SM5901AF NPC | Alldatasheet
Document overview
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Technical content
Features
Package dimensions(Unit: mm) 44-pin QFP 13.20 0.30+- 13.20 0.30+- 10.00 0.20+- 10.00 0.20+- 2.05 0.10+- 0.15 - 0.05 +0.10 0 to 8 +-0.80 0.20 0.80 0.35 2.30MAX 0.05MIN 1.60 Pinout(Top View) VDD2 UC1 UC2 UC3 UC4 VSS2 NTEST1 NTEST2 CLK VSS1 YSRDATA NWE NCAS2 NTEST4 YMCLK YMDATA YMLD YDMUTE YLRCK YSCK ZSCK ZLRCK ZSRDATA YFLAG YFCLK YBLKCK NRESET ZSENSE VDD1 NTEST3 NRAS S M 5901AF
Pin number Pine name I/O Function Setting HL
1 VDD2 - VDD supply pin
2 UC1 Ip/O Microcontroller interface extension I/O 1
3 UC2 Ip/O Microcontroller interface extension I/O 2
4 UC3 Ip/O Microcontroller interface extension I/O 3
5 UC4 Ip/O Microcontroller interface extension I/O 4
6 VSS2 - Ground
7 NTEST1 Ip Test pin Test
8 NTEST2 Ip Test pin Test
9 CLK I 16.9344 MHz clock input
10 VSS1 - Ground
11 YSRDATA I Audio serial input data
12 YLRCK I Audio serial input LR clock Left channel Right channel
13 YSCK I Audio serial input bit clock
14 ZSCK O Audio serial output bit clock
15 ZLRCK O Audio serial output LR clock Left channel Right channel
16 ZSRDATA O Audio serial output data
17 YFLAG I Signal processor IC RAM overflow flag Overflow
18 YFCLK I Crystal-controlled frame clock
19 YBLKCK I Subcode block clock signal
20 NRESET I System reset pin Reset
21 ZSENSE O Microcontroller interface status output
22 VDD1 - VDD supply pin
23 YDMUTE I Forced mute pin Mute
24 YMLD I Microcontroller interface latch clock
25 YMDATA I Microcontroller interface serial data
26 YMCLK I Microcontroller interface shift clock
27 NTEST4 Ip Test pin Test
28 NCAS2 O DRAM CAS control
29 D2 I/O DRAM data input/output 2
30 D3 I/O DRAM data input/output 3
31 D0 I/O DRAM data input/output 0
32 D1 I/O DRAM data input/output 1
33 NWE O DRAM WE control
34 NRAS O DRAM RAS control
35 NTEST4 Ip Test pin Test
36 A8 O DRAM address 8
37 A7 O DRAM address 7
38 A6 O DRAM address 6
39 A5 O DRAM address 5
40 A4 O DRAM address 4
41 A0 O DRAM address 0
42 A1 O DRAM address 1
43 A2 O DRAM address 2
44 A3 O DRAM address 3
Ip : Input pin with pull-up resistor Ip/O : Input/Output pin (With pull-up resistor when a input mode) And in case that only internal 1M DRAM is used, 28, 33, 34, 36 to 44 pin are high impedance, and 29 to 32 pin are input pull up mode. Pin description
Parameter Symbol Rating Unit Supply voltage V DD - 0.3 to 4.6 V Input voltage V I VSS - 0.3 to VDD + 0.3 V Storage temperature T STG - 55 to 125 ˚C Power dissipation P D 600 mW Soldering temperature T SLD 255 ˚C Soldering time tSLD 10 sec (VSS = 0V, VDD pin voltage = VDD) (*1) Refer to pin summary on the next page. Note. Values also apply for supply inrush and switch-off. Parameter Symbol Rating Unit Supply voltage V DD 2.7 to 3.3 V Operating temperature T OPR 0 to 70 ˚C (VSS = 0V, VDD pin voltage = VDD) Parameter Pin Symbol Condition Rating Unit Min Typ Max Current consumption VDD I DD (*A)SHPRF ON 60 mA (*A)Through mode 60 mA Input voltage CLK H level V IH1 0.7VDD V L level V IL1 0.3VDD V VINAC AC coupling 0.3 V P-P (*2,3,4,5) H level V IH2 0.7VDD V L level V IL2 0.3VDD V Output voltage (*4,6) H level V OH1 IOH = - 0.5 mA V DD - 0.4 V L level V OL1 IOL = 1 mA 0.4 V (*5) H level V OH2 IOH = - 0.5 mA V DD - 0.4 V L level V OL2 IOL = 1 mA 0.4 V Input current CLK I IH1 VIN = VDD 15 30 60 µA IIL1 VIN = 0V 15 30 60 µA (*3,4) I IL2 VIN = 0V 1.5 3 15 µA Input leakage current (*2,3,4,5) I LH1 VIN = VDD 1.0 µA (*2,5) I LL VIN = 0V 1.0 µA Output leakage current (*7) I ZH VOUT = VDD 1.0 µA IZL VOUT= 0V 1.0 µA (*A) VDD = 3 V, CLK input frequency fXTI= 384fs = 16.9344 MHz, all outputs unloaded, SHPRF: Shock-proof, typical values are for VDD = 3 V.
