SL3ICS1002 NXP | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 56
Technical content
- General description The UHF EPCglobal Generation 2 standard allows the commercialized provision of mass adoption of UHF RFID technology for passive smart tags and labels. Main fields of applications are supply chain management and logistics for worldwide use with special consideration of European, US and Chinese frequencies to ensure that operating distances of several meters can be realized. The G2X is a dedicated chip for passive, intelligent tags and labels supporting the EPCglobal Class 1 Generation 2 UHF RFID standard. It is especially suited for applications where operating distances of several meters and high anti-collision rates are required. The G2X is a product out of the NXP Semiconductors UCODE product family. The entire UCODE product family offers anti-collision and collision arbitration functionality. This allows a reader to simultaneously operate multiple labels / tags within its antenna field. A UCODE G2X based label/ tag requires no external power supply. Its contact-less interface generates the power supply via the antenna circuit by propagative energy transmission from the interrogator (reader), while the system clock is generated by an on-chip oscillator. Data transmitted from interrogator to label/tag is demodulated by the interface, and it also modulates the interrogator’s electromagnetic field for data transmission from label/tag to interrogator. A label/tag can be operated without the need for line of sight or battery, as long as it is connected to a dedicated antenna for the targeted frequency range. When the label/tag is within the interrogator’s operating range, the high-speed wireless interface allows data transmission in both directions. In addition to the EPC specifications the G2X offers an integrated EAS (Electronic Article Surveillance) feature and read protection of the memory content. On top of the specification of the G2XL the G2XM offers 512-bit of user memory. SL3ICS1002/1202 UCODE G2XM and G2XL Rev. 3.6 — 10 March 2011 139036 Product data sheet COMPANY PUBLIC
Rev. 3.6 — 10 March 2011 139036 2 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 2. Features and benefits
2.1 Key features
512-bit user memory (G2XM only) 240-bit of EPC memory 64-bit tag identifier (TID) including 32-bit unique serial number Memory read protection EAS (Electronic Article Surveillance) command Calibrate command 32-bit kill password to permanently disable the tag 32-bit access password to allow a transition into the secured transmission state Broad international operating frequency: from 840 MHz to 960 MHz Long read/write ranges due to extremely low power design Reliable operation of multiple tags due to advanced anti-collision Forward link: 40-160 kbit/s Return link: 40-640 kbit/s
2.2 Key benefits
High sensitivity provides long read range Low Q-factor for consistent performance on different materials Improved interference suppression for reliable operation in multi-reader environment Large input capacitance for ease of assembly and high assembly yield Highly advanced anti-collision resulting in highest identification speed Reliable and robust RFID technology suitable for dense reader and noisy environments
2.3 Custom commands
EAS Alarm Enables the UHF RFID tag to be used as EAS tag without the need for a backend data base. Read Protect Protects all memory content including CRC16 from unauthorized reading. Calibrate Activates permanent back-scatter in order to evaluate the tag-to-reader performance.
Table 1. Ordering information G2XM Table 2. Ordering information G2XL
Rev. 3.6 — 10 March 2011 139036 4 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 5. Block diagram The SL3ICS1002/1202 IC consists of three major blocks: - Analog RF Interface - Digital Controller - EEPROM The analog part provides stable supply voltage and demodulates data received from the reader for being processed by the digital part. Further, the modulation transistor of the analog part transmits data back to the reader. The digital section includes the state machines, processes the protocol and handles communication with the EEPROM, which contains the EPC and the user data. Fig 1. Block diagram of G2X IC 001aai335 MOD DEMOD VREG VDD data in data out R/W ANALOG RF INTERFACE PAD PAD RECT DIGITAL CONTROL ANTENNA ANTICOLLISION READ/WRITE CONTROL ACCESS CONTROL EEPROM INTERFACE CONTROL RF INTERFACE CONTROL EEPROM MEMORY SEQUENCER CHARGE PUMP
Rev. 3.6 — 10 March 2011 139036 5 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 6. Wafer layout and pinning information
6.1 Wafer layout
(1) X-scribe line width: 56.4 μm (2) Y-scribe line width: 56.4 μm (3) Chip step, x-length: 488.0 μm (4) Chip step, y-length: 470,0 μm (5) Bump to bump distance X (TP1 - RFN): 351,0 μm (6) Bump to bump distance Y (RFN - RFP): 333,0 μm (7) Distance bump to metal sealring X: 40,3 μm (8) Distance bump to metal sealring Y: 40,3 μm Bump size X x Y: 60 μm x 60 μm Fig 2. Wafer layout and pinning information 001aai346not to scale! (1) (7) (2) (8) (5) (6) (4) (3) Y X TP2 TP1 RFN RFP
6.2 FCS2 layout strap and pinning
Table 3. Pin description of SOT1040-1
Table 4. Pin description of TSSOP8
- Plastic or metal protrusions of 0.15 mm maximum per side are not included.
- Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Table 5. TSSOP8 Marking
Rev. 3.6 — 10 March 2011 139036 9 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Fig 5. Package outline SOT1122 ReferencesOutline version European projection Issue date IEC JEDEC JEITA SOT1122 MO-252 sot1122_po Unit mm max nom min 0.50 0.04 0.55 0.425 0.30 0.25 0.22 0.35 0.30 0.27 A (1) Dimensions Notes 1. Dimension A is including plating thickness. 2. Can be visible in some manufacturing processes. SOT1122 A1 D 1.50 1.45 1.40 1.05 1.00 0.95 Ee e 0.55 0.50 0.47 0.45 0.40 0.37 bb
1 LL 1
XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm D E e L 0 1 2 mm scale b (2) (2) A pin 1 indication type code terminal 1 index area
Table 6. Pin description of SOT1122 Table 7. SOT1122 Marking
Rev. 3.6 — 10 March 2011 139036 11 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Fig 6. Package FCS2, SOT1040AA1, 12 μm Cu metallization
Rev. 3.6 — 10 March 2011 139036 12 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Fig 7. Package FCS2, SOT1040AB2, 20 μm Al metallization
Rev. 3.6 — 10 March 2011 139036 13 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Fig 8. Splicing drawing SOT1040-1
Rev. 3.6 — 10 March 2011 139036 14 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 8. Mechanical specification
8.1 Wafer specification
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BL-ID document number: 1093**”.
8.1.1 Wafer
- Designation: each wafer is scribed with batch number and wafer number
- Diameter: 200 mm (8”)
- Thickness: 150 μm ± 15 μm
- Number of pads 4
- Pad location: non diagonal/ placed in chip corners
- Distance pad to pad RFN-RFP 333.0 µm
- Distance pad to pad TP1-RFN: 351.0 µm
- Process: CMOS 0.14 µm
- Batch size: 25 wafers
- Dies per wafer: 120.000
8.1.2 Wafer backside
- Material: Si
- Treatment: ground and stress release
- Roughness: R a max. 0.5 μm, Rt max. 5 μm
8.1.3 Chip dimensions
- Die size without scribe: 0.414 mm x 0.432 mm = 0.178 mm 2
- Scribe line width: x-dimension:56.4 μm (width is measured on top metal layer) y-dimension: 56.4 μm (width is measured on top metal layer)
8.1.4 Passivation on front
- Type Sandwich structure
- Material: PE-Nitride (on top)
- Thickness: 1.75 μm total thickness of passivation
Rev. 3.6 — 10 March 2011 139036 15 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL
8.1.5 Au bump
- Bump material: > 99.9% pure Au
- Bump hardness: 35 – 80 HV 0.005
- Bump shear strength: > 70 MPa
- Bump height: 18 μm
- Bump height uniformity: – within a die: ± 2 μm – within a wafer: ± 3 μm – wafer to wafer: ± 4 μm
- Bump flatness: ± 1.5 μm
- Bump size: – RFP, RFN 60 x 60 μm – TP1, TP2 60 x 60 μm – Bump size variation: ± 5 μm
- Under bump metallization: sputtered TiW
8.1.6 Fail die identification
No inkdots are applied to the wafer. Electronic wafer mapping (SECS II format) covers the electrical test results and additionally the results of mechanical/visual inspection. See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BL-ID document number: 1093**”
8.1.7 Map file distribution
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BL-ID document number: 1093**”
8.2 SOT1040 specification
Table 8. Mechanical properties SOT1040AA1 Table 9. Mechanical properties SOT1040AB2
taken to avoid applying greater than the rated maxima. [3] For ESD measurement, the die chip has been mounted into a CDIP20 package. Table 10. Limiting values [1][2]
10.1 Wafer characteristics
10.2 Package characteristics
[1] Measured with network analyzer at 915 MHz; values at 0.5 dBm after peak max of on-set of die, measured in the center of the pads. Table 11. Wafer characteristics Table 12. Package interface characteristics
Rev. 3.6 — 10 March 2011 139036 19 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 11. Handling information for Flip Chip Strap (FCS2, SOT1040)
11.1 Storage conditions
The following storage conditions are applicable if the FCS2 products are kept in their original packing:
- Storage temperature: +15 °C to +30 °C
- Relative humidity: max. 60 %
- Duration of storage: max. 0.5 years Deviating requirements have to be arranged with NXP Semiconductors.
11.2 Assembly conditions
11.2.1 General assembly recommendations
NXP recommends to use dedicated strap assembly equipment to prevent damage of the FCS2 strap or the die itself. In case of any doubts, the customer is constrained to contact NXP Semiconductors for further clarification.
11.2.2 Antenna bonding
Mounting the FCS2 product onto the antenna can be done in multiple ways:
- Crimping
- Conductive gluing
- Soldering (possible, but not recommended by NXP Semiconductors)
11.2.3 Label converting
Generally, an optimization of the entire lamination process by label manufacturer is recommended in order to minimize the stress onto the module and guarantee high assembly yield. Roller diameter must not be smaller than 45 mm.
Rev. 3.6 — 10 March 2011 139036 20 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 12. Packing information
12.1 Flip Chip Strap (FCS2, SOT1040)
The strap is shipped on a 13 inch by 9 mm reel. For details please refer to Ref. 21 “Data sheet - Flip chip strap - FCS2, General packing specification, BL-ID document number: 1738**”.
12.2 Wafer
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BL-ID document number: 1093**”.
12.3 TSSOP
12.4 SOT1122
Part orientation T1. For details please refer to
Rev. 3.6 — 10 March 2011 139036 21 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 13. Functional description
13.1 Power transfer
The interrogator provides an RF field that powers the tag, equipped with a UCODE G2X. The antenna transforms the impedance of free space to the chip input impedance in order to get the maximum possible power for the G2X on the tag. The RF field, which is oscillating on the operating frequency provided by the interrogator, is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC. The antenna that is attached to the chip may use a DC connection between the two antenna pads. Therefore the G2X also enables loop antenna design. Possible examples of supported antenna structures can be found in the reference antenna design guide.
