SL3170E INTERSIL | Alldatasheet

Document overview

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  • PDF pages: 19

Technical content

Features

  • Full Fail-safe (Open, Short, Terminated/Floating) Receivers
  • Hot Plug - Tx and Rx Outputs Remain Three-state During Power-up (Only Versions with Output Enable Pins)
  • True 1/8 Unit Load Allows up to 256 Devices on the Bus
  • Single 3.3V Supply μA (Max)
  • -7V to +12V Common Mode Input/Output Voltage Range
  • Half and Full Duplex Pinouts
  • Three State Rx and Tx Outputs Available
  • Current Limiting and Thermal Shutdown for driver Overload Protection
  • Tiny MSOP Packages Consume 50% Less Board Space
  • Pb-Free (RoHS Compliant)

Applications

  • Automated Utility Meter Reading Systems
  • High Node Count Systems
  • Field Bus Networks
  • Security Camera Networks
  • Building Environmental Control/ Lighting Systems
  • Industrial/Process Control Networks

TABLE 1. SUMMARY OF FEATURES CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners.

2 FN6307.5 June 8, 2012 Pinouts ISL3172E, ISL3175E, ISL3178E (8 LD MSOP, SOIC) TOP VIEW ISL3171E, ISL3174E, ISL3177E (8 LD MSOP, SOIC) TOP VIEW ISL3170E, ISL3173E, ISL3176E (10 LD MSOP) TOP VIEW ISL3170E, ISL3173E, ISL3176E (14 LD SOIC) TOP VIEW RO RE DE DI VCC B/Z A/Y GND D R VCC RO DI GND A B Z Y D R RO RE DE DI GND VCC A B Z Y D R NC RO RE DE DI GND GND VCC NC A B Z Y NC D R

Ordering Information

PART NUMBER (Notes 1, 2, 3) PART MARKING TEMP . RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL3170EIBZ 3170EIBZ -40 to +85 14 Ld SOIC M14.15 ISL3170EIUZ 3170Z -40 to +85 10 Ld MSOP M10.118 ISL3171EIBZ 3171 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3171EIUZ 3171Z -40 to +85 8 Ld MSOP M8.118 ISL3172EIBZ 3172 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3172EIUZ 3172Z -40 to +85 8 Ld MSOP M8.118 ISL3173EIBZ 3173EIBZ -40 to +85 14 Ld SOIC M14.15 ISL3173EIUZ 3173Z -40 to +85 10 Ld MSOP M10.118 ISL3174EIBZ 3174 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3174EIUZ 3174Z -40 to +85 8 Ld MSOP M8.118 ISL3175EIBZ 3175 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3175EIUZ 3175Z -40 to +85 8 Ld MSOP M8.118 ISL3176EIBZ 3176EIBZ -40 to +85 14 Ld SOIC M14.15 ISL3176EIUZ 3176Z -40 to +85 10 Ld MSOP M10.118 ISL3177EIBZ 3177 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3177EIUZ 3177Z -40 to +85 8 Ld MSOP M8.118 ISL3178EIBZ 3178 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3178EIUZ 3178Z -40 to +85 8 Ld MSOP M8.118 NOTES: 1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E,ISL3175E, ISL3176E, ISL3177E, ISL3178E. For more information on MSL please see tech brief TB363. ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E

3 FN6307.5 June 8, 2012 Truth Tables TRANSMITTING INPUTS OUTPUTS RE DE DI Z Y X1101 X1010 0 0 X High-Z High-Z 1 0 X High-Z * High-Z * NOTE: *Shutdown Mode (See Note 10), except for ISL3171E, ISL3174E, ISL3177E Truth Tables (continued) RECEIVING INPUTS OUTPUT RE DE Half Duplex DE Full Duplex A-B RO 00 X ≥ -0.05V 1 00 X ≤ -0.2V 0 0 0 X Inputs Open/Shorted 1 0 0 X High-Z * 1 1 1 X High-Z NOTE: *Shutdown Mode (See Note 10), except for ISL3171E, ISL3174E, ISL3177E Pin Descriptions PIN FUNCTION RO Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted. RE Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function isn’t required, connect RE directly to GND or through a 1kΩ to 3kΩ resistor to GND. DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the Tx enable function isn’t required, connect DE to VCC through a 1kΩ to 3kΩ resistor. DI Driver input. A low on DI forces output Y low and output Z hi gh. Similarly, a high on DI forces output Y high and output Z low. GND Ground connection. A/Y ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. B/Z ±15kV IEC61000 ESD Protected RS-485/422 level, Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. A ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input. B ±15kV IEC61000 ESD Protected RS-485/422 level, inverting receiver input. Y ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting driver output. Z ±15kV IEC61000 ESD Protected RS-485/422 level, inverting driver output. VCC System power supply input (3.0V to 3.6V). NC No Connection. ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E

