SK20P06 SKTECHNOLGY | Alldatasheet

Document overview

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  • PDF pages: 6

Technical content

Features

Applications

  • Low On-Resistance
  • Low Input Capacitance
  • Low Miller Charge
  • Low Input / Output Leakage
  • Motor Drive
  • PowerTool
  • LED Lighting 1 of 6REV.08

ctricalCharacteristics(T A=25°C unlessotherwisenoted) Par ameter Sym bol Con ditions Min. Typ . Max . Unit OFF CHARACTERISTICS Drai n-SourceBreakdown Voltage BVDSS VGS=0V , IDS=-25 0uA -60 - - V Zero GateVoltageDrainCurrent IDSS VDS=-60 V,VGS=0V TJ=25°C - - 1 uA Gat e-SourceLeakageCurrent IGSS VGS=-48 V ,VDS=0V TJ=12 5°C - - 100 nA ON C HARACTERISTICS Gat eThreshold Voltage VGS( TH) VGS=VDS, IDS=-25 Drai n-SourceOn-Resistance 2 RDS( ON) VGS=-10 V ,IDS=-12 A - - 70 mΩ VGS=-4. 5V , IDS=-8A - - 105 Forw ard Transconductance gfs VDS=-5V ,ID=-12 A - 15 - S DYN AMICCHARACTERISTICS Inp utCapacitance Ciss VDS=-15 V,VGS=0V f=1 MHz - 148 7 - pFOut putCapacitance Coss - 101 - Rev erseTransferCapacitance Crss - 75 - Forw ard Transconductance gfs ID=-12 A,VDS=-5V - 15. 8 - S SWI TCHINGCHARACTERISTICS Turn -On DelayTime Td(o VDS=-15 V,VGS=-10 RGEM=3. 3Ω ID=-1 A - 29. 2 - ns Ris eTime tr - 21 - Turn -OffDelayTime Td(o ff) - 61 - Fal lTime tf - 7.4 - Tot alGateChargeat4.5V Qg VDS=-48 V,IDS=-10 VGS=-4. - 9.7 2 - nCGat etoSource GateCharge Qgs - 3.2 - Gat etoDrain”Miller” Charge Qgd - 3.1 5 - SWI TCHINGCHARACTERISTICS Drai n-SourceDiodeForwardVoltage 2 VSD VGS=0V ,IS=-1A - - -1.2 V Con tinuousSourceCurrent 1 ,5 IS VG=VD=0V , Force Curre nt - - -18 ns Pul sedSourceCurrent 2 ,5 ISM - - -36 nC Notes: 1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper. 2. The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 4. The power dissipation is limited by 150℃ junction temperature 5. The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation. 2 of 6REV.08 SK20P06

Typical Operating Characteristics 3 of 6REV.08 SK20P06

Typical Operating Characteristics (Cont.) i 4 of 6REV.08 SK20P06

Soldering Methods for SK Product 1. Storage environment: Temperature=10°C to35°C Humidity=65%±15% 2. Reflow soldering of surface-mount devices 5 of 6REV.08 SK20P06

Min. Max . Min. Max A 2.18 4 2.33 8 0.08 6 0.09 A1 0.89 0 1.14 3 0.03 5 0.04 b 0.63 5 0.89 0 0.02 5 0.03 b2 0.91 0 1.14 3 0.03 5 0.04 b3 4.95 3 5.46 0 0.19 5 0.21 c 0.45 7 0.61 0 0.01 8 0.02 c1 0.45 7 0.89 0 0.01 8 0.03 D 5.33 4 6.22 3 0.21 0 0.24 D1 5.20 7 0.20 E 6.35 0 6.73 0 0.25 0 0.26 E1 4.32 0 0.17 e 2.29 BSC 0.09

0 BSC

L 3.70 0 4.40 0 0.14 6 0.17 L1 0.85 0 1.25 0 0.03 3 0.04 L2 0.89 0 1.27 0 0.03 5 0.05 6 of 6REV.08 SK20P06