SLVU2.8-8 LITTELFUSE | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 4
Technical content
Features
Applications
The SLVU2.8-8 was designed to protect low voltage, CMOS devices from ESD and lightning induced transients. There is a compensating diode in series with each low voltage TVS to present a low loading capacitance to the line being protected. These robust structures can safely absorb repetitive ESD strikes at ±30kV (contact discharge) per IEC 61000-4-2 standard and can safely dissipate up to 30A (IEC 61000-4-5 2nd Edition, tP=8/20μs) with very low clamping voltages. Pinout Functional Block Diagram
- ESD, IEC 61000-4-2, ±30kV contact, ±30kV air
- EFT , IEC 61000-4-4, 40A (5/50ns)
- Lightning, IEC 61000-4-5 2nd Edition, 30A (8/20μs)
- Low capacitance of 2.6pF per line
- Low leakage current of 0.1μA (MAX) at 2.8V
- SOIC-8 (JEDEC MO-012) pin configuration allows for protection of all 4 differential pair for 1GbE
- RoHS Compliant and Lead Free
- Moisture Sensitivity Level (MSL -1)
- 10/100/1000 Ethernet
- WAN/LAN Equipment
- Switching Systems
- Desktops, Servers, and Notebooks
- Analog Inputs
- Base Stations 12 34 87 65 Pin 1.3.5.7 Pin 2.4.6.8 RoHS Pb GREENSLVU2.8-8 Series 2.8V 30A TVS Array Additional Information Datasheet SamplesResources
© 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/22/19 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SLVU2.8-8 Series Absolute Maximum Ratings Parameter Rating Units Peak Pulse Power (tP=8/20µs) 750 W Peak Pulse Current (tP=8/20µs) 30 A Operating Temperature -40 to 125 ºC Storage Temperature -55 to 150 ºC Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR≤1μA (Each Line) 2.8 V Reverse Breakdown Voltage VBR IT=2μA (Each Line) 3.0 V Snapback Voltage VSB ISB=50mA 2.8 V Reverse Leakage Current ILEAK VR=2.8V (Each Line) 0.1 μA Clamping Voltage1 VC IPP=5A, tP=8/20μs (Each Line) 8.5 VIPP=24A, tP=8/20μs (Each Line) 17 ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact) ±30 kV IEC61000-4-2 (Air) ±30 Dynamic Resistance2 RDYN TLP tp=100ns, (Each Line) 0.3 Ω Diode Capacitance1 CD VR=0V , f=1MHz (Each Line) 2.6 3.0 pF CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Note: 1 Parameter is guaranteed by design and/or device characterization. 2 Transmission Line Pulse (TLP) test setting : Std.TDR(50Ω),tp=100ns, tr=0.2ns ITLP and VTLP averaging window: star t1=70ns to end t2=80ns Thermal Information Parameter Rating Units Storage Temperature Range -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Capacitance vs. Reverse Bias (Each line) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 &DSDFLWDQFH Bias Voltage (V) Clamping Voltage vs. Peak Pulse Currennt (Each line) 05 10 15 20 25 30 Clamp Voltage-VC (V) Peak Pulse Current-IPP (A)
© 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/22/19 TVS Diode Arrays (SPA® Diodes) SP4021 Lightning Surge Protection- SLVU2.8-8 Series Parameter Rating Units Storage Temperature Range -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 5°C/second max TS(max) to TL - Ramp-up Rate 5°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Body Material V-0 per UL 94 Molded Epoxy Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-203 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13.
Ordering Information
Part Number Package Min. Order Qty. SLVU2.8-8BTG SOIC-8 2500 Positive T ransmission Line Pulsing (TLP) Plot (Each line) 05 10 15 20 TLP Current (A) TLP Volts (V) Negative T ransmission Line Pulsing (TLP) Plot (Each line) -20- 15 -10- 50 TLP Current (A) TLP Volts (V) 8/20 µs Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP
© 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/22/19 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SLVU2.8-8 Series Embossed Carrier T ape & Reel Specification — SOIC Package User Feeding Direction Pin 1 Location Symbol Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1. 9 2.1 0.075 0.083 D 1. 5 1. 6 0.059 0.063 D1 1 .50 Min 0.059 Min P0 3.9 4.1 0.154 0.161 W 11. 9 12.1 0.468 0.476 P 7. 9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package SOIC-8 Pins 8 JEDEC MS-012 Millimetres Inches Min Max Min Max A 1 .35 1 .75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1 .25 1 .65 0.050 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 1 .27 BSC 0.050 BSC L 0.40 1 .27 0.016 0.050 o Recommended Soldering Pad Outline (Reference Only) FL Part Numbering System Part Marking System SLVU2.8 B T G Series Package B = SOIC-8 No. of channels T= Tape & Reel G= Green 12 34 87 65 SLVU2.8-8BTGLF xxxxxxxxx DATE CODE