SKR18_10 SEMIKRON | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Features
- high current density due to mesa technology
- high surge current
- compatible to thick wire bonding
- compatible to all standard solder processes Typical Applications*
- uncontrolled rectifier bridges Absolute Maximum Ratings Symbol Conditions Values Unit VRRM Tj =2 5° C , IR =2m A 1600 V IF(AV) Tc =8 0° C , Tj = 150 °C 320 A i2t Tj = 150 °C, 10 ms, sin 180° 151300 A 2s IFSM 10 ms sin 180° Tj =2 5° C 7000 A Tj = 150 °C 5500 A Tjmax 150 °C
Electrical Characteristics
Symbol Conditions min. typ. max. Unit IR Tj =2 5° C , VRRM 2m A Tj = 120 °C, VRRM 3.3 mA VF Tj =2 5° C , IF = 360 A 11 . 2 1 V Tj = 125 °C, IF = 360 A 0.9 1.1 V V(TO) Tj = 125 °C 0.83 V rT Tj = 125 °C 0.5 m Ω trr Tj =2 5° C , ± 1A 53 µs Thermal Characteristics Symbol Conditions min. typ. max. Unit Tj -40 150 °C Tstg -40 150 °C Tsolder 10 min. 250 °C Tsolder 5 min. 320 °C Rth(j-c) Semipack 2 assembly 0.18 K/W Mechanical Characteristics Symbol Conditions Values Unit Raster size 18.2 x 18.2 mm 2 Area total 331.24 mm 2 Anode bondable (Al) Cathode solderable (Ag/Ni) Wire bond Al, diameter ≤ 500 µm Package tray Chips / Package 16 pcs
SKR 18,2 Qu bond 2 Rev. 1 – 19.02.2010 © by SEMIKRON This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and syste ms is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.