SLA7000 ETC | Alldatasheet

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Technical content

DESCRIPTION

The SLA7000 series consists of a group of 6 CMOS gate arrays with gate counts from 1,632 to 16,250 gates. The series is fabricated utilizing our 1.5 micron high speed CMOS silicon gate technology to achieve Propagation delays of 1.0ns for the internal gates. All 1/O buffers are TTL and CMOS compatible which makes this series an ideal choice for replacing existing discrete logic as well as for new designs requiring very high speed and/or high gate counts.

FEATURES

@Very high speed silicon gate CMOS technology @TTL and CMOS 1/0 compatible @High output drivercapability @Gate densities from 1,632 to 16,250 gates @"Hard" MSI macrocelis for superior AC performance @Cell libraries, software, and documentation available for IBM® PC compatibles with Future Net or OrCAD and Daisy and Mentor systems IBM® is a registered trade mark of International Business Machines. HSLA7000 SERIES Series ~ SLA7160 SLA7220 SLA7340 SLA7490 SLA7620 SLA7800 SLA790S** Parameter Gates (2input NAND) 1,682 2,232 3,432 4,900 6.210 8.000 16.250 Technology SILICON GATE CMOS 2 LAYER METALLIZATION 1/0 level TTL, CMOS Internal gate 1.0ns cc Delay time | Input buffer toun=1.9ns, toy =3.4ns Output buffer tpur=5.5ns, tpn. =4.7ns, C.=30pF Total ports for 1/0 70 82 104 128 150 170 188 Total ports for Power/GND (Max) 8 8 8 8 8 8 8 Output mode Normal, Open-drain, 3-state, Bidirectional ‘1 Typical fanout of 2, Imm of interconnect. *2. Standard V/O cell *3. Sea of Gates (approx 8K usable gates.) C19

ee) ABSOLUTE MAXIMUM RATINGS (Vss=0V) Supply voltage oo BOO a Input voltage Vf =0.3 to Voo+0.3 Vv Output voltage Yo | 0.8toV 08 SCC Storage temperature To _ =65 to 150 Cc IBRECOMMENDED OPERATING CONDITIONS Supply voltage Voo = 475 5.00 5.25 v ELECTRICAL CHARACTERISTICS (Woo =5V : 5%, Ta=0 to 70C. _ Supply current _,_ lo | Standby - 2 = nA High level output voltage Vou tors a 24 - - v Low level output voltage | = Vox iaerare o- - 04 v High level input voltage a Voo=5.25V 20 0 - 7 = Vv Input leakage current lu = = = 1 mn MIPACKAGE TYPES |_ Package Type | Nootpins | code | z160 | 7220] za40 | 7490 | 7620 | 7000 | 7005 | po NootPads SSC*idSCi8«| sw | 112 | ea | ___No.ofGrossGates | s602| 2292| sanz | 4900 | 6210 [11040 | 13500 | Bo eA [ 24 | ca fat ot ft ft Plastic DIP [ 28 | cee Ta taf TT [40 | cao at Ta a fa PT | 42 {| ca2 Ta tat of of of ft | Plastic Shrink ip | 64 | seg Ta Ta Ta TT | 4a raee Ta Ay | s2 | Fsee Taff TT [ eo | ros [avtaltatatal| | | [eo | Fees Ta TA | a Tay Pa | {| a0 | Feos Ta tatata ta | oo] Plastic QFP |__t00 | Fioo-s Jae [ae Tat | ae Tae Te | |_120 [roe | | tata ta [wt | |__12e | Frzeg [TT a Ta Ta Ta Ta | ize | izes [| fT | UT TT | 144 [ riage [TT | ta Ta Ta Ta {| 160 [| Frees [ [ [ ta tata [a | | 16 | Fieo [| [of Tf T Ta [a | | __Pasiesor [ze ween Tat ft tt tT [2p | Mae Ta Tat TUT [| eo | co | Twtwmtatwat [4 PlasticPGA = {__ig2_ | aise TT UT wm TA Tm Taw Tw [ive | ative a a [| 4g Tag OT a TT CUdThwmLr Ta UT PLoc [ee | ves Pa a a a a TT

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Poise] Pisa | va Ta TA a ta a | Ki Avalable Now (A): Lead Frame Currently Not Avaliable *:Pin Pad Table Exists F: Currently Not Available ©-20 (8): Bondable Pads for Die/Package Configuration

SLA7000Series. aS (PERFORMANCE CURVES @Output Current Al pee | HA ere le ee st Ann ~ Ms s 30 Measuring Circuit PERCHA | Bec HH. i 0 02 04 06 08 10 12) | toa ~ Cr ty th ® voo CLOT T Lo Seo =e GB ee aCE Es [4 os “COCCI =H HAH “~ 215 = aol A LTT oe) 80ers Tea a BN at [TI] ITT TI a ws @Delay Time - OO ; p10 ‘rool Liat i. « «0 LETT Tt] Lu. =20 0 20 40 60 8o('C) Cai

S.MOS MACROCELL oR MACROCELL CONVERSION CONVERSION SCHEMATIC oR SCHEMATIC CAPTURE CAPTURE SIMULATION oR SIMULATION TT RESIMULATION AND VERIFICATION SIMULATION APPROVAL AUTO-ROUTING (IF SMOS DOES CAPTURE AND SIMULATION.) RESIMULATION AND VERIFICATION PG. TAPES, MASK MAKING, TEST PROGRAMS SAMPLE APPROVAL SAMPLE PRODUCTION PRODUCTION C-22