4 FN6307.5 June 8, 2012 Typical Operating Circuits ISL3172E, ISL3175E, ISL3178E ISL3171E, ISL3174E, ISL3177E ISL3170E, ISL3173E, ISL3176E 0.1µF+ D R VCC GND RO RE DE DI A/Y B/Z +3.3V 0.1µF + D R VCC GND RO RE DE DI A/Y B/Z +3.3V RT RT 0.1µF+ D R VCC GND RO DI A B Y Z +3.3V 0.1µF + D VCC GND RO DI A B Y Z +3.3V RT RT 0.1µF+ D R 6, 7 VCC GND RO RE DE DI A B Y Z +3.3V 0.1µF + D R12 6, 7 VCC GND RO RE DE DI A B Y Z +3.3V RT RT (PIN NUMBERS FOR SOIC) ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E

5 FN6307.5 June 8, 2012 Absolute Maximum Ratings Thermal Information Input Voltages DE, RE Input/Output Voltages CC +0.3V) Short Circuit Duration Operating Conditions Thermal Resistance (Typical, Note 4) θJA (°C/W) http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, (Note 5) PARAMETER SYMBOL TEST CONDITIONS TEMP (°C) MIN (Note 19) TYP MAX (Note 19) UNITS DC CHARACTERISTICS Driver Differential VOUT VOD RL = 100Ω (RS-422) (Figure 1A, Note 16) Full 2 2.3 - V RL = 54Ω (RS-485) (Figure 1A) Full 1.5 2 V CC V No Load - - V CC RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) Full 1.5 2.2 - V Change in Magnitude of Driver Differential VOUT for Complementary Output States ΔVOD RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V Driver Common-Mode VOUT VOC RL = 54Ω or 100Ω (Figure 1A) Full - 2 3 V Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States ΔVOC RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V Logic Input High Voltage V IH DI, DE, RE Full 2 - - V Logic Input Low Voltage V IL DI, DE, RE Full - - 0.8 V Logic Input Hysteresis V HYS DE, RE (Note 15) 25 - 100 - mV Logic Input Current I IN1 DI = DE = RE = 0V or VCC (Note 18) Full -2 - 2 μA Input Current (A, B, A/Y, B/Z) I IN2 DE = 0V, VCC = 0V or 3.6V VIN = 12V Full - 80 125 μA VIN = -7V Full -100 -50 - μA Output Leakage Current (Y , Z) (Full Duplex Versions Only, Note 13) IIN3 RE = 0V, DE = 0V, VCC = 0V or 3.6V VIN = 12V Full - 10 40 μA VIN = -7V Full -40 -10 - μA Output Leakage Current (Y , Z) in Shutdown Mode (Full Duplex, Note 13) IIN4 RE = VCC, DE = 0V, VCC = 0V or 3.6V VIN = 12V Full - 10 40 μA VIN = -7V Full -40 -10 - μA Driver Short-Circuit Current, VO = High or Low IOSD1 DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 7) Full - - ±250 mA Receiver Differential Threshold Voltage VTH -7V ≤ VCM ≤ 12V Full -200 -125 -50 mV Receiver Input Hysteresis ΔVTH VCM = 0V 25 - 15 - mV ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E

