SLVU2.8-8 SEMITECH | Alldatasheet
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Technical content
Features
400 W Peak Pulse Power per Line (tp=8/20s) Protects four line pairs Low capacitance Low Leakage Current. Low Operating and Clamping Voltages. Transient Protection for High Speed Data Lines to IEC61000-4-2(ESD)±15kV(air),±8kV(Contact) IEC61000-4-4(EFT) 40A(5/50ns) IEC61000-4-5(lightning) 24A(8/20us) Absolute Maximum Ratings Parameter Symbol Value Units Peak Pulse Power (tp = 8/20μs) - See Fig1. PPK 400 W Peak Pulse Current (tp = 8/20μs) IPP 24 A Storage Temperature Range TSTG -55 to 150 °C Operating Junction Temperature Range TJ -55 to 150 °C Fig1. Peak Pulse Power VS Pulse Time
SLVU2.8-8 SHANGHAI SEMITECH SEMICONDUCTOR CO., LTD 2. Electrical Parameter Symbol Parameter IPP Peak Pulse Current VC Clamping Voltage @ IPP VRWM Reverse Stand-Off Voltage IR Reverse Leakage Current @ VRWM VSB Snap-Back Voltage @ ISB ISB Snap-Back Current VPT Punch-Through Voltage IPT Punch-Through Current Fig2. SLVU2.8-8 IV Characteristic Curve
Electrical Characteristics
Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off Voltage VRWM 2.8 V Punch-Through Voltage VPT IPT = 2uA 3.0 V Snap-Back Voltage VSB ISB = 50mA 2.8 V Reverse Leakage Current IR VRWM =2.8V, T=25℃ (Each Line) 1 uA Clamping Voltage VC IPP =2A, tP=8/20us (Each Line) 5.5 V Clamping Voltage VC IPP =5A, tP=8/20us (Each Line) 8.5 V Clamping Voltage VC IPP =24A, tP=8/20us (Each Line) 15 V Junction Capacitance Cj VR =0V, f =1MHz (Each Line) 7 10 pF Typical Characteristics Fig3. Pulse Waveform Fig4. Power Derating Curve
SLVU2.8-8 SHANGHAI SEMITECH SEMICONDUCTOR CO., LTD 3. Fig5. Clamping Voltage vs. Fig6. Forward Voltage vs. Peak Pulse Current Forward Current Fig7. Insertion Loss S21 Application Note Electronic equipment is susceptible to damage caused by Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), and tertiary lightningeffects. Knowing that equipment can be damaged, the SLVU2.8 -4 was designed to provide the level of protection required to safe guard sensitive equipment. This product can b e used in different configurations to provide a level of protection to meet unidirectional line requirements as well as bidirectional requirements either in a common -mode or differential -mode configuration.
SLVU2.8-8 SHANGHAI SEMITECH SEMICONDUCTOR CO., LTD 4. Bidirectional Common-Mode Protection (Figure 9) The SLVU2.8-8 provides up to four lines of protection in a common-mode configuration as depicted in figure 9. Circuit connectivity is as follows: Line 1 is connected to Pin 1 Line 2 is connected to Pin 7 Line 3 is connected to Pin 3 Line 4 is connected to Pin 5 Pins 2, 4, 7 and 8 are connected to ground Bidirectional different--Mode Protection (Figure 10) The SLVU2.8-8 provides up to two-line pairs of protection in a differential-mode configuration as depicted in figure 11. Circuit connectivity is as follows: Line Pair 1 is connected to Pins 1 & 2 Line Pair 2 is connected to Pins 3 & 4 Line Pair 3 is connected to Pins 7 & 8 Line Pair 4 is connected to Pins 5 & 6 Circuit Board Layout Protection Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following guidelines are recommended: The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. The path length between the TVS device and the protected line should be minimized. All conductive loops including power and ground loops should be minimized. The transient current return path to ground should be kept as short as possible to reduce parasitic inductance. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. Fig 9. Fig10.
SLVU2.8-8 SHANGHAI SEMITECH SEMICONDUCTOR CO., LTD 5. Typical Applications Fig11. Gigabit Ethernet Protection Circuit
SLVU2.8-8 SHANGHAI SEMITECH SEMICONDUCTOR CO., LTD 6. Typical Applications Fig12. One SLVU2.8-8 Protecting Two 10/100 Ethernet Port
SLVU2.8-8 SHANGHAI SEMITECH SEMICONDUCTOR CO., LTD 7. SOP-8 MECHANICAL DATA DIM Millimeters MIN TYP MAX A 1.75 A1 0.10 0.25 A2 1.35 1.55 1.75 B 0.35 0.42 0.49 C 0.19 0.25 D 4.80 4.90 5.00 E 5.80 6.00 6.20 E1 3.80 3.95 4.00 e 1.27 L 0.40 0.90 K 0o 8o