SH7722

SH7722 RENESAS | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 354

Technical content

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1 st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.

1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. 2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part . 4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operat ion of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, an d “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. “Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics , especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. 9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Fur ther, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renes as Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority- owned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

www.renesas.com Renesas 32-Bit RISC Microcomputer SH7780 Series R8A7722 -Preliminary - SH7722 Data Sheet Rev.1.00 2008.10

1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products. 7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above. 8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products. Renesas shall have no liability for damages arising out of such detachment. 12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas. 13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have any other inquiries. Notes regarding these materials

General Precautions on Handling of Product 1. Treatment of NC Pins Note: Do not connect anything to the NC pins. The NC (not connected) pins are either not connected to any of the internal circuitry or are used as test pins or to reduce noise. If something is connected to the NC pins, the operation of the LSI is not guaranteed. 2. Treatment of Unused Input Pins Note: Fix all unused input pins to high or low level. Generally, the input pins of CMOS products are high-impedance input pins. If unused pins are in their open states, intermediate levels are induced by noise in the vicinity, a pass- through current flows internally, and a malfunction may occur. 3. Processing before Initialization Note: When power is first supplied, the product's state is undefined. The states of internal circuits are undefined until full power is supplied throughout the chip and a low level is input on the reset pin. During the period where the states are undefined, the register settings and the output state of each pin are also undefined. Design your system so that it does not malfunction because of processing while it is in this undefined state. For those products which have a reset function, reset the LSI immediately after the power supply has been turned on. 4. Prohibition of Access to Undefined or Reserved Addresses Note: Access to undefined or reserved addresses is prohibited. The undefined or reserved addresses may be used to expand functions, or test registers may have been be allocated to these addresses. Do not access these registers; the system's operation is not guaranteed if they are accessed. 5. Reading from/Writing Reserved Bit of Each Register Note: Treat the reserved bit of re gister used in each module as follows except in cases where the specifications for values which are read from or written to the bit are provided in the description. The bit is always read as 0. The write value should be 0 or one, which has been read immediately before writing. Writing the value, which has been read immediately before writing has the advantage of preventing the bit from being affected on its extended function when the function is assigned.

This LSI is a RISC (Reduced Instruction Set Computer) microcomputer which includes a Renesas Technology-original RISC CPU as its core, and the peripheral functions required to configure a system. This LSI includes the SH4AL-DSP extended functions that have functional upward compatibility with the SH4AL-DSP. Target Users: This manual was written for users who will be using this LSI in the design of application systems. Users of this manual are expected to understand the fundamentals of electrical circuits, logical circuits, and microcomputers. Objective: This manual was written to explain the hardware functions and electrical characteristics of this LSI to the above users. Note: This data sheet contains references to the SH7722 Hardware Manual. The contents of the SH7722 Hardware Manual will be disclosed upon acceptance of a confidentiality agreement. For details, please contact a Renesas Technology sales representative.

ASID Address Space Identifier BSC Bus State Controller CMT Compare Match Timer CPG Clock Pulse Generator CPU Central Processing Unit DMA Direct Memory Access DMAC Direct Memory Access Controller DSP Digital Signal Processor ETU Elementary Time Unit FIFO First-In First-Out FLCTL Flash Memory Controller H-UDI User Debugging Interface IIC Inter IC Bus INTC Interrupt Controller JTAG Joint Test Action Group KEYSC Key Scan Interface LCDC LCD Controller LRU Least Recently Used LSB Least Significant Bit MMC Multi Media Card

MMU Memory Management Unit MSB Most Significant Bit PC Program Counter PFC Pin Function Controller RISC Reduced Instruction Set Computer RWDT RCLK Watchdog Timer SBSC SDRAM Bus State Controller SCIF Serial Communication Interface with FIFO SIO Serial Interface SIOF Serial Interface with FIFO SIU Sound Interface Unit TAP Test Access Port TLB Translation Lookaside Buffer TMU Timer Unit UART Universal Asynchronous Receiver/Transmitter UBC User Break Controller VIO Video I/O VOU Video Output Unit VPU Video Processing Unit All trademarks and registered trademarks are the property of their respective owners.

38.5.12 I

Rev. 1.00 Oct. 9, 2008 Page 1 of 336 REJ03B0272-0100 Section 1 Overview The SH7722 is a system LSI that incorporates an SH4AL-DSP microcontroller with a clock speed of up to 333 MHz as its core, together with a variety of functions required for multimedia applications. These include MPEG4 and H.264 accelerators, a 2D graphics accelerator, LCD controller, camera interface, and sound input/output module. The SH4AL-DSP microcontroller is a 32-bit RISC-type SuperH architecture CPU with a DSP extension function, and is a new generation CPU core which is upward compatible with SH-1, SH2, and SH3-DSP at the instruction set level. Super scalar design in which two instructions are executed simultaneously allows high-speed processing. In addition, the strong power-management functions keep both operating current and standby current low. This LSI is ideal for use in multimedia devices that require both high-performance operation and low power consumption.

1.1 Features

The features of this LSI are listed in table 1.1.

Rev. 1.00 Oct. 9, 2008 Page 2 of 336 REJ03B0272-0100 Table 1.1 Features of This LSI Item Features CPU • Renesas Technology original architecture

• Upward compatible with SH-1, SH-2, SH-3, and SH3-DSP at instruction set level
• 32-bit internal data bus
• General-register files ⎯ Sixteen 32-bit general registers (eight 32-bit shadow registers) ⎯ Seven 32-bit control registers ⎯ Four 32-bit system registers
• RISC-type instruction set (upward compatible with SH-1, SH-2, SH-3, and SH3-DSP) ⎯ Instruction length: 16-bit fixed length for improved code efficiency ⎯ Load/store architecture ⎯ Delayed branch instructions ⎯ Instructions executed with conditions ⎯ Instruction set based on the C language
• Super scalar design which executes two instructions simultaneously
• Instruction execution time: Two instructions per cycle (max.)
• Virtual address space: 4 Gbytes
• Space identifier ASID: 8 bits, 256 virtual address spaces
• On-chip multiplier
• Eight-stage pipeline

Rev. 1.00 Oct. 9, 2008 Page 3 of 336 REJ03B0272-0100 Item Features DSP • Mixture of 16-bit and 32-bit instructions

• 32-/40-bit internal data bus
• Multiplier, ALU, and barrel shifter
• 32-bit multiplier for 16-bit x 16-bit operations
• Large-capacity DSP data register files ⎯ Six 32-bit data registers ⎯ Two 40-bit data registers
• Extended Harvard architecture for DSP data bus ⎯ Two data buses ⎯ One instruction bus
• Maximum of four parallel operations: ALU, multiplication, two load/store operations
• Two addressing units to generate addresses for two memory access
• DSP data addressing modes: ⎯ Increment and indexing (with or without modulo addressing)
• Zero-overhead repeat loop control
• Conditional execution instructions
• User DSP mode and privileged DSP mode Memory management unit (MMU)
• 4-Gbyte address space, 256 address spaces (8-bit ASID)
• Single virtual memory mode and multiple virtual memory mode
• Supports multiple page sizes: 1 Kbyte, 4 Kbytes, 64 Kbytes, or 1 Mbyte
• 4-entry full associative TLB for instructions
• 64-entry full associative TLB for instructions and operands
• Specifies replacement way by software and supports random replacement algorithm
• Address mapping allows direct access to TLB contents Note: This LSI does not support the 32-bit address extended mode or the 32-bit boot function. Cache memory • Instruction cache (IC) ⎯ 32-kbyte, 4-way set associative ⎯ 32-byte block length
• Operand cache (OC) ⎯ 32-kbyte, 4-way set associative ⎯ 32-byte block length ⎯ Selectable write mode (copy-back or write-through)

Rev. 1.00 Oct. 9, 2008 Page 4 of 336 REJ03B0272-0100 Item Features X/Y memory • Three independent read/write ports ⎯ 8-/16-/32-bit access from CPU ⎯ Maximum of two 16-bit accesses from DSP ⎯ 8-/16-/32-/64-bit or 16-/32-byte access by SuperHyway bus master

• Total of 16 kbytes
• Memory protective functions specialized for DSP access in addition to memory protective functions for CPU access U memory • Two independent read/write ports ⎯ 8-/16-/32-bit access from CPU ⎯ 8-/16-/32-/64-bit or 16-/32-byte access by SuperHyway bus master
• Large 128-kbyte memory IL memory (ILRAM)
• Three independent read/write ports ⎯ Instruction fetch access from CPU using virtual address ⎯ Instruction fetch access from CPU using physical address and 8-/16-/32- bit operand access from CPU ⎯ 8-/16-/32-/64-bit or 16-/32-byte access by SuperHyway bus master
• Total of 4 kbytes Interrupt controller (INTC)
• Nine external interrupt pins (NMI, IRQ7 to IRQ0) ⎯ NMI: Fall/rise selectable ⎯ IRQ: Fall/rise/high level/low level selectable
• On-chip peripheral interrupts: Priority can be specified for each module Bus state controller (BSC)
• Supports SRAM, burst ROM, and PCMCIA interfaces.
• Physical address space is provided to support six areas in total: two areas (areas 0 and 4) of up to 64 Mbytes each and four areas (areas 5A, 5B, 6A, and 6B) of up to 32 Mbytes each.
• The following settings can be individually made for each area. ⎯ Memory type: SRAM, NOR-Flash, burst ROM, PCMCIA ⎯ Data bus width: Selectable from 16 bits and 32 bits (16 bits when the selected data bus width for the SBSC is 64 bits.) ⎯ Number of wait cycles

Rev. 1.00 Oct. 9, 2008 Page 5 of 336 REJ03B0272-0100 Item Features Bus state controller for SDRAM (SBSC)

• 3.3 V SDR-SDRAM can be directly connected
• Physical address space is provided to support two areas (areas 2 and 3) of up to 64 Mbytes
• Up to 128 Mbytes of SDRAM can be connected
• Data bus width: Selectable from 16 bits, 32 bits, and 64 bits (only 16 bits or 32 bits can be selected when the selected data bus width for the BSC is 32 bits.)
• Supports auto-refresh and self-refresh
• Auto-precharge mode or bank active mode can be selected Direct memory access controller (DMAC)
• Number of channels: Six channels. One of these channels (channel 0) can receive an external request
• Address space: 4 Gbytes on architecture
• Data transfer length: Bytes, words (2 bytes), longwords (4 bytes), 16 bytes, and 32 bytes
• Maximum transfer count: 16,777,216 transfers
• Address mode: Dual address mode
• Transfer request: Selectable from three types of external request, on-chip peripheral module request, and auto request
• Bus mode: Selectable from cycle steal mode (normal mode and intermittent mode) and burst mode
• Priority: Selectable from fixed channel priority mode and round-robin mode
• Interrupt request: Supports interrupt request to CPU at the end of data transfer
• Repeat function: Automatically resets the transfer source, destination, and count at the end of DMA transfer
• Reload function: Automatically resets the transfer source and destination at the end of the specified number of DMA transfers

Rev. 1.00 Oct. 9, 2008 Page 6 of 336 REJ03B0272-0100 Item Features Clock pulse generator (CPG)

• Clock mode: Input clock selectable from external inputs (EXTAL and RCLK)
• Generates six types of system clocks ⎯ CPU clock (Iφ): Maximum 333.4 MHz (VDD = 1.25 to 1.35 V) ⎯ SH clock (SHφ): Maximum 133.4 MHz ⎯ U memory clock (Uφ): Maximum 133.4 MHz ⎯ SDRAM clock (B3φ): Maximum 133.4 MHz ⎯ Bus clock (Bφ): Maximum 66.7 MHz ⎯ Peripheral clock (Pφ): Maximum 33.4 MHz
• Supports power-down mode ⎯ Module standby function (stops clocks for individual modules.) ⎯ Sleep mode (stops clocks for the CPU core.) ⎯ Software standby mode (stops clocks in the LSI except the I/O area and the RCLK operation area.) ⎯ U-standby mode (turns off the power in the LSI except the I/O area and the RCLK operation area.) Timer unit (TMU) • Internal three-channel 32-bit timer
• Auto-reload type 32-bit down counter
• Internal prescaler for Pφ
• Interrupt request Compare match timer (CMT)
• 32-bit timer of one channel (16 bits/32 bits can be selected)
• Source clock: RCLK
• Compare match function provided
• Interrupt requests R watchdog timer (RWDT)
• One-channel watchdog timer operating at RCLK
• Operational in power-down modes
• Generates a system reset when a counter overflow occurs Realtime clock (RTC)
• Operates at RCLK and includes clock and calendar functions
• Generates alarm interrupt and periodic interrupt Timer pulse unit (TPU)
• Four pulse outputs possible
• Maximum of 4-phase PWM output possible

