SK8205 SKTECHNOLGY | Alldatasheet
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Marking: 2 4 SK8205 SOT23-6 R Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Rating Unit Drain-So urce Voltage VDS 20 V Drain Cu rrent - Continuous ID(T a=25℃) 6 A Drain Cu rrent - Continuous ID(T a=70℃) 4.8 A Drain Cu rrent – Pulsed IDM 20 A Gate-Source Voltage VGS ±12 V Maximum Power Dissipation PD(T a=25℃) 1.14 W Thermal Res istance Junction-to-Ambient RθJA 11 0 /℃ W Junction Temperatur e Tj 150 ℃ Storage Tem perature Range Tstg -55～150 ℃ 1 o f 5REV.08 8205
est Conditions Min Typ Max Unit Drain-So urce Breakdown Voltage BV DSS VGS=0V ID=250μA2 0 V Drain-So urce Leakage Current(Tj=25 )℃ IDSS V DS=20V VGS=0V 1 μA Drain-So urce Leakage Current(Tj=70 )℃ IDSS V DS=16V VGS=0V 25 μA Gate-Source Leakage Current I GSS V GS=±10V VDS=0V ±100 nA Gate Threshold Voltage VGS(th) VDS=VGS I D=250μA 0.5 1.2 V S tatic Drain-Source On-Resistance R DS(on) VGS=4.5V ID=6.0A 24 m Ω VGS=2.5V ID=5.2A 30 m Ω Forwar d Transconductance g FS VDS=10V ID=6.0A 20 S Forwar d On Voltage VSD V GS=0V IS=1.7A 1.2 V Input Cap acitance Ciss VDS=20V VGS=0V f=1.0MHz 1035 pF Output Cap acitance Coss 320 pF Reverse T ransfer Capacitance C rss 150 pF Tu rn-on Delay Time td(on) VDS=10V ID=1A VGS=5V RG=6Ω RD=10Ω ns Ris e Time tr 70 ns T urn-off Delay Time td(of 40 ns Fall T ime tf 65 ns Notes: 1，Surface Mou nted on FR4 Board, t ≤ 10 sec. 2，Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤2%. Electrical Characteristics(Ta=25℃) SK8205 2 o f 5REV.08
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rature Profile for IR Reflow Soldering(Pb-Free) N o t e : 1.Preheating:150~180 ℃, Time:60~90sec. 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3. Cooling Speed: 2~10℃/sec. Resistance to Soldering Heat Test Conditions Temp:260±5℃ Time:10±1 sec SK8205 5 o f 5REV.08