SL6609A MITEL | Alldatasheet
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Technical content
This device is an advanced direct conversion receiver for operation up to 470MHz. The design is based on the SL6609 receiver and is a pin for pin product upgrade. The device integrates all functions to translate a binary FSK modulated RF signal into a demodulated data stream. Adjacent channel rejection is provided using tuneable gyrator filters. To assist operation in the presence of large interfering signals both RF and audio AGC functions are provided. The device also includes a 1 volt regulator capable of sourcing up to 5mA, a battery flag and the facility of incorporating a more complex post detection filter off-chip. Both battery flag and data outputs have open collector outputs to ease their interface with other devices.
FEATURES
n Very low power operation - typ 3.0mW n Single cell operation for most of the device. Limited functional blocks operating via an inverter n Superior sensitivity of -130dBm n Operation at wide range of paging data rates 512, 1200, 2400 baud n On chip 1 volt regulator n Small package offering SSOP
APPLICATIONS
n Small form factor pagers i.e. PCMCIA n Low data rate data receivers i.e. Security/remote control NP28 Fig.1 Pin connections ABSOLUTE MAXIMUM RATINGS Supply voltage 6V Storage temperature -55 °C to +150°C Operating temperature -20 °C to +70°C
ORDERING INFORMATION
SL6609A / KG / NPDS - SSOP devices in anti-static sticks SL6609A / KG / NPDE - SSOP devices in tape and reel Fig.2 Block diagram of SL6609A LIMITER DETECTOR LIMITER MIXER BEC V BG GND GNDVCC2VCC1VR VR VR - + 23 22 4 1 20 11 15 6 10 21 13 18 19 812727235 TPX RFIADJ LOY GYRI LOX VR TPY GTHADJ TCADJ BEC TPLIMY VCC2 DATAOP BATTFL IAGCOUT IRFAMP MIXA GND MIXB VREG REGCNT VCC1 VBATT VBG BRF1 BRF2 TPLIMX DIGGND DS4015 - 2.5 July 1995 SL6609A Direct Conversion FSK Data Receiver Advance Information
V V mA µA µA µA V V µA V µA mA ms ms µA µA µVrms µA µA Max 2.8 3.5 1.8 700 1.05 1.27 1.07 600 9:7 500 1.0 Min 0.95 1.8 0.95 1.15 0.93 0.25 400 7:9 100 21,27,28 11,13,14 21,27,28 11,13,14 VCC1 - Supply voltage VCC2 - Supply voltage ICC1 - Supply current ICC2 - Supply current Power down ICC1 Power down ICC2 1 volt regulator Band gap voltage reference Band gap current source Voltage reference Voltage reference sink/source 1 volt regulator load current Turn on Time Turn off Time Detector output current RF current source Current Source (IRF) Decoder Sensitivity Output mark space ratio Data O/P Sink Current Data O/P Leakage Current
ELECTRICAL CHARACTERISTICS
These characteristics are guaranteed over the following conditions unless otherwise stated: Tamb = 25°C, VCC1 = 1.3V, VCC2 = 2.7V Characteristics Pin Comments Value Units 1.3 2.7 1.5 550 1.0 1.21 1.0 +/-4 500 Typ VCC1 < VCC2 - 0.7 volts Includes IRF. Does not include regulator supply. Audio AGC inactive Batt flag & Data O/P high Pin 27 voltage: 0.3 - 1.3V I Load = 3mA. Ext PNP. ß >= 100, V CE = 0.1 volt VCC1 > 1.1V Stable data o/p when 3dB above sensitivity. CBG and CVR = 2.2µF Fall to 10% of steady state current C BG and CVR = 2.2µF Pin 27 voltage: 0.3 - 1.3V Signal injected at TPX and TPY B.E.R. < 1 in 30 5KHz deviation @ 1200 bits/sec BRF capacitor = 1nF Output logic low Output Iogic high