Rev. 1.00 Oct. 9, 2008 Page 7 of 336 REJ03B0272-0100 Item Features Serial I/O (SIO) • One channel

• Clocked synchronous mode (clock/data/strobe x 2)
• Data length programmable
• Programmable processing of clock polarity and data values in idle state (such as low level or high impedance)
• Eight-bit fixed-length address, programmable data length
• Strobe position programmable, level/edge-ready
• MSB/LSB changeable
• Internal prescaler for Pφ
• Interrupt request Serial I/O with FIFO (SIOF)
• Two channels
• Internal 64-byte transmit/receive FIFOs
• Supports 8-/16-bit data and 16-bit stereo audio input/output
• Sampling rate clock input selectable from Pφ and external pin
• Internal prescaler for Pφ
• Interrupt request and DMAC request
• SPI mode ⎯ Provides continuous full-duplex communication with SPI slave device in fixed master mode ⎯ Serial clock (SCK) rise or fall edge selectable for data sampling timing ⎯ SCK clock phase selectable for transmit timing ⎯ Three slave devices selectable ⎯ Transmit/receive data length fixed to 8 bits Serial communication interface with FIFO (SCIF)
• Three channels
• Internal 16-byte transmit/receive FIFOs
• High-speed UART for Bluetooth
• Internal prescaler for Pφ
• Interrupt request and DMAC request
• Both asynchronous and clock synchronous serial communications possible

Rev. 1.00 Oct. 9, 2008 Page 8 of 336 REJ03B0272-0100 Item Features SIM card interface (SIM)

• One channel. Conforms to the ISO 7816-3 data protocol. (T = 0, T = 1)
• Asynchronous half-duplex character transmission protocol
• Data length: 8 bits
• Parity bit generation and check
• Selectable output clock cycles per etu (elementary time unit)
• Selectable direct convention/inverse convention
• On-chip prescaler
• Switchable clock polarity (high or low) in idle state
• Interrupt request and DMAC request IrDA interface (IrDA)
• Conforms to version 1.2a
• CRC calculation function I C bus interface (IIC)
• Supports single master transmission/reception
• Supports standard mode (100 kHz) and high-speed mode (400 kHz) AND/NAND flash memory controller (FLCTL)
• Directly connected memory interface with AND-/NAND-type flash memory
• Read/write in sectors
• Two types of transfer modes: Command access mode and sector access mode (512-byte data + 16-byte management code: with 4-bit ECC)
• Interrupt request and DMAC transfer request
• Supports up to 4-Gbit of flash memory Video processing unit (VPU)
• MPEG-4 single video object plane (VOP) encoding and decoding
• Applicable standard: MPEG-4 Simple Profile, MPEG-4 H.264 (Baseline)*
• Image size: Sub-QCIF to VGA
• Bit rate: Maximum 8 Mbps
• Motion detection: Layer tracking (Renesas Technology original method)
• Rate control: Control with quantizing amount predicted (Renesas Technology original method), both VOP and MB supported
• Interrupt request and no DMAC request (bus master function supported) Note: Some of Baseline tools are not supported.

Rev. 1.00 Oct. 9, 2008 Page 9 of 336 REJ03B0272-0100 Item Features Video I/O (VIO) A module that provides the interface with camera module and image processing

• CEU block (image capturing from camera module) ⎯ Camera module interface: Data (8 bits: YCbCr 4:2:2), horizontal sync signal (HD), vertical sync signal (VD) ⎯ Size of captured image: 5M pixels, 3M pixels, 2M pixels, UXGA, SXGA, XGA, SVGA, VGA, CIF, QVGA, QCIF, QQVGA, Sub-QCIF, etc. ⎯ Output image format: YCbCr (4:2:2/4:2:0) ⎯ Image format conversion function: Reduced image generating prefilter function YCbCr 4:2:2 → YCbCr 4:2:2, YCbCr 4:2:0 YCbCr format (Y: 8 bits and CbCr: 16 bits)
• VEU block (image processing in memory) A. Video image processing function Input image format: YCbCr image (Y/CbCr plane image), RGB image (RGB pack image) Output image format: YCbCr image (Y/CbCr plane image), RGB image (RGB pack image) Image processing function: Scaling image generating filter function YCbCr → RGB/RGB → YCbCr conversion function Dithering function (in RGB color subtraction) B. Filter processing function Mirroring, vertical inversion, point symmetry, ±90-degree image conversion functions Deblocking filter Median filter C. Video image processing and filter processing combined operation
• BEU block (image blending) A. PinP function Input image format: YCbCr image (Y/CbCr plane image), RGB image (RGB pack image) Output image format: YCbCr image (Y/CbCr plane image), RGB image (RGB pack image) B. Graphic processing function Input graphic format: YCbCr/RGB image Output graphic format: YCbCr/RGB image C. PinP and graphic combined operation Two PinP planes and one graphic plane can be blended simultaneously D. Results of processing are written back to memory
• Strobe control function (manual mode/auto mode)
• Frame drop function (1/2, 1/3, 1/4, 1/5, or 1/6 drop)
• Interrupt request is supported but DMAC request is not supported (with bus master function)

Rev. 1.00 Oct. 9, 2008 Page 10 of 336 REJ03B0272-0100 Item Features JPEG processing unit (JPU)

• Conforming specification: JPEG baseline
• Operating precision: Conforming to JPEG Part 2 and ISO-IEC10918-2
• Color format: YCbCr 4:2:2/YCbCr 4:2:0
• Quantization tables: Four tables
• Huffman tables: Four tables (two AC tables and two DC tables)
• Target markers: Start of image (SOI), start of frame type 0 (SOF0), start of scan (SOS), define quantization tables (DQT), define Huffman tables (DHT), define restart interval (DRI), restart (RSTm), and end of image (EOI)
• Interrupt request and no DMAC request (bus master function supported) LCD controller (LCDC)
• Supported LCD panel: TFT color LCD
• Input data format: 8, 12, 16, 18, or 24 bpp
• LCD driver interface ⎯ Specialized LCD bus, independent of memory bus ⎯ RGB interface or 80-series CPU bus interface selectable ⎯ Bus width: 8, 9, 12, 16, 18, or 24 bits ⎯ One-pixel one-time, two-time, or three-time transfer mode selectable ⎯ Signal polarity and SYNC output timing and width programmable in RGB interface ⎯ Access cycle programmable in 80-series CPU bus interface
• Dot clock: Bus clock, peripheral clock, or external clock selectable as the source clock
• Display data fetch: Continuous mode (according to the refresh rate of the LCD panel) and one-shot mode (according to the frame rate of the movie) are supported. Image data can be fetched only for updated sections.
• Writing back the display data on the sub-LCD panel is supported.
• 256-entry, 24-bit-input/output built-in color palette
• An interrupt can be generated at the frame and the user-specified line
• Interrupt request and no DMAC request (bus master function supported) Video output unit (VOU)
• Output format: 16-bit interface with 8-bit Y and 8-bit C
• Pixel frequency: 13.5 MHz, 27 MHz
• Partial image display: Any background color (specified through the register) + display image
• Supported image size: Sub-QCIF, QVGA, VGA, etc.
• Interrupt request and no DMAC request (bus master function supported)

Rev. 1.00 Oct. 9, 2008 Page 11 of 336 REJ03B0272-0100 Item Features TS interface (TSIF)

• Serial TS data input
• Filters 38 kinds of PIDs in total (The PID values of PAT and CAT packets are fixed. For PCR, video, and audio packets, the PID values are predefined.)
• Interrupt request and DMAC request Sound interface unit (SIUA/SIUB)
• Internal two channels
• 16-bit stereo
• Supports PCM and I2S formats
• IEC60958 (SPDIF) supports stereo consumer mode
• Two sound output systems and two sound input systems
• DSP functions (FIR filter, IIR filter, equalizer, etc.)
• Serial I/O can be directly connected to external A/D or D/A converter.
• Internal prescaler
• Supports slave mode
• Interrupt request and DMA transfer request USB function module (USBF)
• Supports USB 2.0 high-speed mode (480 Mbps) and full-speed mode (12 Mbps)
• Internal USB transceivers
• Eight endpoints are supported in total. The endpoint number is switchable.
• Provides Control (endpoint 0), Bulk-transfer (five endpoints in total), Interrupt (two endpoints in total), and Isochronous (two endpoints in total)
• Supports USB standard commands. The class/vendor commands are processed by firmware.
• FIFO buffers for endpoints (Bulk and Isochronous)
• Module input clock: 48 MHz
• Interrupt request and DMAC request Key scan interface (KEYSC)
• Key scan: Chattering elimination in key input interrupt detection is possible
• Input or output bit numbers can be set to be programmable (5 inputs/6 outputs, 6 inputs/5 outputs, 7 inputs/4 outputs.)
• Canceling software standby and U-standby modes by a key input SD card host interface (SDHI)
• SD memory/SDIO interface supported
• Maximum operating frequency: 25 MHz
• Card detection function
• Interrupt request and DMA transfer request

Rev. 1.00 Oct. 9, 2008 Page 12 of 336 REJ03B0272-0100 Item Features 2D graphics accelerator (2DG)

• BitBLT function
• Supports the quadrangle drawing function and associated drawing modes
• Figure drawing functions ⎯ Drawing rectangles and quadrangles Filling with a single color or gradations between colors Texture mapping (Methods of mapping: Magnification, minification, and repetition) (Filtering: Nearest neighbor interpolation, bilinear interpolation, and average pixel methods) Coordinate transformation Flipping graphics ⎯ Drawing horizontal straight lines Drawing with a single color or gradations between colors Texture mapping (Methods of mapping: Magnification, minification, and repetition) (Filtering: Nearest neighbor interpolation, bilinear interpolation, and average pixel methods)
• Pixel processing functions ⎯ Scissor testing, alpha blending, shadowing, raster operation (ROP), and color conversion ⎯ Color key and writing-mask control
• Interrupt request and no DMAC request (bus master function supported)

Rev. 1.00 Oct. 9, 2008 Page 13 of 336 REJ03B0272-0100 Item Features I/O port • I/O port is switchable for each bit User break controller (UBC)

• Debugging with user break interrupts supported
• Two break channels
• All of address, data value, access type, and data size can be set as break conditions
• Supports sequential break function User debugging interface (H-UDI)
• Supports E10A emulator
• Realtime branch trace
• 417-pin LFBFA package: 13 mm × 13 mm, 0.5 mm-pitch Power-supply voltage
• I/O: 3.0 to 3.6 V
• Internal: 1.15 to 1.35 V Process • 90-nm CMOS, 7 metal layers

Rev. 1.00 Oct. 9, 2008 Page 14 of 336 REJ03B0272-0100

1.2 Block Diagram

Figure 1.1 shows a block diagram of this LSI. DSP UBC CPU AUD HPB H-UDI INTC CPG RWDT DMAC BSC LCDC SBSC CPU: UBC: DSP: AUD: XYRAM: URAM: I-Cache: MMU: O-Cache: DMAC: VIO: VOU: VPU: JPU: LCDC: BSC: SIM: TSIF: SBSC: HPB: TPU: RWDT: INTC: CPG: TMU: CMT: SIO: SIOF: SCIF: I 2C: FLCTL: SIU: USBF: KEYSC: IrDA: SDHI: H-UDI: PFC: 2DG: RTC: MMU 2DG VIO VOU VPU JPU [Legend] SIO IrDA SIOF SCIF I2C FLCTL SIU USBF KEYSC SDHI TSIF SIM RTC TMU CMT TPU I/O port (PFC) External bus External bus External bus XYRAM

