SK52 YEASHIN | Alldatasheet

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Technical content

http://www.yeashin.com 1 REV.02 20120305 SK52~SK510

FEATURES

  • Plastic package has Underwriters Laboratory Flammability Classification 94V-O
  • For surface mounted applications
  • Low profile package
  • Built-in strain relief
  • Metal to silicon rectifier. majority carrier conduction
  • Low power loss,high efficiency
  • High surge capacity
  • For use in low voltage high frequency inverters, free wheeling, and polarity protection applications
  • High temperature soldering guaranteed: 260°C /10 seconds at terminals MECHANICAL DATA Case: JEDEC DO-214AB molded plastic Terminals:Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes positive end (cathode) Standard packaging: 16mm tape (EIA-481) Weight: 0.007 ounce, 0.21 gram SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER VOLTAGE- 20 to 100 Volts CURRENT- 5.0 Amperes MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. Resistive or inductive load. NOTES: A.Pulse Test with PW =300µsec, 2% Duty Cycle. B.Mounted on P.C. Board with 14mm (.013mm thick) copper pad areas. SMC / DO-214AB Unit: inch ( mm ) .260 (6.60) .280 (7.11) .006 (.152) .012 (.305) .008(.203) .002(.051) .305 (7.75) .320 (8.13) .030 (0.76) .060 (1.52) Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current at T L (See figure 1) Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load (JEDEC method) Maximum Instantaneous Forward Voltage at 5.0A (Note 1) Maximum DC Reverse Current (Note 1) Ta= 25°C at Rated DC Blocking Voltage Ta=100°C Maximum Thermal Resistance(Note 2) Operating Temperature Range Storage Temperature Range 5.0 100.0 0.5 V V V A A mA 20.0 V RRM V RMS V DC V °C/W UNITSSYMBOLS I(AV) I FSM V F I R RθJL RθJA T J T STG 0.50 -55 to +150 -55 to +150 17.0 55.0 SK52 20.0 14.0 20.0 SK53 30.0 21.0 30.0 SK54 40.0 28.0 40.0 SK55 50.0 35.0 50.0 SK56 60.0 42.0 60.0 SK58 80.0 56.0 80.0 SK59 90.0 63.0 90.0 SK510 100.0 70.0 100.0 0.75 0.85 Typical total capacitance (1MHz ,VR = 4V) pF T 280C

http://www.yeashin.com 2 REV.02 20120305 SK52~SK510 DEVICE CHARACTERISTICS AVERAGE FORWARD CURRENT, AMPERES INSTANTANEOUS FORWARD CURRENT. AMPERES CAPACITANCE. PF PEAK FORWARD SURGE CURRENT. AMPERES Fig.3- TYPICAL REVERSE CHARACTERISTICS Fig.5- MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT Fig.4- TYPICAL JUNCTION CAPACITANCE Fig.2- TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS Fig.1- FORWARD CURRENT DERATING CURVE LEAD TEMPERATURE. C O INSTANTANEOUS FORWARD VOLTAGE. VOLTS REVERSE VOLTAGE. VOLTS PERCENT OF RATED PEAK REVEERSE VOLTAGE NUMBER OF CYCLES AT 60Hz INSTANTANEOUS REVERSE CURRENT. MILLAMPERES 0.1 1 10 100 6.0 5.0 4.0 3.0 2.0 1.0 1.0 .3.2 SINGLE PHASE HALF WAVE 60Hz RESISTIVE OR INDUCTIVE LOAD P.C.B MOUNTED ON 0.55x0.55 " (14x14mm) COPPER PAD AREAS T= 2 5C PULSE WIDTH=30uS 1% DUTY CYCLE J O 100 T =150 C 10ms SINGLE HALF SINE-WAVE J O 20 40 60 80 100 120 140 1.0 0.1 0.01 .001 1000 0.1 1.0 10 100 100 T= 1 0 0 C A O T= 7 5 C A O T= 2 5 C A O T=2 5 C J O SK58~SK510 SK52~SK54 SK ~SK5655 SK52~SK54 SK55~S510 SK52~SK54 SK55~SK510 f=1MHz 150

http：//www.yeashin.com REV.01 亞 昕 科 技 股 份 有 限 公 司 YEASHIN TECHNOLOGY CO., LTD.

亞 昕 科 技 股 份 有 限 公 司 YEASHIN TECHNOLOGY CO., LTD. http://www.yeashin.com Note : According to J-STD-020D.

