SK22WA SKTECHNOLGY | Alldatasheet
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Surface Mount Schottky Barrier Rectifier Reverse Voltage - 20 to 200 V Forward Current - 2.0A @ Features * Metal silicon junction, majority carrier conduction + For surface mounted applications . fa) ; Ye + Low power loss, high efficiency + High forward surge current capability + For use in low voltage, high frequency inverters, MARKING: free wheeling, and polarity protection applications sk22WA K22 sk24WA —K24 SK2GWA 26 SK2BWA 2B SK2IOWA —K210. = SK2IZWA 212 SK2ISWA — K215 SK220WA — K220 Weight : 17mg , 0.0006 oz ‘Simplified outline SOD-123FL and symbol @ Absolute Maximum Ratings and Electrical characteristics Ratings at 25 °C ambient temperature unless otherwise specified.Single phase, half wave, 60Hz resistive or inductive load, for capacitive load, derate by 20 % Peak Forward Surge Current,8,3ms Single Half Sine-wave Superimposed A on Rated Load (JEDEC method) Maximum DC Reverse Current T. = 25°C 0.3 at Rated DC Reverse Voltage T, =100°C 5 mA [rmmanamnemmnmn Tc | mm pce 1) Measured at 1MHz and applied reverse voltage of 4 V D.C. REV.08 1 of 4
\\’ rE a Fig.1 Forward Current Derating Curve Fig.2 Typical Reverse Characteristics = ee oe = = 25 z ——= 24 1 | Al Tf 3) Bois a o a a Fy Single phase half-wave 60 Hz 3 SSS § 25 [resistive or inductive toad iY I 5 ——— =! oo 2 — 25 50 75 100 125 150 = 0 20 40 60 80 100 Ambient Temperature (°C) Percent of Rated Peak Reverse Voltage ( % ) Fig.3 Typical Forward Characteristic Fig.4 Typical Junction Capacitance 2 9 Po como oom < 2 LLL Ae _ eect 2 ot eee € go LSS Hi Cee CE So fy ey g 2 BS SSS aa LVL 8 eS a =.= —— SK22WAISK24WA s 8 Ci SS Be i - —— sraswasizawa ° | | Ee 2 a oS ein 5 4, [—-seomacm (ITE LLL
3 CT | eas 2 2
= 2 s ,,_ LW | 5 iw = 0 02 04 06 08 1.0 12 14 1.6 1.8 04 1 10 100 Instaneous Forward Voltage (V) Reverse Voltage (V) Fig.5 Maximum Non-Repetitive Peak Forward Surage Current j=] € (JEDEC Method) a B 4 N & 30 r Ny el 2 2 AY 2 LH EB 4 [>See P
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REV.08 2 of 4
& H x che SK22WA THRU SK220WA PACKAGE OUTLINE Plastic surface mounted package; 2 leads ZALL ROUND <ALL ROUND i i — He | cera | E _ {i / Oe a oh Es Top View Bottom View punt] op vA Pc Pope Pe Po Te a Pox [as [79 | na [rs | «3 | 6 | 150 | fo eas Da Le bar orf aaa The recommended mounting pad size Una 2 REV.08 3 of 4
Wg oz x: 5 #4 areal SK22WA THRU SK220WA + Recommended condition of flow soldering
300 Preliminary Heating Soldering Cooling (in air)
o 245°C it = 1 2 200 1 = 1 B 1 3 180 . i S 120°C tot © 1 = 100 2 100°C ! | s it S 1 50 1 5 a ec it 210 5 min more than 1 min ‘less than 10s + Recommended condition of reflow soldering 00; Peak Temperature 24510 260°C, 108 max
20 SS*~*S*«Rtow Heating Rate
oS Reena erererwrered (1 rey Some) Sennen = f t 2 200 | I 5 | | 2 it 3 a @ ‘we f 1 | | : | hob | = ‘100 1 | | | = 1 | | \\ ° 1 | | | 2 50 1 | | | 2 freHeatng Rate) Soto yO". | | S2s0%c° | Coating re 5 1105°C/s 50 to 120s | 2010308 ; morethan 60s 2 times max Recommended peak temperature is over 245 °C. If peak temperature is below 245 °C, you may adjust the following parameters; time length of peak temperature (longer), time length of soldering (longer), thickness of solder paste (thicker) * Condition of hand soldering Temperature: 320°C Time: 3s max. Times: one time + Remark: Lead free solder paste (96.5Sn/3.0Ag/0.5Cu) REV.08 4 of 4