16 Kbytes

128 Kbytes

32 Kbytes

4 Kbytes

Internal bus for cache and RAM SuperHyway bus Central processing unit User break controller Digital signal processor Advanced user debugger X/Y memory User memory Instruction cache Memory management unit Operand (data) cache Direct memory access controller Video I/O Video output unit Video processing unit JPEG processing unit LCD controller Bus state controller SIM card interface TS interface SDRAM bus state controller Peripheral bus bridge Timer pulse unit RCLK watchdog timer Interrupt controller Clock pulse generator Timer unit Compare match timer Serial I/O Serial I/O with FIFO Serial communication interface with FIFO I 2C bus controller AND/NAND flash memory controller Sound interface unit USB function module Key scan interface IrDA interface SD card host interface User debugging interface Pin function controller 2D graphics accelerator Realtime clock Figure 1.1 Block Diagram

Rev. 1.00 Oct. 9, 2008 Page 15 of 336 REJ03B0272-0100

1.3 Pin Assignments

1.3.1 BGA-449 Pin Assignments

Figure 1.2 and table 1.2 show the pin assignments of BGA-449. ABCDEFGH JKLMNPRTUVWY A A A B AC AD AE (Top View) Figure 1.2 Pin Assignments (BGA-449)

Rev. 1.00 Oct. 9, 2008 Page 16 of 336 REJ03B0272-0100 Table 1.2 Pin Assignments (BGA449) Pin No. Pin Name Description Treatment of Unused Pin A1 AV33 3.3 V power supply for USB reference power supply circuit Always used A2 V SS Ground Always used A3 XTAL Clock output Open A4 EXTAL External clock input Pulled down A5 PTG3/AUDATA3 Port/AUD data output Open A6 AUDCK AUD clock Open A7 TCK H-UDI test clock input Open A8 PTJ6 Port Open A9 RCLK 32.768 kHz clock input Always used A10 TSTMD Test mode setting Pulled up A11 MD0 Mode setting pin Always used A12 PTS1/SCIF0_RXD Port/SCIF receive data Open A13 PTK4/SIUAOLR/SIOF1_SYNC Port/SIU port A sound output L-R clock/SIOF1 frame signal Open A14 PTK1/SIUAOSLD/SIOF1_TXD Port/SIU port A sound output serial data/SIOF1 output data Open A15 PTK0/SIUMCKA/SIUFCKA/ SIOF1_MCK Port/SIU port A master clock input/SIU port A sampling clock output/SIOF1 master clock input Open A16 PTQ4/SIOF0_SYNC/ TS_SDEN Port/SIOF frame signal/ TS serial data enable Open A17 PTF6/SIUMCKB/SIUFCKB/ SIOMCK Port/SIU port B master clock input/SIU port B sampling clock output/SIO master clock Open A18 PTF2/SIUBILR/SIOD Port/SIU port B sound input L-R clock/SIO Transmit/receive data Open A19 PTD5/SDHID3 Port/SD data bus Pulled up A20 PTD1/SDHICMD Port/SD command Open A21 PTR3/ CS6B/CE1B/LCDCS2 Port/chip select/LCD chip select 2 Open A22 PTH6/LCDVSYN2/DACK0 Port/LCD vertical sync signal/DMA transfer request acknowledge Open

Rev. 1.00 Oct. 9, 2008 Page 17 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin A23 V DD_PLL PLL power supply Always used A24 V SS_PLL PLL ground Always used A25 V SS Ground Always used B1 AV12 1.2 V power supply for USB-PLL Always used B2 V SS Ground Always used B3 PTZ1/KEYIN0/IRQ6 Port/key input/interrupt request Open B4 PTJ0/IRQ0 Port/interrupt request Open B5 PTG4/AUDSYNC Port/AUD sync signal Open B6 PTG0/AUDATA0 Port/AUD data output Open B7 TDI H-UDI test data input Open B8 PDSTATUS/PTJ5 Power-down status output/port Open B9 RESETP Power-on reset Always used B10 MD8 Mode setting pin Pulled up or Pulled down B11 MD1 Mode setting pin Always used B12 PTS2/SCIF0_SCK/TPUTO Port/SCIF serial clock/TPU output Open B13 PTK5/SIUAIBT/ SIOF1_SS1 Port/SIU port A sound input bit clock/SPI slave device select Open B14 PTK3/SIUAOBT/SIOF1_SCK Port/SIU port A sound output bit clock/SIOF1 serial clock Open B15 PTQ6/ SIOF0_SS2/SIM_RST Port/SIOF0 slave device select/SIM reset Open B16 PTQ1/SIOF0_TXD/SIM_CLK/ IrDA_OUT Port/SIOF0 transmit data/SIM clock/IrDA transmit data output Open B17 PTF4/SIUBOLR/SIOSTRB1 Port/SIU port B sound output L-R clock/SIO serial strobe Open B18 PTF1/SIUBISLD/SIORXD Port/SIU port B sound input serial data/SIO input data Open B19 PTD6/SDHIWP Port/SD write protect Pulled up B20 PTD2/SDHID0 Port/SD data bus Pulled up B21 WAIT/PTR2 WAIT/port Pulled up B22 PTH5/LCDVSYN Port/LCD vertical sync signal Open B23 V SS Ground Always used

Rev. 1.00 Oct. 9, 2008 Page 18 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin B24 V SS Ground Always used B25 V SS_DLL DLL ground Always used C1 DM USB DM pin Open C2 V SS Ground Always used C3 PTZ2/KEYIN1 Port/key input Open C4 PTJ1/IRQ1 Port/interrupt request Open C5 MPMD E10 ASE mode set input Open C6 PTG2/AUDATA2 Port/AUD data output Open C7 TRST H-UDI test reset input Always used C8 TST Test pin (fix to V CCQ) Pulled up C9 PTJ7/STATUS0 Port/status output Open C10 RESETA System reset input Pulled up C11 MD2 Mode setting pin Always used C12 PTS4/ SCIF0_CTS/SIUAISPD Port/SCIF CTS input/SPDIF input serial data Open C13 PTS0/SCIF0_TXD Port/SCIF transmit data Open C14 PTK2/SIUAISLD/SIOF1_RXD Port/SIU port A sound input serial data/SIOF1 input data Open C15 PTQ5/ SIOF0_SS1/TS_SPSYN C Port/SPI slave device select/ TS serial data sync signal Open C16 PTQ0/SIOF0_MCK/IRQ3/SIM_ D Port/SIOF0 master clock input/ interrupt request/SIM data Open C17 PTF3/SIUBIBT/SIOSTRB0 Port/SIU port B sound input bit clock/SIO serial strobe Open C18 PTD4/SDHID2/ IRQ2 Port/SD data bus/interrupt request Pulled up C19 PTD0/SDHICLK Port/SD clock Open C20 PTD3/SDHID1 Port/SD data bus Pulled up C21 PTR0/LCDVEPWC/LCDVEPW Port/LCD power supply control/ LCD power supply control Open C22 PTH4/LCDDISP/LCDRS Port/LCD display enable signal/ LCD register select Open C23 PTH2/LCDDON/LCDDON2 Port/LCD display ON-OFF signal/LCD display ON-OFF signal Open

Rev. 1.00 Oct. 9, 2008 Page 19 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin C24 PTX5/LCDD23 Port/LCD data bus Open C25 V DD_DLL DLL power supply Always used D1 DP USB DP pin Open D2 DG12 1.2 V power supply ground for USB driver/receiver Always used D3 DG33 3.3 V power supply ground for USB driver/receiver Always used D4 V SS Ground Always used D5 NMI Nonmaskable interrupt Pulled up D6 ASEBRK/BRKAK E10A emulator brake input/acknowledge Open D7 PTG1/AUDATA1 Port/AUD data output Open D8 TDO H-UDI test data output Open D9 TMS H-UDI test mode select input Open D10 RESETOUT Reset output Open D11 MD5 Mode setting pin Always used D12 PTS3/ SCIF0_RTS/SIUAOSPD Port/SCIF RTS output/SPDIF output serial data Open D13 PTK6/SIUAILR/ SIOF1_SS2 Port/SIU port A sound input L-R clock/SPI slave device select Open D14 PTQ3/SIOF0_SCK/TS_SCK Port/SIOF0 serial clock/ TS serial clock Open D15 PTQ2/SIOF0_RXD/TS_SDAT/ IrDA_IN Port/SIOF0 receive data/TS serial data input/IrDA receive data input Open D16 PTF5/SIUBOBT/SIOSCK Port/SIU port B sound output bit clock/SIO serial clock Open D17 PTF0/SIUBOSLD/SIOTXD Port/SIU port B sound output serial data/SIO output data Open D18 PTD7/ SDHICD Port/SD card detection Pulled up D19 PTR1/LCDDCK/LCDWR Port/LCD dot clock signal/write strobe Open D20 PTR4/ LCDRD Port/read strobe Open D21 PTH7/LCDVCPWC/ LCDVCPWC2 Port/LCD power supply control/ LCD power supply control Open

Rev. 1.00 Oct. 9, 2008 Page 20 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin D22 PTH3/LCDHSYN/ LCDCS Port/LCD horizontal sync signal/ LCD chip select Open D23 PTX4/LCDD22 Port/LCD data bus Open D24 PTX2/LCDD20 Port/LCD data bus Open D25 PTX0/LCDD18/DV_CLK Port/LCD data bus/pixel clock output Open E1 REFRIN External resistor pin for USB constant current circuit Pulled down E2 DG12 1.2 V power supply ground for USB driver/receiver Always used E3 DG33 3.3 V power supply ground for USB driver/receiver Always used E4 DV33 3.3 V power supply for USB driver/receiver (3.3 V) Always used E5 V SS Ground Always used E6 V SS Ground Always used E7 V SS Ground Always used E8 V CCQ I/O power supply (3.3 V) Always used E9 V CCQ I/O power supply (3.3 V) Always used E10 V CCQ I/O power supply (3.3 V) Always used E11 V CCQ I/O power supply (3.3 V) Always used E12 V SS Ground Always used E13 V SS Ground Always used E14 V SS Ground Always used E15 V CCQ I/O power supply (3.3 V) Always used E16 V CCQ I/O power supply (3.3 V) Always used E17 V CCQ I/O power supply (3.3 V) Always used E18 V CCQ I/O power supply (3.3 V) Always used E19 V SS Ground Always used E20 V SS Ground Always used E21 V SS Ground Always used E22 PTX1/LCDD19/DV_CLKI Port/LCD data bus/video clock input Open E23 PTH1/LCDD17/DV_HSYNC Port/LCD data bus/ VOU horizontal sync signal Open

Rev. 1.00 Oct. 9, 2008 Page 21 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin E24 PTH0/LCDD16/DV_VSYNC Port/LCD data bus/ VOU vertical sync signal Open E25 PTL6/LCDD14/DV_D14 Port/LCD data bus/pixel data Open F1 AG33 3.3 V power supply ground for USB reference power supply circuit Always used F2 AG12 1.2 V power supply ground for USB- PLL Always used F3 UG12 1.2 V power supply ground for USB- UTM480 Always used F4 VBUS USB VBUS pin Pulled down F5 DV33 3.3 V power supply for USB driver/receiver (3.3 V) Always used F21 V SS Ground Always used F22 PTL7/LCDD15/DV_D15 Port/LCD data bus/pixel data Open F23 PTL4/LCDD12/DV_D12 Port/LCD data bus/pixel data Open F24 PTL3/LCDD11/DV_D11 Port/LCD data bus/pixel data Open F25 PTL2/LCDD10/DV_D10 Port/LCD data bus/pixel data Open G1 EXTALUSB 48-MHz oscillator connection pin input for USB Pulled down G2 PTZ3/KEYIN2 Port/key input Open G3 V SS Ground Always used G4 DV12 1.2 V power supply for USB driver/receiver (1.2 V) Always used G5 DV12 1.2 V power supply for USB driver/receiver (1.2 V) Always used G21 V SS Ground Always used G22 PTX3/LCDD21 Port/LCD data bus Open G23 PTL1/LCDD9/DV_D9 Port/LCD data bus/pixel data Open G24 PTL0/LCDD8/DV_D8 Port/LCD data bus/pixel data Open G25 PTM6/LCDD6/DV_D6 Port/LCD data bus/pixel data Open H1 XTALUSB 48-MHz oscillator connection pin output for USB Open H2 PTZ5/KEYIN4/IRQ7 Port/key input/interrupt request Open H3 PTZ4/KEYIN3 Port/key input Open

