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Technical content

Features

Optimized glass passivated chip TJ = 175 °C capability suitable for high reliability and automotive requirement

3600 W peak pulse power capability with a

10/1000 μs waveform, repetitive rate (duty cycle):0.01 % Meet ISO 7637-2 5a/5b and ISO 16750 load dump test (varied by test condition) AEC-Q101 qualified Low leakage current Working Voltage: 10 to 43 V

www.anova-semi.com Revision: C Nov-04-2016 P. 2 AMBIENT TEMPERATURE , (℃)AVERAGE FORWARD CURRENT, (A) 0 100 25 100 175 0 0 0 0.2 ## 0.5 76 1 50 1.5 33 2 23 3 13 4 10 0 5 1 6600 25 5 10 2800 ## 0 100 1100 10 5200 100 1900 Fig. 3 - Steady State Power Derating Curve Ratings and Characteristics Curves (TA=25℃ unless otherwise noted) Fig. 1 - Pulse Derating Curve Fig. 2 - Pulse Waveform Fig. 4 - Peak Pulse Power Rating Curve Package Outline Dimensions (millimeters) 0.0 2.0 4.0 6.0 8.0 0 25 50 75 100 125 150 175 200 Steady State Power Dissipation, (W) Lead Temperature , TL (℃) 100 0 25 50 75 100 125 150 175 200 Peak Pulse Derating in Percentage of Peak Power or Current, (%) Ambient Temperature ,TA (℃) 100 0 1 2 3 4 Peak Pulse Current , (% ) Time , (ms) 10/1000 μsec. Waveform Peak Value (Ipp) td Tr=10μs Half Value = Ipp TJ = 25 °C Pulse Width (td) is defined as the point where the peak current decays to 50 % of Ipp 1000 10000 10 100 Pulse Width ,td (ms) Peak Power (W) Recommended Mounting Pad Layout 11.0 9.5 15.8 3.5 3.0 3.3

www.anova-semi.com Revision: C Nov-04-2016 P. 3 B MIN. C 1.5 (0.059) 13.5 ± 0.50 (0.53 ± 0.02) 150 ℃ 200 ℃ 60-180 sec <3 ℃/sec >220 ℃ 245 ℃ 60-150 sec <3 ℃/sec 10-30 sec <5 ℃/sec <6 min 280 ℃ Time within actual peak temp. Ramp down Rate Time(25℃ to Peak temp.) Do not exceed Ramp up rate (150-200℃) Reflow Liquidus Temp. Peak Temp. Time(Liq. to Peak) Ramp up rate (220-200℃) Recommended Soldering Parameters IR-Reflow Condition Pre Heat Temp. min Temp. max Time(min to max) 30.4 (1.197) Surface Mount Tape and Reel Packaging Dimensions in Millimeters (inches) 24 mm (0.945) 330 ± 2.0 (13.0 ± 0.079) 178 ± 2.0 (7.0 ± 0.079) 20.2 tp ts Perheat Ts(min) Ts(max) TL tL TP Ramp-up Time(t) Temp from 25 °C to Peak Temperature(T) B D C ZONE 1 ZONE1 AN G T

www.anova-semi.com Revision: C Nov-04-2016 P. 4 Min (V) Max (V) IT (mA) SM5Z10A 11.1 12.3 5.0 15 250 10 212 17.0 SM5Z11A 12.2 13.5 5.0 10 150 11 198 18.2 SM5Z12A 13.3 14.7 5.0 10 150 12 181 19.9 SM5Z13A 14.4 15.9 5.0 10 150 13 167 21.5 SM5Z14A 15.6 17.2 5.0 10 150 14 155 23.2 SM5Z15A 16.7 18.5 5.0 10 150 15 148 24.4 SM5Z16A 17.8 19.7 5.0 10 150 16 138 26.0 SM5Z17A 18.9 20.9 5.0 10 150 17 130 27.6 SM5Z18A 20.0 22.1 5.0 10 150 18 123 29.2 SM5Z20A 22.2 24.5 5.0 10 150 20 111 32.4 SM5Z22A 24.4 26.9 5.0 10 150 22 101 35.5 SM5Z24A 26.7 29.5 5.0 10 150 24 93 38.9 SM5Z26A 28.9 31.9 5.0 10 150 26 86 42.1 SM5Z28A 31.1 34.4 5.0 10 150 28 79 45.4 SM5Z30A 33.3 36.8 5.0 10 150 30 74 48.4 SM5Z33A 36.7 40.6 5.0 10 150 33 68 53.3 SM5Z36A 40.0 44.2 5.0 10 150 36 62 58.1 SM5Z40A 44.4 49.1 5.0 10 150 40 56 64.5 SM5Z43A 47.8 52.8 5.0 10 150 43 52 69.4 1.Surge current waveform is defined at 10/1000uS waveform NOTE: 2.For all types maximum VF = 2.0 V at IF = 100 A measured on 8.3 ms single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute maximum Electrical Characteristics(TA=25℃ unless otherwise noted) Part Number (Uni) Breakdown Voltage VBR @IT Maximum Reverse Leakage IR @VRWM (uA) Maximum IR @VRWM TJ=175 (uA) Working Peak Reverse Voltage VRWM (V) Maximum Reverse Surge Current IPP (A) (1) Maximum Clamping Voltage VC@IPP (V)