Electrical characteristics
Recommended operating conditions DC characteristics Standard voltage: (VDD = 2.7 to 3.3 V, VSS = 0 V, Ta = 0 to 70˚C) Absolute maximum ratings
(*1) Pin function Clock input pin (AC input) Pin name CLK (*2) Pin function Schmitt input pins Pin name YSRDATA, YLRCK, YSCK, YFLAG, YFCLK, NRESET, YBLKCK, YDMUTE, YMLD, YMDATA, YMCLK (*3) Pin function Schmitt input pin with pull-up Pin name NTEST1, NTEST2, NTEST3, NTEST4 (*4) Pin function I/O pins (Schmitt input with pull-up in input state) Pin name UC1, UC2, UC3, UC4 (*5) Pin function I/O pins (Schmitt input in input state) Pin name D0, D1, D2, D3 (*6) Pin function Outputs Pin name ZSCK, ZLRCK, ZSRDATA, ZSENSE (*7) Pin function Outputs Pin name NCAS2, NWE, NRAS, A0, A1, A2, A3, A4, A5, A6, A7, A8 <Pin summary>
Parameter Symbol Condition Rating Unit System clock Min Typ Max Clock pulsewidth (HIGH level) tCWH 26 29.5 125 ns Clock pulsewidth (LOW level) tCWL 26 29.5 125 ns Clock pulse cycle tCY 384fs 56 59 250 ns CWHt CWLt CYt 0.5VDDCLK Parameter Symbol Rating Unit Condition Min Typ Max YSCK pulsewidth (HIGH level) tBCWH 75 ns YSCK pulsewidth (LOW level) tBCWL 75 ns YSCK pulse cycle tBCY 150 ns YSRDATA setup time tDS 50 ns YSRDATA hold time tDH 50 ns Last YSCK rising edge to YLRCK edge tBL 50 ns YLRCK edge to first YSCK rising edge tLB 50 ns 0 2fs Memory system ON YLRCK pulse frequency (MSON=H) See note below. fs fs Memory system OFF (MSON=L) Note. When the memory system is OFF (through mode), the input data rate is synchronized to the system clock input (384fs), so input data needs to be at 1/384 of this frequency. But, this IC can tolerate a certain amount of jitter. For details, refer to Through-mode operation. YSCK YSRDATA YLRCK BCYt DSt DHt BCWHt BCWLt LBtBLt 0.5VDD 0.5VDD 0.5VDD Serial input (YSRDATA, YLRCK, YSCK pins) AC characteristics Standard voltage: VDD = 2.7 to 3.3 V, VSS = 0 V, Ta = 0 to 70 °C (*) Typical values are for fs = 44.1 kHz System clock (CLK pin) System clock input
Parameter Symbol Rating Unit Min Typ Max YMCLK LOW-level pulsewidth tMCWL 30 + 2tCY ns YMCLK HIGH-level pulsewidth tMCWH 30 + 2tCY ns YMDATA setup time tMDS 30 + tCY ns YMDATA hold time tMDH 30 + tCY ns YMLD LOW-level pulsewidth tMLWL 30 + 2tCY ns YMLD setup time tMLS 30 + tCY ns YMLD hold time tMLH 30 + tCY ns Rise time tr 100 ns Fall time tf 100 ns ZSENSE output delay tPZS 100 + 3tCY ns Note. tCY is the system clock cycle time (59ns typ). YMDATA YMCLK ZSENSE YMLD YMDATA YMCLK YMLD MDSt MDHt MCWLt MLSt MCWHt MLHt MLWLt PZSt 0.5VDD0.5VDD 0.5VDD 0.5VDD 0.5VDD 0.5VDD 0.3 VDD 0.3 VDD 0.7 VDD 0.7 VDD ft rt Reset input (NRESET pin) Parameter Symbol Rating Unit Min Typ Max First HIGH-level after supply voltage rising edge tHNRST 0 tCY (Note) NRESET pulsewidth tNRST 64 tCY (Note) Note. tCY is the system clock (CLK) input (384fs) cycle time. tCY = 59 ns, tNRST (min) = 3.8 µs when fs = 44.1 kHz NRESET VDD HNRSTt tNRST Microcontroller interface (YMCLK, YMDATA, YMLD, ZSENSE pins)