Rev. 1.00 Oct. 9, 2008 Page 22 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin H4 UV12 1.2 V power supply for USB-UTM480 Always used H5 UV12 1.2 V power supply for USB-UTM480 Always used H21 V CCQ I/O power supply (3.3 V) Always used H22 PTM7/LCDD7/DV_D7 Port/LCD data bus/pixel data Open H23 PTM5/LCDD5/DV_D5 Port/LCD data bus/pixel data Open H24 PTM4/LCDD4/DV_D4 Port/LCD data bus/pixel data Open H25 PTM3/LCDD3/DV_D3 Port/LCD data bus/pixel data Open J1 PTY1/KEYOUT1 Port/key output Open J2 PTY5/KEYOUT5/KEYIN5 Port/key output/key input Open J3 PTY3/KEYOUT3 Port/key output Open J4 PTY2/KEYOUT2 Port/key output Open J5 PTY0/KEYOUT0 Port/key output Open J21 V CCQ I/O power supply (3.3 V) Always used J22 PTL5/LCDD13/DV_D13 Port/LCD data bus/pixel data Open J23 PTM1/LCDD1/DV_D1 Port/LCD data bus/pixel data Open J24 PTM2/LCDD2/DV_D2 Port/LCD data bus/pixel data Open J25 PTM0/LCDD0/DV_D0 Port/LCD data bus/pixel data Open K1 PTT3/ FWE Port/AND-NAND flash memory write enable Open K2 PTT2/FSC Port/AND-NAND flash memory chip enable Open K3 PTT1/DREQ0 Port/DMA transfer request Open K4 PTT0/FCDE Port/AND-NAND flash memory/command data enable Open K5 PTY4/KEYOUT4/KEYIN6 Port/key output/key input Open K10 V DD Internal power supply (1.2 V) Always used K11 V DD Internal power supply (1.2 V) Always used K12 V DD Internal power supply (1.2 V) Always used K13 V DD Internal power supply (1.2 V) Always used K14 V DD Internal power supply (1.2 V) Always used K15 V DD Internal power supply (1.2 V) Always used K16 V DD Internal power supply (1.2 V) Always used

Rev. 1.00 Oct. 9, 2008 Page 23 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin K21 V CCQ I/O power supply (3.3 V) Always used K22 HPD63/PTN7 SDRAM upper data bus/port Open K23 HPD48/PTB0 SDRAM upper data bus/port Open K24 HPD62/PTN6 SDRAM upper data bus/port Open K25 HPD61/PTN5 SDRAM upper data bus/port Open L1 PTU3/NAF1/VIO_D9 Port/AND-NAND flash memory data bus/VIO data input Open L2 PTU2/NAF0/VIO_D8 Port/AND-NAND flash memory data bus/VIO data input Open L3 PTU1/FRB/VIO_CLK2 Port/AND-NAND flash memory ready/busy/VIO clock Open L4 PTU0/ FCE/VIO_HD2 Port/AND-NAND flash memory chip enable/VIO horizontal sync Open L5 V CCQ I/O power supply (3.3 V) Always used L10 V DD Internal power supply (1.2 V) Always used L11 V DD Internal power supply (1.2 V) Always used L12 V SS Ground Always used L13 V SS Ground Always used L14 V SS Ground Always used L15 V DD Internal power supply (1.2 V) Always used L16 V DD Internal power supply (1.2 V) Always used L21 V CCQ I/O power supply (3.3 V) Always used L22 HPD49/PTB1 SDRAM upper data bus/port Open L23 HPD50/PTB2 SDRAM upper data bus/port Open L24 HPD60/PTN4 SDRAM upper data bus/port Open L25 HPD59/PTN3 SDRAM upper data bus/port Open M1 PTV1/NAF4/VIO_D12 Port/AND-NAND flash memory data bus/VIO data input Open M2 PTV0/NAF3/VIO_D11 Port/AND-NAND flash memory data bus/VIO data input Open M3 PTU4/NAF2/VIO_D10 Port/AND-NAND flash memory data bus/VIO data input Open

Rev. 1.00 Oct. 9, 2008 Page 24 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin M4 PTT4/FOE/VIO_VD2 Port/AND-NAND flash memory output enable/VIO vertical sync Open M5 V SS Ground Always used M10 V DD Internal power supply (1.2 V) Always used M11 V SS Ground Always used M12 V SS Ground Always used M13 V SS Ground Always used M14 V SS Ground Always used M15 V SS Ground Always used M16 V DD Internal power supply (1.2 V) Always used M21 V SS Ground Always used M22 HPD51/PTB3 SDRAM upper data bus/port Open M23 HPD58/PTN2 SDRAM upper data bus/port Open M24 HPD52/PTB4 SDRAM upper data bus/port Open M25 HPD53/PTB5 SDRAM upper data bus/port Open N1 PTV2/NAF5/VIO_D13 Port/AND-NAND flash memory data bus/VIO data input Open N2 SCL I C serial clock input/output Pulled up N3 PTV3/NAF6/VIO_D14 Port/AND-NAND flash memory data bus/VIO data input Open N4 PTV4/NAF7/VIO_D15 Port/AND-NAND flash memory data bus/VIO data input Open N5 V SS Ground Always used N10 V DD Internal power supply (1.2 V) Always used N11 V SS Ground Always used N12 V SS Ground Always used N13 V SS Ground Always used N14 V SS Ground Always used N15 V SS Ground Always used N16 V DD Internal power supply (1.2 V) Always used N21 V SS Ground Always used N22 HPD56/PTN0 SDRAM upper data bus/port Open

Rev. 1.00 Oct. 9, 2008 Page 25 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin N23 HPD55/PTB7 SDRAM upper data bus/port Open N24 HPD54/PTB6 SDRAM upper data bus/port Open N25 HPD57/PTN1 SDRAM upper data bus/port Open P1 SDA I C serial data input/output Pulled up P2 PTA1/VIO_D1 Port/VIO data input Open P3 PTA2/VIO_D2 Port/VIO data input Open P4 PTA0/VIO_D0/LCDLCLK Port/VIO data input/LCD clock source input Open P5 V SS Ground Always used P10 V DD Internal power supply (1.2 V) Always used P11 V SS Ground Always used P12 V SS Ground Always used P13 V SS Ground Always used P14 V SS Ground Always used P15 V SS Ground Always used P16 V DD Internal power supply (1.2 V) Always used P21 V SS Ground Always used P22 HPD31 SDRAM lower data bus Open P23 HPD30 SDRAM lower data bus Open P24 HPD16 SDRAM lower data bus Open P25 HPCLKR SDRAM interface synchronous clock Open R1 PTA3/VIO_D3 Port/VIO data input Open R2 PTA4/VIO_D4 Port/VIO data input Open R3 PTA5/VIO_D5/SCIF1_TXD Port/VIO data input/SCIF transmit data Open R4 PTW2/VIO_HD/SCIF2_RXD Po rt/VIO horizontal sync/SCIF receive data Open R5 V CCQ I/O power supply (3.3 V) Always used R10 V DD Internal power supply (1.2 V) Always used R11 V DD Internal power supply (1.2 V) Always used R12 V SS Ground Always used R13 V SS Ground Always used

Rev. 1.00 Oct. 9, 2008 Page 26 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin R14 V SS Ground Always used R15 V DD Internal power supply (1.2 V) Always used R16 V DD Internal power supply (1.2 V) Always used R21 V CCQ I/O power supply (3.3 V) Always used R22 HPD19 SDRAM lower data bus Open R23 HPD18 SDRAM lower data bus Open R24 HPD29 SDRAM lower data bus Open R25 HPD17 SDRAM lower data bus Open T1 PTA6/VIO_D6/SCIF1_RXD Port/VIO data input/SCIF receive data Open T2 PTA7/VIO_D7/SCIF1_SCK Port/VIO data input/SCIF serial clock Open T3 PTW0/VIO_CLK/SCIF1_RTS Port/VIO clock input/SCIF RTS output Open T4 RDWR Read/write signal Open T5 V CCQ I/O power supply (3.3 V) Always used T10 V DD Internal power supply (1.2 V) Always used T11 V DD Internal power supply (1.2 V) Always used T12 V DD Internal power supply (1.2 V) Always used T13 V DD Internal power supply (1.2 V) Always used T14 V DD Internal power supply (1.2 V) Always used T15 V DD Internal power supply (1.2 V) Always used T16 V DD Internal power supply (1.2 V) Always used T21 V CCQ I/O power supply (3.3 V) Always used T22 HPD26 SDRAM lower data bus Open T23 HPD20 SDRAM lower data bus Open T24 HPD27 SDRAM lower data bus Open T25 HPD28 SDRAM lower data bus Open U1 PTW1/VIO_VD/ SCIF1_CTS Port/VIO vertical sync/ SCIF CTS input Open U2 PTW3/VIO_STEM/SCIF2_TXD Port/VIO strobe emission signal/ SCIF transmit data Open

Rev. 1.00 Oct. 9, 2008 Page 27 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin U3 PTW4/VIO_STEX/SCIF2_SCK Port/VIO strobe emission signal/ SCIF serial clock Open U4 D3 Data bus Open U5 V CCQ I/O power supply (3.3 V) Always used U21 V CCQ I/O power supply (3.3 V) Always used U22 HPD24 SDRAM lower data bus Open U23 HPD22 SDRAM lower data bus Open U24 HPD25 SDRAM lower data bus Open U25 HPD21 SDRAM lower data bus Open V1 PTW5/VIO_CKO/ SCIF2_RTS Port/VIO clock output/ SCIF RTS output Open V2 PTW6/VIO_FLD/SCIF2_CTS Port/VIO field signal/SCIF CTS input Open V3 CS5B/CE1A Chip select/PCMCIA card select Open V4 CS4 Chip select Open V5 V CCQ I/O power supply (3.3 V) Always used V21 V CCQ I/O power supply (3.3 V) Always used V22 HPDQM0 SDRAM interface lower LL side data mask Open V23 HPDQM1 SDRAM interface lower LU side data mask Open V24 HPDQM3 SDRAM interface lower UU side data mask Open V25 HPD23 SDRAM lower data bus Open W1 PTX6/CS6A/ CE2B Port/chip select/PCMCIA card select Open W2 D15 Data bus Open W3 D7 Data bus Open W4 D14 Data bus Open W5 V SS Ground Always used W21 V SS Ground Always used W22 HPA7 SDRAM interface address bus Open W23 HPA15 SDRAM interface address bus Open W24 HPA16 SDRAM interface address bus Open

Rev. 1.00 Oct. 9, 2008 Page 28 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin W25 HPDQM2 SDRAM interface lower UL side data mask Open Y1 D6 Data bus Open Y2 D13 Data bus Open Y3 D5 Data bus Open Y4 D12 Data bus Open Y5 V SS Ground Always used Y21 V SS Ground Always used Y22 HPA2 SDRAM interface address bus Open Y23 HPA12 SDRAM interface address bus Open Y24 HPA13 SDRAM interface address bus Open Y25 HPA14 SDRAM interface address bus Open AA1 D4 Data bus Open AA2 D11 Data bus Open AA3 D10 Data bus Open AA4 D2 Data bus Open AA5 V SS Ground Always used AA6 V SS Ground Always used AA7 V SS Ground Always used AA8 V CCQ I/O power supply (3.3 V) Always used AA9 V CCQ I/O power supply (3.3 V) Always used AA10 V CCQ I/O power supply (3.3 V) Always used AA11 V CCQ I/O power supply (3.3 V) Always used AA12 V SS Ground Always used AA13 V SS Ground Always used AA14 V SS Ground Always used AA15 V CCQ I/O power supply (3.3 V) Always used AA16 V CCQ I/O power supply (3.3 V) Always used AA17 V CCQ I/O power supply (3.3 V) Always used AA18 V CCQ I/O power supply (3.3 V) Always used AA19 V SS Ground Always used