V V µA µA µA µA dB V µA 0.05 Max 0.3 500 24, 26 3, 5 3, 5 These characteristics are guaranteed over the following conditions unless otherwise stated: Tamb = 25°C, VCC1 = 1.3V, VCC2 = 2.7V Characteristics Pin Comments Value Units TypMin (VCC2 - 0.3) Battery Economy Input logic high Input logic low Input current Input current Battery Flag Input Input current Battery Flag Output Battfl Sink Current Battfl leakage current Mixers Gain to "IF Test" RF input impedance LO input impedance LO DC bias voltage Audio AGC Max Audio AGC Sink Current Powered Up Powered Down Powered Up Powered down transient initial µA (VBATT-VR) > 20mV (VBATT-VR) < -20mV LO inputs driven in parallel with 50mVRMS @ 50MHz.IF = 2kHz See Figs.8a, 8b See Fig.9 Equal to Pin 21 (VCC1) Min -130 -128 +/-2.3 +/-2.2 dBm dB dB kHz kHz Sensitivity Intermodulation Adjacent channel Centre frequency acceptance Deviation acceptance Characteristics Pin Comments Max -125 Typ Value Units 1200 bps Δf = 4kHz LO = -18dBm 1200 bps Δf = 4kHz LO = -18dBm 1200 bps Δf = 4kHz LO = -18dBm Channel spacing 25kHz 1200 bps Δf = 4kHz LO = -18dBm 1200 bps Δf = 4kHz LO = -18dBm RECEIVER CHARACTERISTICS (Demonstration board) Measurement conditions unless stated VCC1 = 1.3V, VCC2 = 2.7V, LNA = 18dB Power Gain, 2dB Noise figure, Carrier frequency 153MHz, BER 1 in 30, Tamb = 25°C (TPx/TPy typically:- 160mVPP ± 10% for - 73dBm RF input to the LNA)
RECEIVER CHARACTERISTICS (Demonstration board) Measurement conditions unless stated VCC1 = 1.3V, VCC2 = 2.7V, LNA = 20dB Power Gain, 2dB Noise figure, Carrier frequency 282MHz, BER 1 in 30, Tamb = 25°C (TPx/TPy typically:- 160mVPP ± 10% for - 73dBm RF input to the LNA) Min -128 -126 55.5 72.5 +/- 2.3 +/- 2.2 dBm dB dB kHz kHz Sensitivity Intermodulation Adjacent channel Centre frequency acceptance Deviation acceptance Characteristics Pin Comments Max -123 Typ Value Units 1200 bps Δf = 4kHz LO = -15dBm 1200 bps Δf = 4kHz LO = -15dBm 1200 bps Δf = 4kHz LO = -15dBm Channel spacing 25kHz 1200 bps Δf = 4kHz LO = -15dBm 1200 bps Δf = 4kHz LO = -15dBm RECEIVER CHARACTERISTICS Measurement conditions unless stated VCC1 = 1.3V, VCC2 = 2.7V, LNA = 22dB Power Gain, 2dB Noise figure, Carrier frequency 470MHz, BER 1 in 30, Tamb = 25°C (TPx/TPy typically:- 140mVPP ± 10% for - 73dBm RF input to the LNA) 1200 bps Δf = 4kHz 2400 bps Δf = 4.5kHz LO = -15dBm 1200 bps Δf = 4kHz 2400 bps Δf = 4.5kHz LO = -15dBm 1200 bps Δf = 4kHz LO = -15dBm 1200 bps Δf = 4kHz 2400 bps Δf = 4.5kHz LO = -15dBm Channel spacing 25kHz 1200 bps Δf = 4kHz 2400 bps Δf = 4.5kHz LO = -15dBm 1200 bps Δf = 4kHz 2400 bps Δf = 4.5kHz LO = -15dBm -128 -125.5 53.5 72.5 69.5 +/-2.3 +/-2 +/-2.2 +/-2 Min -130 +/-1.9 dBm dBm dB dB dB kHz kHz Sensitivity Intermodulation (IP3) Intermodulation (IP2) Adjacent channel Centre frequency acceptance Deviation acceptance Characteristics Pin Comments Max -125 -122 Typ Value Units