Parameter Symbol Condition Rating Unit Min Typ Max ZSCK pulsewidth tSCOW 15 pF load 1/96fs ZSCK pulse cycle tSCOY 15 pF load 1/48fs ZSRDATA and ZLRCK output delay time tDHL 15 pF load 0 60 ns tDLH 15 pF load 0 60 ns DRAM access timing (NRAS, NCAS2, NWE, A0 to A8, D0 to D3) Parameter Symbol Condition Rating Unit Min Typ Max NRAS pulsewidth tRASL 15 pF load 5 tCY(note) tRASH 15 pF load 3 tCY NRAS falling edge to NCAS2 falling edge tRCD 15 pF load 2 tCY NCAS2 pulsewidth tCASH 15 pF load 5 tCY tCASL 15 pF load 3 tCY NRAS Setup time tRADS 15 pF load 1 tCY falling edge to address Hold time tRADH 15 pF load 1 tCY NCAS2 Setup time tCADS 15 pF load 1 tCY falling edge to address Hold time tCADH 15 pF load 5 tCY NCAS2 Setup time tCWDS 15 pF load 3 tCY falling edge to data write Hold time tCWDH 15 pF load 3 tCY NCAS2 Input setup tCRDS 40 ns rising edge to data read Input hold tCRDH 40 ns NWE pulsewidth tWEL 15 pF load 6 tCY NWE falling edge to NCAS2 falling edge tWCS 15 pF load 3 tCY Non compression 1.4 ms Refresh cycle 1M 6-bit compression 3.7 ms (fs = 44.1 kHz playback) DRAM 5-bit compression 4.4 ms tREF 4-bit compression 5.5 ms Memory system ON Non compression 2.7 ms Decode sequence operation 4M 6-bit compression 7.3 ms (RDEN=H) DRAM 5-bit compression 8.8 ms 4-bit compression 10.9 ms Note. tCY is the system clock (CLK) input (384fs) cycle time. tCY = 59 ns when fs = 44.1 kHz ZSCK ZSRDATA 0.5VDD DLH ZLRCK 0.5VDD DHLtt DLH SCOWttSCOWt SCOYt Serial output (ZSRDATA, ZLRCK, ZSCK pins)
(DRAM2 SELECT) A0 to A9 D0 to D3 (WRITE) NRAS D0 to D3 (READ) NWE (WRITE) tCY3 WCSt CYt6 CRDHtCRDSt CWDHtCWDSt CYt3 CYt3 CYt5 CADHtCADStRADHtRADSt CYt1 CYt1 CYt1 CYt5CYt3CYt2 tRCD tCASL CASH t RASHt CYt3CYt5 RASLt WELt DRAM access timing (when external DRAM is used)
Output Interface Input Interface Attenuator Input Buffer Decoder Encoder 1M DRAM SM5901 YBLKCK YFCLK YFLAG YMDATA YMCLK YMLD ZSENSE UC1 to UC4 YDMUTE NRESET NTEST 1, 2, 3, 4 CLK NRAS NCAS2 NWE A0 to A8 D0 to D3 Through Mode Compression Mode ZLRCK ZSCK ZSRDATA YLRCK YSCK YSRDATA DRAM Interface Block diagram
This IC has two modes of operation; shock-proof mode and through mode. The operating sequences are controlled using com- mands from a microcontroller. D7 D6 D5 D4 D3 D2 D1 D0 B7 B6 B5 B4 B3 B2 B1 B0 COMMAND 8bit DATA 8bit YMDATA YMCLK YMLD B7 B6 B5 B4 B3 B2 B1 B0 COMMAND 8bit YMDATA YMCLK YMLD S7 S6 S5 S4 S3 S2 S1 S0 STATUS 8bit ZSENSE B7 B6 B5 B4 B3 B2 B1 B0 COMMAND 8bit YMDATA YMCLK YMLD S7 S6 S1 S0 RESIDUAL DATA 15bit ZSENSE M1 M2 M7 0 16bit RESIDUAL DATA ENTRY (lowest bit is 0) Functional description Read command format (Command 92 (memory residual read)) Read command format (Commands 90, 91, 93) Microcontroller interface Commands from the microcontroller are input using 3 bit serial inputs; data (YMDATA), bit clock (YMCLK) and load signal (YMLD). In the case of a read command from the microcon- troller, bit serial data is output (ZSENSE) synchro- nized to the bit clock input (YMCLK).