13.2 Data transfer
13.2.1 Reader to G2X Link
An interrogator transmits information to the UCODE G2X by modulating an RF signal in the 840 MHz - 960 MHz frequency range. The G2X receives both information and operating energy from this RF signal. Tags are passive, meaning that they receive all of their operating energy from the interrogator's RF waveform. An interrogator is using a fixed modulation and data rate for the duration of at least an inventory round. It communicates to the G2X by modulating an RF carrier using DSB-ASK, SSB-ASK or PR-ASK with PIE encoding. communications.
13.2.2 G2X to reader Link
An interrogator receives information from the UCODE G2X by transmitting a continuous-wave RF signal to the tag; the G2X responds by modulating the reflection coefficient of its antenna, thereby generating modulated sidebands used to backscatter an information signal to the interrogator. The system is a reader talks first (RTF) system, meaning that a G2X modulates its antenna reflection coefficient with an information signal only after being directed by the interrogator. G2X backscatter is a combination of ASK and PSK modulation depending on the tuning and bias point. The backscattered data is either modulated with FM0 baseband or Miller sub carrier. communications.
13.3 Operating distances
[1] CEPT/ETSI regulations [CEPT1], [ETSI1]. [2] New CEPT/ETSI regulations. [ETSI3]. [3] FCC 47 part 15 regulation [FCC1]. The typical write range is > 50% of the read range. Table 13. Symbol description Table 14. Operating distances for UCODE G2X based tags and labels in released frequency
Rev. 3.6 — 10 March 2011 139036 23 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL
13.4 Air interface standards
The G2X is certified according EPCglobal 1.0.9 and fully supports all parts of the "Specification for RFID Air Interface EPCglobal, EPCTM Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID, Protocol for Communications at 860 MHz - 960 MHz, Version 1.1.0". EPCglobal compliance and interoperability certification
Rev. 3.6 — 10 March 2011 139036 24 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14. Physical layer and signaling
14.1 Reader to G2X communication
14.1.1 Physical layer
For interrogator-to-G2X link modulation refer to Section 18, Ref. 1, annex H.1 Baseband waveforms, modulated RF, and detected waveforms.
14.1.2 Modulation
An interrogator sends information to one or more G2X by modulating an RF carrier using double-sideband amplitude shift keying (DSB-ASK), single-sideband amplitude shift keying (SSB-ASK) or phase-reversal amplitude shift keying (PR-ASK) using a pulse-interval encoding (PIE) format. The G2X receives the operating energy from this same modulated RF carrier. Section 18 The G2X is capable of demodulating all three modulation types.
14.1.3 Data encoding
The R=>T link is using PIE. For the definition of the therefore relevant reference time interval for interrogator-to-chip signaling (Tari) refer to Section 18, Ref. 1, chapter
14.1.4 Data rates
Interrogators shall communicate using Tari values between 6.25 μs and 25 μs, inclusive. For interrogator compliance evaluation the preferred Tari values of 6.25 μs, 12.5 μs or
14.1.5 RF envelope for R=>T
A specification of the relevant RF envelope parameters can be found in Section 18,
14.1.6 Interrogator power-up/down waveform
For a specification of the interrogator power-up and power-down RF envelope and waveform parameters refer to Section 18
14.1.7 Preamble and frame-sync
An interrogator shall begin all R=>T signaling with either a preamble or a frame-sync. A preamble shall precede a Query command and denotes the start of an inventory round. For a definition and explanation of the relevant R=>T preamble and frame-sync refer to
Rev. 3.6 — 10 March 2011 139036 25 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL
14.2 G2X to reader communication
An interrogator receives information from a G2X by transmitting an unmodulated RF carrier and listening for a backscattered reply. The G2X backscatters by switching the reflection coefficient of its antenna between two states in accordance with the data being
14.2.1 Modulation
The UCODE G2X communicates information by backscatter-modulating the amplitude and/or phase of the RF carrier. Interrogators shall be capable of demodulating either demodulation type.
14.2.2 Data encoding
The encoding format, selected in response to interrogator commands, is either FM0 baseband or Miller-modulated subaltern. The interrogator commands the encoding choice
14.2.2.1 FM0 baseband
FM0 inverts the baseband phase at every symbol boundary; a data-0 has an additional mid-symbol phase inversion. For details on FM0 and generator state diagram, FM0 symbols and sequences and how FM0 transmissions should be terminated refer to
14.2.2.2 FM0 Preamble
T=>R FM0 signaling begin with one of two defined preambles, depending on the value of the TRext bit specified in the Query command that initiated the inventory round. For
14.2.2.3 Miller-modulated sub carrier
Baseband Miller inverts its phase between two data-0s in sequence. Baseband Miller also places a phase inversion in the middle of a data-1 symbol. For details on Miller-modulated sub carrier, generator state diagram, sub carrier sequences and terminating sub carrier transmissions refer to Section 18
14.2.2.4 Miller sub carrier preamble
T=>R sub carrier signaling begins with one of the two defined preambles. The choice depends on the value of the TRext bit specified in the Query command that initiated the inventory round. For further details refer to Section 18
14.2.3 Data rates
The G2X IC supports tag to interrogator data rates and link frequencies as specified in
Rev. 3.6 — 10 March 2011 139036 26 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL
14.3 Link timing
For the interrogator interacting with a UCODE G2X equipped tag population exact link and response timing requirements must be fulfilled, which can be found in Section 18, Ref. 1, chapter 6.3.1.6.
