SK32 TGS | Alldatasheet
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0.070” 0.190 0.125” SUGGESTED SOLDER PAD LAYOUT SK38 SK38 80V 56V 80V Electrical Characteristics @ 25°C Unless Otherwise Specified Average Forward Current IF(AV) 3.0A TL = 100°C Peak Forward Surge Current I FSM 100A 8.3ms, half sine Maximum DC Reverse Current At Rated DC Blocking Voltage I R .5mA 20mA TJ = 25°C TJ = 100°C Typical Junction Capacitance CJ 250pF Measured at 1.0MHz, VR=4.0V Maximum Instantaneous Forward Voltage SK32-34 SK35-36 SK38-310 V F .50V .75V .85V IFM = 3.0A; TJ = 25°C* *Pulse test: Pulse width 200 µsec, Duty cycle 2% DO-214AB (SMC) (LEAD FRAME) A B D C E F G H DIMENSIONS INCHES MM DIM MIN MAX MIN MAX NOTE A .260 .280 6.60 7.11 B .220 .245 5.59 6.22 C .006 .012 0.15 0.31 E .305 .320 7.75 8.13 F .079 .103 2.00 2.62 G .108 .128 2.75 3.25 H .002 .008 0.050 0.203 Revision: B 2011/07 /04 www.mccsemi.com 1 of 4
- Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates Compliant. See ordering information) Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
- Epoxy meets UL 94 V-0 flammability rating
- Moisture Sensitivity Level 1
- For Surface Mount Applications
- High Current Capability With Low Forward Voltage
- High Temp Soldering: 260°C for 10 Seconds At Terminals Maximum Ratings
- Operating Temperature: -55°C to +150°C
- Storage Temperature: -55°C to +150°C
- Maximum Thermal Resistance :10°C/W Junction To Lead
- Maximum Thermal Resistance :55°C/W Junction To Ambiemt TIGER ELECTRONIC CO.,LTD
Revision: B 2011 /07/04 Device Packing Part Number-TP Tape&Reel: 3Kpcs/Reel Ordering Information :