Bit Name Function H operation Reset level D7 MSWREN Encode sequence start/stop Start L D6 MSWACL Write address reset Reset L D5 MSRDEN Decode sequence start/stop Start L D4 MSRACL Read address reset Reset L D3 MSDCN2 MSDCN2=H, MSDCN1=H: 3-pair comparison start L MSDCN2=H, MSDCN1=L: 2-pair comparison start D2 MSDCN1 MSDCN2=L, MSDCN1=H: Direct-connect start L MSDCN2=L, MSDCN1=L: Connect operation stop D1 WAQV Q data valid Valid L D0 MSON Memory system ON ON L 1000 0000 B0B1B2B3B4B5B6B7 80hex =Anti-shock memory system settings Bit Name Function H operation Reset level D3 UC4OE Extension I/O port UC4 input/output setting Output L D2 UC3OE Extension I/O port UC3 input/output setting Output L D1 UC2OE Extension I/O port UC2 input/output setting Output L D0 UC1OE Extension I/O port UC1 input/output setting Output L 1000 0001 B0B1B2B3B4B5B6B7 81hex =Extension I/O port input/output settings Bit Name Function H operation Reset level D3 UC4WD Extension I/O port UC4 output data setting H output L D2 UC3WD Extension I/O port UC3 output data setting H output L D1 UC2WD Extension I/O port UC2 output data setting H output L D0 UC1WD Extension I/O port UC1 output data setting H output L 1000 0010 B0B1B2B3B4B5B6B7 82hex = Extension port HIGH/LOW output level A port setting is invalid if that port has already been defined as an input using the 81H command above. Command table Write command summary MS command 80 Extension I/O settings 81 Extension I/O output data settings 82
Bit Name Function H operation Reset level D7 ATT Attenuator enable Attenuator ON L D6 MUTE Forced muting (changes instantaneously) Mute ON L D5 SOFT Soft muting (changes smoothly when ON only) Soft mute L D3 CMP12 12-bit comparison connect/ 16-bit comparison connect 12-bit comparison L 1000 0011 B0B1B2B3B4B5B6B7 83hex = Refer to Attenuation, Soft mute, Force mute. Bit Name Function H operation Reset level D7 K7 MSB 2 L D6 K6 2 H D5 K5 2 L D4 K4 2 L D3 K3 2 L D2 K2 2 L D1 K1 2 L D0 K0 LSB 2 L 1000 0100 B0B1B2B3B4B5B6B7 84hex = Refer to Attenuation, Soft mute, Force mute Bit Name Function H operation Reset level D6 RAMX2 External DRAM select (used / no used) used L D5 YFLGS FLAG6 set conditions (reset using status read command 90H) L - When YFLGS=0, YFCKP=0, YFCLK input falling edge, YFLAG=L - When YFLGS=0, YFCKP=1, YFCLK input rising edge, YFLAG=L D4 YFCKP - When YFLGS=1, YFCKP=0, YFLAG=L L - When YFLGS=1, YFCKP=1, YFLAG=H D3 COMPFB Full-bit non compression mode L D2 COMP6B 6-bit compression mode H D1 COMP5B 5-bit compression mode L D0 COMP4B 4-bit compression mode L 1000 0101 B0B1B2B3B4B5B6B7 85hex = When the number of compression bits is set incorrectly (2 or more bits in D0 to D3 are set to 1 or all bits are set to 0), 6-bit compression mode is selected. ATT, MUTE settings 83 Attenuation level settings 84 Option settings 85
Bit Name Function HIGH-level state S7 FLAG6 Signal processor IC jitter margin exceeded Exceeded S6 MSOVF Write overflow (Read once only when RA exceeds WA) DRAM overflow S3 DCOMP Data compare-connect sequence operating Compare-connect sequence operating S2 MSWIH Encode sequence stop due to internal factors Encoding stopped S1 MSRIH Decode sequence stop due to internal factors Decoding stopped 1001 0000 B0B1B2B3B4B5B6B7 90hex = Refer to Status flag operation summary Bit Name Function HIGH-level state S7 MSEMP Valid data empty state (Always HIGH when RA exceeds VWA) No valid data S6 OVFL Write overflow state (Always HIGH when WA exceeds RA) Memory full S5 ENCOD Encode sequence operating state Encoding S4 DECOD Decode sequence operating state Decoding 1001 0001 B0B1B2B3B4B5B6B7 91hex = Refer to Status flag operation summary. Read command summary Anti-shock memory status (1) 90 Anti-shock memory status (2) 91
Bit Name Function HIGH-level state S3 UC4RD S2 UC3RD S1 UC2RD S0 UC1RD 1001 0011 B0B1B2B3B4B5B6B7 93hex = Input data entering (or output data) an extension port terminal is echoed to the microcontroller. (That is, the input data entering an I/O port configured as an input port using the 81H command, OR the output data from a pin configured as an output port using the 82H command.) Bit Name Function S7 AM20 Valid data accumulated VWA-RA (MSB) 4M bits S6 AM19 S5 AM18 S4 AM17 S3 AM16 S2 AM15 S1 AM14 S0 AM13 M1 AM12 M2 AM11 M3 AM10 M4 AM09 M5 AM08 M6 AM07 M7 AM06 M8 AM05 to 0 constant output ... AM00 1001 0010 B0B1B2B3B4B5B6B7 92hex = Note. The time conversion factor varies depending on the compression bit mode.(M = 1,048,576 K= 1,024) Residual time (sec) = Valid data residual (Mbits) × Time conversion value k 2M bits 1M bits 512K bits 256K bits 128K bits 64K bits 32K bits 16K bits 8K bits 4K bits 512 bits 2K bits 1K bits 256 bits 128 to 4 bits Anti-shock memory valid data residual 92 Extension I/O inputs 93