The SL6609A is a Direct Converson Receiver designed for use up to 470MHz. It is available in a 28 pin SSOP package and it integrates all the facilities required for the conversion of an RF FSK signal to a base-band data signal. Low Noise Amplifier To achieve optimum performance it is necessary to incorporate a Low Noise RF Amplifier at the front end of the receiver. This is easily biased using the on chip voltage and current sources provided. All voltages and current sources used for bias of the RF amplifier, receiver and mixers should be RF decoupled using suitable capacitors (see Fig.4 for a suitable Low-Noise- Amplifier). Local Oscillator The Local Oscillator signal is applied to the device in phase quadrature. This can be achieved with the use of two RC networks operating at the -3dB/45° transfer characteristic, giving a full 90° phase differential between the LO ports of the device. Each LO port of the device also requires an equal level of drive from the Oscillator. (see Fig.5). Pin Number Pin Description X channel pre-gyrator filter test-point. This can be used for input and output RF current source adjustment pin LO input channel Y Gyrator current adjust pin LO input channel X VREF 1.0 V internal signal ground Y channel pre-gyrator filter test point, input or output Audio AGC gain and threshold adjust. RSSI signal indicator Audio AGC time constant adjust Battery economy control Battery flag output Y channel limiter (post gyrator filter) test point, output only Supply connection Data output pin X channel limiter (post gyrator filter) test point, output only Bit rate filter 2, input to data output stage Bit rate filter 1, output from detector Digital ground Bandgap voltage output Battery flag input voltage Supply connection 1V regulator control external PNP drive 1V regulator output voltage Mixer input B Ground Mixer input A Current source for external LNA. Value of current output will decrease at high mixer input signal levels due to RF AGC Audio AGC output current Pin Name TPX RFIADJ LOY GYRI LOX VR TPY GTHADJ TCADJ BEC BATTFL TPLIMY VCC2 DATAOP TPLIMX BRF2 BRF1 DIG GND VBG VBATT VCC1 REGCNT VREG MIXB GND MIXA IRFAMP IAGCOUT Gyrator Filters The on chip filters include an adjustable gyrator filter. This may be adjusted with the use of an additional resistor between Pin 4 and GND. This allows flexibility of filter characterstics and also allows for compensation for possible process variations. Audio AGC The Audio AGC fundamentally consists of a current sink which is controlled by the audio (baseband data) signal. It has three parameters that may be controlled by the user. These are the Attack (turn on) time, Decay (duration) time and Threshold level (see Figs.6 and 7). See Application note for details. Regulator The on chip regulator must be used in conjunction with a suitable PNP transistor to achieve regulation. As the transistor forms part of the regulator feedback loop the transistor should exhibit the following characteristics:- H FE > = 100 for VCE > = 0.1V
Fig.3 Application circuit board SL6609A Vbg note 3