6 FN6307.5 June 8, 2012 Receiver Output High Voltage V OH IO = -4mA, VID = -50mV Full V CC - 0.6 - - V Receiver Output Low Voltage V OL IO = -4mA, VID = -200mV Full - 0.17 0.4 V Three-State (high impedance) Receiver Output Current (Note 13) IOZR 0.4V ≤ VO ≤ 2.4V Full -1 0.015 1 μA Receiver Input Resistance R IN -7V ≤ VCM ≤ 12V Full 96 150 - k Ω Receiver Short-Circuit Current I OSR 0V ≤ VO ≤ VCC Full ±73 0 ±60 mA Thermal Shutdown Threshold T SD Full - 150 - °C SUPPLY CURRENT No-Load Supply Current (Note 6) I CC DI = 0V or VCC DE = VCC, RE = 0V or VCC Full - 510 800 μA DE = 0V, RE = 0V Full - 480 700 μA Shutdown Supply Current (Note 13) ISHDN DE = 0V, RE = VCC, DI = 0V or VCC Full - 0.01 12 μA ESD PERFORMANCE RS-485 Pins (A, Y, B, Z, A/Y, B/Z) IEC61000-4-2, Air-Gap Discharge Method 25 - ±15 - kV IEC61000-4-2, Contact Discharge Method 25 - ±8- k V Human Body Model, From Bus Pins to GND 25 - ±15 - kV All Pins HBM, per MIL-STD-883 Method 3015 25 - ±7- k V Machine Model 25 - 200 - V DRIVER SWITCHING CHARACTERISTICS (ISL3170E, ISL3171E, ISL3172E, 250kbps) Maximum Data Rate f MAX VOD = ±1.5V, CD = 820pF (Figure 4, Note 17) Full 250 800 - kbps Driver Differential Output Delay t DD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 250 1100 1500 ns Driver Differential Output Skew t SKEW RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 6 100 ns Driver Differential Rise or Fall Time t R, tF RDIFF = 54Ω, CD = 50pF (Figure 2) Full 350 960 1600 ns Driver Enable to Output High t ZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 8, 13) Full - 26 600 ns Driver Enable to Output Low t ZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 8, 13) Full - 200 600 ns Driver Disable from Output High t HZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Note 13) Full - 28 55 ns Driver Disable from Output Low t LZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Note 13) Full - 30 55 ns Time to Shutdown t SHDN (Notes 10, 13) Full 50 200 600 ns Driver Enable from Shutdown to Output High tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 10, 11, 13) Full - 180 700 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 10, 11, 13) Full - 100 700 ns DRIVER SWITCHING CHARACTERISTICS (ISL3173E, ISL3174E, ISL3175E, 500kbps) Maximum Data Rate f MAX VOD = ±1.5V, CD = 820pF (Figure 4, Note 17) Full 500 1600 - kbps Driver Differential Output Delay t DD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 180 350 800 ns Driver Differential Output Skew t SKEW RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 1 30 ns Driver Differential Rise or Fall Time t R, tF RDIFF = 54Ω, CD = 50pF (Figure 2) Full 200 380 800 ns Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, (Note 5) PARAMETER SYMBOL TEST CONDITIONS TEMP (°C) MIN (Note 19) TYP MAX (Note 19) UNITS ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E