FLAG6 READ Meaning - Indicates to the CD signal processor DSP (used for error correction, de-interleaving) that a 90H disturbance has exceeded the RAM jitter margin. bit 7 Set - Set according to the YFLAG input and the operating state of YFCKP and YFLGS. FLAG6 set conditions When YFLGS=0, YFCKP=0, YFCLK input falling edge, YFLAG=L When YFLGS=0, YFCKP=1, YFCLK input rising edge, YFLAG=L When YFLGS=1, YFCKP=0, YFLAG=L When YFLGS=1, YFCKP=1, YFLAG=H Reset - By 90H status read - By 80H command when MSON=ON - After external reset MSOVF READ Meaning - Indicates once only that a write to external DRAM has caused an overflow. (When reset 90H by the 90H status read command, this flag is reset even if the overflow condition continues.) bit 6 Set - When the write address (WA) exceeds the read address (RA) Reset - By 90H status read - When a read address clear (MSRACL) or write address clear (MSWACL) command is issued - After external reset DCOMP READ Meaning - Indicates that a compare-connect sequence is operating 90H Set - When a (3-pair or 2-pair) compare-connect start command is received (MSDCN2=1) bit 3 - When a direct connect command is received (MSDCN2=0, MSDCN1=1) Reset - When a (3-pair or 2-pair) comparison detects conforming data - When the connect has been performed after receiving a direct connect command - When a compare-connect stop command (MSDCN2=0, MSDCN1=0) is received - When a MSWREN=1 command is received (However, if a compare-connect command is received at the same time, the compare-connect command has priority.) - After external reset MSWIH READ Meaning - Indicates that the encode sequence has stopped due to internal factors 90H (not microcontroller commands) bit 2 Set - When FLAG6 (above) is set - When MSOVF (above) is set Reset - When conforming data is detected after receiving a compare-connect start command - When the connect has been performed after receiving a direct connect command - When a read address clear (MSRACL) or write address clear (MSWACL) command is received - After external reset MSRIH READ Meaning - Indicates that the decode sequence has stopped due to internal factors 90H (not microcontroller commands) bit 1 Set - When the valid data residual becomes 0 Reset - By 90H status read - When a read address clear (MSRACL) or write address clear (MSWACL) command is issued - After external reset Status flag operation summary
MSEMP READ Meaning - Indicates that the valid data residual has become 0 91H Set - When the VWA (final valid data's next address) bit 7 = RA (address from which the next read would take place) Reset - Whenever the above does not apply OVFL READ Meaning - Indicates a write to external DRAM overflow state 91H Set - When the write address (WA) exceeds the read address (RA). bit 6 (Note: This flag is not set when WA=RA through an address initialize or reset operation.) Reset - When the read address (RA) is advanced by the decode sequence - When a read address clear (MSRACL) or write address clear (MSWACL) command is issued - After external reset ENCOD READ Meaning - Indicates that the encode sequence (input data entry, encoding, DRAM write) is operating 91H Set - By the 80H command when MSWREN=1 bit 5 - When conforming data is detected during compare-connect operation - When the connect has been performed after receiving a direct connect command Reset - When the FLAG6 flag=1 (above) - When the OVFL flag=1 (above) - By the 80H command when MSWREN=0 - By the 80H command when MSDCN1=1 or MSDCN2=1 (compare-connect start command) - By the 80H command when MSON=0 - After external reset Note. Reset conditions have priority over set conditions. For example, if the 80H command has MSWREN=1 and MSDCN1=1, the ENCOD flag is reset and compare-connect operation starts. DECOD READ Meaning - Indicates that the decode sequence (read from DRAM, decoding, 91H attenuation, data output) is operating bit 4 Set - By a new 80H command when MSRDEN=1 and the MSEMP flag=0 (above) Reset - Whenever the above does not apply
