SM2029

SM4532 ABC | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 6

Technical content

Peak Temp：260℃ max. Max time above 230℃ ：50sec max. Max time above 200℃ ：70sec max. 0.30±0.2 0.50±0.3 0.60±0.4 0.60±0.4 0.60±0.4 0.60±0.4 ABC'S ITEM NO. ABC'S DWG NO. SPECIFICATION FOR APPROVAL d﹒Solderability： SM3266 SM2029 SM1608 SM3261 SM4516 SM4532 b﹒Operating temp. ：-55℃ ---- +125℃ a﹒Storage temp. ：-40℃ ---- +105℃ c﹒Terminal Strength： Ⅳ﹒GENERAL SPECIFICATION： AR-001A Solder : Sn96.5 / Ag3 / Cu0.5 Dip time : 4 ±1 seconds Solder temp. : 260±5℃ or equivalent Type F ( kgf ) time ( sec ) 1.0 Flux : Rosin 1.0 0.5 0.6 1.0 1.5 F 250 Temperature ( )℃ 30±5 100 150 200 Temperature +4.0 / sec max.℃ Rising Area d﹒Remark：Products comply with RoHS' requirements c﹒Terminal electrode：Ag/Ni/Sn SM1608 SM2029 SM3261 SM3266 SM4516 SM4532 Series b﹒Internal conductor ：Silver or Ag / Pd a﹒Body：Ferrite Ⅲ﹒MATERIALS： Ⅱ﹒SCHEMATIC DIAGRAM： Ⅰ﹒CONFIGURATION & DIMENSIONS： NAME PROD. REF : 0.8±0.2 1.2±0.2 1.6±0.2 1.6±0.2 1.6±0.2 3.2±0.2 B 1.6±0.2 2.0±0.2 3.2±0.2 3.2±0.2 4.5±0.2 4.5±0.2 A 1.5±0.2 1.6±0.2 1.1±0.2 1.6±0.2 0.9±0.2 0.8±0.2 C MULTILAYER CHIP BEAD A D D C B 260℃ -(1.0 ~ 5.0) / sec max.℃ Peak Temperature: Forced Cooling Area Time ( seconds ) 100150200 70sec max. 50sec max. 150 ~ 200 / 60 ~ 120sec ℃ Preheat Area +2.0 ~ 4.0 ℃ / sec max. Reflow Area 250 230℃ ba 0.7 1.0 2.2 2.2 3.0 3.0 GD 0.7 1.0 1.4 1.4 1.4 3.0 H c 0.7 1.0 1.1 1.1 1.5 1.5 I Unit : m/m G ( PCB Pattrn ) I H I PAGE: 1

SM4532121YL□ SM4516151YL□ 1). □：Packaging Information … A：Bulk B：Taping Reel ABC'S DWG NO. ABC'S ITEM NO. SPECIFICATION FOR APPROVAL AR-001A 2)."- ":Reference code SM4532700YL□ SM4516800YL□ SM3266600YL□-□□□ □ □ □ 60±25% MULTILAYER CHIP BEAD SM4516800YL□-□□□ SM4532131YL□-□□□ SM4532121YL□-□□□ SM4532700YL□-□□□ Ⅴ﹒ELECTRICAL CHARACTERISITCS： DWG No. NAME PROD. REF : 80±25% 125±25% 120±25% 70±25% at 100MHz (Ω) Impedance 3000.3 SM4532131YL□ SM3266600YL□ 0.3400 0.3 0.3 0.3 (Ω) 0.3 max. RDC 300 300 300 300 IDC max. (mA) PAGE: 2-1

Ⅴ﹒ELECTRICAL CHARACTERISITCS： SPECIFICATION FOR APPROVAL at 100MHz 19±25% 31±25% 26±25% 7±25% 10±25% 11±25% (Ω) 9±25% 30±25% 1). □：Packaging Information … A：Bulk B：Taping Reel 5±25% MULTILAYER CHIP BEAD SM2029070YL□ AR-001A SM1608050YL□ SM2029100YL□-□□□ 2)."- ":Reference code□ SM3261190YL□ SM2029110YL□-□□□ SM1608090YL□-□□□ SM1608300YL□-□□□ SM1608050YL□-□□□ □ □ SM3261190YL□-□□□ SM3261310YL□-□□□ SM3261260YL□-□□□ SM2029070YL□-□□□ DWG No. REF : PROD. NAME SM2029100YL□ SM2029110YL□ SM1608090YL□ SM1608300YL□ PAGE: 2-2 6000.2 SM3261260YL□ 0.2 0.3 0.2 0.2 SM3261310YL□ 500 400 600 600 0.2 0.2 0.2 max. (Ω) 0.2 RDC ABC'S DWG NO. ABC'S ITEM NO. 500 600 500 (mA) max. 500 IDC 1000

