SKCD61C170IHD_10 SEMIKRON | Alldatasheet

Document overview

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  • PDF pages: 2

Technical content

Features

  • high current density
  • easy paralleling due to a small forward voltage spread
  • positive temperature coefficient
  • very soft recovery behavior
  • small switching losses
  • high ruggedness
  • compatible to thick wire bonding
  • compatible to standard solder processes Typical Applications*
  • freewheeling diode for IGBT
  • particularly suitable for frequencies < 8 kHz Absolute Maximum Ratings Symbol Conditions Values Unit VRRM Tj =2 5° C , IR =0 . 1m A 1700 V IF(AV) Ts =8 0° C , Tj = 150 °C 65 A IFSM 10 ms sin 180° Tj =2 5° C 850 A Tj = 150 °C 710 A Tjmax 150 °C

Electrical Characteristics

Symbol Conditions min. typ. max. Unit i2t Tj = 150 °C, 10 ms, sin 180° 2520 A 2s IR Tj =2 5° C , VRRM = 1700 V 0.10 mA Tj = 125 °C, VRRM =1 7 0 0V mA VF Tj =2 5° C , IF = 100 A 1.73 2.02 V Tj = 125 °C, IF = 100 A 1.78 2.05 V V(TO) Tj = 125 °C 1.03 V rT Tj = 125 °C 7.4 m Ω Dynamic Characteristics Symbol Conditions min. typ. max. Unit trr Tj = 25 °C, 75 A, 1200 V, 800 A/µs µs trr Tj = 125 °C, 75 A, 1200 V, 800 A/µs ns Qrr Tj = 25 °C, 75 A, 1200 V, 800 A/µs µC Qrr Tj = 125 °C, 75 A, 1200 V, 800 A/µs 26 µC Irrm Tj = 25 °C, 75 A, 1200 V, 800 A/µs A Irrm Tj = 125 °C, 75 A, 1200 V, 800 A/µs 66 A Thermal Characteristics Symbol Conditions min. typ. max. Unit Tj -40 150 °C Tstg -40 150 °C Tsolder 10 min. 250 °C Tsolder 5 min. 320 °C Rth(j-s) sold. on 0,38 mm DCB, reference point on copper heatsink close to the chip 0.54 K/W Mechanical Characteristics Symbol Conditions Values Unit Raster size 7.8 x 7.8 mm 2 Area total 61 mm 2 Anode bondable (Al) Cathode solderable (Ag/Ni) Wire bond Al, diameter ≤ 500 µm Package wafer frame Chips / Package 156 (5" Wafer) pcs

2 Rev. 1 – 18.02.2010 © by SEMIKRON This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and syste ms is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.