Rev. 1.00 Oct. 9, 2008 Page 29 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin AA20 V SS Ground Always used AA21 V SS Ground Always used AA22 HPA9 SDRAM interface address Open AA23 HPA8 SDRAM interface address Open AA24 HPA10 SDRAM interface address Open AA25 HPA11 SDRAM interface address Open AB1 D9 Data bus Open AB2 D1 Data bus Open AB3 D8 Data bus Open AB4 WE1/WE D15 to D8 write/PCMCIA memory write Open AB5 A25/PTE7 Address bus/port Open AB6 A15 Address bus Open AB7 A21 Address bus Open AB8 A3 Address bus Open AB9 A11 Address bus Open AB10 A9 Address bus Open AB11 A5 Address bus Open AB12 IOIS16/PTC5 PCMCIA-IF 16 bits/port Pulled up AB13 D31/HPD47 Upper data bus/ SDRAM upper data bus Open AB14 D27/HPD43 Upper data bus/ SDRAM upper data bus Open AB15 D26/HPD42 Upper data bus/ SDRAM upper data bus Open AB16 D24/HPD40 Upper data bus/ SDRAM upper data bus Open AB17 HPD0 SDRAM lower data bus Open AB18 HPD4 SDRAM lower data bus Open AB19 HPD9 SDRAM lower data bus Open AB20 HPD7 SDRAM lower data bus Open AB21 HPDQM7/PTC4 SDRAM interface upper UU side data mask/port Open

Rev. 1.00 Oct. 9, 2008 Page 30 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin AB22 HPA4 SDRAM interface address bus Open AB23 HPA5 SDRAM interface address bus Open AB24 HPA6 SDRAM interface address bus Open AB25 HPCLK SDRAM interface synchronous clock Open AC1 D0 Data bus Open AC2 CS0 Chip select Open AC3 RD Read signal Open AC4 WE3/ICIOWR D31 to D24 write/PCMCIA IO write Open AC5 A23/PTE5 Address bus/port Open AC6 A19 Address bus Open AC7 A18 Address bus Open AC8 A13 Address bus Open AC9 A7 Address bus Open AC10 A4 Address bus Open AC11 A0 Address bus Open AC12 PTC7 Port Open AC13 D30/HPD46 Upper data bus/ SDRAM upper data bus Open AC14 D18/HPD34 Upper data bus/ SDRAM upper data bus Open AC15 D20/HPD36 Upper data bus/ SDRAM upper data bus Open AC16 D22/HPD38 Upper data bus/ SDRAM upper data bus Open AC17 HPD14 SDRAM lower data bus Open AC18 HPD12 SDRAM lower data bus Open AC19 HPD10 SDRAM lower data bus Open AC20 HPD8 SDRAM lower data bus Open AC21 HPDQM6/PTC3 SDRAM interface upper UL side data mask Open AC22 HPRAS SDRAM interface row address Open AC23 HPCS3 SDRAM interface chip select Open

Rev. 1.00 Oct. 9, 2008 Page 31 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin AC24 HPA1 SDRAM interface address bus Open AC25 HPA3 SDRAM interface address bus Open AD1 V SS Ground Always used AD2 V SS Ground Always used AD3 WE0 D7 to D0 write Open AD4 MD3 Data bus width set Always used AD5 A22/PTE4 Address bus/port Open AD6 A17 Address bus Open AD7 A14 Address bus Open AD8 A10 Address bus Open AD9 A6 Address bus Open AD10 A1 Address bus Open AD11 CS5A/CE2A Chip select/PCMCIA card select Open AD12 PTE0/IRQ4/ BS Port/interrupt request/bus start Pulled up AD13 D17/HPD33 Upper data bus/ SDRAM upper data bus Open AD14 D28/HPD44 Upper data bus/ SDRAM upper data bus Open AD15 D21/HPD37 Upper data bus/ SDRAM upper data bus Open AD16 D23/HPD39 Upper data bus/ SDRAM upper data bus Open AD17 HPD1 SDRAM lower data bus Open AD18 HPD2 SDRAM lower data bus Open AD19 HPD11 SDRAM lower data bus Open AD20 HPD6 SDRAM lower data bus Open AD21 HPDQM5/PTC2 SDRAM interface upper LU side data mask/port Open AD22 HPCAS SDRAM interface column address Open AD23 HPCS2 SDRAM interface chip select Open AD24 V SS Ground Always used AD25 V SS Ground Always used

Rev. 1.00 Oct. 9, 2008 Page 32 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin AE1 V SS Ground Always used AE2 V SS Ground Always used AE3 WE2/ICIORD D23 to D16 write/PCMCIA IO read Open AE4 A24/PTE6 Address bus/port Open AE5 A20 Address bus Open AE6 A16 Address bus Open AE7 A12 Address bus Open AE8 A8 Address bus Open AE9 A2 Address bus Open AE10 CKO System clock Open AE11 PTE1/IRQ5 Port/interrupt request Pulled up AE12 D16/HPD32 Upper data bus/ SDRAM upper data bus Open AE13 D29/HPD45 Upper data bus/ SDRAM upper data bus Open AE14 D19/HPD35 Upper data bus/ SDRAM upper data bus Open AE15 D25/HPD41 Upper data bus/ SDRAM upper data bus Open AE16 HPCLKD SDRAM interface synchronous clock Open AE17 HPD15 SDRAM lower data bus Open AE18 HPD13 SDRAM lower data bus Open AE19 HPD3 SDRAM lower data bus Open AE20 HPD5 SDRAM lower data bus Open AE21 HPDQM4/PTC0 SDRAM interface upper LL side data bus/port Open AE22 HPRDWR SDRAM interface read/write Open AE23 HPCKE SDRAM interface clock enable Open AE24 V SS Ground Always used AE25 V SS Ground Always used

Rev. 1.00 Oct. 9, 2008 Page 33 of 336 REJ03B0272-0100

1.3.2 BGA-417 Pin Assignments

Figure 1.3 and table 1.3 show the pin assignments of BGA-417. ABCDEFGH JKLMNPRTUVWY A A A B AC AD (Top View) Figure 1.3 Pin Assignments (BGA-417)

Rev. 1.00 Oct. 9, 2008 Page 34 of 336 REJ03B0272-0100 Table 1.3 Pin Assignments (BGA-417) Pin No. Pin Name Description Treatment of Unused Pin A1 DV33 3.3 V power supply for USB driver/receiver (3.3 V) Always used A2 XTAL Clock output Open A3 EXTAL External clock input Pulled down A4 PTG4/AUDSYNC Port/AUD sync signal Open A5 PTG0/AUDATA0 Port/AUD data output Open A6 TRST H-UDI test reset input Always used A7 TCK H-UDI test clock input Open A8 STATUS0/PTJ7 Port/status output Open A9 RCLK 32.768 kHz clock input Always used A10 TSTMD Test mode setting Pulled up A11 PTS4/SCIF0_CTS/SIUAISPD Port/SCIF CTS input/SPDIF input serial data Open A12 PTS0/SCIF0_TXD Port /SCIF transmission data Open A13 PTK3/SIUAOBT/SIOF1_SCK Port/SIU port A sound output bit clock/SIOF1 serial clock Open A14 PTQ6/SIOF0_SS2/SIM_RST Port/SIOF0 slave device selection/SIM reset Open A15 PTQ2/SIOF0_RXD/TS_SDAT/ IrDA_IN Port/SIOF0 reception data/TS serial data input/IrDA reception data input Open A16 PTF5/SIUBOBT/SIOSCK Port/SIU port B sound output bit clock/SIO input data Open A17 PTF1/SIUBISLD/SIORXD Port/SIU port B sound input serial data/SIO input data Open A18 PTD5/SDHID3 Port/SD data bus Pulled up A19 PTD0/SDHICLK Port/SD clock Open A20 V DD_PLL PLL power supply Always used A21 V SS_PLL PLL ground Always used A22 V DD_DLL DLL power supply Always used

Rev. 1.00 Oct. 9, 2008 Page 35 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin A23 V SS_DLL DLL ground Always used A24 V SS Ground Always used B1 DM USB DM pin Open B2 PTZ1/KEYIN0/IRQ6 Port/key input/interrupt request Open B3 NMI Nonmaskable interrupt Pulled up B4 PTG2/AUDATA2 Port/AUD data output Open B5 AUDCK AUD clock Open B6 TDI H-UDI test data input Open B7 PDSTATUS/PTJ5 Power-down status output/port Open B8 RESETP Power-on reset Always used B9 MD8 Mode setting pin Always used B10 MD1 Mode setting pin Always used B11 PTS2/SCIF0_SCK/TPUTO Port/SCIF serial clock/TPU output Open B12 PTK5/SIUAIBT/SIOF1_SS1 Port/SIU port A sound input bit clock/SIOF1 slave device selection Open B13 PTK1/SIUAOSLD/SIOF1_TXD Port/SIU port A sound output serial data/SIOF1 output data Open B14 PTQ4/SIOF0_SYNC/TS_SDEN Port/SIOF frame signal/IrDA port/TS serial data enable Open B15 PTQ0/SIOF0_MCK/IRQ3/ SIM_D Port/SIOF0 master clock input/ interrupt request/SIM data Open B16 PTF3/SIUBIBT/SIOSTRB0 Port/SIU port B sound input bit clock/SIO serial strobe Open B17 PTD4/SDHID2/IRQ2 Port/SD data bus/interrupt request Pulled up B18 PTD6/SDHIWP Port/SD write protect Pulled up B19 PTD2/SDHID0 Port/SD data bus Pulled up B20 PTR4/LCDRD Port/read strobe Open B21 WAIT/PTR2 WAIT/port Pulled up B22 PTH3/LCDHSYN/ LCDCS Port/LCD horizontal sync signal/LCD chip selection Open B23 PTX5/LCDD23 Port/LCD data bus Open

Rev. 1.00 Oct. 9, 2008 Page 36 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin B24 PTX4/LCDD22 Port/LCD data bus Open C1 DP USB DP pin Open C2 DG33 3.3 V power supply ground for USB driver-receiver Always used C3 PTZ2/KEYIN1 Port/key input Open C4 MPMD E10 ASE mode setting input Pulled up C5 PTG3/AUDATA3 Port/AUD data output Open C6 TDO H-UDI test data output Open C7 TST Test pin (fixed at V CCQ level) Pulled up C8 RESETOUT Reset output Open C9 MD5 Mode setting pin Always used C10 MD0 Mode setting pin Always used C11 PTS1/SCIF0_RXD Port/SCIF reception data Open C12 PTK4/SIUAOLR/SIOF1_SYNC Port/SIU port B sound output L-R clock/SIOF1 frame signal Open C13 PTK0/SIUMCKA/SIUFCKA/ SIOF1_MCK Port/SIU port A master clock input/SIU port A sampling clock output/SIOF1 master clock input Open C14 PTQ3/SIOF0_SCK/TS_SCK Port/SIO F0 serial clock/IrDA clock/TS serial clock Open C15 PTF6/SIUMCKB/SIUFCKB/ SIOMCK Port/SIU port B master clock input/SIU port B sampling clock output/SIO serial clock Open C16 PTF2/SIUBILR/SIOD Port/SIU port B sound input L-R clock/SIO transmission and reception data Open C17 PTD7/SDHICD Port/SD card detection Pulled up C18 PTD3/SDHID1 Port/SD data bus Pulled up C19 PTR0/LCDVEPWC/ LCDVEPWC2 Port/LCD power supply control/LCD power supply control Open C20 PTH7/LCDVCPWC/ LCDVCPWC2 Port/LCD power supply control/LCD power supply control Open C21 PTH6/LCDVSYN2/DACK0 Port/LCD vertical sync signal/ DMA transfer request acknowledge Open

Rev. 1.00 Oct. 9, 2008 Page 37 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin C22 PTH2/LCDDON/LCDDON2 Port/LCD display ON-OFF signal/LCD display ON-OFF signal Open C23 PTX2/LCDD20 Port/LCD data bus Open C24 PTX0/LCDD18/DV_CLK Port/LCD data bus/clock output Open D1 DV12 1.2 V power supply for USB driver/receiver (1.2 V) Always used D2 DG12 1.2 V power supply ground for USB driver/receiver Always used D3 PTJ1/IRQ1 Port/Interrupt request Open D4 ASEBRK/BRKAK E10A emulator brake input/acknowledge Open D5 PTG1/AUDATA1 Port/AUD data output Open D6 TMS H-UDI test mode selection input Open D7 PTJ6 Port Open D8 RESETA Reset input Pulled up D9 MD2 Mode setting pin Always used D10 PTS3/ SCIF0_RTS/SIUAOSPD Port/SCIF RTS output/SPDIF output serial data Open D11 PTK6/SIUAILR/SIOF1_SS2 Port/SIU port A sound input L-R clock/SIOF slave device selection Open D12 PTK2/SIUAISLD/SIOF1_RXD Port/SIU port A sound input serial data/SIOF1 input data Open D13 PTQ5/SIOF0_SS1/ TS_SPSYNC Port/SIOF0 slave device selection/TS serial data sync signal Open D14 PTQ1/SIOF0_TXD/SIM_CLK/ IrDA_OUT Port/SIOF0 transmission data/SIM clock/IrDA transmission data output Open D15 PTF4/SIUBOLR/SIOSTRB1 Port/SIU port B sound output L-R clock/SIO serial strobe Open D16 PTF0/SIUBOSLD/SIOTXD Port/SIU port B sound output serial data/SIO output data Open D17 PTD1/SDHICMD Port/SD command Open D18 PTR3/ CS6B/CE1B/LCDCS2 Port/Port/chip selection/LCD chip selection 2 Open