7 FN6307.5 June 8, 2012 Driver Enable to Output High t ZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 8, 13) Full - 26 350 ns Driver Enable to Output Low t ZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 8, 13) Full - 100 350 ns Driver Disable from Output High t HZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Note 13) Full - 28 55 ns Driver Disable from Output Low t LZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Note 13) Full - 30 55 ns Time to Shutdown t SHDN (Notes 10, 13) Full 50 200 600 ns Driver Enable from Shutdown to Output High tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 10, 11, 13) Full - 180 700 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 10, 11, 13) Full - 100 700 ns DRIVER SWITCHING CHARACTERISTICS (ISL3176E, ISL3177E, ISL3178E, 20Mbps) Maximum Data Rate f MAX VOD = ±1.5V, CD = 350pF (Figure 4, Note 17) Full 20 28 - Mbps Driver Differential Output Delay t DD RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 27 40 ns Driver Differential Output Skew t SKEW RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 1 3 ns Driver Output Skew, Part-to-Part ΔtDSKEW RDIFF = 54Ω, CD = 50pF (Figure 2, Note 14) Full - - 11 ns Driver Differential Rise or Fall Time t R, tF RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 9 15 ns Driver Enable to Output High t ZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 8, 13) Full - 17 50 ns Driver Enable to Output Low t ZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 8, 13) Full - 16 40 ns Driver Disable from Output High t HZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Note 13) Full - 25 40 ns Driver Disable from Output Low t LZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Note 13) Full - 28 50 ns Time to Shutdown t SHDN (Notes 10, 13) Full 50 200 600 ns Driver Enable from Shutdown to Output High tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 10, 11, 13) Full - 180 700 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 10, 11, 13) Full - 90 700 ns RECEIVER SWITCHING CHARACTERISTICS (All Versions) Maximum Data Rate f MAX VID = ±1.5V (Note 17) ISL3170E-75E Full 12 20 - Mbps ISL3176E-78E Full 20 35 - Mbps Receiver Input to Output Delay t PLH, tPHL (Figure 5) ISL3170E-75E Full 25 70 120 ns ISL3176E-78E Full 25 33 60 ns Receiver Skew | tPLH - tPHL |t SKD (Figure 5) Full - 1.5 4 ns Receiver Skew, Part-to-Part ΔtRSKEW (Figure 5, Note 14) Full - - 15 ns Receiver Enable to Output High t ZH RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Notes 9, 13) ISL3170E-75E Full 5 15 20 ns ISL3176E-78E Full 5 11 17 ns Receiver Enable to Output Low t ZL RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 9, 13) ISL3170E-75E Full 5 15 20 ns ISL3176E-78E Full 5 11 17 ns Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, (Note 5) PARAMETER SYMBOL TEST CONDITIONS TEMP (°C) MIN (Note 19) TYP MAX (Note 19) UNITS ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E

11 FN6307.5 June 8, 2012 Receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs (except on the ISL3171E, ISL3174E and ISL3177E) are tri-statable via the active low RE input. Driver Features The RS-485/422 driver is a differential output device that delivers at least 1.5V across a 54Ω load (RS-485) and at least 2V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width and to minimize EMI. All drivers are tri-statable via the active high DE input, except on the ISL3171E, ISL3174E and ISL3177E. The 250kbps and 500kbps driver outputs are slew rate limited to minimize EMI and to reduce reflections in unterminated or improperly terminated networks. Outputs of the ISL3176E through ISL3178E drivers are not limited, so faster output transition times allow data rates of at least 20Mbps. Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control lines (DE, RE ) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power up may crash the bus. To avoid this scenario, the ISL317XE versions with output enable pins incorporate a “Hot Plug” function. During power up, circuitry monitoring V CC ensures that the Tx and Rx outputs remain disabled for a period of time, regardless of the state of DE and RE . This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. ESD Protection All pins on these devices in clude class 3 (>7kV) Human Body Model (HBM) ESD protec tion structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of ±15kV HBM and ±15kV IEC61000. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-485 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-485 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-485 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc. so it is difficult to obtain repeatable results. The ISL317XE RS-485 pins withstand ±15kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±8kV. The ISL317XE survive ±8kV contact discharges on the RS-485 pins. Data Rate, Cables, and Terminations RS-485/422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. Devices operating at 20Mbps are limited to lengths less than 100’, while the 250kbps versions can operate at full data rates with lengths of several thousand feet. Twisted pair is the cable of choice for RS-485/422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative, when using the 20Mbps devices to minimize reflections. Short networks using the 250kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E

16 FN6307.5 June 8, 2012 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Package Outline Drawing M8.118

8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE

Rev 4, 7/11 DETAIL "X" SIDE VIEW 2 TYPICAL RECOMMENDED LAND PATTERN TOP VIEW PIN# 1 ID 0.25 - 0.36 DETAIL "X" 0.10 ± 0.05 (4.40) (3.00) (5.80) H C

1.10 MAX

0.09 - 0.20 3°±3° GAUGE PLANE 0.25

0.95 REF

0.55 ± 0.15 B

0.08 C A-B D

3.0±0.05 0.85±010 SEATING PLANE A

0.65 BSC

3.0±0.05 4.9±0.15 (0.40) (1.40) (0.65) D SIDE VIEW 1 Dimensioning and tolerancing conform to JEDEC MO-187-AA Plastic interlead protrusions of 0.15mm max per side are not Dimensions in ( ) are for reference only. Dimensions are measured at Datum Plane "H". Plastic or metal protrusions of 0.15mm max per side are not Dimensions are in millimeters. NOTES: and AMSEY14.5m-1994. included. included. 0.10 CM

