SK82L MCC | Alldatasheet
Document overview
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Technical content
Features
l Extremely Low Thermal Resistance l For Surface Mount Application l Higher Temp Soldering: 250oC for 10 Seconds At Terminals l Low Forward Voltage Maximum Ratings l Operating Temperature: -55oC to +150oC l Storage Temperature: -55oC to +150oC l Typical Thermal Resistance: 18oC/W Junction to Lead SK82L SK82L 20V 14V 20V SK83L SK83L 30V 21V 30V SK835L SK835L 35V 24.5V 35V SK84L SK84L 40V 28V 40V SK845L SK845L 45V 31.5V 45V SK86L SK86L 60V 42V 60V SK88L SK88L 80V 56V 80V SK810L SK810L 100V 70V 100V Maximum DC Blocking Voltage MCC Catalog Number Device Marking Maximum Reccurrent Peak Reverse Voltage Maximum RMS Voltage Electrical Characteristics @ 25oC Unless Otherwise Specified Average Forward Current IF(AV) 8.0A TJ=95 oC Peak Forward Surge Current I FSM 200A 8.3ms half sine Maximum Instantaneous Forward Voltage SK82L-86L .65V SK88L-810L .80V VF IFM=8.0A TA=25 oC Maximum DC Reverse Current At Rated DC Blocking Voltage IR 1mA 20mA TJ=25 oC TJ=100 oC Typical Junction Capacitance CJ 400pF Measured at 1.0MHz, V R=4.0V SK82L THRU SK810L
8.0 Amp
(SMCJ) (LEAD FRAME) DIMENSIONS INCHES MM DIM MIN MAX MIN MAX NOTE A .075 .095 1.90 2.42 B .115 .121 2.92 3.07 C .002 .008 .05 .20 D --- .020 --- .51 E .030 .060 .76 1.52 F G .305 .320 7.75 8.13 H .260 .280 6.60 7.11 J .220 .245 5.59 6.22 H J E F G A BD C 0.070” 0.190 0.125” SUGGESTED SOLDER PAD LAYOUT www.mccsemi.com /G01/G02/G03/G04/G05/G06/G07/G05/G08/G08/G09/G04/G03/G02/G0A/G0B/G06/G07omponents
21201 Itasca Street Chatsworth
/G07/G18/G06/G19/G0F/G1A/G0F/G0F /G1B/G15/G05/G1C/G09/G1D/G06/G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G1A /G24/G0A/G25/G1D/G06/G06/G06/G1E/G1F/G0F/G1F/G20/G06/G21/G10/G0F/G22/G23/G19/G1A/G19 MCC