14.3.1 Regeneration time
The regeneration time is the time required if a G2X is to demodulate the interrogator signal, measured from the last falling edge of the last bit of the G2X response to the first falling edge of the interrogator transmission. This time is referred to as T2 and can vary between 3.0 Tpri and 20 Tpri. For a more detailed description refer to Section 18 , Ref. 1, chapter 6.3.1.6.
14.3.2 Start-up time
14.3.3 Persistence time
An interrogator chooses one of four sessions and inventories tags within that session (denoted S0, S1, S2, and S3). The interrogator and associated UCODE G2X population operate in one and only one session for the duration of an inventory round (defined above). For each session, a corresponding inventoried flag is maintained. Sessions allow tags to keep track of their inventoried status separately for each of four possible time-interleaved inventory processes, using an independent inventoried flag for each process. Two or more interrogators can use sessions to independently inventory a common UCODE G2X chip population. A session flag indicates whether a G2X may respond to an interrogator. G2X chips maintain a separate inventoried flag for each of four sessions; each flag has symmetric A and B values. Within any given session, interrogators typically inventory tags from A to B followed by a re-inventory of tags from B back to A (or vice versa). Additionally, the G2X has implemented a selected flag, SL, which an interrogator may assert or deassert using a Select command. For a description of Inventoried flags S0 – S3 refer to Section 18, Ref. 1 chapter 6.3.2.2 tag flags and respective persistence time refer to Section 18, Ref. 1, table 6.14.
14.4 Bit and byte ordering
The transmission order for all R=>T and T=>R communications respects the following conventions:
- within each message, the most-significant word is transmitted first, and
- within each word, the most-significant bit (MSB) is transmitted first, whereas one word is composed of 16 bits. To represent memory addresses and mask lengths EBV-8 values are used. An extensible bit vector (EBV) is a data structure with an extensible data range. For a more detailed explanation refer to Section 18, Ref. 1, Annex A.
Rev. 3.6 — 10 March 2011 139036 27 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL
14.5 Data integrity
The G2X ignores invalid commands. In general, "invalid" means a command that (1) is incorrect given the current the G2X state, (2) is unsupported by the G2X, (3) has incorrect parameters, (4) has a CRC error, (5) specifies an incorrect session, or (6) is in any other way not recognized or not executable by the G2X. The actual definition of "invalid" is state-specific and defined, for each G2X state, in n Section 18, Ref. 1 Annex B and Annex C. All UCODE G2X backscatter error codes are summarized in Section 18, Ref. 1 Error codes, Annex I. For a detailed description of the individual backscatter error situations which are command specific please refer to the Section 18, Ref. 1 individual command description section 6.3.2.10.
14.6 CRC
A CRC-16 is a cyclic-redundancy check that an interrogator uses when protecting certain R=>T commands, and the G2X uses when protecting certain backscattered T=>R sequences. To generate a CRC-16 an interrogator or the G2X first generates the CRC-16 precursor shown in Section 18, Ref. 1 Table 6.11, then take the ones-complement of the generated precursor to form the CRC-16. For a detailed description of the CRC-16 The CRC-5 is only used to protect the Query command (out of the mandatory command set). It is calculated out of X5 + X3 + 1. For a more detailed CRC-5 description refer to Section 18, Ref. 1, table 6.12. For exemplary schematic diagrams for CRC-5 and CRC-16 encoder/decoder refer to Section 18, Ref. 1, Annex F. For a CRC calculation example refer to Section 16.1, Table 32 and Table 33.
Rev. 3.6 — 10 March 2011 139036 28 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 15. TAG selection, inventory and access This section contains all information including commands by which a reader selects, inventories, and accesses a G2X population An interrogator manages UCODE G2X equipped tag populations using three basic operations. Each of these operations comprises one or more commands. The operations are defined as follows Select: The process by which an interrogator selects a tag population for inventory and access. Interrogators may use one or more Select commands to select a particular tag population prior to inventory. Inventory: The process by which an interr ogator identifies UCODE G2X equipped tags. An interrogator begins an inventory round by transmitting a Query command in one of four sessions. One or more G2X may reply. The interrogator detects a single G2X reply and requests the PC, EPC, and CRC-16 from the chip. An inventory round operates in one and only one session at a time. For an example of an interrogator inventorying and accessing a single G2X refer to Section 18 , Ref. 1, Annex E. Access: The process by which an interrogator transacts with (reads from or writes to) individual G2X. An individual G2X must be uniquely identified prior to access. Access comprises multiple commands, some of which employ one-time-pad based cover-coding of the R=>T link.
15.1 G2X Memory
Figure 6.17. The tag memory is logically subdivided into four distinct banks. The logical address of all memory banks begin at zero (00h). Table 15. G2X memory sections
15.1.1 Memory map
Table 16. Memory map
Rev. 3.6 — 10 March 2011 139036 31 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL
15.1.1.1 User memory (only G2XM)
The User Memory bank contains a sequential block of 512 bits (32 words of 16 bit) ranging from address 00h to 1Fh. The user memory can be accessed via Select, Read or Write command and it may be write locked, permanently write locked, unlocked or permanently unlocked. In addition reading of not only of the User Memory but of the whole memory including EPC and TID can be protected by using the custom ReadProtect command.