COMPONENTS LIST FOR APPLICATION BOARD At 282MHz, 25kHz Channel Spacing. C18 1n C19 not used C20 1n C21 1n C22 not used C23 1n C24 1n C25 1n C26 6p8 C27 1n C28 1n C29 100p C30 2u2 C31 2u2 C32 4p7 C33 4p7 C34 3p3 C35 not used VC1 1-10p VC2 1-10p VC3 1-10p Inductors L1 68n (4) L2 not used (3) L3 470n L4 39n L5 680n Active Components Q1 FMMT589 Q2 2SC5065 (Toshiba) Q3 BFT25A (Philips) Q4 not used Q5 2SC5065 (Toshiba) D1 Panasonic MA862 (5) Misc T1 30nH 1:1 Coilcraft M1686-A Xtal 5th Overtone 94.075MHz (LO Circuit in Fig.3) Resistors R1 open circuit R2 open circuit R3 100 R4 100k R5 1k R6 1k R7 100 R8 open circuit R9 220k R10 1M R11 100k (6) R12 not used R13 1k5 (1) R14 4k7 R15 4k7 R16 33k R17 not used R18 0R (3) R19 10k R20 620 R21 1k R22 open circuit Capacitors C1 1n C2 2p7 C3 4p7 C4 1n C5 2p7 C6 2u2 C7 1n C8 100n C9 1n (2) C10 2u2 C11 100n C12 1n C13 1n C14 1n C15 1n C16 1n C17 1n C17a 1n Notes 1. The values of R13 is determined by the set-up proce- dure. See Application Note. 2. The value of C9 is determined by the output data rate. Use 2nF for 512bps, 1nF for 1200bps and 470pF for 2400bps. 3. L2 is used in the Audio AGC circuit (see Fig. 6). For the characteristics of the Audio AGC current source see Fig.7. If the audio AGC is not required then the current source (Pin 28) may be disabled by connecting Pin 9 (TCADJ) to VR (Pin 6) and by connecting Pin 28 (IAGCOUT) to Vcc1, (R18). The voltage at Pin 8 may still be used as an RSSI. R9, C8, C14, C19, R17 and D1 may then be omitted. See Fig.6 for AGC component values. 4. L1and C26 form the low noise matching network for the RF amplifier. The values given are for the RF amplifier specified in the Applications Circuit with no Audio AGC connected. i.e. R17 and D1 omitted. 5. Suggested diode for use with the Audio AGC circuit (see Fig.6) (D1 is not included on the general demon- stration circuit). 6. The value of R11 is dependent on the data output load. R11 should allow sufficient current to drive the data output load.
COMPONENTS LIST FOR APPLICATION BOARD At 470MHz, 25kHz Channel Spacing.
- The values of R13 is determined by the set-up proce-
- The value of "C9" is determined by the output data rate.
- R12 & Q4 form a dummy load for the regulator.
- L2 is used in the Audio AGC circuit (see Fig.6). For the
figure 7. If the Audio AGC is not required then the
- L1and C26 form the low noise matching network for the
connected. i.e. R17 and D1 omitted.
- Suggested diode for use with the Audio AGC circuit
- The value of R11 is dependent on the data output load.
Fig.4 RF amplifier RF Amplifier Components Values Resistors Capacitors R14, R15 4k7 C13, C15 1nF Active components R13 see note 1 C16, C17 1nF D1 MA862 (Panasonic) R22 47k C20, C21 1nF see note 2 C24, C25 1nF L2 820nH Notes: (1) The value of R13 is determined by the set up procedure (See "Set up for optimum performance"). (2) C20 and C21 are purely for deomonstration purposes. Pin 24 and Pin 26 may be DC coupled provided that no DC voltage is applied to the mixer inputs. Frequency Dependent Components 153MHz 280MHz 450MHz C26 not used 6.8p not used C27 not used not used not used L1 150nH 68nH 39nH C34 3p3 2p2 1p5 T1 100nH 30nH 16nH Coilcraft N2261-A Coilcraft M1686-A Coilcraft Q4123-A VC1 1-10pF 1-10pF 1-3pF Q4, Q5 Toshiba 2SC5065 Toshiba 2SC5065 Philips BFT25A (See also Lo drive Network) Fig.5 Local oscillator drive network Higher Input Impedance (crystal oscillator input) 153MHz 280MHz 450MHz C3 Set by load allowable on crystal oscillator (typical 4p7) C2 10p 5p6 3p3 C5 10p 5p6 3p9 R3 100 100 100 R7 100 100 100 R5, R6 = 1k C4, C18 = 1n LO Drive Network Component Values 50Ohm input impedance (External LO injection) 153MHz 280MHz 450MHz C2 10p 5p6 3p3 C5 10p 5p6 3p9 C3, C4, C18 = 1n R3, R5, R6, R7 = 100Ohms