亞 昕 科 技 股 份 有 限 公 司 YEASHIN TECHNOLOGY CO., LTD. http://www.yeashin.com 3、Solder Paste Parameter： Item Property Testing Method Liquid resistivity ( Ω．m) １×１0 以上 JIS Z 3197 8.1.1 (1999) Flux content (wt %) 10.5±0.03 JIS Z 3197 8.1.2(1999) Copper mirror corrosion test Accept JIS Z 3197 8.1.4.2.3(1999) GQ G K Powder（u m） Ball shape 10-38 Ball shape 20-45 JIS Z 3284 Attach file 1 Melt point (℃) 216-221 DSC Flux fluoride content None JIS Z 3284 Attach file 2 40℃ 90% >1×10 Insulate resistivity Ω 85℃ 85% >5×10 JIS Z 3284 Attach file 3 Flux residuum corrosion test No corrosion JIS Z 3284 Attach file 4 GQ GK Printing test 0.4mm pitch 0.5mm pitch JIS Z 3284 Attach file 5 Visicosity (Pa.s) 180±20 JIS Z 3284 Attach file 6 Printing cave None 0.2mm solder bridge JIS Z 3284 Attach file 7 Heating cave None 0.2mm solder bridge JIS Z 3284 Attach file 8 Beginning １．>０Ｎ Adhesive After 24 hrs. １．>０Ｎ JIS Z 3284 Attach file 9 Dewetting ２grade（copper plate） JIS Z 3284 Attach file 10 Beginning １－３grade Solder ball test After 24 hrs. １－３grade JIS Z 3284 Attach file 11 Residuum adhesive after soldering None JIS Z 3284 Attach file 12 Transfer test None JIS Z 3284 Attach file 13 1、Solder Composition： Composition Sn Pb Ag Sb Cu Bi Zn Fe Al As Cd 96.5Sn3.0Ag0.5Cu rest <0.1 3.0 ±0.2 <0.12 0.5 ±0.05 <0.1 <0.002 <0.02 <0.002 <0.03 <0.002 2、Solder Stick Parameter： Extension strength (kgf/mm ) 3.7 Elongation 33 Liquid phase temp (℃) 221 Solid phase temp (℃) 216

ALL DIMENSION IN MILLIMETERS SKETCH "A" rotation Typical component cavity center line Typical component center line Note1.: A0B0K0 are determined by component size. The clearance between the component and the cavity must be within 0.05(.002) min. to 0.50 rotate more than 20 within the determined cavity,see sketch "A" below See Note 1 and Table P Dt K Top Cover Tape See Note 1 and Table For Machine Reference Only Including Draft and Radii Concentric Around B B D For components 2.0mm x 1.2mm and larger P P A E F W 10 pitches cumulative tolerance on tape ±0.2 User Direction of Feed B K Tape Size D E Po t(Max) Ao Bo Ko 8, 12 , 16 mm 1.55 0.1 Constant Dimensions Product Tape B1 D1 K Type Size Max. Min. Max. SOT-23/323/363 SOD-123/323 SMA SMF SMB MINI DIP SMC 3.29 2.0±0.1 40 F P2 R W P 12mm 16mm 8mm 4.5 8.2 12.1 1.0 1.5 3.5±0.05 5.5±0.05 7.5±0.1 4.5 2.0 ±0.05 16.0±0.3 4.0±0.1 8.0±0.1 30 12.0±0.3 http //www.yeashin.com 亞 昕 科 技 股 份 有 限 公 司 YEASHIN TECHNOLOGY CO., LTD.

0.10mm Max. Embossed Carrier Cavity RM i n . Bending Radius S e eN o t e2 Note2.: Tape and component shall pass around radius "R" without damage . A Full Radius T C N G (measured at hub) * Drive spokes optional. If used, dimensions with asterisks apply. No Components* Components Min. 160mm Min. 390mm User Direction of Feed Top Cover Tape End Start Min. 160mm Carrier tape sealed with cover tape Notes: 1. There shall be a leader of 230mm [9.05] minimum which may consist of carrier and/or cover tape or a start tape followed by a minimum of 160mm [6.30] of empty carrier tape sealed with cover tape. 2. There shall be a trailer of 160mm [6.30] minimum of empty carrier tape sealed with cover tape. The entire carrier tape must release from the reel hub as the last portion of the tape unwinds from the reel without damage to the carrier tape and the remaining components in the cavities. ALL DIMENSION IN MILLMETERS A B* D* N T 8.4 +1.5 -0.0 12.4 +2.0 -0.0 16.4 +2.0 -0.1 C G 16mm 330 1.5 13.0±0.2 20.2 50 12mm 14.4 330 1.5 13.0±0.2 20.2 Tape Size 50 18.4 22.4 8mm 178 1.5 13.0±0.2 20.2 50 http //www.yeashin.com

BOX SIZE: Q'TY PER BOX ( PER REEL ) SOT-23/323/363 12000 SOD-123/323 ( 3000 ) 15000 SMB MINI DIP SMC 3000 ( 1500 ) TUBE SIZE: Q'TY PER BOX ( PER TUBE ) 9000 ( 50 ) DFS B 187 340 BOXTUBE 444*15*5.9 490*155*145 SMA/SMF DFS DIMENSION (mm) PRODUCTS OUTLINE A C 6000 ( 3000 ) PACKAGING PRODUCTS OUTLINE PACKAGEING SIZE (mm) 187 70 340 http //www.yeashin.com

Box Dimensions :mm Quantity per Box :7.5Kpcs/Roll,2Rolls/Box,15Kpcs/Box CARTON SHIPPING MARK 345 +-5mm T YPE Q TY N .W. 370+-5mm G .W. C/NO. SIDEMARK 355+-5mm TYPE: QTY: N.W.: G. W. : Box dimensions: mm Quantity per Box:15kpcs/Box. 8Box/carton,120kpcs/carton http //www.yeashin.com