17 FN6307.5 June 8, 2012 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Package Outline Drawing M8.15

8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE

Rev 4, 1/12 DETAIL "A" TOP VIEW INDEX AREA 12 3 -C- SEATING PLANE x 45° NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M-1994. 2. Package length does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 3. Package width does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 4. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 5. Terminal numbers are shown for reference only. 6. The lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 7. Controlling dimension: MILLIMETER. Co nverted inch dimensions are not necessarily exact. 8. This outline conforms to JEDEC publication MS-012-AA ISSUE C. SIDE VIEW “A SIDE VIEW “B” 1.27 (0.050) 6.20 (0.244) 5.80 (0.228) 4.00 (0.157) 3.80 (0.150) 0.50 (0.20) 0.25 (0.01) 5.00 (0.197) 4.80 (0.189) 1.75 (0.069) 1.35 (0.053) 0.25(0.010) 0.10(0.004) 0.51(0.020) 0.33(0.013) 0.25 (0.010) 0.19 (0.008) 1.27 (0.050) 0.40 (0.016) 1.27 (0.050) 5.20(0.205) 4 5 TYPICAL RECOMMENDED LAND PATTERN 2.20 (0.087) 0.60 (0.023)

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnishe d by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN6307.5 June 8, 2012 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Mini Small Outline Plastic Packages (MSOP) NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M -1994. 3. Dimension “D” does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums and to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimen- sions are for reference only L 0.25 (0.010) R 4X q 4X q GAUGE PLANE SEATING PLANE EE1 N TOP VIEW INDEX AREA -C- -B- 0.20 (0.008) A B C SEATING PLANE 0.20 (0.008) C 0.10 (0.004) C -A--H- SIDE VIEW b e D A -B- END VIEW0.20 (0.008) C D CL C a - H - -A - - B - - H - M10.118 (JEDEC MO-187BA)

10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE

A 0.037 0.043 0.94 1.10 - A1 0.002 0.006 0.05 0.15 - A2 0.030 0.037 0.75 0.95 - b 0.007 0.011 0.18 0.27 9 c 0.004 0.008 0.09 0.20 - D 0.116 0.120 2.95 3.05 3 E1 0.116 0.120 2.95 3.05 4 e 0.020 BSC 0.50 BSC - E 0.187 0.199 4.75 5.05 - L 0.016 0.028 0.40 0.70 6 L1 0.037 REF 0.95 REF - N1 0 1 0 7 R 0.003 - 0.07 - - o 15o 5o 15o - α 0o 6o 0o 6o - Rev. 0 12/02 θ

19 FN6307.5 June 8, 2012 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Package Outline Drawing M14.15

14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE

Rev 1, 10/09 A D

0.25 A-BMC

C 0.10 C 5 B D

0.10 A-BC

0.20 C 2X

0.10 DC 2X

H 0.10 C 3 6 ID MARK PIN NO.1 (0.35) x 45° SEATING PLANE GAUGE PLANE 0.25 (5.40) (1.50) 1.27 0.31-0.51 4° ± 4° DETAIL"A" 0.22±0.03 0.10-0.25

1.25 MIN

1.75 MAX

(1.27) (0.6) 6.0 8.65 3.9 14 8 Dimensioning and tolerancing conform to AMSEY14.5m-1994. Dimension does not include interlead flash or protrusions. Dimensions in ( ) for Reference Only. Interlead flash or protrusions shall not exceed 0.25mm per side. Datums A and B to be determined at Datum H. Dimensions are in millimeters. NOTES: The pin #1 indentifier may be either a mold or mark feature. 6. Does not include dambar protrusion. Allowable dambar protrusion 7. Reference to JEDEC MS-012-AB. shall be 0.10mm total in excess of lead width at maximum condition. DETAIL "A"SIDE VIEW TYPICAL RECOMMENDED LAND PATTERN TOP VIEW