SM5S VISHAY | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 3
Technical content
Features
- Ideally suited for load dump protection
- Plastic package has Underwriters Laboratory Flammability Classification 94V-0
- High temperature stability due to unique oxide passivation and patented PAR® construction
- Integrally molded heatsink provides a very low thermal resistance for maximum heat dissipation
- Low leakage current at TJ = 175°C
- High temperature soldering guaranteed: 260°C for 10 seconds at terminals
- Meets ISO7637-2 surge spec.
- Low forward voltage drop 0.413(10.5) 0.374(9.5) 0.366(9.3) 0.343(8.7) 0.606(15.4) 0.583(14.8) 0.150(3.8) 0.126(3.2) 0.091(2.3) 0.067(1.7) 0.116(3.0) 0.093(2.4) Mounting Pad Layout Mechanical Data Case: Molded plastic body, surface mount with heatsink integrally mounted in the encapsulation Terminals:Plated, solderable per MIL-STD-750, Method 2026 Polarity:Heatsink is anode Mounting Position:Any Weight:0.091 oz., 2.58 g Packaging codes/options: 2D/750 per 13" Reel (16mm Tape), anode towards sprocket hole, 4.5K/box 2E/750 per 13" Reel (16mm Tape), cathode towards sprocket hole, 4.5K/box DO-218AB Dimensions in inches and (millimeters)
formerly General Semiconductor www.vishay.com Document Number 88382 2 06-May-02 Electrical Characteristics(TC = 25°C unless otherwise noted) Maximum Maximum Max. Peak Maximum Reverse Reverse Pulse Clamping Device Type Breakdown Voltage T est CurrentStand-off Leakage Leakage Current Voltage at V(BR) IT Voltage at V WM at VWM at 10/1000µµsI PPM (V) V WM ID Tc = 175oC Waveform V C Min. Max. (mA) (V) ( µµA) I D (µµA) (A) (V) Note: For all types maximum VF = 2.0V at IF = 100A measured on 8.3ms single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute maximum
formerly General Semiconductor Document Number 88382 www.vishay.com 06-May-02 3 Ratings and Characteristic Curves(TA = 25°C unless otherwise noted) Power Derating Curve 2.0 4.0 6.0 8.0 0 50 100 150 200 Power Dissipation (W) Reverse Surge Power (W) Pulse Width (ms) – 1/2 IPP Exponential Waveform 1,000 10,000 10 100 Case Temperature (°C) 100 150 0 10 20 30 40 Input Peak Pulse Current % Time, ms (t) Pulse Waveform Reverse Power Capability TA = 25°C Pulse width (td) is defined as the point where the peak current decays to 50% of I PP td tr = 10µs Peak Value IPP Half Value –IPP Load Dump Power Characteristics (10ms Exponential Waveform) 1,000 500 1,500 2,000 2,500 3,000 25 50 75 100 125 150 175 Load Dump Power (W) Case Temperature (°C) Transient Thermal Impedance (°C/W) 0.01 11 0 100 100 0.01 0.1 t – Pulse Width (sec.) 0.1 R Θ JA R Θ JC Typical Transient Thermal Impedance