SLG55544

SLG55544 RENESAS | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 20

Technical content

Features

• Meets Battery Charging Specification BC1.2 for DCP and CDP
• Meets Chinese Telecommunications Industry Standard YD/T 1591-2009
• Supports Non-BC 1.2 charging modes via Automatic s e - lection - DM/DP Divider Modes 2.7V/2.0V (1A) & 2.0V/2.7V (2A) - DM/DP 1.2V Mode
• Support Smart-CDP function - Automatic CDP/SDP mode support for Always data Communication
• Compatible with USB 2.0/3.0 power switch requirements
• 73 m Ω (typ) high side MOSFET
• Adjustable Current Limit up to 3.0 A (typ)
• Pb-Free / RoHS Compliant
• Halogen-Free
• TQFN-16 Package / MSL-1
• UL Listed and CB File No. E468659 Pin Configuration

Applications

• USB Ports/Hubs
• Notebook PCs
• Universal Wall Charging Adapter 16-pin TQFN NC DP_IN DM_IN CTL2 CTL1 EN SLG55544 FAULT# GND ILIM_L DP_OUT DM_OUT VIN GND 4ILIM_SEL CTL3 8 VOUT 12

16 ILIM_H

(Top View) DP_IN DM_IN EN FAULT# DP_OUT DM_OUT VIN ILIM_SEL VOUT Power Switch Control Circuitry CTL1 Charge Logic CTL3 CTL2 Charging Downstream Port Mode BC Divider Mode BC 1.2 DCP Mode / 1.2 V Mode Dedicated Sense Host Sense Charge Mode Select Shorted/Divider Mode Switch High Band - width Switch Auto Discharge Current Limit Switch ILIM_L ILIM_H

000-00055544-104 Page 2 of 19 SLG55544 Pin Description Pin # Name Type Description 1 VIN PWR Input voltage, connect a 0.1 µF or greater ceramic capacitor from IN to GND as close to the device as possible

2 DM_OUT Input/Output D- data line to USB host control ler

3 DP_OUT Input/Output D+ data line to USB host control ler

4 ILIM_SEL Input Logic level input signal used to dyna mically change power switch cur -

rent-limit threshold; logic LOW selects ILIM_L, logic HIGH selects ILIM_H

5 EN Input Logic level control input for turning the p ower switch and the signal switches

on/off. When EN is LOW, the device is disabled, the signal and power switches are OFF.

6 CTL1 Input Logic level control inputs for controllin g the charging mode and the signal

switches. The “000” configuration is used to force and discharge of the output (VOUT) capacitor. 7 CTL2 Input

8 CTL3 Input

9 NC NC No Connect. Open or connect to Ground

10 DP_IN Input/Output D+ data line to connector, input /output used for hand-shaking with portable

11 DM_IN Input/Output D- data line to connector, input /output used for hand-shaking with portable

12 VOUT PWR Power switch output

13 FAULT# Output Active low open drain output, asserte d during over-temperature or

14 GND GND Ground

15 ILIM_L Input External resistor used to set current- limit threshold when ILIM_SEL is LOW. See current limit setting in detailed description.

16 ILIM_H Input External resistor used to set current- limit threshold when ILIM_SEL is

HIGH. See current limit setting in detailed description.