15.1.1.2 Special behavior of user memory address 1Fh
WRITE or SELECT of user memory address 1Fh will falsely set an error flag. This will affect the subsequent READ or SELECT. The following commands will falsely set an internal error flag (without actually causing an error): 1) WRITE to user memory with WordPtr=1Fh 2) SELECT to user memory with compare mask ending at bitaddress 1FFh (e.g. Pointer=1FEh, length=1 or Pointer=1FDh, length=2 …) Note: The error flag is set independent of the chip state (also chips in the e.g. Ready state are affected). The falsely set error flag will affect the following sub sequential commands: A) READ command with WordCount=0 → falsely responds with "memory overrun" error B) SELECT command with Length<>0 → falsely assumes non existing memory location The behavior can be avoided with:
- Turning off the RF carrier to reset the chip (This is what readers typically do!).
- Using the READ command with WordCount<>0.
- Sending other command prior to READ or SELECT (e.g. WRITE to address<>1Fh, ReqRN) or executing READ or SELECT two times. Remark: The WRITE operation itself is not affected by this problem i.e. data is written properly! With commercially available readers this behavior is typically not observed.
15.1.1.3 Supported EPC types
The EPC types are defined in the EPC Tag Standards document from EPCglobal. These standards define completely that portion of EPC tag data that is standardized, including how that data is encoded on the EPC tag itself (i.e. the EPC Tag Encodings), as well as how it is encoded for use in the information systems layers of the EPC Systems Network (i.e. the EPC URI or Uniform Resource Identifier Encodings). The EPC Tag Encodings include a Header field followed by one or more Value Fields. The Header field indicates the length of the Values Fields and contains a numbering system identifier (NSI). The Value Fields contain a unique EPC Identifier and optional Filter Value when the latter is judged to be important to encode on the tag itself.
Rev. 3.6 — 10 March 2011 139036 32 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL
15.2 Sessions, selected and inventoried flags
Session, Selected and Inventory Flags are according the EPCglobal standard. For a
15.2.1 G2X States and slot counter
15.2.2 G2X State Diagram
The tag state are according the EPCglobal standard please refer to: Section 18, Ref. 1, section 6.3.2.4 Tag states and slot counter. A detailed tag state diagram is shown in Section 18, Ref. 1, figure 6.19. Refer also to Section 18, Ref. 1, Annex B for the associated state-transition tables and to Section 18, Ref. 1, Annex C for the associated command-response tables.
15.3 Managing tag populations
For a detailed description on how to manage an UCODE G2X tag populations refer to
15.4 Selecting tag populations
For a detailed description of the UCODE G2X tag population selection process refer to
15.5 Inventorying tag populations
For a detailed description on accessing individual tags based on the UCODE G2X refer to
15.6 Accessing individual tags
For a detailed description on accessing individual tags based on the UCODE G2X refer to An example inventory and access of a single UCODE G2X tag is shown in Section 18, Ref. 1, Annex E.1.
15.7 Interrogator commands and tag replies
15.7.1 Commands
An overview of interrogator to tag commands is located in Section 18, Ref. 1, Table 6.16. Note that all mandatory commands are implemented on the G2X according to the standard. Additionally the optional command Access is supported by the G2X (for details refer to Section 15.11 “Optional Access Command”). Besides also custom commands are implemented on the G2X (for details refer to Section 15.12 “Custom Commands”.
Rev. 3.6 — 10 March 2011 139036 33 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL
15.7.2 State transition tables
The G2X responses to interrogator commands are defined by State Annex B transition tables in Section 18, Ref. 1. Following states are implemented on the G2X:
- Ready, for a description refer to Section 18, Ref. 1, Annex B.1.
- Arbitrate, for a description refer to Section 18, Ref. 1, Annex B.2.
- Reply, for a description refer to Section 18, Ref. 1, Annex B.3.
- Acknowledged, for a description refer to Section 18, Ref. 1, Annex B.4.
- Open, for a description refer to Section 18, Ref. 1, Annex B.5.
- Secured, for a description refer to Section 18, Ref. 1, Annex B.6.
- Killed, for a description refer to Section 18, Ref. 1, Annex B.7.
15.7.3 Command response tables
The G2X responses to interrogator commands are described in following Annex C sections of Section 18, Ref. 1:
- Power-up, for a description refer to Section 18, Ref. 1, Annex C.1.
- Query, for a description refer to Section 18, Ref. 1, Annex C.2.
- QueryRep, for a description refer to Section 18, Ref. 1, Annex C.3.
- QueryAdjust, for a description refer to Section 18, Ref. 1, Annex C.4.
- ACK, for a description refer to Section 18, Ref. 1, Annex C.5.
- NAK, for a description refer to Section 18, Ref. 1, Annex C.6.
- Req_RN, for a description refer to Section 18, Ref. 1, Annex C.7.
- Select, for a description refer to Section 18, Ref. 1, Annex C.8.
- Read, for a description refer to Section 18, Ref. 1, Annex C.9.
- Write, for a description refer to Section 18, Ref. 1, Annex C.10.
