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Technical content
- Using a 1.6mm thick PC board is recommended. 2. Please place purchase orders for taping products per minimum order unit (1 reel or a case). Notes ø3.5 H7.8 Rubber dome h 12.7 0.30.4 0.5 12.7 ø 4 1 2 Dimensions Product Line Circuit Diagram Unit:mm SKPDALD010 Product No. Operatin g force Travel ʢmmʣ Rating ʢmax.ʣ Operating life ʢ5mA 5V DCʣ Initial contact resistance Rubber color Height 0.78N 1.18N 2.45N 2.94N Vertical 1.2 1.75 5mA 12V DC Rating ʢmin.ʣ 10BA 1V DC 500,000cycles 100,000cycles 1kЊ max. Minimum order unit ʢpcs.ʣ 800 Light gray Light blue Blue Gray hʹ5mm hʹ5.5mm hʹ6.1mm SKPDAMD010 SKPDACD010 SKPDAFD010 Operating direction Style PC board mounting hole dimensions ʢViewed from switch mounting faceʣ 2-ø 1 holes h 5.5 6.1 Refer to P.306 for soldering conditions. 7.8mm Square(Radial Type) SKPD Series Varieties of 1mm, 1.2mm or 1.75mm-travel to support wide range of applications. TACT SwitchTM Specification of Radial Taping Package (Taping Packaging for Auto-insertion) /K34/K37 /K33/K33/K31 /K32/K39/K31 Unit:mmBox Size 800 8,000 8,000 Number of packagesʢpcs.ʣ 1 box 1 case /Japan 1 case /export packing
WɿWidth. The most outer dimension excluding terminal portion. D ɿDepth. The most outer dimension excluding terminal portion. H ɿHeight. The minimum dimension if there are variances. Contact 298 296 299 300296 Carbon Silver Carbon Silver Carbon Soft Feeling Type 6.6 6.3 7.5 9.9 7.3 ˘7.8 5.9 6 6 6.7 5 7 6.6 6.3 V6.45 ˘7.8 Snap–in Surface mount Radial SKEG SKPE SKEG SKEY SKPF ʕ ʕ Horizontal type ʕ ʕ High operation force and long stroke Low contact resistance SKPM ʕ SKPN SKPG SKPL SKPD Round terminal and low contact resistance ʕ Series Ŗ20ˆ to ʴ70ˆ SKEG Ŗ40ˆ to ʴ90ˆ 100MЊ min. 100V DC SKEY/PDɿ50MЊ min. 100V DC 250V AC for 1min. SKPN : 200V AC for 1min. SKEY/PD : 100V AC for 1min. Ŗ30ʶ2ˆ for 96h 80ʶ2ˆ for 96h 60ʶ2ˆ, 90 to 95%RH for 96h 10 to 55 to 10Hz/min., the amplitude is 1.5mm for all the frequencies, in the 3 direction of X, Y and Z for 2hours respectively Shall be in accordance with individual specifications. ʕ ˔ ʕ Type Dimensions ʢmmʣ W D H Operation force coverage Page
Features
performanceDurabilityEnvironmental performance Insulation resistance Voltage proof Vibration Lifetime Cold Dry heat Damp heat ˔ 5"$54XJUDI5. 4PMEFSJOH$POEJUJPOT ʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜ ˔ 5"$54XJUDI 5. $BVUJPOT ʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜ ˔ 1SPEVDU-JOFPG,OPCGPS5"$54XJUDI ʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜ
- Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 П CAʢKʣor CCʢTʣat solder jointsʢcopper foil surface ʣ. A heat resistive tape should be used to fix thermocouple. 3. Temperature profile Soldering Conditions Condition for Reflow Available for Surface Mount Type. 180 150 260˚C max. 3 sec max. 230˚C Time TFDNBYʢQSFIFBUJOHʣ 3 to 4min. Time inside soldering equipment Temperature (˚C ) 40s max. Manual SolderingʢExcept SKRT Seriesʣ Flux built-up Mounting surface should not be exposed to fluk Ambient temperature of the soldered surface of PC board. 100ˆ max. 60s max. 260ˆ max. 5s max. Preheating temperature Preheating time Soldering temperature Duration of immersion Items Condition Condition 2times max.Number of soldering Soldering temperature 350ˆmax. 3s max.Duration of soldering 60W max.Capacity of soldering iron Items 1. Consult with us for availability of TACT Switch TM washing. 2. Prevent flux penetration from the top side of the TACT Switch TM. 3. Switch terminals and a PC board should not be coated with flux prior to soldering. 4. The second soldering should be done after the switch is stable with normal temperature. 5. Use the flux with a specific gravity of min 0.81. ʢEC-19S-8 by TAMURA Corporation, or equivalents.ʣ Notes Conditions for Auto-dip Available for Snap-in Type and Radial Type ʢExcept SKHJ, SKHL, SKQJ, SKQK, SKEG seriesʣ 1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC boards and others. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Note