17 Thermal Pad GND Ground

Ordering Information

SLG55544VTR TQFN-16 - Tape and Reel

000-00055544-104 Page 3 of 19 SLG55544 1. Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to a bsolute-maximum-rated conditions for extended perio ds may affect device reliability. Absolute Maximum Conditions 1 Parameter Min. Max. Unit Supply Voltage range VIN -0.3 7 V Input Voltage range EN, ILIM_L, ILIM_H, ILIM_SEL, CTL1, CTL2, CTL3 -0.3 7 V Output Voltage range VOUT, FAULT# -0.3 7 V Output Voltage range VIN to VOUT -7 7 V Voltage range DP_IN, DM_IN, DP_OUT, DM_OUT -0.3 VIN+0.3 or 5.7 V Input Clamp current DP_IN, DM_IN, DP_OUT, DM_OUT -- ±2 0 mA Continuous current in SDP or CDP mode DP_IN to DP_O UT or DM_IN to DM_OUT -- ±100 mA Continuous current in BC1.2 DCP mode DP_IN to DM_IN -- ±35 mA Continuous output current Internally limited Continuous output sink current FAULT#, NC -- 25 mA Continuous output source current ILIM_L, ILIM_H -- 1 m A Continuous total power dissipation Internally limited ESD Rating, Human Body Model (HBM) VIN, EN, ILIM_L, ILIM_H, ILIM_SEL, CTL1, CTL2, CTL3, NC, OUT, FAULT# 2 -- kV ESD Rating, Human Body Model (HBM) DP_IN, DM_IN, DP _OUT, DM_OUT 8 -- kV ESD Rating, Charged Device Model 500 -- V Operating Temperature Range -40 85 °C Storage Temperature Range -65 165 °C

000-00055544-104 Page 4 of 19 SLG55544 1. For more information about traditional and new t hermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. 3. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. 4. The junction-to-board thermal resistance is obta ined by simulating in an environment with a ring co ld plate fixture to control the PCB temperature, as described in JESD51-8. 5. The junction-to-top characterization parameter, ψ JT , estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). 6. The junction-to-board characterization parameter, ψ JB , estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). 7. The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Thermal Information 1 Parameter RTE Unit θJA Junction-to-ambient thermal resistance 2 53.4 °C/W θJCtop Junction-to-case (top) thermal resistance 3 51.4 °C/W θJB Junction-to-board thermal resistance 4 17.2 °C/W ψ JT Junction-to-top characterization parameter 5 3.7 °C/W ψ JB Junction-to-board characterization parameter 6 20.7 °C/W θJCbot Junction-to-case (bottom) thermal resistance 7 3.9 °C/W Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) Symbol Parameter Condition/Note Min. Typ. Max. Unit VIN Input Voltage VIN 4.5 -- 5.5 V Logic Level Inputs (CTL1, CTL2, CTL3, EN, ILIM_SEL) 0 -- 5.5 V Data Line Inputs (DP_IN, DM_IN, DP_OUT, DM_OUT) -- -- 5.5 V Continuous Current Data Line inputs (SDP or CDP mode, DP_IN to DP_OUT or DM_IN to DM_OUT) -- -- ±30 mA Data Line inputs (BC1.2 DCP mode, DP_IN to DM_IN) -- -- ±15 mA R ILIM Current-limit set resistors ILIM_L to GND, ILIM_H to GND 16.9 -- 750 k Ω TJ Operating virtual junction temperature -40 -- 125 °C V IH Input Logic High 1.8 -- -- V VIL Input Logic Low -- -- 0.8 V VHYST Input Logic Hysteresis -- 250 -- mV

000-00055544-104 Page 5 of 19 SLG55544

Electrical Characteristics

Conditions are -40 ≤ T J ≤ 125°C unless otherwise noted. V EN = V IN = 5 V, R FAULT# = 10 k Ω , R ILIM_L = 80 k Ω , R ILIM_H = 20 k Ω , ILIM_SEL = V IN , CTL1 = CTL2 = CTL3 = V IN , unless otherwise noted. Positive currents are into pins. Typical values are at 25°C. All voltages are with respect to GND unless otherwise noted. Electrical Characteristics - Power Switch Symbol Parameter Condition/Note Min. Typ. Max. Unit Rds ON Static drain-source on-state resistance IOUT = 2 A, V ILIM_SEL = Logic High -- 73 -- m Ω I OUT = 100 mA, V ILIM_SEL = Log - ic Low -- 73 -- m Ω -40°C ≤ T A = T J ≤ 85°C, I OUT =

