SLG55570A RENESAS | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 9

Technical content

Features

  • Low Supply Current
  • Automatic Current-Limit Switch Control
  • Automatic USB Charger Identification Circuit
  • Apple iPad* @ 2.4 A charging current support
  • Chinese Telecom Standard YD/T 1591-2009 specification support
  • Samsung Galaxy Tab** charge scheme support
  • Pb-Free / RoHS Compliant / Halogen-Free
  • TDFN-8 Package Target Applications
  • Power bank
  • Car charger
  • USB universal wall charger Pin Configuration - SLG55570A * Apple iPhone, iPad and iPod are trademarks of App le Inc., registered in the U.S. and other countries. ** Samsung Galaxy Tab are trademarks of Samsung Ele ctronics, registered in Korea and other countries. VDD GND NC NC GND DP DM CEN 4 5 Thermal Pad connected to GND TDFN-8 (Top View) FSM Logic One Shot VREF1 VREF1 CEN DM DP VREF2 FET VDD Resistor Divider Resistor Divider

000-0055570-101 Page 2 of 8 SLG55570A Pin Description - SLG55570A

Ordering Information

Pin # Pin Name Type Pin Description 1 CEN Output N-FET Open Drain Output. Current Limit Switch (CLS) Control Output. CEN will be low for 2 seconds (typ). Requires a pull up resistor.

2 DM Input/Output USB Connector D-

3 DP Input/Output USB Connector D+

4 GND GND Ground

5 VDD PWR Power Supply. Connect a 0.1 µF capacitor between VDD and GND as close as possible to the device.

6 NC NC No Connect

7 NC NC No Connect

8 GND GND Ground

9 Thermal Pad GND Ground (Must connect to Ground)

SLG55570AVTR TDFN-8 - Tape and Reel

000-0055570-101 Page 3 of 8 SLG55570A Absolute Maximum Ratings Electrical Characteristics - Power Supply Electrical Characteristics - Dynamic Performance Electrical Characteristics - Internal Resistors Parameter Min. Max. Unit Supply Voltage -0.3 6.0 V Continuous Current into any terminal -30 +30 mA Continuous Power Dissipation -- 954 mW Operating Temperature Range -40 85 °C Junction Temperature 150 °C Storage Temperature Range -65 150 °C Lead Temperature (Soldering, 10s) 260 °C Note: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at thes e or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. VDD = 4.75 V to 5.25 V, T A = 25 °C (unless specified otherwise) Parameter Description Condition/Note Min. Typ. Max. Unit VDD Power Supply Range 4.75 -- 5.25 V IDD Supply Current V DD = 5V -- 140 160 µA VDD = 4.75 V to 5.25 V, T A = 25 °C (unless specified otherwise) Parameter Description Condition/Note Min. Typ. Max. Unit CON DP/DM On-Capacitance f = 240MHz --‘ 4.0 5.5 pF VDD = 4.75 V to 5.25 V, T A = 25 °C (unless specified otherwise) Parameter Description Condition/Note Min. Typ. Max. Unit RPD DP/DM Short Pull-down 350 500 700 k Ω RT RP RP1/RP2 Ratio 0.8544 0.863 0.872 Ratio RRP RP1 + RP2 Resistance 69.75 93.0 115.18 k Ω RT RM RM1/RM2 Ratio 0.8544 0.863 0.872 Ratio RRM RM1 + RM2 Resistance 69.75 93.0 115.18 k Ω

000-0055570-101 Page 4 of 8 SLG55570A Electrical Characteristics - CEN Output Electrical Characteristics - ESD Protection VDD = 4.75 V to 5.25 V, T A = 25 °C (unless specified otherwise) Parameter Description Condition/Note Min. Typ. Max. Unit TVBT VBUS Toggle Time 1.5 2.0 2.5 s VOL_CEN CEN Output Logic Low Voltage -- -- 0.4 V IOUT_CEN CEN Output Leakage Current VDD = 5.5V VCEN = 5.5V or CEN deasserted -- -- 1 µA VDD = 4.75 V to 5.25 V, T A = 25 °C (unless specified otherwise) Parameter Description Condition/Note Min. Typ. Max. Unit VESD ESD Protection Level (DP and DM Only) Human Body Model -- ±8 -- kV V ESD ESD Protection Level (All other pins) Human Body Model -- ±2 -- kV

000-0055570-101 Page 5 of 8 SLG55570A CEN Function Waveform CEN CB

000-0055570-101 Page 6 of 8 SLG55570A Package Top Marking System Definition Part ID Assembly Code Datecode Lot Revision 8 7 6 5 1 2 3 4 – Part ID Field: identifies the specific device configuration – Assembly Code Field: Assembly Location of the device. – Date Code Field: Coded date of manufacture – Lot Code: Designates Lot # – Revision Code: Device Revision XX A DD L R

000-0055570-101 Page 7 of 8 SLG55570A Package Drawing and Dimensions

8 Lead TDFN Package

JEDEC MO-229, Variation WCCD

000-0055570-101 Page 8 of 8 SLG55570A Tape and Reel Specifications Carrier Tape Drawing and Dimensions Recommended Reflow Soldering Profile Please see IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 3.00 mm 3 (nominal). More information can be found at www.jedec.org. Package Type # of Pins Nominal Package Size [mm] Max Units Reel & Hub Size [mm] Leader (min) Trailer (min) Tape Width [mm] Part Pitch [mm] per Reel per Box Pockets Length [mm] Pockets Length [mm] TDFN 8L Green 8 2 x 2 x 0.75 3,000 3,000 178 / 60 100 400 100 400 8 4 Package Type Pocket BTM Length Pocket BTM Width Pocket Depth Index Hole Pitch Pocket Pitch Index Hole Diameter Index Hole to Tape Edge Index Hole to Pocket Center Tape Width A0 B0 K0 P0 P1 D0 E F W TDFN 8L W EP0 Y Y Section Y-Y CL F Refer to EIA-481 specification

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