Rev. 1.00 Oct. 9, 2008 Page 38 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin D19 PTR1/LCDDCK/LCDWR Port/LCD dot clock signal/write strobe Open D20 PTH5/LCDVSYN Port/LCD vertical sync signal Open D21 PTH4/LCDDISP/LCDRS Port/LCD display enable signal/LCD register selection Open D22 PTX1/LCDD19/DV_CLKI Port/LCD data bus/video clock input Open D23 PTH0/LCDD16/DV_VSYNC Port/LCD data bus/VOU vertical sync signal Open D24 PTL7/LCDD15/DV_D15 Port/LCD data bus/pixel data Open E1 UV12 1.2 V power supply for USB-UTM480 Always used E2 UG12 1.2 V power supply ground for USB- UTM480 Always used E3 VBUS USB VBUS pin Pulled down E4 PTJ0/IRQ0 Port/interrupt request Open E21 PTX3/LCDD21 Port/LCD data bus Open E22 PTH1/LCDD17/DV_HSYNC Port/LCD data bus/VOU horizontal sync signal Open E23 PTL4/LCDD12/DV_D12 Port/LCD data bus/pixel data Open E24 PTL5/LCDD13/DV_D13 Port/LCD data bus/pixel data Open F1 AG33 3.3 V power supply ground for USB standard current circuit Always used F2 REFRIN External resistor pin for USB constant current circuit Pulled down F3 PTZ4/KEYIN3 Port/key input Open F4 PTZ3/KEYIN2 Port/key input Open F6 V SS Ground Always used F7 V CCQ I/O power supply (3.3 V) Always used F8 V SS Ground Always used F9 V CCQ I/O power supply (3.3 V) Always used F10 V CCQ I/O power supply (3.3 V) Always used F11 V SS Ground Always used F12 V CCQ I/O power supply (3.3 V) Always used

Rev. 1.00 Oct. 9, 2008 Page 39 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin F13 V CCQ I/O power supply (3.3 V) Always used F14 V SS Ground Always used F15 V CCQ I/O power supply (3.3 V) Always used F16 V CCQ I/O power supply (3.3 V) Always used F17 V SS Ground Always used F18 V CCQ I/O power supply (3.3 V) Always used F19 V SS Ground Always used F21 PTL6/LCDD14/DV_D14 Port/LCD data bus/pixel data Open F22 PTL3/LCDD11/DV_D11 Port/LCD data bus/pixel data Open F23 PTL2/LCDD10/DV_D10 Port/LCD data bus/pixel data Open F24 PTL0/LCDD8/DV_D8 Port/LCD data bus/pixel data Open G1 EXTALUSB 48 MHz-oscillator connection pin input for USB Pulled down G2 PTY1/KEYOUT1 Port/key output Open G3 PTZ5/KEYIN4/IRQ7 Port/key input Open G4 PTY0/KEYOUT0 Port/key output Open G6 AG12 1.2 V power supply ground for USB- PLL Always used G7 V SS Ground Always used G8 V DD Internal power supply (1.2 V) Always used G9 V SS Ground Always used G10 V SS Ground Always used G11 V DD Internal power supply (1.2 V) Always used G12 V SS Ground Always used G13 V SS Ground Always used G14 V DD Internal power supply (1.2 V) Always used G15 V SS Ground Always used G16 V SS Ground Always used G17 V DD Internal power supply (1.2 V) Always used G18 V SS Ground Always used

Rev. 1.00 Oct. 9, 2008 Page 40 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin G19 V CCQ I/O power supply (3.3 V) Always used G21 PTL1/LCDD9/DV_D9 Port/LCD data bus/pixel data Open G22 PTM7/LCDD7/DV_D7 Port/LCD data bus/pixel data Open G23 PTM6/LCDD6/DV_D6 Port/LCD data bus/pixel data Open G24 PTM4/LCDD4/DV_D4 Port/LCD data bus/pixel data Open H1 XTALUSB 48 MHz-oscillator connection pin output for USB Open H2 PTY3/KEYOUT3 Port/key output Open H3 PTY2/KEYOUT2 Port/key output Open H4 PTY4/KEYOUT4/KEYIN6 Port/key output and input Open H6 V SS Ground Always used H7 V SS Ground Always used H8 V SS Ground Always used H18 V DD Internal power supply (1.2 V) Always used H19 V SS Ground Always used H21 PTM5/LCDD5/DV_D5 Port/LCD data bus/pixel data Open H22 PTM3/LCDD3/DV_D3 Port/LCD data bus/pixel data Open H23 PTM2/LCDD2/DV_D2 Port/LCD data bus/pixel data Open H24 PTM0/LCDD0/DV_D0 Port/LCD data bus/pixel data Open J1 PTY5/KEYOUT5/KEYIN5 Port/key output-input Open J2 PTT1/DREQ0 Port/DMA transmission request Open J3 PTT0/FCDE Port/command data enable Open J4 PTT2/FSC Port/AND-NAND flash memory chip enable Open J6 V CCQ I/O power supply (3.3V) Always used J7 AV33 3.3 V power supply for USB standard current circuit Always used J18 V SS Ground Always used J19 V CCQ I/O power supply (3.3 V) Always used J21 PTM1/LCDD1/DV_D1 Port/LCD data bus/pixel data Open J22 HPD63/PTN7 SDRAM upper data bus/port Open

Rev. 1.00 Oct. 9, 2008 Page 41 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin J23 HPD48/PTB0 SDRAM upper data bus/port Open J24 HPD62/PTN6 SDRAM upper data bus/port Open K1 PTT3/FWE Port/AND-NAND flash memory write enable Open K2 PTU0/FCE/VIO_HD2 Port/AND-NAND flash memory chip enable/VIO horizontal sync Open K3 PTT4/FOE/VIO_VD2 Port/AND-NAND flash memory output enable/VIO vertical sync Open K4 PTU1/FRB/VIO_CLK2 Port/AND-NAND flash memory ready- busy/VIO clock Open K6 V CCQ I/O power supply (3.3 V) Always used K7 AV12 1.2 V power supply for USB-PLL Always used K18 V SS Ground Always used K19 V CCQ I/O power supply (3.3 V) Always used K21 HPD61/PTN5 SDRAM upper data bus/port Open K22 HPD60/PTN4 SDRAM upper data bus/port Open K23 HPD49/PTB1 SDRAM upper data bus/port Open K24 HPD50/PTB2 SDRAM upper data bus/port Open L1 PTU2/NAF0/VIO_D8 Port/AND-NAND flash memory data bus/VIO data input Open L2 PTU4/NAF2/VIO_D10 Port/AND-NAND flash memory data bus/VIO data input Open L3 PTU3/NAF1/VIO_D9 Port/AND-NAND flash memory data bus/VIO data input Open L4 PTV0/NAF3/VIO_D11 Port/AND-NAND flash memory data bus/VIO data input Open L6 V SS Ground Always used L7 V DD Internal power supply (1.2 V) Always used L18 V DD Internal power supply (1.2 V) Always used L19 V SS Ground Always used L21 HPD59/PTN3 SDRAM upper data bus/port Open L22 HPD58/PTN2 SDRAM upper data bus/port Open

Rev. 1.00 Oct. 9, 2008 Page 42 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin L23 HPD51/PTB3 SDRAM upper data bus/port Open L24 HPD52/PTB4 SDRAM upper data bus/port Open M1 PTV1/NAF4/VIO_D12 Port/AND-NAND flash memory data bus/VIO data input Open M2 PTV3/NAF6/VIO_D14 Port/AND-NAND flash memory data bus/VIO data input Open M3 PTV2/NAF5/VIO_D13 Port/AND-NAND flash memory data bus/VIO data input Open M4 PTV4/NAF7/VIO_D15 Port/AND-NAND flash memory data bus/VIO data input Open M6 V CCQ I/O power supply (3.3 V) Always used M7 V SS Ground Always used M18 V SS Ground Always used M19 V CCQ I/O power supply (3.3 V) Always used M21 HPD57/PTN1 SDRAM upper data bus/port Open M22 HPD56/PTN0 SDRAM upper data bus/port Open M23 HPD53/PTB5 SDRAM upper data bus/port Open M24 HPD54/PTB6 SDRAM upper data bus/port Open N1 SCL I C serial clock I/O Pulled up N2 SDA I C serial data I/O Pulled up N3 PTA0/VIO_D0/LCDLCLK Port/VIO data input/LCD clock source input Open N4 PTA2/VIO_D2 Port/VIO data input Open N6 V CCQ I/O power supply (3.3 V) Always used N7 V SS Ground Always used N18 V SS Ground Always used N19 V CCQ I/O power supply (3.3 V) Always used N21 HPD17 SDRAM lower data bus Open N22 HPD16 SDRAM lower data bus Open N23 HPD55/PTB7 SDRAM lower data bus/port Open N24 HPCLKR SDRAM interface sync clock Open

Rev. 1.00 Oct. 9, 2008 Page 43 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin P1 PTA1/VIO_D1 Port/VIO data input Open P2 PTA3/VIO_D3 Port/VIO data input Open P3 PTA4/VIO_D4 Port/VIO data input Open P4 PTA6/VIO_D6/SCIF1_RXD Port/VIO data input/SCIF reception data Open P6 V SS Ground Always used P7 V DD Internal power supply (1.2 V) Always used P18 V DD Internal power supply (1.2 V) Always used P19 V SS Ground Always used P21 HPD18 SDRAM lower data bus Open P22 HPD19 SDRAM lower data bus Open P23 HPD31 SDRAM lower data bus Open P24 HPD30 SDRAM lower data bus Open R1 PTA5/VIO_D5/SCIF1_TXD Port/VIO data input/SCIF transmission data Open R2 PTA7/VIO_D7/SCIF1_SCK Port/VIO data input/SCIF serial clock Open R3 PTW0/VIO_CLK/SCIF1_RTS Port/VIO clock input/SCIF RTS output Open R4 PTW2/VIO_HD/SCIF2_RXD Po rt/VIO horizontal sync/SCIF reception data Open R6 V CCQ I/O power supply (3.3 V) Always used R7 V SS Ground Always used R18 V SS Ground Always used R19 V CCQ I/O power supply (3.3 V) Always used R21 HPD21 SDRAM lower data bus Open R22 HPD20 SDRAM lower data bus Open R23 HPD29 SDRAM lower data bus Open R24 HPD28 SDRAM lower data bus Open T1 PTW1/VIO_VD/ SCIF1_CTS Port/VIO vertical sync/SCIF CTS input Open T2 PTW3/VIO_STEM/SCIF2_TXD Port/VIO strobe emission signal/SCIF transmission data Open

