,significantlyreducingphase margin.A ceramicoutputcapacitorcan be used ifa seriesresistanceisadded (recommended valueofresistanceabout0.1Ω to2Ω). At lowervaluesofoutputcurrent,lessoutputcapacitanceisrequiredforstability.The capacitorcan be reduced to0.33µF forcurrentsbelow10mA or0.1µF forcurrentsbelow1mA. Unlikemany otherregulators,theSM72238 willremainstableand inregulationwithno loadinadditiontothe internalvoltagedivider.ThisisespeciallyimportantinCMOS RAM keep-aliveapplications. A 1µF tantalum,ceramicoraluminum electrolyticcapacitorshouldbe placedfromtheSM72238 inputtoground ifthereismore than10 inchesofwirebetween theinputand theAC filtercapacitororifa batteryisused as the input. REDUCING OUTPUT NOISE Inreferenceapplicationsitmay be advantageoustoreducetheAC noisepresentattheoutput.One method isto reducetheregulatorbandwidthby increasingthesizeoftheoutputcapacitor.Thisistheonlyway noisecan be reducedbutisrelativelyinefficient,as increasingthecapacitorfrom1µF to220µF onlydecreasesthenoisefrom 430µV to160µV rms fora 100kHz bandwidthat5V output. TypicalApplications *Minimum input-outputvoltagerangesfrom40mV to400mV, dependingon loadcurrent.Currentlimitistypically 160mA. Figure26. 5 VoltCurrentLimiter Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:SM72238

SNVS694C –JANUARY 2011–REVISED APRIL 2013 www.ti.com Schematic Diagram

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www.ti.com SNVS694C –JANUARY 2011–REVISED APRIL 2013

REVISION HISTORY

Changes from RevisionB (April2013)toRevisionC Page Copyright© 2011–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:SM72238

www.ti.com 13-Sep-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples SM72238TD-3.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.0 SM72238TD-3.3/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.3 SM72238TD-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 SM72238TDE-3.0/NOPB ACTIVE TO-252 NDP 3 250 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.0 SM72238TDE-3.3/NOPB ACTIVE TO-252 NDP 3 250 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.3 SM72238TDE-5.0/NOPB ACTIVE TO-252 NDP 3 250 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 SM72238TDX-3.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.0 SM72238TDX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.3 SM72238TDX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

www.ti.com 13-Sep-2014 Addendum-Page 2 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SM72238TDE-3.0/NOPB TO-252 NDP 3 250 213.0 191.0 55.0 SM72238TDE-3.3/NOPB TO-252 NDP 3 250 213.0 191.0 55.0 SM72238TDE-5.0/NOPB TO-252 NDP 3 250 213.0 191.0 55.0 SM72238TDX-3.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 SM72238TDX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 SM72238TDX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 Pack Materials-Page 2

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