2 A, V ILIM_SEL = Logic High -- 73 -- m Ω

TA = T J = 25°C, I OUT = 2 A, VILIM_SEL = Logic HIgh -- 73 -- m Ω TR Rise Time, Output C L = 1 µF, R L = 100 Ω , 0.7 1.0 1.6 ms TF Fall Time, Output C L = 1 µF, R L = 100 Ω , 0.2 0.35 0.5 ms RDIS Out Discharge Resistance 337 498 681 Ω TDIS Out Discharge Hold Time -- 2 -- s IREV Reverse leakage current VOUT = 5.5 V, V IN = V EN = 0 V, TJ = 25°C -- -- 2 µA Electrical Characteristics - Input EN Symbol Parameter Condition/Note Min. Typ. Max. Unit VEN Enable pin turn on/off threshold, falling -- 1.08 -- V V EN_HYS EN Hysteresis -- 230 1 -- mV IEN Input current V EN = 0 V or 5.5 V -0.5 -- 0.5 µA TON Turn On time C L = 1 µF, R L = 100 Ω , -- 2.7 4.0 ms TOFF Turn Off time C L = 1 µF, R L = 100 Ω , -- 1.7 3.0 ms Note: 1. Typical value for reference only, not 100% tested. Electrical Characteristics - Current Limit Symbol Parameter Condition/Note Min. Typ. Max. Unit VILIM_SEL ILIM_SEL turn on/off thresh - old, falling -- 1.08 -- V VILIM_HYS ILIM_SEL Hysteresis -- 230 1 -- mV ILIM_SEL Input current V ILIM_HYS = 0 V or 5.5 V -0.5 -- 0.5 µA

000-00055544-104 Page 6 of 19 SLG55544 ISHORT Maximum DC Output current from VIN to VOUT V ILIM_SEL = Logic Low RILIM_L = 210k Ω 0.22 0.26 0.30 A VILIM_SEL = Logic Low RILIM_L = 80.6k Ω -40°C ≤ T J ≤ 85°C 0.60 0.66 0.72 A VILIM_SEL = Logic Low RILIM_L = 22.1k Ω 2.120 2.275 2.430 A VILIM_SEL = Logic High RILIM_H = 20k Ω 2.340 2.510 2.685 A VILIM_SEL = Logic High RILIM_H = 16.9k Ω 2.77 2.97 3.17 A TIOS Response time to short cir - cuit VIN = 5 V -- 6.65 1 -- µs Note: 1. Typical value for reference only, not 100% tested. Electrical Characteristics - Supply Current Symbol Parameter Condition/Note Min. Typ. Max. Unit ICCL Supply current, switch dis - abled VEN = 0 V, OUT grounded, -40°C ≤ T J ≤ 85°C -- 0.1 2 µA ICCH Supply current, operating V EN = V IN -- 215 270 µA Electrical Characteristics - Undervoltage Lockout Symbol Parameter Condition/Note Min. Typ. Max. Unit VUVLO Low level input voltage, IN V IN rising 3.9 4.1 4.3 V VIN_HYS Hysteresis, IN 100 1 mV Note: 1. Typical value for reference only, not 100% tested. Electrical Characteristics - FAULT# Symbol Parameter Condition/Note Min. Typ. Max. Unit VOL Output Low voltage, FAULT# IFAULT# = 1 mA -- -- 100 mV ILEAK Off-state leakage V FAULT# = 5.5 V -- -- 1 µA FAULT# Deglitch FAULT# assertion or de-asser - tion due to over-current condi - tion -- 8.6 -- ms Electrical Characteristics - CTL Inputs Symbol Parameter Condition/Note Min. Typ. Max. Unit VCTL CTL pins turn on/off thresh - old, falling -- 1.08 -- V VCTL_HYS Hysteresis, CTL -- 230 1 -- mV Input current V CTL = 0 V or 5.5 V -0.5 -- 0.5 µA Note: 1. Typical value for reference only, not 100% tested. Electrical Characteristics - Current Limit Symbol Parameter Condition/Note Min. Typ. Max. Unit