Rev. 1.00 Oct. 9, 2008 Page 44 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin T3 PTW4/VIO_STEX/SCIF2_SCK Port/VIO strobe dimmer signal/SCIF serial clock Open T4 PTW6/VIO_FLD/ SCIF2_CTS Port/VIO field signal/SCIF CTS input Open T6 V CCQ I/O power supply (3.3 V) Always used T7 V SS Ground Always used T18 V SS Ground Always used T19 V CCQ I/O power supply (3.3 V) Always used T21 HPD23 SDRAM lower data bus Open T22 HPD22 SDRAM lower data bus Open T23 HPD27 SDRAM lower data bus Open T24 HPD26 SDRAM lower data bus Open U1 PTW5/VIO_CKO/ SCIF2_RTS Port/VIO clock output/SCIF RTS output Open U2 CS5B/CE1A Chip selection/chip selection Open U3 CS4 Chip selection Open U4 RDWR Read/write signal Open U6 V SS Ground Always used U7 V DD Internal power supply (1.2 V) Always used U18 V DD Internal power supply (1.2 V) Always used U19 V SS Ground Always used U21 HPDQM0 SDRAM-I/F lower LL side data mask Open U22 HPDQM2 SDRAM-I/F lower UL side data mask Open U23 HPD25 SDRAM lower data bus Open U24 HPD24 SDRAM lower data bus Open V1 PTX6/CS6A /CE2B Port/chip selection/PCMCIA card selection Open V2 D15 Data bus Open V3 D7 Data bus Open V4 D5 Data bus Open V6 V CCQ I/O power supply (3.3 V) Open V7 V SS Ground Always used

Rev. 1.00 Oct. 9, 2008 Page 45 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin V8 V DD Internal power supply (1.2 V) Always used V9 V SS Ground Always used V10 V SS Ground Always used V11 V DD Internal power supply (1.2 V) Always used V12 V SS Ground Always used V13 V SS Ground Always used V14 V DD Internal power supply (1.2 V) Always used V15 V SS Ground Always used V16 V SS Ground Always used V17 V DD Internal power supply (1.2 V) Always used V18 V SS Ground Always used V19 V CCQ I/O power supply (3.3 V) Always used V21 HPA13 SDRAM interface address bus Open V22 HPA15 SDRAM interface address bus Open V23 HPDQM3 SDRAM-I/F lower LL side data mask Open V24 HPDQM1 SDRAM-I/F lower UL side data mask Open W1 D14 Data bus Open W2 D6 Data bus Open W3 D12 Data bus Open W4 D3 Data bus Open W6 V SS Ground Open W7 V CCQ I/O power supply (3.3 V) Always used W8 V SS Ground Always used W9 V CCQ I/O power supply (3.3 V) Always used W10 V CCQ I/O power supply (3.3 V) Always used W11 V SS Ground Always used W12 V CCQ I/O power supply (3.3 V) Always used W13 V CCQ I/O power supply (3.3 V) Always used W14 V SS Ground Always used W15 V CCQ I/O power supply (3.3 V) Always used

Rev. 1.00 Oct. 9, 2008 Page 46 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin W16 V CCQ I/O power supply (3.3 V) Always used W17 V SS Ground Always used W18 V CCQ I/O power supply (3.3 V) Always used W19 V SS Ground Always used W21 HPA7 SDRAM interface address bus Open W22 HPA11 SDRAM interface address bus Open W23 HPA16 SDRAM interface address bus Open W24 HPA14 SDRAM interface address bus Open Y1 D13 Data bus Open Y2 D4 Data bus Open Y3 D2 Data bus Open Y4 D8 Data bus Open Y21 HPA5 SDRAM interface address bus Open Y22 HPA6 SDRAM interface address bus Open Y23 HPA12 SDRAM interface address bus Open Y24 HPA10 SDRAM interface address bus Open AA1 D11 Data bus Open AA2 D10 Data bus Open AA3 D9 Data bus Open AA4 WE0 Write in D7 to D0 Open AA5 A23/PTE5 Address bus/port Open AA6 A21 Address bus Open AA7 A15 Address bus Open AA8 A11 Address bus Open AA9 A7 Address bus Open AA10 A3 Address bus Open AA11 IOIS16/PTC5 16-bit PCMCIA interface/port Pulled up AA12 D31/HPD47 Upper data bus/SDRAM upper data bus Open AA13 D28/HPD44 Upper data bus/SDRAM upper data bus Open

Rev. 1.00 Oct. 9, 2008 Page 47 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin AA14 D26/HPD42 Upper data bus/SDRAM upper data bus Open AA15 D25/HPD41 Upper data bus/SDRAM upper data bus Open AA16 HPD0 SDRAM lower data bus Open AA17 HPD13 SDRAM lower data bus Open AA18 HPD4 SDRAM lower data bus Open AA19 HPD6 SDRAM lower data bus Open AA20 HPDQM4/PTC0 SDRAM interface upper LL side data mask Open AA21 HPCS3 SDRAM interface chip selection Open AA22 HPA2 SDRAM interface address bus Open AA23 HPA9 SDRAM interface address bus Open AA24 HPA8 SDRAM interface address bus Open AB1 D1 Data bus Open AB2 CS0 Chip selection Open AB3 WE1/WE Writ in D15 to D8/PCMCIA memory write Open AB4 WE3/ICIOWR Write in D31 to D24/PCMCIA IO write Open AB5 A25/PTE7 Address bus/port Open AB6 A17 Address bus Open AB7 A13 Address bus Open AB8 A9 Address bus Open AB9 A5 Address bus Open AB10 A1 Address bus Open AB11 PTE1/IRQ5 Port/interrupt request Pulled up AB12 D30/HPD46 Upper data bus/SDRAM upper data bus Open AB13 D29/HPD45 Upper data bus/SDRAM upper data bus Open AB14 D27/HPD43 Upper data bus/SDRAM upper data bus Open

Rev. 1.00 Oct. 9, 2008 Page 48 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin AB15 D24/HPD40 Upper data bus/SDRAM upper data bus Open AB16 HPD1 SDRAM lower data bus Open AB17 HPD3 SDRAM lower data bus Open AB18 HPD10 SDRAM lower data bus Open AB19 HPD7 SDRAM lower data bus Open AB20 HPDQM7/PTC4 SDRAM interface upper UU side data mask Open AB21 HPCAS SDRAM interface column address Open AB22 HPCS2 SDRAM interface chip selection Open AB23 HPA3 SDRAM interface address bus Open AB24 HPA4 SDRAM interface address bus Open AC1 D0 Data bus Open AC2 WE2/ICIORD Write in D23 to D16/PCMCIA IO read Open AC3 A24/PTE6 Address bus/port Open AC4 A20 Address bus Open AC5 A18 Address bus Open AC6 A14 Address bus Open AC7 A10 Address bus Open AC8 A6 Address bus Open AC9 A2 Address bus Open AC10 A0 Address bus Open AC11 PTC7 Port Open AC12 D16/HPD32 Upper data bus/SDRAM upper data bus Open AC13 D18/HPD34 Upper data bus/SDRAM upper data bus Open AC14 D20/HPD36 Upper data bus/SDRAM upper data bus Open AC15 D22/HPD38 Upper data bus/SDRAM upper data bus Open AC16 HPD15 SDRAM lower data bus Open

Rev. 1.00 Oct. 9, 2008 Page 49 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin AC17 HPD14 SDRAM lower data bus Open AC18 HPD12 SDRAM lower data bus Open AC19 HPD5 SDRAM lower data bus Open AC20 HPD8 SDRAM lower data bus Open AC21 HPDQM6/PTC3 SDRAM interface upper UL side data mask Open AC22 HPRAS SDRAM interface low address Open AC23 HPA1 SDRAM interface address bus Open AC24 HPCLK SDRAM interface sync clock Open AD1 V SS Ground Always used AD2 RD Read signal Open AD3 MD3 Mode setting pin Open AD4 A22/PTE4 Address bus/port Always used AD5 A19 Address bus Open AD6 A16 Address bus Open AD7 A12 Address bus Open AD8 A8 Address bus Open AD9 A4 Address bus Open AD10 CKO System clock Open AD11 CS5A/CE2A Chip selection/chip selection Open AD12 PTE0/IRQ4/ BS Port/interrupt request/bus start Pulled up AD13 D17/HPD33 Upper data bus/SDRAM upper data bus Open AD14 D19/HPD35 Upper data bus/SDRAM upper data bus Open AD15 D21/HPD37 Upper data bus/SDRAM upper data bus Open AD16 D23/HPD39 Upper data bus/SDRAM upper data bus Open AD17 HPCLKD SDRAM interface sync clock Open AD18 HPD2 SDRAM lower data bus Open AD19 HPD11 SDRAM lower data bus Open

Rev. 1.00 Oct. 9, 2008 Page 50 of 336 REJ03B0272-0100 Pin No. Pin Name Description Treatment of Unused Pin AD20 HPD9 SDRAM lower data bus Open AD21 HPDQM5/PTC2 SDRAM interface upper LU side data mask Open AD22 HPRDWR SDRAM interface read-write Open AD23 HPCKE SDRAM interface clock enable Open AD24 V SS Ground Always used

Rev. 1.00 Oct. 9, 2008 Page 51 of 336 REJ03B0272-0100

1.4 Pin Functions

Table 1.4 lists the pin functions. Table 1.4 Pin Functions Classification Symbol I/O Name Function VDD Input Power supply Internal LSI power supply. Connect all VDD pins to system power supply. If there is any open pin, the system will not work. VSS Input Ground Ground pin. Connect all V SS pins to system power supply (0 V). If there is any open pin, the system will not work. VCCQ Input Power supply Power supply for I/O pins. Connect all VCC pins to system power supply. If there is any open pin, the system will not work. Power supply DV33, DV12, AV33, AV12, UV12 Input Power supply for USB DV33: 3.3 V-digital power supply for USB DV12: 1.2 V-digital power supply for USB AV33: 3.3 V-analog power supply for USB AV12: 1.2 V-analog power supply for USB UV12: 1.2 V-digital power supply for USB

Rev. 1.00 Oct. 9, 2008 Page 52 of 336 REJ03B0272-0100 Classification Symbol I/O Name Function VDD_PLL Input PLL power supply Power supply pin for on-chip PLL oscillator VSS_PLL Input PLL ground Ground pin for on-chip PLL oscillator VDD_DLL Input DLL power supply Power supply pin for on-chip DLL oscillator VSS_DLL Input DLL ground Ground pin for on-chip DLL oscillator EXTAL Input External clock Inputs external clock. When this pin is not used, this pin should be connected to VSS. XTAL Output Clock output This pin should be open. RCLK Input RTC clock Connects the 32.768-kHz RTC clock. This clock must always be input while this LSI is operating. SIUMCKA SIUMCKB Input SIU external clock Supplies external clock to the SIU module. EXTALUSB Input Clock XTALUSB Output USB clock 48-MHz clock pin for USB Crystal resonator should be connected between EXTALUSB and XTALUSB. When using an external clock input, an external clock signal should be connected to EXTALSUB: and XTALUSB should be open.

Rev. 1.00 Oct. 9, 2008 Page 53 of 336 REJ03B0272-0100 Classification Symbol I/O Name Function Operating mode control MD8, MD5, TSTMD, MD3, MD2, MD1, MD0 Input Mode setting Sets operating mode. Do not change any of these pins during operation. MD2 to MD0 are for setting clock mode; MD3 for selecting bus width; MD5 for setting endian; MD8 for setting test mode. TSTMD is a test pin used during the shipping inspection of the LSIs, and should be fixed to VccQ. RESETP Input Power-on reset System enters the power-on reset state when this pin goes low. RESETOUT Output Reset output This pin goes low while this LSI is in the reset state. RESETA Input Reset input System enters the reset state when this pin goes low with power being supplied. STATUS0 Output Status output This pin goes high while this LSI is in the U-standby mode. PDSTATUS Output Power-down status output This pin goes high while this LSI at U-standby mode. System control TST Input Test pin Test pin used during shipping inspection of the LSIs Should be fixed to VccQ. NMI Input Nonmaskable interrupt Nonmaskable interrupt request pin. Fix the pin high when not in use. Interrupt IRQ7 to IRQ0 Input Interrupt request 7 to 0 Maskable interrupt request pins. Either level input or edge input is selectable. For level input, high level and low level are selectable. For edge input, rising edge and falling edge are selectable.