Fig.6 AGC Schematic 100k Vcc1 current source 1 pin 8 R16 Pin 9 Ctc C8 Rdecay current source 2 C26 R22 C22 C15 RF input Pin 28 L1L2 Vcc1 to RF Amp Vr VrVr D1 = MA862 R9 = 220k C8 = 100nF L2 = 820nH R22 = 47k R16 = 33k C22 = 1n Note L1, C26 and C15 are part of RF Amplifier (see Fig.4) -120 -115 -110 -105 -100 -95 -90 -85 -80 -75 -70 -65 -60 IP Level dBm Pin 28 OP Current (µA) VCC2=2.7 VCC1=1.3 VCC2=4 VCC1=3 VCC2=1.8 VCC1=1.0 Fig.7 Audio AGC current vs. IP power at 25°C
Fig.8a SL6609A Mixer A input S-Parameters Fig.8b SL6609A Mixer B input S-Parameters Fig.9 SL6609A LO X,Y inputs S-Parameters 50MHz 1GHz 50MHz 1GHz 50MHz 1GHz FREQ 50.000 100.000 150.000 200.000 250.000 300.000 350.000 400.000 450.000 500.000 550.000 600.000 650.000 700.000 750.000 800.000 850.000 900.000 950.000 1000.00 MAG 0.969 0.958 0.942 0.917 0.893 0.858 0.832 0.806 0.781 0.755 0.743 0.725 0.703 0.680 0.666 0.653 0.636 0.615 0.604 0.600 ANG -7.20 -14.45 -20.59 -26.40 -33.26 -39.84 -44.78 -49.01 -54.00 -59.53 -64-35 -68.43 -73.01 -78.74 -83.76 -87.48 -91.32 -97.17 -102.84 -105.23 S11 FREQ 50.000 100.000 150.000 200.000 250.000 300.000 350.000 400.000 450.000 500.000 550.000 600.000 650.000 700.000 750.000 800.000 850.000 900.000 950.000 1000.00 MAG 0.970 0.960 0.945 0.919 0.902 0.872 0.850 0.825 0.803 0.776 0.760 0.739 0.717 0.698 0.683 0.666 0.659 0.647 0.637 0.634 ANG -7.06 -13.83 -19.90 -25.70 -32.18 -38.03 -43.07 -48.27 -53.58 -58.49 -63.08 -67.98 -72.63 -76.96 -81.09 -85.49 -89.51 -93.90 -98.42 -102.40 S11 FREQ 50.000 100.000 150.000 200.000 250.000 300.000 350.000 400.000 450.000 500.000 550.000 600.000 650.000 700.000 750.000 800.000 850.000 900.000 950.000 1000.00 MAG 0.993 0.995 0.997 0.997 0.996 0.986 0.965 0.936 0.902 0.872 0.838 0.804 0.798 0.810 0.784 0.779 0.790 0.788 0.768 0.743 ANG -4.17 -8.43 -12.88 -17.57 -22.63 -28.16 -33.87 -39.17 -43.88 -48.54 -52.81 -56.60 -59.47 -65.19 -71.49 -75.97 -82.54 -91.16 -100.20 -108.52 S11
Vcc1 = 1.0V, Vcc2 = 1.8V Vcc1 = 1.3V, Vcc2 = 2.7V Vcc1 = 3.0V, Vcc2 = 4.0V Conditions:- 282MHz demonstration board i.e. 20dB LNA, 2dB noise figure, carrier frequency 282MHz, 1200bps baud rate, 4kHz deviation frequency, BER 1 in 30. Fig.10a AC parameters vs. supply and temperature
Vcc1 = 1.0V, Vcc2 = 1.8V Vcc1 = 1.3V, Vcc2 = 2.7V Vcc1 = 3.0V, Vcc2 = 4.0V Conditions:- 282MHz demonstration board i.e. 20dB LNA, 2dB noise figure, carrier frequency 282MHz, 1200bps baud rate, 4kHz deviation frequency, BER 1 in 30. Fig.10b AC parameters vs. supply and temperature
Vcc1 = 0.98V, Vcc2 = 1.78V Vcc1 = 1.3V, Vcc2 = 2.7V Vcc1 = 3.0V, Vcc2 = 4.0V Fig.11 DC parameters vs. supply and temperature (IP3 vs audio AGC both on and off) Note 1- IP3 is level above wanted needed to reduce receiver to 1 in 30 B.E.R. Conditions:- ICC1 includes 500µA LNA current but does not include the regulator supply (audio AGC inactive). ICC2 measured with BATT FLAG and DATA O/P HIGH, Fc = 282MHz.