000-00055544-104 Page 7 of 19 SLG55544 Electrical Characteristics - Thermal Shutdown Symbol Parameter Condition/Note Min. Typ. Max. Unit Thermal shutdown threshold 155 -- -- °C Thermal shutdown threshold in current-limit 135 -- -- °C Hysteresis 20 1 °C Note: 1. Typical value for reference only, not 100% tested. Electrical Characteristics - Analog Switch VIN = 5.0 V, T A = 25 °C (unless specified otherwise) Symbol Parameter Condition/Note Min. Typ. Max. Unit VDP_IN , V DM_IN Analog signal Range 0 -- V DD V RON On Resistance DP_OUT/DM_OUT Switch V DP/DM_OUT = 0 V, IDP/DM_IN = 30 mA -- 2 4 Ω VDP/DM_OUT = 2.4 V, IDP/DM_IN = -15 mA -- 3 6 Ω ΔRON On Resistance Mismatch between channels DP_OUT/DM_OUT Switch V IN = 5 V VDP_IN = V DM _IN = 400 mV IDP_IN = I DM_IN = 10 mA -- 0.1 -- Ω RFLAT On Resistance flatness DP_OUT/DM_OUT Switch V IN = 5.0 V VDP_IN = V DM_IN = 0 V to V IN IDP_IN = I DM_IN = 10 mA -- 0.5 -- Ω RSHORT On Resistance of DP_OUT/DM_OUT Short V CB = 0 V VDP_IN = 1 V IDP_IN = I DM _IN = 10 mA -- 100 150 Ω IDP_OUT_OFF , IDM_OUTOFF Off-Leakage Current VIN = 3.6 V VDP_IN = V DM_IN = 0.3 V to 3.3 V VDP_OUT = V DM_OUT = 3.3 V to 0.3 V V EN = 0 V -250 -- 250 nA IDP_IN_OFF , IDM_IN_OFF Off-Leakage Current VIN = 3.6 V VDP_IN = V DM_IN = 3.3 V to 0.3 V VEN = V IN -250 -- 250 nA Electrical Characteristics - Dynamic Performance VDD = 5.0 V, T A = 25 °C (unless specified otherwise) Symbol Parameter Condition/Note Min. Typ. Max. Unit TON Turn On Time VDP_OUT or V DM_OUT = 1.5 V RL = 300 Ω CL = 35 pF --‘ 20 100 µs TOFF Turn Off Time VDP_OUT or V DM_OUT = 1.5 V RL = 300 Ω CL = 35 pF --‘ 1 5 µs TPLH , T PHL DP_OUT/DM_OUT Switch Propagation Delay R L = R S = 50 Ω -- 60 -- ps

000-00055544-104 Page 8 of 19 SLG55544 TSKEW Output Skew Skew between DP_IN and DM_IN when connected to DP_OUT and DM_OUT R L = R S = 50 Ω -- 40 -- ps COFF DP_OUT/DM_OUT Off-Ca - pacitance f = 1 MHz --‘ 2.0 -- pF CON DP_IN/DM_IN On-Capaci - tance f = 240 MHz --‘ 4.0 5.5 pF BW -3dB Bandwidth R L = R S = 50 Ω -- 1000 -- MHz VISO Off-Isolation VDP_OUT, VDP_IN = 0 dBm RL = R S =50 Ω f = 250 MHz -- -20 -- dB VCT Crosstalk VDP_OUT, VDP_IN = 0 dBm RL = R S = 50 Ω f = 250 MHz -- -25 -- dB Electrical Characteristics - Dynamic Performance VDD = 5.0 V, T A = 25 °C (unless specified otherwise) Symbol Parameter Condition/Note Min. Typ. Max. Unit

000-00055544-104 Page 9 of 19 SLG55544 Parameter Measurement Information Test Circuit Voltage Waveform Voltage Waveforms Response Time to Short-Circuit Waveforms ISHORT

000-00055544-104 Page 10 of 19 SLG55544 DCP BC1.2 Operation VOUT Discharge During CTL Lines Change