- MSWREN When 1: Encode sequence starts Invalid when MSON is not 1 within the same 80H command Invalid when FLAG6=1 Invalid when OVFL=1 Invalid when a compare-connect start command (MSDCN2=1 or MSDCN1=1) occurs simultaneously Direct connect if a compare-connect sequence is already operating When 0: Encode sequence stops - MSWACL When 1: Initializes the write address (WA) When 0: No operation - MSRDEN When 1: Decode sequence starts Does not perform decode sequence if MSON=1.If there is no valid data, decode sequence temporarily stops. But, because the MSRDEN flag setting is maintained as is, the sequence automatically re-starts when valid data appears. When 0: Decode sequence stops -MSRACL When 1: Initializes the read address (RA) When 0: No operation - MSDCN2, MSDCN1 When 1 and 1: 3-pair compare-connect sequence starts When 1 and 0: 2-pair compare-connect sequence starts When 0 and 1: Direct connect sequence starts When 0 and 0: Compare-connect sequence stops. No operation if a compare-connect sequence is not operating. - WAQV When 1: The immediately preceding YBLKCK falling-edge timing WA (write address) becomes the VWA (valid write address). When 0: No operation - MSON When 1: Memory system turns ON and compres- sion-type shock-proof operation starts When 0: Memory system turns OFF and through- mode playback starts. (In this mode, the attenuator is still active.) Write command supplementary information 80H (MS command) 81H (I/O setting on extension I/O) 82H (Setting output data on extension I/O)
85H (option settings) - RAMX2 When 1: External DRAM is used When 0: External DRAM is no used - YFLGS, YFCKP see 9-2-3. When 0 and 0: Sets FLAG6 on the falling edge of YFCLK when YFLAG=0 When 0 and 1: Sets FLAG6 on the rising edge of YFCLK when YFLAG=0 When 1 and 0: Sets FLAG6 when YFLAG=0 When 1 and 1: Sets FLAG6 when YFLAG=1 - COMPFB, COMP6B, COMP5B, COMP4B When 0, 0, 0 and 1: Selects 4-bit compression mode When 0, 0, 1 and 0: Selects 5-bit compression mode When 1, 0, 0 and 0: Selects full-bit compression mode In all other cases: Selects 6-bit compression mode Changing mode without initialize in opera- tion is possible. 83H (ATT, MUTE settings) - ATT (attenuator enable) When 1: Attenuator settings become active (84H command) When 0: Attenuator settings become inactive, and output continues without attenuation - MUTE (forced muting) When 1: Outputs are instantaneously muted to 0.(note 1) Same effect as taking the YDMUTE pin HIGH. When 0: No muting(note 1) (note1) Effective at the start of a Left-channel out- put data. - SOFT (soft muting) When 1: Outputs are smoothly muted to 0. When 0: No muting. Soft mute release occurs instantaneously to either the value set by the 84H com- mand (When ATT=1) or 0dB (When ATT=0) - MUTE, SOFT, YDMUTE relationship When all mute inputs are 0, mute is released. - CMP12 (12-bit comparison connection) When 1: Performs comparison connection using only the most significant 12 bits of input data. When 0: Performs comparison connection using all 16 bits of input data.
Shock-proof mode is the mode that realizes shock- proof operation using external DRAM. Shock-proof mode is invoked by setting MSON=H in microcon- troller command 80H. This mode comprises the following 3 sequences. Shock-proof operation overview - Encode sequence 1. Input data from a signal processor IC is stored in internal buffers. 2. Encoder starts after a fixed number of data have been received. 3. The encoder, after the most suitable predicting filter type and quantization steps have been deter- mined, performs APC encoding and then writes to external DRAM. - Decode sequence 1. Reads compressed data stored in external buffer RAM at rate fs. 2. Decoder starts, using the predicting filter type and quantization levels used when encoded. 3. Performs attenuation operation (including muting operation) 4. Outputs the result. - Compare-connect sequence 1. Encoding immediately stops when either external buffer RAM overflows or when a CD read error occurs due to shock vibrations. 2. Then, using microcontroller command 80H, the compare-connect start command is executed and compare-connect sequence starts. 3. Compares data re-read from the CD with the pro- cessed final valid data stored in RAM (confirms its correctness). 4. As soon as the comparison detects conforming data, compare-connect sequence stops and encode sequence re-starts, connecting the data directly behind previous valid data.
