SM SPSEMI | Alldatasheet
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Technical content
Surface Mount Devices Almost anywhere there is a low voltage Lead free deivce power supply, up to DC60V and a load Size 7555mm/2920 mils to be protested, including: Surface Mount packaging for automated assembly Computer mother board, Modem. Agency recognition: Telecommunication equipments D min max min max min max min Dimensions (mm) A B C Product dimensions (mm) Model Test Passive aging Humidity aging Thermal shock Resistance to solvent Vibration Maximum surface of the device in the tripped state is 125℃ No change Environmental Specifications C o n d i t i o n s Resistance change 85℃,1000hrs MIL-STD-202,Method 201 No change Ambient operating confitions:-40℃ to 85℃ ±5% typical 85℃,85%℃R.H.,168hrs ±5% typical 85℃,to-40℃,13times ±33% typical MIL-STD-202,Method 215 5.1 ±0.1 2.3 ±0.1 2.3 ±0.1 5.6 ±0.1 PPTC/SM Series 01 | www.spsemi.cn ZZZL B D A C REV.2014.05.01
Model Ihold Itrip Vmax Imax Pd max Current Time Rmin Rmax (A) (A) (Vdc) (A) (w) (A) (S) (Ω) (Ω) Ihold Itrip Vmax Imax Pd Rmin/max R1max *CAUTION Maximum Time To Trip Resistance Hold Current:Maximum current device will not trip in 25℃ still air. Maximum resistance of device at 25℃ measured one hour after trippde tripping. Operation beyond the specified rating may result in damage and possible arcing. Maximum operating volatge device can withstand without damage at ratde current(imax). Maximum fault current device can withstand without damage at rated voltage(Vmax). Typical power dissipatde from device when in the tripped state in 25℃ still air. Minimum/Maximum device resistance prior to tripping at 25℃. maximun ambient operating temperature(Tmao)vs.hold current(Ihold) Ihold versus tempetature Model SM030 SM050 Trip current:Minimum current at which the device will always trip in 25℃ still air SM250 SM260 SM300 Electrical characteristics(25℃) SM075 SM100 SM125 SM150 SM185 SM200 PPTC/SM Series 02 | www.spsemi.cn REV.2014.05.01
Termination pad characteristics Terminal pad materials Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper Terminal pad solderability Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Thermal Derating Curve Typical Time-To-Trip At 25°C Derating Curves for SMD Series 100 120 140 160 -40 -20 0 20 40 60 80 Temperature (°C) Percentage of Derated Current Average Time Current Curves 0.01 0.1 100 0010111.0 Current In Amperes Time In Seconds 3.00A 0.50A 0.75A 1.00A 1.25A 1.5A 1.85A 2.0A 2.5A 2.6A 0.3A
Package Information
Reel: SM030～300 2000pcs/Reel Recommended Solder Reflow Conditions Soldering ‧Recommended reflow methods ：IR, vapor phase oven, hot air oven. ‧Devices are not designed to be wave soldered to the bottom side of the board. ‧Recommended maximum paste thickness is 0.25 mm (0.010 inch). ‧Devices can be cleaned using standard method and solvents. Note ：If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. SMSMD SeriesPreheating Cooling 60-120 sec. 120 sec. 30-60 sec. 300 200 160 250 190 100 Temperature(° C) PPTC/SM Series 03 | www.spsemi.cn REV.2014.05.01