000-00055544-104 Page 11 of 19 SLG55544 Overview The following overview references various industry standards. It is always recommended to consult the most up-to-date standard to ensure the most recent and accurate information. Rechargeable portable equipment requires an extern al power source to charge its batteries. USB ports are a convenient lo cation for charging because of an available 5 V pow er source. Universally accepted standards are required to make sure host a nd client-side devices operate together in a system to ensure power management requirements are met. Traditionally, USB host ports following the USB 2.0 specification mus t provide at least 500 mA to downstream client-side devices. Because multi ple USB devices can be attached to a single USB por t through a bus-powered hub, it is the responsibility of the client-side device to negotiate its power allotment from the host to ensure the total current draw does not exceed 500 mA. In general, each USB device is granted 100 mA and may request more current in 100 mA unit steps up to 500 mA. The host may grant or deny based on the available current. Additionally, the success of USB has made the mini- USB connector a popular choice for wall adapter cab les. This allows a portable device to charge from both a wall adapter and USB port with only one connector. One common di fficulty has resulted from this. As USB charging has gained popularity, t he 500 mA minimum defined by USB 2.0 has become ins ufficient for many handset and personal media players which need a higher charging rate. On the other hand, wall adapters can provide much more current than 500 mA. Several new standards have been introduced defining protocol handshaking methods that allow host and client devices to acknowledge and draw additional c urrent beyond the 500 mA minimum defined by USB 2.0 while still using a single micro-USB input connector. The SLG55544 supports three of the most common protocols:

• USB 2.0 Battery Charging Specification BC1.2
• Chinese Telecommunications Industry Standard YD/T 1591-2009
• Divider Mode All three methods have similarities and differences , but the biggest commonality is that all three def ine three types of charging ports that provide charging current to client-side devices. These charging ports are defined as:
• Standard Downstream Port (SDP)
• Charging Downstream Port (CDP)
• Dedicated Charging Port (DCP) BC1.2 defines a Charging Port as a downstream facing USB port that provides power for charging portable equipment. The table below shows the differences between these ports according to BC1.2 (draft). BC1.2 (draft) defines the protocol necessary to allow portable equipment to determine what type of port it is connected to so that it can allot its maximum allowable current draw. The hand-shaking process has two steps. During step one, the primary detection, the portable equipment outputs a nominal 0.6-V output on its D+ line and reads the voltage input on its D- line. The portable device concludes it is connected to an SDP if the voltage is less than the nominal data detect voltage of 0.3 V. The portable device concludes that it is connected to a Charging Port i f the D- voltage is greater than the nominal data d etect voltage of 0.3 V and less than 0.8 V. The second step, the secondary det ection, is necessary for portable equipment to dete rmine between a CDP and a DCP. The portable device outputs a nominal 0. 6 V output on its D- line and reads the voltage inp ut on its D+ line. The portable device concludes it is connected to a CDP if the data line being read remains less than the nominal data detect voltage of 0.3 V. The portable device concludes it is connected to a DCP if the data line being read is greater than the nominal data detect voltage of 0.3V and less than 0.8 V. Operating Modes Port Type Supports USB 2.0 Communication Maximum Allowable Current Draw By Portable Equipment (A) SDP (USB 2.0) Yes 0.5 SDP (USB 3.0) Yes 0.9 CDP Yes 1.5 DCP No 1.5