13.3ms VWA latch set WAQV set VWA(x) VWA(x + 1) YBLKCK Microcontroller data set Refer to Microcontroller interface VWA Values shown are for rate fs. The values are 1/2 those shown at rate 2fs. Fig 2. YBLKCK and VWA relationship The VWA is determined according to the YBLKCK pin and WAQV command. Refer to the timing chart below. 1.YBLKCK is a 75 Hz clock(HIGH) when used for normal read mode and it is a 150Hz clock when used for double-speed read mode. Both modes clock are synchronized to the CD format block end timing. When this clock goes LOW, WA which is the write address of internal encode sequence, is stored (see note 2). 2.The microcontroller checks the subcode and, if confirmed to be correct, generates a WAQV com- mand (80H). 3.When the WAQV command is received, VWA is updated according to the previously latched WA. (note 2) Actually, there is a small time difference, or gap, between the input data and YBLKCK. This gap serves to preserves the preceding WA to protect against incorrect operation. RAM addresses SM5901 has an 1M DRAM as the internal buffer. and an external 1M DRAM can be also connected to expand the memory to 2M bits. Three kinds of addresses are used for external RAM control. WA (write address) RA (read address) VWA (valid write address) Among these, VWA is the write address for con- forming data whose validity has been confirmed. Determination of the correctness of data read from the CD is delayed relative to the encode write pro- cessing, so VWA is always delayed relative to WA. The region available for valid data is the area between VWA-RA. - Connect data work area This is an area of memory reserved for connect data. This area is 2Kbits. Fig1. RAM addresses RA WA VWA Valid data area Connect data work area VWA (valid write address)
Correct data demodulation becomes impossible for the CD signal processor IC when a disturbance exceeding the RAM jitter margin occurs. The YFLAG signal input pin is used to indicate when such a condition has occurred. The YFLAG signal is a 7.35 kHz clock synchronized to the CD format frame 1. The IC checks the YFLAG input and stops the encode sequence when such a disturbance has occurred, and then makes FLAG6 active. The YFLAG check method used changes depend- ing on the YFLGS flag and YFCKP flag (85H com- mand). See table1. If YFLAGS is set to 1, then YFCLK should be tied either High or Low. YFLAG, YFCLK, FLAG6 85H command YFLGS YFCKP FLAG6 set conditions FLAG6 reset conditions 1 0 0 When YFLAG=LOW on YFCLK input falling edge - By status read (90H command) 2 1 When YFLAG=LOW on YFCLK input rising edge - When MSON=LOW 3 1 0 When YFLAG=LOW YFCLK be tied either High or Low - After system reset 4 1 When YFLAG=HIGH Table1. YFLAG signal check method
The SM5901 supports three kinds of connect modes; 3-pair compare-connect, 2-pair compare- connect and direct connect. Note that the SM5901 can also operate in 12-bit comparison connect mode using only the most sig- nificant 12 bits of data for connection operation. In 3-pair compare-connect mode, the final 6 valid data (3 pairs of left- and right-channel data input before encode processing) and the most recently input data are compared until three continuous data pairs all conform. At this point, the encode sequence is re-started and data is written to VWA. In 2-pair compare-connect mode, comparison occurs just as for 3-pair comparison except that only 2 pairs from the three compared need to con- form with the valid data. At this point, the encode sequence is re-started and data is written to VWA. In direct-connect mode, comparison is not per- formed at all, and encode sequence starts and data is written to the VWA. This mode is for systems that cannot perform compare-connect operation. - Compare-connect preparation time 1. Comparison data preparation time Internally, when the compare-connect start com- mand is issued, a sequence starts to restore the data for comparison. The time required for this preparation after receiving the command is approxi- mately 2.5 · (1/fs). (approximately 60 ms when fs = 44.1 kHz) 2. After the above preparation is finished, data is input beginning from the left-channel data and com- parison starts. 3. If the compare-connect command is issued again, the preparation time above is not necessary and operation starts from step 2. 4. The same sequence takes place in direct-con- nect mode also. However, at the point when 3 words have been input, all data is directly connect- ed as if comparison and conformance had taken place. - Compare-connect sequence stop If a compare-connect stop command (80H with MSDCN1= 1, MSDCN2= 0) is input from the micro- controller, compare-connect sequence stops. If compare-connect sequence was not operating, the compare-connect stop command performs no operation. However, make sure that the other bit settings within the same 80H command are valid.
DRAM initialization under the following condition. MSWREN=0 states only MSWREN changes to 1. ization refresh cycle (described above). sequence is shown in the table below. Table 2. Decode sequence refresh rate mode takes place when the command is issued.
A YMLD When 85H generated AB B 003 Selecting compression mode Even when the compression mode in selected with the 85H command during shock-proof operation,no malfunction occurs. The compression mode change is not performed immediately after input of the 85H command, but it is performed at the following timing. After changing the mode, zero data of one block is output. (note) CAS-000 is connect data.
