SM05 UNIONSEMI | Alldatasheet
Document overview
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Technical content
Features
Cellular Handsets and Accessories Portable Electronics Industrial Controls Set-Top Box Servers, Notebook, and Desktop PC Transient protection for data & power lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) Protects one bidirectional line or two unidirectional lines Working Voltages: 5V Low clamping voltage Solid-state silicon avalanche technology P i n C o n f i g u r a t i o n s T o p V i e w M:Monthly Code S M 0 5 S O T 2 3 - 3 z: Mark Pin 1
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Ordering Information
Voltage Packaging Type Channel Marking Code Shipping Qty SM05 5.0V SOT23-3 2 S05 3000/7 Inch Reel Absolute Maximum Ratings RATING SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20μs) PPK 300 Watts Thermal Resistance, Junction to Ambient θJA 325 °C/W Lead Soldering Temperature TL 260(10 sec.) °C Operating Temperature TJ -55 to +125 °C Storage Temperature TSTG -55 to +125 °C
Electrical Characteristics
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT Reverse Stand-Off Voltage V RWM 5 V Reverse Breakdown Voltage V BR It = 1mA 6 6.8 7.2 V Reverse Leakage Current I R VRWM = 5V, T=25°C 0.1 μA IPP = 5A, tp = 8/20μS 9.8 Clamping Voltage V C IPP = 17A, tp = 8/20μS 17.6 V Peak Pulse Current I PP tp = 8/20 μs 1 7 A Junction Capacitance C J Pin 1 to 2 VR = 0V, f = 1MHz 25 pF Junction Capacitance C J Pin 1 to 3 and Pin 2 to 3 VR = 0V, f = 1MHz 50 pF Reverse dynamic resistance R dyn,rev 0.55 Forward dynamic resistance R dyn,fwd IPP >2A 0.35 Ω
http://www.union-ic.com Rev.04 Oct.2011 3 / 6 SM05 Typical Operating Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current 0.1 1 10 100 1000 0.01 0.1 Peak Pulse Power - Ppk(kW) Pulse Duration - tp(uS) 0 2 4 6 8 1 01 21 41 6 Waveform parameters: tr=8uS td=20uS Clamping Voltage - Vc(V) Peak Pulse Current - Ipp(A)
http://www.union-ic.com Rev.04 Oct.2011 4 / 6 SM05 Typical Operating Circuits Detailed Description Device Connection Options The SM05 is designed to protect one bidirectional or two unidirectional data or I/O lines operating at 5 volts. Connection options are as follows: Bidirectional: Pin 1 is connected to the data line and pin 2 is connected to ground (Since the device is symmetrical, these connections may be reversed). The ground connection should be made directly to a ground plane. The path length should be kept as short as possible to minimize parasitic inductance. Pin 3 is not connected. Unidirectional: Data lines are connected to pin 1 and pin 2. Pin 3 is connected to ground. For best results, this pin should be connected directly to a ground plane on the board. The path length should be kept as short as possible to minimize parasitic inductance. Circuit Board Layout Recommendations for Suppression of ESD Good circuit board layout is critical for the suppre ssion of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information): Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the sold er paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.
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Package Information
SM05: SOT23-3 Outline Drawing DIMENSIONS MILLIMETERS INCHES Symbol Min Max Min Max A 0.900 1.200 0.035 0.043 A1 0.000 0.100 0.000 0.004 A2 0.900 1.100 0.035 0.039 b 0.300 0.500 0.012 0.020 c 0.080 0.180 0.003 0.007 D 2.800 3.000 0.110 0.118 E 1.200 1.400 0.047 0.055 E1 2.250 2.550 0.089 0.100 e 0.950TYP 0.037TYP e1 1.800 2.050 0.071 0.080 L 0.550REF 0.022REF L1 0.300 0.500 0.012 0.020 θ 0° 8° 0° 8° Land Pattern NOTES: 1. Compound dimension: 2.90×1.30: 2. Unit: mm; 3. General tolerance±0.05mm unless otherwise specified; 4. The layout is just for reference. Tape and Reel Orientation
http://www.union-ic.com Rev.04 Oct.2011 6 / 6 SM05 IMPORTANT NOTICE The information in this document has been carefu lly reviewed and is believed to be accurate. Nonetheless, this document is subject to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union reserves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: 2F, No. 3, Lane647 Songtao Road, Shanghai 201203 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com