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Technical content

Refer to P.306 for soldering conditions. 1.57N 2.55N 1.57N 0.3 50mA 12V DC 1,000,000cycles 500,000cycles 100mЊ max. Dark gray Red Dark gray SKHWALA010 SKHWARA010 SKHWAPA010 SKHWAQA010 2.55N Vertical 1,000,000cycles 500,000cycles Red h=4.3mm h=5mm Operating force Travel ʢmmʣ 1,000 Minimum order unitʢpcs.ʣ Rating ʢmax.ʣ 10BA 1V DC Rating ʢmin.ʣ Operating life ʢ5mA 5V DCʣ Initial contact resistance Stem color Stem heightProduct No. Operating direction Product Line PC board mounting hole dimensions ʢViewed from switch mounting faceʣStyle 4.5 ø2.7 h 3.6 3.5 6.5 Stem 0.7 1 2 3 4 Dimensions Unit:mm 4-ø1 holes 6.5 4.5 h 4.3 Circuit Diagram Please use 1.6mm thick PC boards. Note 6mm Square Dust-proof (Snap-in Type) SKHW Series Suitable for various electronic devices with unique dust-proof structure and sharp operation feeling. TACT SwitchTM

Snap–inType Dimensions ʢmmʣ W D H Operation force coverage Page

Features

˘4.5 3.8 252 ʕ ʕ SKHL 3.5 4.3 253 SKHH 255 SKHW 259 ʕ Dust–proof type SKRD 6.2 7.15 7.4 260 ʕ Horizontal type SKQJ ˘6.6 261 ʕ SKHL 7.3 7.22 4.3 253 ʕ Horizontal type SKHH 7.5 7.85 7.4 255 SKQJ 7.3 261 ʕ SKHJ 8.5 263 With LED SKQB ˘10 265 Water– proof Operating direction Vertical Horizontal Series Operating temperature range Ŗ20ˆ to ʴ70ˆ SKHJ/HLʢVertical Typeʣ/QJ Ŗ30ˆ to ʴ85ˆ 100MЊ min. 100V DC 250V AC for 1min. Ŗ30ʶ2ˆ for 96h 80ʶ2ˆ for 96h 60ʶ2ˆ, 90 to 95%RH for 96h 10 to 55 to 10Hz/min., the amplitude is 1.5mm for all the frequencies, in the 3 direction of X, Y and Z for 2hours respectively Shall be in accordance with individual specifications. Electrical performanceDurabilityEnvironmental performance Insulation resistance Voltage proof Vibration Lifetime Cold Dry heat Damp heat ʕ ˔ ʕ ˔ ˔ ˔ ʕ ˔ 5"$54XJUDI 4PMEFSJOH$POEJUJPOT ʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜ ˔ 5"$54XJUDI $BVUJPOT ʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜ ˔ 1SPEVDU-JOFPG,OPCGPS5"$54XJUDI ʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜʜ WɿWidth. The most outer dimension excluding terminal portion. D ɿDepth. The most outer dimension excluding terminal portion. H ɿHeight. The minimum dimension if there are variances. The automotive operating temperature range to be individually discussed upon request. Note

  1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 П CAʢKʣor CCʢTʣat solder jointsʢcopper foil surface ʣ. A heat resistive tape should be used to fix thermocouple. 3. Temperature profile Soldering Conditions Condition for Reflow Available for Surface Mount Type. 180 150 260˚C max. 3 sec max. 230˚C Time TFDNBYʢQSFIFBUJOHʣ 3 to 4min. Time inside soldering equipment Temperature (˚C ) 40s max. Manual SolderingʢExcept SKRT Seriesʣ Flux built-up Mounting surface should not be exposed to fluk Ambient temperature of the soldered surface of PC board. 100ˆ max. 60s max. 260ˆ max. 5s max. Preheating temperature Preheating time Soldering temperature Duration of immersion Items Condition Condition 2times max.Number of soldering Soldering temperature 350ˆmax. 3s max.Duration of soldering 60W max.Capacity of soldering iron Items 1. Consult with us for availability of TACT Switch TM washing. 2. Prevent flux penetration from the top side of the TACT Switch TM. 3. Switch terminals and a PC board should not be coated with flux prior to soldering. 4. The second soldering should be done after the switch is stable with normal temperature. 5. Use the flux with a specific gravity of min 0.81. ʢEC-19S-8 by TAMURA Corporation, or equivalents.ʣ Notes Conditions for Auto-dip Available for Snap-in Type and Radial Type ʢExcept SKHJ, SKHL, SKQJ, SKQK, SKEG seriesʣ 1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC boards and others. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Note