SKKT 107/16 E

SKKT107 SEMIKRON | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 5

Technical content

© by SEMIKRON Rev. 3.0 – 31.05.2022 1 SEMIPACK® 1 SKKT Thyristor Modules SKKT 107/16 E Features* • Heat transfer through aluminium oxide ceramic insulated metal baseplate • UL recognized, file no. E63532 Typical Applications • DC motor control (e. g. for machine tools) • AC motor soft starters • Temperature control (e. g. for ovens, chemical processes) • Professional light dimming (studios, theaters) Absolute Maximum Ratings Symbol Conditions Values Unit Chip IT(AV) sin. 180° Tj = 130 °C Tc = 85 °C 119 A Tc = 100 °C 91 A ITSM 10 ms Tj = 25 °C 2250 A Tj = 130 °C 1900 A i2t 10 ms Tj = 25 °C 25313 A²s Tj = 130 °C 18050 A²s VRSM Tj = 25 °C 1700 V VRRM Tj = 25 °C 1600 V VDRM Tj = 25 °C 1600 V (di/dt)cr Tj = 130 °C 140 A/µs (dv/dt)cr Tj = 130 °C 1000 V/µs Tj -40 ... 130 °C Module Tstg -40 ... 125 °C Visol 1 s 3600 V Characteristics Symbol Conditions min. typ. max. Unit Chip VT Tj = 25 °C, I T = 300 A 1.6 1.75 V VT(TO) Tj = 130 °C 0.8 0.90 V rT Tj = 130 °C 2.80 3.35 m Ω IDD;IRD Tj = 130 °C, V DD = VDRM; VRD = VRRM 20 mA tgd Tj = 25 °C, I G = 1 A, di G/dt = 1 A/µs 1 µs tgr VD = 0.67 * VDRM 2 µs tq Tj = 130 °C 200 µs IH Tj = 25 °C 150 250 mA IL Tj = 25 °C, R G = 33 Ω 300 600 mA VGT Tj = 25 °C, d.c. 2.5 V IGT Tj = 25 °C, d.c. 100 mA VGD Tj = 130 °C, d.c. 0.25 V IGD Tj = 130 °C, d.c. 4 mA Rth(j-c) continuous DC per chip 0.15 K/W per module 0.075 K/W Rth(j-c) sin. 180° per chip 0.2 K/W per module 0.1 K/W Rth(j-c) rec. 120° per chip 0.21 K/W per module 0.105 K/W Module Rth(c-s) chip 0.09 K/W module 0.05 K/W Ms to heatsink M5 4.25 5.75 Nm Mt to terminals M5 2.55 3.45 Nm a 5 * 9.81 m/s² w 75 g

2 Rev. 3.0 – 31.05.2022 © by SEMIKRON Fig. 1L: Power dissipation per thyristor/diode vs. on-state current Fig. 1R: Max. power dissipation per chip vs. ambient temperature Fig. 2L: Max. power dissipation of one module vs. rms current Fig. 2R: Max. power dissipation of one module vs. case temperature Fig. 3L: Max. power dissipation of two modules vs. direct current Fig. 3R: Max. power dissipation of two modules vs. case temperature

© by SEMIKRON Rev. 3.0 – 31.05.2022 3 Fig. 4L: Max. power dissipation of three modules vs. direct current Fig. 4R: Max. power dissipation of three modules vs. case temperature Fig. 5: Recovered charge vs. current decrease Fig. 6: Transient thermal impedance vs. time Fig. 7: On-state characteristics Fig. 8: Surge overload current vs. time

4 Rev. 3.0 – 31.05.2022 © by SEMIKRON This is an electrostatic discharge sensitive device (ESDS) due to international standard IEC 61340. *IMPORTANT INFORMATION AND WARNINGS The specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in Fig. 9: Gate trigger characteristics SKKT SEMIPACK 1

© by SEMIKRON Rev. 3.0 – 31.05.2022 5 typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make changes.