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SMD Schottky Barrier Rectifier http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 SKFM3020C-D2 THRU SKFM30200C-D2 Document ID Issued Date Revised Date Revision Page. DS-12162I 2009/02/10 2012/08/31 E 7

Epoxy:UL94-V0 rated flame retardant Case : Molded plastic, Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 Mounting Position : Any Weight : 1.46 gram TO-263 / D2PAK Approximated Package outline Page 2 Low power loss, high efficiency. High current capability, l Ultra high-speed switching. Silicon epitaxial planar chip, metal silicon junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228

Features

ow forward voltage drop. High surge capability. Guardring for overvoltage protection. Suffix "-H" indicates Halogen-free parts, ex. SΚFM3020C-D2-H. SKFM3020C-D2 SKFM3030C-D2 SKFM3040C-D2 -55 to +125 SYMBOLS VRRM (V) VRMS VR (V) (V) *1 *2 *3 *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage@I = 15.0A F VF (V) 0.55 Formosa MS PARAMETER CONDITIONS Forward rectified current Forward surge current Reverse current Storage temperature See Fig.1 8.3ms single half sine-wave (JEDEC methode) Symbol MIN. TYP. MAX. UNIT IO IFSM IR TSTG A A mA O C 30.0 150 0.5 +175-65 V = V T = 25 CR RRM J O V = V T = 100 CR RRM J O SKFM30100C-D2 100 70 100 SKFM3050C-D2 SKFM3060C-D2 SKFM3080C-D2 0.70 0.85 30.0A Surface Mount Schottky Barrier Rectifiers - 20V-200V (C ) O Operating temperature T,J http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 -55 to +150 SKFM3045C-D2 45 31.5 45 Dimensions in inches and (millimeters) D2PAK 0.402(10.20) 0.386(9.80) 0.192(4.8) 0.176(4.4) 0.370(9.40) 0.354(9.00) 0.205(5.20) 0.189(4.80) 0.063(1.60) 0.055(1.40) 0.024(0.60) 0.016(0.40) 0.055(1.40) 0.047(1.20) 0.185(4.70) 0.169(4.30) 0.012(0.30) 0.004(0.10) 0.108(2.70) 0.092(2.30) 0.046(1.20) 0.032(0.80) Document ID Issued Date Revised Date Revision Page. Maximum ratings (AT T =25A o C unless otherwise noted) SKFM30150C-D2 150 150 SKFM30200C-D2 200 200 0.90 0.92 105 140 SKFM3020C-D2 THRU SKFM30200C-D2 DS-12162I 2009/02/10 2012/08/31 E 7 SMD Schottky Barrier Rectifier Thermal resistance RθJA O C/W15Junction to ambient RθJC O C/W4.5Junction to case Electrical characteristics (AT T =25A o C unless otherwise noted)

Rating and characteristic curves (SKFM3020C-D2 THRU SKFM30200C-D2) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE CASE TEMPERATURE,( C)° http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. 0 25 50 75 100 125 150 175 SKFM3020C-D2~SKFM3045C-D2 SKFM3050C-D2~SKFM30200C-D2 FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT NUMBER OF CYCLES AT 60Hz PEAK FOR WARD SURGE CURRENT ,(A) 100 175 125 150 11 0 100 T =25 CJ 8.3ms Single Half Sine Wave JEDEC method AVERAGE FOR WARD CURRENT ,(A) 0.1 1.0 .01 INSTANTANEOUS FOR WARD CURRENT ,(A) FORWARD VOLTAGE,(V) Pulse Width 300us 1% Duty Cycle T =25 CJ FIG.2-TYPICAL FORWARD CHARACTERISTICS 20V-45V 50V-60V 80V-100V 150V-200V DS-12162I 2009/02/10 2012/08/31 E 7 FIG.4- TYPICAL REVERSE CHARACTERISTICS REVERSE LEAKAGE CURRENT , (mA) 0.001 0.01 0.1 1.0 100 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) 20 40 60 80 100 20V~45V 50V~200V T2 5 CJ= ° T 100 CJ= °

Suggested solder pad layout Page 4 Formosa MS L C E 1 3 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Dimensions in inches and (millimeters) C 0.098(2.50) PACKAGE D2PAK E L 0.665(16.90) 0.425(10.80) 0.071(1.80) 0.449(11.40) 0.138(3.50) 0.374(9.50) SKFM3020C-D2 THRU SKFM30200C-D2 DS-12162I 2009/02/10 2012/08/31 E 7 SMD Schottky Barrier Rectifier

13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width Overall tape thickness Tape width P E B C d F T W P A D D D Symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 330.00 50.00 13.00 1.75 11.50 16.00 4.00 2.00 0.23 24.00 30.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. 10.70 16.30 5.10 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. SKFM3020C-D2 THRU SKFM30200C-D2 DS-12162I 2009/02/10 2012/08/31 E 7 Packing information E B d F W PA D D1D2 C T SMD Schottky Barrier Rectifier

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Reel packing D2PAK/TO-263 800 16.0 800 337*337*37 330 350*330*360 6,400 15.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) 13" Document ID Issued Date Revised Date Revision Page. Profile Feature Soldering Condition Average ramp-up rate(T to T ) <3 /sec Preheat -Temperature Min(Tsmin) 150 -Temperature Max(Tsmax) 200 -Time(min to max)(t ) 60~120sec Tsmax to T -Ramp-upRate <3 /sec Time maintained above: -Temperature(T ) 217 -Time(t ) 60~260sec Peak Temperature(T ) 255 0/ 5 Time within 5 of actual Peak Temperature(t ) Ramp-down Rate <3 /sec Time 25 to Peak Temperature <6minutes LP s L L L P P o o o o o oo o o o C C C C C C- + C C C C 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55%±25% 2.Reflow soldering of surface-mount devices oo CC Suggested thermal profiles for soldering processes Critical Zone TL to TP Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat t25 C to Peak o Time TL TP Ramp-down Temperature SKFM3020C-D2 THRU SKFM30200C-D2 DS-12162I 2009/02/10 2012/08/31 E 7 SMD Schottky Barrier Rectifier

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. SKFM3020C-D2 THRU SKFM30200C-D2 DS-12162I 2009/02/10 2012/08/31 E 7 SMD Schottky Barrier Rectifier 1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Forward Surge 9. Humidity 10. High Temperature Storage Life at 260 5 for 10 2sec. immerse body into solder 1/16" 1/32" at 245 5 for 5 sec. V =80% rate at T =125 for 168 hrs. Rated average rectifier current at T =25 for 500hrs. T = 25 C, I = I On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. 15P at T =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. 8.3ms single half sine-wave , one surge. at T =85 , RH=85% for 1000hrs. at 175 for 1000 hrs. ±C ± C C C CC C C O O O O O OO O O RJ A AF O SIG A A O MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 MIL-STD-750D METHOD-1036 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 MIL-STD-750D METHOD-1031 JESD22-A102 Item Test Conditions Reference High reliability test capabilities