SK82 MCC | Alldatasheet
Document overview
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- PDF pages: 3
Technical content
Features
- For Surface Mount Applications
- Extremely Low Thermal Resistance
- Easy Pick And Place
- High Temp Soldering: 250°C for 10 Seconds At Terminals
- High Current Capability With Low Forward Voltage DIMENSIONS INCHES MM DIM MIN MAX MIN MAX NOTE A .200 .214 5.08 5.43 B .177 .203 4.70 5.30 C .002 .005 .05 .13 D --- .02 --- .51 E .053 .067 1.35 1.70 F .168 .179 4.27 4.55 G .320 .330 8.13 8.38 H .239 .243 6.08 6.18 J .234 .240 5.95 6.10 Maximum Ratings
- Operating & Storage Temperature: -55°C to +125°C
- Maximum Junction Temperature: 150°C
- Typical Thermal Resistance: 18°C/W Junction To Lead MST Part Number Device Marking Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage SK82 SK82 20V 14V 20V SK83 SK83 30V 21V 30V SK84 SK84 40V 28V 40V SK845 SK845 45V 31.5V 45V SK85 SK85 50V 35V 50V SK86 SK86 60V 42V 60V SK88 SK88 80V 56V 80V SK810 SK810 100V 70V 100V Electrical Characteristics @ 25 °C Unless Otherwise Specified Average Forward Current I F(AV) 8.0A TJ = 95°C Peak Forward Surge Current I FSM 200A 8.3ms, half sine Maximum Instantaneous Forward Voltage SK82-86 SK88-810 V F .65V .85V I FM = 8.0A; TJ = 25°C* Maximum DC Reverse Current At Rated DC Blocking Voltage I R 1mA 20mA TJ = 25°C TJ = 100°C Typical Junction Capacitance C J 400pF Measured at 1.0MHz, V R=4.0V 0.070” 0.190’ 0.200” SUGGESTED SOLDER PAD LAYOUT H J E F G A BD C Cathode Band www.mccsemi.com DO-214AB (SMCJ) (Round Lead) /G01/G02/G03/G04/G05/G06/G07/G05/G08/G08/G09/G04/G03/G02/G0A/G0B/G06/G07omponents
21201 Itasca Street Chatsworth
/G07/G18/G06/G19/G0F/G1A/G0F/G0F /G1B/G15/G05/G1C/G09/G1D/G06/G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G1A /G24/G0A/G25/G1D/G06/G06/G06/G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G19 MCC