- Kill, for a description refer to Section 18, Ref. 1, Annex C.11.
- Lock, for a description refer to Section 18, Ref. 1, Annex C.12.
- Access, for a description refer to Section 18, Ref. 1, Annex C.13.
- T2 time-out, for a description refer to Section 18, Ref. 1, Annex C.17.
- Invalid command, for a description refer to Section 18, Ref. 1, Annex C.18.
15.7.4 Example data-flow exchange
For data flow-exchange examples refer to Section 18, Ref. 1, Annex K:
- K.1 Overview of the data-flow exchange
- K.2 Tag memory contents and lock-field values
- K.3 Data-flow exchange and command sequence
15.8 Mandatory Se lect Commands
Select commands select a particular UCODE G2X tag population based on user-defined criteria.
Rev. 3.6 — 10 March 2011 139036 34 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL
15.8.1 Select
For a detailed description of the mandatory Select command refer to Section 18, Ref. 1, section 6.3.2.10.
15.9 Mandatory Inventory Commands
Inventory commands are used to run the collision arbitration protocol.
15.9.1 Query
For a detailed description of the mandatory Query command refer to Section 18, Ref. 1, section 6.3.2.10.
15.9.2 QueryAdjust
For a detailed description of the mandatory QueryAdjust command refer to Section 18,
15.9.3 QueryRep
For a detailed description of the mandatory QueryRep command refer to Section 18,
15.9.4 ACK
For a detailed description of the mandatory ACK command refer to Section 18, Ref. 1, section 6.3.2.10.
15.9.5 NAK
For a detailed description of the mandatory NAK command refer to Section 18, Ref. 1, section 6.3.2.10.
Rev. 3.6 — 10 March 2011 139036 35 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL
15.10 Mandatory Access Commands
Access commands are used to read or write data from or to the G2X memory. For a detailed description of the mandatory Access command refer to Section 18, Ref. 1, section 6.3.2.10.
15.10.1 REQ_RN
Access commands are used to read or write data from or to the G2X memory. For a detailed description of the mandatory Access command refer to Section 18 , Ref. 1, section 6.3.2.10.
15.10.2 READ
For a detailed description of the mandatory Req_RN command refer to Section 18, Ref. 1, section 6.3.2.10.
15.10.3 WRITE
For a detailed description of the mandatory Write command refer to Section 18, Ref. 1, section 6.3.2.10.
15.10.4 KILL
For a detailed description of the mandatory Kill command refer to Section 18, Ref. 1, section 6.3.2.10.
15.10.5 LOCK
For a detailed description of the mandatory Lock command refer to Section 18, Ref. 1, section 6.3.2.10.
15.11 Optional Access Command
15.11.1 Access
For a detailed description of the optional Access command refer to Section 18, Ref. 1, section 6.3.2.10.
15.12 Custom Commands
15.12.1 ReadProtect
ReadProtect-Bit will than be cleared.
- ReadProtect succeeds: After completing the ReadProtect the G2X shall backscatter the reply shown in Table 19 comprising a header (a 0-bit), the tag's handle, and a CRC-16 calculated over the 0-bit and handle. Immediately after this reply the G2X will render itself to this ReadProtect mode. If the interrogator observes this reply within 20 ms then the ReadProtect completed successfully.
- The G2X encounters an error: The G2X will backscatter an error code during the CW period rather than the reply shown in the EPCglobal Spec (see Annex I for error-code definitions and for the reply format).
- ReadProtect does not succeed: If the interrogator does not observe a reply within 20 ms then the ReadProtect did not complete successfully. The interrogator may issue a Req_RN command (containing the handle) to verify that the G2X is still in the interrogation zone, and may re-initiate the ReadProtect command. The G2X reply to the ReadProtect command will use the extended preamble shown in EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a Tag shall reply as if TRext=1) regardless of the TRext value in the Query that initiated the round.
Table 17. ReadProtect command
Table 18. G2X reply to a successful ReadProtect procedure Table 19. ReadProtect command-response table
Rev. 3.6 — 10 March 2011 139036 38 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL
15.12.2 Reset ReadProtect
Reset ReadProtect allows an interrogator to resets the ReadProtect-bit and re-enables reading of the G2X memory content according the EPCglobal specification. The G2X will execute Reset ReadProtect from the Open or Secured states. If a G2X in the Open or Secured states receives a Reset ReadProtect with a valid CRC-16 and a valid handle but an incorrect access password, it will not reply and transit to the Arbitrate state. If a G2X in the Open or Secured states receives a Reset ReadProtect with a valid CRC-16 and a valid handle but the ReadProtect-Bit is not set ('0'), it will not change the ReadProtect-Bit but backscatter the reply shown in Table 22. If a G2X in the Open or Secured receives a Reset ReadProtect with a valid CRC-16 but an invalid handle, or it receives a Reset ReadProtect before which the immediately preceding command was not a Req_RN, it will ignore the Reset ReadProtect and remain in its current state. A frame-sync must be prepended the Reset ReadProtect command. After sending a Reset ReadProtect an interrogator shall transmit CW for the lesser of TReply or 20 ms, where TReply is the time between the interrogator's Reset ReadProtect command and the G2X backscattered reply. An interrogator may observe three possible responses after sending a Reset ReadProtect, depending on the success or failure of the operation:
- Write succeeds: After completing the Reset ReadProtect a G2X will backscatter the reply shown in Table 22 comprising a header (a 0-bit), the handle, and a CRC-16 calculated over the 0-bit and handle. If the interrogator observes this reply within 20 ms then the Reset ReadProtect completed successfully.
