SM600 SUNMATE | Alldatasheet
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Technical content
devices(PTC),provide over-current protection for electrical and electronic devices. They function using conducting strips of metal imbedded inside polymers. Under normal conditions, the devices resistance is near zero, but over-current conditions will heat the PTC and expand the polymer, increasing the impedance. When current returns to normal, the components cool down, returning to their original shape and very low levels of resistance. l Over-current and over-temperature protection of automotive electronics l Hard disk drives l Point-of-sale (POS) equipment l PCMCIA cards l Power over Ethernet (POE) l HDMI 1.4 Source protection l Computers & peripherals l Industrial control l Security systems l I(hold): 0.11~0.16A l 600V Operating voltages l Radial leaded devices. l Over-current protection l Very high voltage surge capabilities. l Available in lead-free version. l Fast time–to–trip l RoHS compliant, Lead- Free and Halogen-Free Test Conditions Resistance change Passive aging +85℃，1000hrs ±8% typical Humidity aging +85℃，85%R.H.1000hrs ±8% typical Thermal shock +125℃ to -55℃，10times ±12% typical Resistance to solvent MIL-STD-202，Method 215 No change Vibration MIL-STD-202，Method 201 No change X X X -06 MS LOGO Hold current Voltage rating(VDC) Part Number Code
Description
POSITIVE THERMAL COEFFICIENT(PTC) Environmental Specifications
（A） IT (mA) Vmax （V） Maximum Time to Trip Imax （A） Pd typ （W） Resistance(Ω) Current(A) Time(S) Rimin R1max IH=Hold current: maximum current at which the device will not trip at 25 still air.℃ IT=Trip current: minimum current at which the device will nalways at 25 still air.℃ V max=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand tithout damage at rated voltage. T trip=Maximum time to trip(s) at assigned current. Pd=Typical power dissipation: typical amount of power dissipated by the decice when in state air environment. Ri min=Minimum device resistance at 25℃ prior to tripping. R1 max=Maximum device resistance is measured one hour post reflow. Solder reflow conditions Wave Soldering Soldering Temperature:260 ~270℃℃ Soldering Time:≤3sec. Soldering Position: Resettable fuse wire and the bottom ≥ 6mm。 Manual soldering Soldering Temperature:250℃~280℃ Soldering Time:≤3sec. Soldering Position: Resettable fuse wire and the bottom ≥ 6mm。 Environmental temperature and IH,IT Time(s) 300 250 200 150 100 Temperature 0 50 100 150 200 250 Soldering 245℃-260 Pre-heating 100℃-130℃ Cooling 5s max. -30 -20 -10 0 10 20 30 40 50 60 70 80 85 IT IH 300 250 200 150 100 SM600-110 SM600-150 SM600-160
Fig:1 Type Number Dimensions（mm） Dimensions（in） Shape A(max) B(max) C(typ) D(max) LeadΦ (typ) A(max) B(max) C(typ) D(max) LeadΦ (typ) Fig Packaging Part Number Quantity 500pcs/bag Marking SM600-110 SM600-150 SM600-160 SM600-110~SM600-160