000-00055544-104 Page 12 of 19 SLG55544 Standard Downstream Port (SDP) An SDP is a traditional USB port that follows USB 2.0/3.0 and supplies a maximum of 500 mA per port for USB 2.0 and 900 mA per port for USB 3.0. USB 2.0 communications is supported, and the host controller must be active to allow charging. Charging Downstream Port (CDP) be active to allow charging. What separates a CDP from an SDP is the host-charge handshaking logic that identifies this port as a CDP . A CDP is identifiable by a compliant BC1.2 (draft) client device and allows for additional current draw by the client device. The CDP hand-shaking process is two steps. During step one the portable equipment outputs a nominal 0.6 V output on its D+ line and reads the voltage input on its D- line. The portable device concludes it is connected to an SDP if the voltage is less than the nominal data detect voltage of 0.3 V. The portable device concludes that it is connected to a Charging Port if the D- voltage is greater than the nominal data detect voltage of 0.3V and less than 0.8 V. The second step is necessary for portable equipment to determine between a CDP and a DCP. The portable device outputs a nominal 0.6 V output on its D- line and reads the voltage input on its D+ line. The portable device concludes it is connected to a CDP if the data line being read remains less than the nominal data detect voltage of 0.3 V. The portable device concludes it is connected to a DCP if the data line being read is greater than the nominal data detect voltage of 0.3V and less than 0.8 V. Dedicated Charging Port (DCP) A DCP is a special type of wall-adapter used in charging applications that uses a micro-B connector to connect to portable devices. A DCP only provides power and does not support data connection to an upstream port. As shown in follow ing sections, a DCP is identified by the electrical characteristics of its data lines. The SLG55544 emulates DCP in two charging states, namely DCP Forced and DCP Auto. In DCP Forced state the device will support one of the following two DCP charging schemes: Divider1 or Shorted. In DCP Auto state, the SLG55544 charge detection state machine is enabled which will selectively implement charging schemes involved with the Shorted, Divider1, Divider2, and 1.2 V modes. Shorted DCP mode complies with BC1.2 and Chinese Telecommunications Industry Standard YD/T 1591-2009, Divider and 1.2V modes are used to charge devices that do not comply with BC1.2 DCP standard. High-Bandwidth Data Line Switch The SLG55544 passes the D+ and D- data lines throug h the device to enable monitoring and handshaking w hile supporting charging operation. A wide bandwidth signal switch is used, allowing data to pass through the device w ithout corrupting signal integrity. The data line switches are turned on in any of CDP or SDP operating modes. The EN input als o needs to be at logic High for the data line switches to be enabled. Note: 1. While in CDP mode, the data switches are ON even while CDP handshaking is occurring. 2. The data line switches are OFF if EN is low, or if in DCP mode (BC1.2 (draft), Divider mode or Auto -detect). They are not automatically turned off if the power switch (IN to OUT) is doing current limiting. With SLG55544, the data line switches are also off when in “000” mode. 3. The data switches are for USB 2.0 differential pair only. In the case of a USB 3.0 host, the super speed differential pairs must be routed directly to the USB connector without passing through the SLG55544.

000-00055544-104 Page 13 of 19 SLG55544 Logic Control Modes The SLG55544 supports the listed standards above fo r the SDP , CDP and DCP modes using the CTL1, CTL2, and CTL3 logic I/O control pins, although their truth tables are different as shown below. The different CTLx settings correspond to the different types of charge modes. Also, using the Auto-Detect Mode, the Divider Mode or BC1.2 (draft) / YD/T 1591 -2009 can be automatically selected without external user interaction Note: With the SLG55544, if the “000” mode is selected, t he power switch will be turned off and an output di scharge resistor will be connected, while the data line switches will be turned off. Notes: 1. No VOUT discharge when charging between 1111 and 1110. 2. CDP Load present governed by the SMART-CDP function. SLG55544 Control Truth Table CTL1 CTL2 CTL3 ILIM_SEL MODE Current Limit Settings Note 0 0 0 0 Discharge N/A Output held LOW 0 0 0 1 Discharge N/A Output held LOW 0 0 1 0 DCP Auto ILIM_H Data Lines Disconnected 0 0 1 1 DCP Auto ILIM_H Data Lines Disconnected 0 1 0 0 SDP1 ILIM_L Data Lines Connected 0 1 0 1 SDP1 ILIM_H Data Lines Connected 0 1 1 0 DCP Auto ILIM_H Data Lines Disconnected 0 1 1 1 DCP Auto ILIM_H Data Lines Disconnected 1 0 0 0 DCP Shorted ILIM_L Device forced to stay in DCP BC 1.2 charging mode 1 0 0 1 DCP Shorted ILIM_H Device forced to stay in DCP BC 1.2 charging mode 1 0 1 0 DCP / Divider1 ILIM_L Device forced to stay in DCP Divider1 charging mode 1 0 1 1 DCP / Divider1 ILIM_H Device forced to stay in DCP Divider1 charging mode 1 1 0 0 SDP1 ILIM_L Data Lines Connected 1 1 0 1 SDP1 ILIM_H Data Lines Connected 1 1 1 0 SDP2

1 ILIM_L Data Lines Connected

1 1 1 1 CDP 1,2 ILIM_H Data Lines Connected

000-00055544-104 Page 14 of 19 SLG55544 Output Discharge To allow a charging port to renegotiate current with a portable device, SLG55544 uses the VBUS discharge function. It proceeds by turning off the power switch while discharging V OUT, then turning back ON the power switch to reassert the VOUT voltage. This discharge function is automatically applied when a change at the CTLx lines results in any of the following mode transitions.