- The G2X encounters an error: The G2X will backscatter an error code during the CW period rather than the reply shown in Table 22 (see EPCglobal Spec for error-code definitions and for the reply format).
- Write does not succeed: If the interrogator does not observe a reply within 20 ms then the Reset ReadProtect did not complete successfully. The interrogator may issue a Req_RN command (containing the handle) to verify that the G2X is still in the interrogation zone, and may reissue the Reset ReadProtect command. The G2X reply to the Reset ReadProtect command will use the extended preamble shown in EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a G2X will reply as if TRext=1 regardless of the TRext value in the Query that initiated the round. The Reset ReadProtect command is structured as following:
- 16 bit command
- Password: 32 bit Access-Password XOR with 2 times current RN16
- 16 bit handle
- CRC-16 calculate over the first command-code bit to the last handle bit
Table 20. Reset ReadProtect command Table 21. G2X reply to a successful Reset ReadProtect command Table 22. Reset ReadProtect command-response table
15.12.3 ChangeEAS
and offline article surveillance. Query that initiated the round.
- Write succeeds: After completing the ChangeEAS a G2X will backscatter the reply shown in Table 25 comprising a header (a 0-bit), the handle, and a CRC-16 calculated over the 0-bit and handle. If the interrogator observes this reply within 20 ms then the ChangeEAS completed successfully.
- The G2X encounters an error: The G2X will backscatter an error code during the CW period rather than the reply shown in Table 25 (see EPCglobal Spec for error-code definitions and for the reply format).
- Write does not succeed: If the interrogator does not observe a reply within 20 ms then the ChangeEAS did not complete successfully. The interrogator may issue a Req_RN command (containing the handle) to verify that the G2X is still in the interrogator's field, and may reissue the ChangeEAS command. Upon receiving a valid ChangeEAS command a G2X will perform the commanded set/reset operation of the EAS_Alarm-Bit. If EAS-Bit is set, the EAS_Alarm command will be available after the next power up and reply the 64 bit EAS code upon execution. Otherwise the EAS_Alarm command will be ignored.
Table 23. ChangeEAS command
Table 24. G2X reply to a successful ChangeEAS command Table 25. ChangeEAS command-response table
15.12.4 EAS_Alarm
and without the need for a backend database. G2X will reply to an EAS_Alarm command from the ready state only. protected Secure state the G2X will not reply to an EAS_Alarm command.
- 16 bit command
- 16 bit inverted command
- DR (TRcal divide ratio) sets the T=>R link frequency as described in EPCglobal Spec.
- M (cycles per symbol) sets the T=>R data rate and modulation format as shown in EPCglobal Spec. Table 6.10.
- TRext chooses whether the T=>R preamble is prepended with a pilot tone as A preamble must be prepended the EAS_Alarm command according EPCglobal Spec, Upon receiving an EAS_Alarm command the tag loads the CRC5 register with 01001b and backscatters the 64 bit alarm code accordingly. The reader is now able to calculate the CRC5 over the backscattered 64 bits received to verify the received code.
Table 26. EAS_Alarm command Table 27. G2X reply to a successful EAS_Alarm command
Table 28. Eas_Alarm command-response table
15.12.5 Calibrate
the user memory content in an infinite loop. The G2XL will continuously backscatter zeros. handle and a prepended frame-sync. Table 29. Calibrate command Table 30. G2X reply to a successful Calibrate command Table 31. Calibrate command-response table
16.1 CRC Calculation EXAMPLE
Table 32. Practical example of CRC calculation for a 'Req_RN' command by the reader
1 DF94
Table 33. Practical example of CRC calculation for a 'Req_RN' command by the reader
Table 34. Abbreviations
Rev. 3.6 — 10 March 2011 139036 48 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 18. References [1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.1.0 (December 17, 2005) [2] EPCglobal: EPC Tag Data Standards [3] EPCglobal (2004): FMCG RFID Phys ical Requirements Document (draft) [4] EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference (draft) [5] European Telecommunications Standards Institute (ETSI), EN 302 208: Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency identification equipment operating in the band 865 MHz to 868 MHz with power levels up to 2 W, Part 1 – Technical characteristics and test methods [6] European Telecommunications Standards Institute (ETSI), EN 302 208: Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency identification equipment operating in the band 865 MHz to 868 MHz with power levels up to 2 W, Part 2 – Harmonized EN under article 3.2 of the R&TTE directive [7] [CEPT1]: CEPT REC 70-03 Annex 1 [8] [ETSI1]: ETSI EN 330 220-1, 2 [9] [ETSI3]: ETSI EN 302 208-1, 2 V<1.1. 