SH960MD-CM236 DFI | Alldatasheet
Document overview
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Technical content
Features
Intel® CM236/QM170 Chipset USB 3.0 4x CORE Processor Graphics CORE Memory Controller A / B 6th Generation Intel® Xeon®/Core™ E3/i7/i5 DMI CORE CORE CORE DDI Port 1 PCIe (2 x1/1 x2) C / D DDR4 2133MHz Memory Down Channel A DDR4 2133MHz Memory DownChannel B DDI Port 2 EEPROM SMBus LPC Bus 8-bit DIO WDT I2C Bus TPM 1.2 (optional) Serial Port 0,1 Fan PWM/ TACH_IN SLP/LID TCA6408A Embedded Controller IT8528E SPI Flash SPI Bus SATA 3.0 4x Intel GLAN I210IT MDI PCIe x1 PCIe (4 x1/1 x4) HDA USB 2.0 8x DDI Port 3 (optional) PCIe x16 (PEG) CH7517 VGA PCIe (2 x1/1 x2) eDP PTN3460 LVDS (optional) 6th Gen Intel® Xeon®/Core TM Processor COM Express Basic
- Dual channel DDR4 2133MHz onboard Memory up to 16GB
- Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
- eDP resolution supports up to 4096x2304 @ 60Hz
- Multiple expansion: 1 PCIe x16, 8 PCIe x1
- Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0 R2.1 Type6 AMT * Populated by default CPU Fan BGA 1440 Intel CM236 /QM170 DDR4 RAID3 Displays PCIe L0~3 PCIe L4~5 PCIe L6~7 x4 x4 x2 x2 x2 x2 x1 x1 x1 x1 x1 x1 x1 x1 * 8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 Wide Temperature -400C 850C 76.00 100.78 115.00 117.00 121.00 0.00 4.00 11.46 45.41 87.00 91.00 4.00 0.000.00 12.00 0.00 2.50 14.00 20.00 30.00 3.00 10.00 8.00 6.58 87.00 4.00 4.0030.20±0.1 36.0070.00 12.60 19.00 150±5.0 Coming Soon
Packing List Optional Items
Ordering Information
www.dfi.com DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © July 7, 2023 DFI Inc. SH960MD-CM236/QM170 SYSTEM Processor 6th Generation Intel® CoreTM Processors, BGA 1440 Intel® Xeon® E3-1515M v5 Processor, Quad Core, 8M Cache, 2.8GHz (3.7GHz), 45W (Support ECC) Intel® Core™ i7-6820EQ Processor, Quad Core, 8M Cache, 2.8GHz (3.5GHz), 45W Intel® Core™ i5-6442EQ Processor, Quad Core, 6M Cache, 1.9GHz (2.7GHz), 25W Intel® Core™ i3-6100E Processor, Dual Core, 3M Cache, 2.7GHz, 35W (Support ECC) Intel® Celeron® Processor G3900E, Dual Core, 2M Cache, 2.4GHz, 35W (Support ECC) Chipset Intel® CM236 Chipset Intel® QM170 Chipset Memory 8GB/16GB DDR4 Memory Down Dual Channel DDR4 2133MHz BIOS Insyde SPI 128Mbit GRAPHICS Controller Intel HD Graphics Feature OpenGL up to 4.4, DirectX 12, OpenCL 2.1 HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9 HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9 Display 1 x VGA/DDI (DDI available upon request) 1 x LVDS/eDP (eDP available upon request) 2 x DDI (HDMI/DVI/DP++) VGA: resolution up to 1920x1200 @ 60Hz LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz HDMI: resolution up to 4096x2160 @ 24Hz or 2560x1600 @ 60Hz DVI: resolution up to 1920x1200 @ 60Hz DP++/eDP: resolution up to 4096x2304 @ 60Hz Triple Displays VGA + LVDS + DDI or VGA + DDI1 + DDI2 eDP + 2 DDI (available upon request) EXPANSION Interface 1 x PCIe x16 or 2 x PCIe x8 (Gen 3) 8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3) 1 x LPC 1 x I C 1 x SMBus 2 x UART (TX/RX) AUDIO Interface HD Audio ETHERNET Controller 1 x Intel I210IT (10/100/1000Mbps) I/O USB 4 x USB 3.0 8 x USB 2.0 SATA 4 x SATA 3.0 (up to 6Gb/s) RAID 0/1/5/10 DIO 1 x 8-bit DIO WATCHDOG TIMER Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds SECURITY TPM Available Upon Request POWER Type 12V, 5VSB, VCC_RTC (ATX mode) 12V, VCC_RTC (AT mode) OS SUPPORT Windows 8.1 64-bit Windows 7 (/WES7) 32/64-bit Windows 10 IoT Enterprise 64-bit Debian 8 (with VESA graphic driver) CentOS 7 (with VESA graphic driver) Linux ENVIRONMENT Temperature Operating: 0 to 60°C -40 to 85°C Storage: -40 to 85°C Humidity Operating: 5 to 90% RH Storage: 5 to 90% RH MTBF TBD MECHANICAL Dimensions COM Express® Basic 95mm (3.74") x 125mm (4.9") Compliance PICMG COM Express® R2.1, Type 6 CERTIFICATIONS CE, FCC, RoHS, UKCA Model Name P/N Processor Memory VGA/DDI LVDS/eDP GbE USB 3.0 USB 2.0 Power Thermal Temp. Coating SH960MD-CM236T1-E3-1515M 770-SH96M1-000G E3-1515M 16G onboard VGA LVDS 1 4 8 ATX/AT Cooler -40 to 85 o C Upon Request SH960MD-QM170T8-6442EQ 770-SH96M1-100G i5-6442EQ 8G onboard DDI eDP 1 4 8 ATX/AT Cooler -40 to 85 o C Upon Request SH960MD-QM170T1-6820EQ 770-SH96M1-200G i7-6820EQ 16G onboard VGA LVDS 1 4 8 ATX/AT Cooler -40 to 85 o C Upon Request SH960MD-HM170T8-6100E 770-SH96M1-300G i3-6100E 8G onboard VGA LVDS 1 4 8 ATX/AT Cooler -40 to 85 o C Upon Request SH960MD-CM236T8-G3900E 770-SH96M1-400G G3900E 8G onboard VGA LVDS 1 4 8 ATX/AT Cooler -40 to 85 o C Upon Request SH960MD-QM170T1-6822EQ 770-SH96M1-500G i7-6822EQ 16G onboard VGA LVDS 1 4 8 ATX/AT Cooler -40 to 85 o C Upon Request
- 1 SH960MD-CM236/QM170 board
- 1 Cooler (Height: 36.58mm) A71-111101-000G
- COM332-B carrier board kit 770-CM3321-000G
- Heat spreader (Height: 11mm) TBD Note: HALT test, shock/ vibration test and conformal coating are optional for the application in especially harsh environments.