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Technical content

Features

Applications

The SLVU2.8-4 was designed to protect low voltage, CMOS devices from ESD and lightning induced transients. There is a compensating diode in series with each low voltage TVS to present a low loading capacitance to the line being protected. These robust structures can safely absorb repetitive ESD strikes at ±30kV (contact discharge) per IEC61000-4-2 standard and each structure can safely dissipate up to 40A (IEC61000-4-5, t P=8/20μs) with very low clamping voltages. Pinout Functional Block Diagram

  • ESD, IEC61 000-4-2, ±30kV contact, ±30kV air EFT, IEC61 000-4-4, 40A (5/50ns)
  • Lightning , IEC61 000-4-5, 40A (8/20μs)
  • L ow capacit ance of 2pF per line
  • L ow leakage cur rent of 1μA (MAX) at 2.8V
  • SOIC-8 (JEDEC MO-0 12) pin configuration allows f or simple flow-through layout
  • 10/100/1000 Ethernet WAN/LAN Equipment
  • Switching S ystems
  • Desktops, Ser vers, and Notebooks
  • Analog Inputs Base St ations 56 78 43 21 Pin 1.3 Pin 2.4 Pin 6.8 Pin 5.7 RoHS Pb GREEN Application Example Ethernet PHY RJ-45 Connector SLVU2.8-4 Device is shown as transparent for actual footprintCase GND Tx+ Tx- Rx+ Rx- SLVU2.8-4 Series 2.8V 40A TVS Array

3©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: February 15, 2012 SL VU2.8-4 Series SLVU2.8-4 Lightning Surge Protection - SLVU2.8-4 Series Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone T L to TP Critical Zone TL to TP Reflow Condition Pb – F ree assembly P re Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 5°C/second max TS(max) to TL - Ramp-up Rate 5°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package SOIC-8 Pins 8 JEDEC MS-012 Millimetres Inches Min Max Min Max A 1 .35 1 .75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1 .25 1 .65 0.050 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 1.27 BSC 0.050 BSC L 0.40 1 .27 0.016 0.050 o Recommended Soldering Pad Outline (Reference Only) FL Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. All specifications comply to JEDEC SPEC MO-203 Issue A 5. Blo is f acing up f or mold and f acing do wn f or trim/f orm, i.e. re verse trim/f orm. 6. Package surface matte finish VDI 11-13.

©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Revision: February 15, 2012 SL VU2.8-4 Series Lightning Surge Protection - SLVU2.8-4 Series

Ordering Information

Part Number Package Marking Min. Order Qty. SL VU2.8-4BTG SOIC-8 U2.8-4 2500 Part Numbering System Part Marking System SLVU2.8 B T G Series Package B = SOIC-8 No. of channels T= Tape & Reel G= Green U2.8-4 U 2.8 Product Series U = SLVU2.8 Voltage Level No. of channels Embossed Carrier T ape & Reel Specification — SOIC Package User Feeding Direction Pin 1 Location Symbol Millimetres Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1 .95 2.05 0.077 0.081 D 1. 5 1. 6 0.059 0.063 D1 1 .50 Min 0.059 Min P0 3.9 4.1 0.154 0.161 W 11. 9 12.1 0.468 0.476 P 7. 9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087