Carrier tape width : D※ Components SPECIFICATION FOR APPROVAL ABC'S ITEM NO. ABC'S DWG NO. G.W. (Kg) 200 m/m min. AR-001A End Inner : Reel 120 G.W. (gw) 140 150 170 180 2,000SM3266 SM4532 SM4516 1,000 2,000 ( 3 ) Q'TY & G.W. Per package Q'TY (pcs) SM2029 SM1608 SM3261 Series 3,000 4,000 4,000 8007 - 08 07 - 12 07 - 12 07 - 08 07 - 08 07 - 08 Style 200 200 120 P:4 m/m 21±0.8 21±0.8 B no component ( 2 ) Dimensions 07 - 08 07 - 12 Style 178 178 A Leader User direction of feed C D 4 m/m ( 1 ) Configuration Ⅵ﹒PACKAGING INFORMATION： A PROD. NAME REF : MULTILAYER CHIP BEAD 2.0±0.5 B N G T 41 x 39 x 228.2 41 x 39 x 22 41 x 39 x 229.3 9.7 41 x 39 x 22 41 x 39 x 22 41 x 39 x 22 Outer : Carton 8.5 8.5 7.0 Size (cm) Start 400 m/m min. Unit:m/m no component 10+0 14+0 G N 12.5 16.5 T Trailer Cover Tape D Embossed Carrier PAGE: 3

(0.079±0.002) (0.079±0.002) ABC'S ITEM NO. ABC'S DWG NO. SPECIFICATION FOR APPROVAL Fig 2. SM4516 SM4532 SM3261 SM3266 AR-001A 1.93 3.66 1.88 1.88 4.955.50 4.955.50 3.53 3.50 3.50 3.50 SM1608 SM2029 Type 1.75±0.1 (0.069 ±0.004) F±0.05 (0.002) W±0.2 (0.008) P±0.1 (0.004) 1.05 1.50 A 1.85 2.30 B 3.50 3.50 F (0.157±0.004) 4±0.1 2±0.05 PROD. MULTILAYER CHIP BEAD F±0.05 (0.002) 1.75±0.1 (0.069±0.004) ( 4 ) TYPE DIMENSIONS W±0.2 (0.008) Fig 1. NAME P±0.1 (0.004) (0.157±0.004) 4±0.1 2±0.05 REF : 1.85 1.93 1.27 1.80 4.0 8.0 4.0 4.0 12.0 12.0 8.0 8.0 Fig 0.23±0.1(0.004) T±0.1(0.00 4) Unit:m/m A±0.1 (0.004) 1.10 1.104.0 4.0 PTW 8.0 8.0 B±0.1(0.004) φ1.55±0.05 (0.061±0.002) B±0.1(0.004) A±0.1 (0.004) φ1.55±0.05 PAGE: 4

L：Lead Free Standard products comply with RoHS' requirements 1 ~ 9：Lead Free Special products comply with RoHS' requirements Appendix code 2：Package Information Appendix code 1：Product Classification T / R ( Reel package ) T / R ( Reel package ) T / R ( Reel package ) T / R ( Reel package ) T / R ( Reel package ) MULTILAYER CHIP BEAD SPECIFICATION FOR APPROVAL T.B.D. T / R ( Reel package ) Inner package AR-001A B A Code PROD. S M NAME REF : Dimension code SM4532 SM4516 SM3261 SM2029 SM3266 SM1608 pcs3000 4000 4000 pcs pcs 2000 2000 pcs pcs Type code Inner package Q'TY T.B.D. 1000pcs Remark Appendix code 1 : Classification Appendix code 2 : Package PAGE: 5 ABC'S DWG NO. Electrical code Tolerance code Reference code ABC'S ITEM NO. Ⅶ﹒DWGING NUMBER EXPRESSION：