• Any transition to and from CDP
• Any transition to and from SDP In addition to this, can be achieved using the mode “000”. Overcurrent Protection When an over-current condition is detected, the dev ice maintains a constant output current and reduces the output voltage accordingly. Two possible overload conditions can occur. In the first condition, the output has been shorted before the device is enabled or before VIN has been applied. The SLG55544 senses the short and immediately switches into a constant-current output. In the second condition, a short or an overload occurs while the device is enabled. At the instant the overload occurs, high currents may flow for nominally one to two microseconds before the current-limit circuit can react. The device operates in constant-current mode after the current-limit circuit has responded. Complete shutdown occurs only if the fault is present long enough to activate thermal l imiting. The device will remain off until the junction temperature cools approximately 10°C and will then re-start. The device will continue to cycle on/off until the over-current condition is removed. FAULT# Response The FAULT# open-drain output is asserted (active low) during an over-temperature or current limit condition. The output remains asserted until the fault condition is removed. The SLG55544 is designed to eliminate false FAULT# reporting by using an internal deglitch circuit for current limit conditions witho ut the need for external circuitry. This ensures th at FAULT# is not accidentally asserted due to normal operation such as starting into a heavy capacitive load. Over-temperature conditions are not deglitched and assert the FAULT# signal immediately. Undervoltage Lockout (UVLO) The undervoltage lockout (UVLO) circuit disables the power switch until the input voltage reaches the UVLO turn-on threshold. Built-in hysteresis prevents unwanted oscillations on the output due to input voltage drop from large current surges. Thermal Sense The SLG55544 protects itself with two independent thermal sensing circuits that monitor the operating temperature of the power distribution switch and disables operation if the t emperature exceeds recommended operating conditions. The device operates in constant-current mode during an over-current con dition, which increases the voltage drop across pow er switch. The power dissipation in the package is proportional to the v oltage drop across the power switch, so the junctio n temperature rises during an over-current condition. The first thermal sensor turns off the power switch when the die temperature exceeds 135°C and the part is in current limit. The second thermal sensor turns off the power switch when the die temperature exceeds 155°C regardless of whether the power switch is in current limit. Hy steresis is built into both thermal sensors, and th e switch turns on after the device has cooled by approximately 10°C. The switch continues to cycle off and on until the fault is r emoved. The open-drain false reporting output FAULT# is asserted (active low) during an over-temperature shutdown condition.

000-00055544-104 Page 15 of 19 SLG55544 Package Top Marking System Definition Part Code Datecode Lot Revision – Part ID Field: identifies the specific device configuration – Date Code Field: Coded date of manufacture – Lot Code: Designates Lot # – Assembly Site/COO: Specifies Assembly Site/Country of Origin – Revision Code: Device Revision XXXXX DD LLL C RR COO

000-00055544-104 Page 16 of 19 SLG55544 Package Drawing and Dimensions

16 Lead TQFN Package

000-00055544-104 Page 17 of 19 SLG55544 Tape and Reel Specifications Tape and Reel Drawing and Dimensions Recommended Reflow Soldering Profile Please see IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 6.75 mm 3 (nominal). More information can be found at www.jedec.org. Package Type # of Pins Nominal Package Size [mm] Tape Width [mm] Part Pitch [mm] Leader (min) Trailer (min) Reel Diameter [mm] Max Units Pockets Length [mm] Pockets Length [mm] per Reel per Box 16TQFN 16 3 x 3 x 0.75 12 8 42 336 42 336 330 5,000 10,000

000-00055544-104 Page 18 of 19 SLG55544

Revision History

2/8/2022 1.04 Updated Company name and logo Fixed typos 2/4/2016 1.03 Fixed typos and formatting 9/8/2015 1.02 Updated Recommended Operating Conditions Added Recommended Reflow Soldering Profile

000-00055544-104 Page 19 of 19 SLG55544

TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com Contact Information For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Rev.1.0 Mar 2020) © 2021 Renesas Electronics Corporation. All rights reserved.