Fig.12 Sensitivity, IP3 vs Receiver Gain Fig.13 Sensitivity, adjacent Channel vs Receiver Gain
Fig.14 Sensitivity, IP3 vs LO level Fig.15 Sensitivity, Adjacent Channel vs LO level -129 -128 -127 -126 -125 -124 -123 -122 -25 -23 -21 -19 -17 -15 -13 -11 LO Drive Level (dBm) Sensitivity (dBm) IP3 (dB) Sensitivity IP3 -129 -128 -127 -126 -125 -124 -123 -122 -25 -23 -21 -19 -17 -15 -13 -11 LO Drive Level (dBm) Sensitivity (dBm) 71.5 72.5 73.5 Adj. Channel (dB) Sensitivity ACR
Dimensions are shown thus: mm (in) 10·07/10·33 (0·396/0·407) 1·73/1·99 (0·065/0·078) 1·68/1·78 (0·066/0·070) 0·25/0·38 (0·010/0·015) 5·20/5·38 (0·205/0·212) 7·65/7·90 (0·301/0·311) 28-LEAD SHRUNK MINIATURE PLASTIC DIL (SSOP) - NP28 PIN 1 IDENT 0·05/0·21 (0·002/0·008) 0·55/0·95 (0·022/0·037) 0·13/0·20 (0·005/0·008) 0-8°
28 LEADS AT
0·65 (0·0256) NOM. SPACING NOTES 1. Controlling dimensions are millimetres. 2. This package outline diagram is for guidance only. Please contact your Mitel Semiconductor Customer Service Centre for further information. Internet: http://www.gpsemi.com CUSTOMER SERVICE CENTRES l FRANCE & BENELUX Les Ulis Cedex Tel: (1) 69 18 90 00 Fax : (1) 64 46 06 07 l GERMANY Munich Tel: (089) 419508-20 Fax : (089) 419508-55 l ITALY Milan Tel: (02) 6607151 Fax: (02) 66040993 l JAPAN Tokyo Tel: (03) 5276-5501 Fax: (03) 5276-5510 l KOREA Seoul Tel: (2) 5668141 Fax: (2) 5697933 l NORTH AMERICA Scotts Valley, USA Tel: (408) 438 2900 Fax: (408) 438 5576/6231 l SOUTH EAST ASIA Singapore Tel:(65) 3827708 Fax: (65) 3828872 l SWEDEN Stockholm Tel: 46 8 702 97 70 Fax: 46 8 640 47 36 l TAIWAN, ROC Taipei Tel: 886 2 25461260 Fax: 886 2 27190260 l UK, EIRE, DENMARK, FINLAND & NORWAY Swindon Tel: (01793) 726666 Fax : (01793) 518582 These are supported by Agents and Distributors in major countries world-wide. © Mitel Corporation 1998 Publication No. DS4015 Issue No. 2.5 July 1995 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM HEADQUARTERS OPERATIONS MITEL SEMICONDUCTOR Cheney Manor, Swindon, Wiltshire SN2 2QW, United Kingdom. Tel: (01793) 518000 Fax: (01793) 518411 MITEL SEMICONDUCTOR
1500 Green Hills Road,
Scotts Valley, California 95066-4922 United States of America. Tel (408) 438 2900 Fax: (408) 438 5576/6231 This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.