If MSON is set LOW (80H command), an operating mode that does not perform shock-proof functions becomes active. In this case, input data is passed as-is (after attenuator and mute operations) to the output. External DRAM is not accessed. - In this case, input data needs to be at a rate fs and the input word clock must be synchronized to the CLK input (384fs). However, short range jitter can be tolerated (jitter-free system). - Jitter-free system timing starts from the first YLRCK rising edge after either (A) a reset (NESET= 0) release by taking the reset input from LOW to HIGH or (B) by taking MSON from HIGH to LOW. Accordingly, to provide for the largest possi- ble jitter margin, it is necessary that the YLRCK clock be at rate fs by the time jitter-free timing starts. The jitter margin is 0.2/ fs. This jitter margin is the allowable difference between the system clock (CLK) 1/ 384 divided, fs rate clock and the YLRCK input clock. If the timing difference exceeds the jitter margin, irregular operation like data being output twice or conversely complete “1” data output may occur. In the worst case, a click noise will also be generated. - The attenuation register is set by the 84H com- mand. - The attenuation register set value becomes active when the 83H command sets the ATT flag to 1. When the ATT flag is 0, the attenuation register value is considered to be the equivalent of 256 for a maximum gain of 0 dB. - The gain (dB) is given from the set value (Datt) by the following equation. Gain = 20 · log(Datt/256) [dB]; left and right chan- nels - For the maximum attenuation register set value (Datt = 255), the corresponding gain is -0.03 dB. But when the ATT flag is 0 (Datt = 256), there is no attenuation. - After a system reset initialization, the attenuation register is set to 64 (-12 dB). However, because the ATT flag is reset to 0, there is no attenuation. - When the attenuation register setting changes or when the ATT flag changes, the gain changes smoothly from the previous set gain towards the new set value. If a new value for the attenuation level is set before the previously set level is reached, the gain changes smoothly towards the latest setting. The gain changes at a rate of 4 · (1/fs) per step. A full-scale change (255 steps) takes approximately 23.3 ms (when fs = 44.1 kHz). See fig 3. Attenuation Fig 3 Attenuation operation example set 3 Gain set 5 set 1 set 4set 2 time
Soft mute operation is controlled by the SOFT flag using a built-in attenuation counter. Mute is ON when the SOFT flag is 1. When ON, the attenuation counter output decrement by 1 step at a time, thereby reducing the gain. Complete mute takes 1024/fs (or approximately 23.2 ms for fs = 44.1 kHz). Conversely, mute is released when the SOFT flag is 0. In this case, the attenuation counter instanta- neously increases. The attenuation register takes on the value when the ATT flag was 1. If the ATT flag was 0, the new set value is 256 (0 dB). Fig 4. Soft mute operation example 256 step / 1024TS SOFT Attenation level or full scale − ∞ (Gain) Serial output data is muted by setting the YDMUTE pin input HIGH or by setting the MUTE flag to 1. Mute starts and finishes on the leading left-channel bit. When MSON is HIGH and valid data is empty (MSEMP=H), the output is automatically forced into the mute state. 12-bit comparison connection When the CMP12 flag is set to 1, the least signifi- cant 4 bits of the 16-bit comparison connection input data are discarded and comparison connec- tion is performed using the remaining 12 bits. Note that if the CMP12 flag is set to 1 during a com- parison connection operation, only the most signifi- cant 12 bits are used for comparison connection from that point on.
Input timing (YSCK, YSRDATA, YLRCK) Output timing (ZSCK, ZSRDATA, ZLRCK)
(DRAM2 SSELECT) A0 to A8 D0 to D3 (WRITE) NRAS NWE RCDt RASHtRASLt tCASL CASHt CADStRADHttRADS CADHt CWDSt CWDHt WELt DRAM write timing (NRAS, NCAS2, NWE, A0 to A8, D0 to D3) Write timing (when external DRAM is used) DRAM read timing (NRAS, NCA2, NWE, A0 to A8, D0 to D3) Read timing (when external DRAM is used) A0 to A8 NRAS D0 to D3 (READ) NWE RASLt RASHt CASHttCASLRCDt RADStt RADH CADS t CADHt CRDSt CRDHt NCAS2 (DRAM2 SSELECT)
- When external DRAM is used, the DRAM OE pins should be tied LOW. note 2 When CXD 2517 (Sony) is used Set 85H of microcontroller comand (option setting) as setting YFLAG take in; D5: YFLAGS= 1 D4: YFCKP= 0
NC9607BE 1996.8 NIPPON PRECISION CIRCUITS INC. NIPPON PRECISION CIRCUITS INC. reserves the right to make changes to the products described in this data sheet in order to improve the design or performance and to supply the best possible products. Nippon Precision Circuits Inc. assumes no responsib ility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Nippon P recision Circuits Inc. makes no claim or warranty that such applications will be suitable for the use specified without further testing or modifica- tion. The products described in this data sheet are not intended to use for the apparatus which influence human lives due to th e failure or malfunction of the products. Customers are requested to comply with applicable laws and regulations in effect now and hereinafter, includ- ing compliance with export controls on the distribution or dissemination of the products. Customers shall not export, directly or indirect- ly, any products without first obtaining required licenses and approvals from appropriate government agencies. NIPPON PRECISION CIRCUITS INC. 4-3, 2-chome Fukuzumi, Koto-ku Tokyo, 135 -8430, JAPAN Telephon: 03-3642-6661 Facsimile: 03-3642-6698