1> (2004-09-Electromagnetic compatibility And Radio spectrum Matters (ERM) Radio Frequency Identification Equipment operating in the band 865 - MHz to 868 MHz with power levels up to 2 W Part 1: Technical characteristics and test methods. [10] [FCC1]: FCC 47 Part 15 Section 247 [11] ISO/IEC Directives, Part 2: Rules for th e structure and drafting of International Standards [12] ISO/IEC 3309: Information technology – Telecommunications and information exchange between systems – High-level data link control (HDLC) procedures – Frame structure [13] ISO/IEC 15961: Information technology, Automatic identification and data capture – Radio frequency identification (RFID) for item management – Data protocol: application interface [14] ISO/IEC 15962: Information technology, Automatic identification and data capture techniques – Radio frequency identification (RFID) for item management – Data protocol: data encoding rules and logical memory functions [15] ISO/IEC 15963: Information technology — Radio frequency identification for item management — Unique identification for RF tags [16] ISO/IEC 18000-1: Information technology — Radio frequency identification for item management — Part 1: Reference architecture and definition of parameters to be standardized [17] ISO/IEC 18000-6: Information technology automatic identification and data capture techniques — Radio frequency identification for item management air interface — Part 6: Parameters for air interface communications at 860–960 MHz [18] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary – Part 3: radio-frequency identification (RFID)
Rev. 3.6 — 10 March 2011 139036 49 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL [19] U.S. Code of Federa l Regulations (CFR), Title 47, Chapter I, Part 15: Radio-frequency devices, U.S. Federal Communications Commission. [20] Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BL-ID document number: 10931 [21] Data sheet - Flip chip strap - FCS2, General packing specification, BL-ID document number: 1738 1. ** ... document version number
Table 35. Revision history
- Table 5 “TSSOP8 Marking”: added
- Section 15.1.1.2 “Special behavior of user memory address 1Fh”: added 139035 20091102 Product data sheet 139034 Modifications:
- Type SOT1122 added
- Figure 2 “Wafer layout and pinning information”: correction of drawing 139034 20090721 Product data sheet 139033 Modifications:
- Table 11 “TSSOP8 characteristics” andTable 12 “Package interface characteristics” :removed “Memory characteristics” 139033 20090605 Product data sheet - 139032 139132 Modifications: • This data sheet is a combination of data sheets SL3ICS1002 and SL3ICS1202
- New type FCS2 Aluminum, SOT1040AB2 added
- Section 8.1.6 “Fail die identification”: added
- Section 12 “Packing information”: edited 139032 20080716 Product data sheet 139031 Modifications:
- rephrasing of Section 2 “Features and benefits” on page 2
- added “calibrate command” in Section 2 “Features and benefits” on page 2
- redesign of Figure 1 “Block diagram of G2X IC” on page 4
- merging of Fig. 2 Pinning and Fig. 3 Wafer layout - see Figure 2 “Wafer layout and pinning information” on page 5
- added type “FCS2 Polymer Strap - SOT1040AA1” in Section 4 “Ordering information”, Section 6 “Wafer layout and pinning information”, Section 7 “Package outline”, Section 8 “Mechanical specification”, Section 9 “Limiting values”, Section 10 “Characteristics”
- added Section 11 “Handling information for Flip Chip Strap (FCS2, SOT1040)” on page 19
- added Section 12 “Packing information” on page 20
- added Table 13 “Symbol description” on page 22
- correction of Table 16 “Memory map” on page 30
- removed “ongoing” in 32 bit ongoing in Section 2.1 and Table 15 “G2X memory sections” 139031 20080428 Product data sheet 139030
- added Section 7 “Package outline” on page 7
- added Section 8.1.7 “Map file distribution” on page 15
- added Table 9 “Limiting values TSSOP8[1][2]” on page 14
- added room temperature in Table 11 “Memory characteristics” on page 15
- added Section 10.2 “TSSOP8 characteristics” on page 17
- update of the “EPCglobal compliance and interoperability certification” in Section 13.4 “Air interface standards” on page 23
- correction of “(excluding 16 bit CRC-16 and 16 bit PC) in Table 15 “G2X memory sections” on page
- correction of Initials in “tag mask designer” in Table 16 “Memory map” on page 30
- removed the sentence “The ChangeEAS custom command will toggle the state of the EAS-Alarm bit located in the EEprom” in Section 15.12.3 “ChangeEAS” on page 40.
- added description of ChangeEAS in Table 23 “ChangeEAS command” on page 40 139030 20071221 Product data sheet - 139011 Modifications: • change of product status
- general update 139011 20070910 Objective data sheet - 139010 Modifications:
- removed double section Change EAS, EAS Alarm, Chapter 12.11.7
- changed “Reader” to “Tag” 139010 20070612 Objective data sheet - -
- initial version
Table 35. Revision history …continued
Rev. 3.6 — 10 March 2011 139036 52 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 20. Legal information
20.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
20.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
20.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This docu ment contains the product specification.
Rev. 3.6 — 10 March 2011 139036 53 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
20.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. UCODE — is a trademark of NXP B.V. 21. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
Table 10. Limiting values Table 14. Operating distances for UCODE G2X based Table 18. G2X reply to a successful ReadProtect Table 21. G2X reply to a successful Reset ReadProtect Table 22. Reset ReadProtect command-response Table 24. G2X reply to a successful ChangeEAS Table 27. G2X reply to a successful EAS_Alarm Table 30. G2X reply to a successful Calibrate Table 32. Practical example of CRC calculation for a Table 33. Practical example of CRC calculation for a
Rev. 3.6 — 10 March 2011 139036 55 of 56 continued >> NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 24. Contents
11 Handling information for Flip Chip Strap
15.1.1.2 Special behavior of user memory address 1Fh 31
NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 March 2011 139036 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.