Rev. 1.00 Oct. 9, 2008 Page 54 of 336 REJ03B0272-0100 Classification Symbol I/O Name Function A25 to A0 Output Address bus Outputs an address. D31 to D0 I/O Data bus 16-/32-bit bidirectional bus CS0, CS4, CS5A, CS5B, CS6A, CS6B Output Chip select Chip select signal for external memory or device CKO Output System clock Supplies system clock to an external device. RD Output Read strobe Indicates that data is read from an external device. RDWR Output Read/write Read/write signal pin WE3 to WE0 Output Write enable 3 to Indicates that data is written to an external memory or device. WAIT Input Wait Input for inserting a wait cycle into bus cycle during access to the external space BS Output Bus start Signal to indicate the start of bus cycles. Asserted when normal space, burst ROM (clock asynchronous), or PCMCIA is accessed CE1A, CE2A, CE1B, CE2B Output PCICIA card select PCMCIA card select signal ICIOWR Output PCMCIA IO write Strobe signal to indicate the I/O write ICIORD Output PCMCIA IO read Strobe signal to indicate the I/O read WE Output PCMCIA memory write Strobe signal to indicate memory write cycles. BSC (asynchronous bus) IOIS16 Input PCMCIA 16-bit I/O Signal to indicate the 16-bit I/O of PCMCIA Enabled only in little endian mode. In big endian mode, drive this pin low.

Rev. 1.00 Oct. 9, 2008 Page 55 of 336 REJ03B0272-0100 Classification Symbol I/O Name Function HPA16 to HPA1 Output Address bus Outputs an address. HPD63 to HPD0 I/O Data bus 16-/32-/64-bit bidirectional bus HPCS2, HPSC3 Output Chip select 2, 3 Chip select signal for SDRAM HPCLK, HPCLKR, HPCLKD Output Synchronous clock SDRAM synchronous clock signal The same clock signals are output. HPRDWR Output Read/write Read/write signal pin HPDQM7 to HPDQM0 Output Data mask 7 to 0 Indicates that data bits in SDRAM are selected. HPCAS Output Column address Specifies the SDRAM column address. HPRAS Output Row address Specifies the SDRAM row address SBSC (SDRAM bus) HPCKE Output Clock enable SDRAM clock enable signal DREQ0 Input DMA transfer request External DMA transfer request input pin Direct memory access controller (DMAC) DACK0 Output DMA transfer request acknowledge Output pin for acknowledgement of external DMA transfer request Timer pulse unit (TPU) TPUTO Output Output signal Pulse output from the TPU SIOTXD Output Transmit data Transmit data pin SIORXD Input Receive data Receive data pin SIOD I/O Transmit/receive data Transmit/receive data pin SIOSTRB0, SIOSTRB1 Output Serial strobe Synchronizing signal pin SIOSCK Output Serial clock Clock output pin Serial I/O (SIO) SIOMCK Input Serial master clock Serial master clock input pin (common to transmission and reception)

Rev. 1.00 Oct. 9, 2008 Page 56 of 336 REJ03B0272-0100 Classification Symbol I/O Name Function SIOF0_TXD, SIOF1_TXD Output Transmit data Transmit data pin SIOF0_RXD, SIOF1_RXD Input Receive data Receive data pin SIOF0_SCK SIOF1_SCK I/O Serial clock Serial clock pin (common to transmission and reception). This becomes an output fixed pin in SPI mode. SIOF0_MCK, SIOF1_MCK Input Master clock Master clock input pin SIOF0_SYNC SIOF1_SYNC I/O Frame synchronizing signal Frame synchronizing signal pin (common to transmission and reception). This selects fixed output and slave device 0 in SPI mode. SIOF0_SS1, SIOF1_SS1 Output Slave device 1 select Pin for selecting slave device 1 in SPI mode Serial I/O with FIFO (SIOF) SIOF0_SS2, SIOF1_SS2 Output Slave device 2 select Pin for selecting slave device 2 in SPI mode SCIF0_TXD, SCIF1_TXD, SCIF2_TXD Output Transmit data Transmit data pin SCIF0_RXD, SCIF1_RXD, SCIF2_RXD Input Receive data Receive data pin SCIF0_SCK, SCIF1_SCK, SCIF2_SCK I/O Serial clock Clock I/O pin SCIF0_RTS, SCIF1_RTS, SCIF2_RTS Output RTS signal RTS output pin Serial communication interface with FIFO (SCIF) SCIF0_CTS, SCIF1_CTS, SCIF2_CTS Input CTS signal CTS input pin

Rev. 1.00 Oct. 9, 2008 Page 57 of 336 REJ03B0272-0100 Classification Symbol I/O Name Function SIM_RST Output Reset Smart card reset output pin SIM_CLK Output Clock Smart card clock output pin SIM card module (SIM) SIM_D I/O Transmit/ receive data Smart card transmit/receive data I/O pin IrDA_IN Input Receive data input Receive data input IrDA interface (IrDA) IrDA_OUT Output Transmit data output Transmit data output SCL I/O I C clock I/O I C bus clock I/O pin with bus drive function. Output type is NMOS open drain. I C bus interface (IIC) SDA I/O I C data I/O I C bus data I/O pin with bus drive function. Output type is NMOS open drain. FOE Output Flash memory output enable Address latch enable: Asserted for address output and negated for data I/O. Output enable: Asserted for data input/status read. FSC Output Flash memory serial clock Read enable: Reads data at failing edge. Serial clock: Inputs/outputs data in synchronization with the signal. FCE Output Flash memory chip enable Chip enable: Enables the flash memory connected to this LSI. FCDE Output Flash memory command data enable Command latch enable: Asserted at command output. Command data enable: Asserted at command output. FRB Input Flash memory ready/busy Ready/busy: High level indicates ready state and low level indicates busy state. FWE Output Flash memory write enable Write enable: Flash memory latches commands, addresses, and data at rising edge. AND/NAND flash memory controller (FLCTL) NAF7 to NAF0 I/O Flash memory data Data I/O pins

Rev. 1.00 Oct. 9, 2008 Page 58 of 336 REJ03B0272-0100 Classification Symbol I/O Name Function VIO_D15 to VIO_D0 Input VIO data bus VIO camera image data input VIO_CLK, VIO_CLK2 Input VIO clock VIO camera clock input VIO_VD, VIO_VD2 Input VIO vertical sync VIO camera vertical sync signal input VIO_HD, VIO_HD2 Input VIO horizontal sync VIO camera horizontal sync signal input VIO_STEM Output Strobe emission Strobe emission signal VIO_STEX Input Strobe exposed Strobe exposed signal VIO_FLD Input Field signal Field identification signal Video I/O (VIO) VIO_CKO Output Clock output for camera Clock output to camera LCDD23 to LCDD0 Output LCD data bus 24-bit LCD panel data LCDDON Output Display ON/OFF signal Display ON/OFF signal (for main LCD) LCDDON2 Output Display ON/OFF signal 2 Display ON/OFF signal (for sub LCD) LCDHSYN Output Horizontal sync signal Horizontal sync signal LCDDISP Output Display enable signal Display enable signal LCDVSYN Output Vertical sync signal Vertical sync signal LCDVSYN2 Output Vertical sync signal 2 Vertical sync signal (for sub LCD) LCDVCPWC Output Power supply control LCD module power supply control signal (for main LCD) LCDVCPWC2 Output Power supply control 2 LCD module power supply control signal (for sub LCD) LCDVEPWC Output Power supply control LCD module power supply control signal (for main LCD) LCDVEPWC2 Output Power supply control 2 LCD module power supply control signal (for sub LCD) LCD controller (RGB interface) LCDDCK Output Dot cl ock signal Data synchronizing signal

Rev. 1.00 Oct. 9, 2008 Page 59 of 336 REJ03B0272-0100 Classification Symbol I/O Name Function LCD controller (RGB interface) LCDLCLK Input Input clock Input clock signal LCDD23 to LCDD0 I/O LCD data bus 24-bit LCD panel data LCDDON Output Display ON/OFF signal Display ON/OFF signal (for main LCD) LCDDON2 Output Display ON/OFF signal 2 Display ON/OFF signal (for sub LCD) LCDCS Output Chip select Chip select signal (for main LCD) LCDRD Output Read strobe Read strobe signal LCDRS Output Register select Register select signal LCDVSYN I/O Vertical sync signal Vertical sync signal LCDVSYN2 I/O Vertical sync signal 2 Vertical sync signal (for sub LCD) LCDVCPWC Output Power supply control LCD module power supply control signal (for main LCD) LCDVCPWC2 Output Power supply control 2 LCD module power supply control signal (for sub LCD) LCDVEPWC Output Power supply control LCD module power supply control signal (for main LCD) LCDVEPWC2 Output Power supply control 2 LCD module power supply control signal (for sub LCD) LCDWR Output Write strobe Write strobe signal LCDCS2 Output Chip select 2 Chip select signal 2 (for sub LCD) LCD controller (SYS interface) LCDLCLK Input Input clock Input clock signal DV_D15 to DV_D0 Output Data output Data output DV_CLK Output Clock output Pixel clock output DV_VSYNC Output Vertical sync signal output VOU vertical sync signal output DV_HSYNC Output Horizontal sync signal output VOU horizontal sync signal output Video output unit (VOU) DV_CLKI Input Video clock input Video clock input pin

Rev. 1.00 Oct. 9, 2008 Page 60 of 336 REJ03B0272-0100 Classification Symbol I/O Name Function TS_SCK Input Clock TS input clock TS_SDAT Input Receive data TS serial data TS_SDEN Input Data enable TS data enable signal TS interface (TSIF) TS_SPSYNC Input Data sync signal TS data sync signal SIUAOLR SIUBOLR I/O Sound output L/R clock Sound output L/R clock pins (master or slave). SIUAOBT SIUBOBT I/O Sound output bit clock Sound output bit clock pins (master or slave). SIUAOSLD SIUBOSLD Output Sound output serial data Sound output serial data pins SIUAOSPD Output SPDIF output serial data SPDIF output serial data pin SIUAILR SIUBILR I/O Sound input L/R clock Sound input L/R clock pins (master or slave). SIUAIBT SIUBIBT I/O Sound input bit clock Sound input bit clock pins (master or slave). SIUAISLD SIUBISLD Input Sound input serial data Sound input serial data pins SIUAISPD Input SPDIF input serial data SPDIF input serial data pin Sound interface unit (SIUA/SIUB) SIUFCKA, SIUFCKB Output Sampling clock output Sampling clock (clk_fsa and clk_fsb) output pins VBUS Input USB power source detection USB cable connection monitor pin DP I/O D+ I/O USB internal transceiver D+ I/O pin DM I/O D– I/O USB internal transceiver D– I/O pin USB function module (USBF) REFRIN ⎯ ⎯ Reference resistor connection pin for constant current circuit. Should be pulled down and connected to AG33.

Rev. 1.00 Oct. 9, 2008 Page 61 of 336 REJ03B0272-0100 Classification Symbol I/O Name Function KEYIN6 to KEYIN0 Input Key input Key scan interface for input Key scan interface (KEYSC) KEYOUT5 to KEYOUT0 Output Key output Key scan interface for output I/O ports PTA to PTZ I/O Input Output General port General I/O port pins SDHICD Input Card detection SD card detection signal SDHIWP Input Write protection SD write protection signal SDHID3 to SDHID0 I/O Data bus SD data bus signals SDHICMD I/O Command output and response input SD command output and response input signal SD host interface (SDHI) SDHICLK Output Clock SD clock output pin TCK Input Test clock Test clock input pin TMS Input Test mode select Test mode select signal input pin TDI Input Test data input Serial input pin for instructions and data TDO Output Test data output Serial output pin for instructions and data TRST Input Test reset H-UDI reset pin When supplying a power, the TRST pin should be asserted at least for the same period as the RESETP pin. ASEBRK/ BRKACK I/O Break input/ acknowledge Break signal input from emulator/break acknowledge output signal User debugging interface (H-UDI)* MPMD Input ASE mode Sets ASE mode. When an emulator is not used, this pin should be open.

Rev. 1.00 Oct. 9, 2008 Page 62 of 336 REJ03B0272-0100 Classification Symbol I/O Name Function AUDATA3 to AUDATA0 Output AUD data Branch dest ination address output pins in branch trace mode AUDCK Output AUD clock Synchronizing clock output pin in branch trace mode Advanced user debugger (AUD) AUDSYNC Output AUD synchronizing signal Data start position recognition signal output pin in branch trace mode Note: * When an emulator is used, see the relevant User's Manual.

Rev. 1.00 Oct. 9, 2008 Page 63 of 336 REJ03B0272-0100 Section 2 DSP Unit Note: This section contains references to the SH7722 Hardware Manual. The contents of the SH7722 Hardware Manual will be disclosed upon acceptance of a confidentiality agreement. For details, please contact a Renesas Technology sales representative.

2.1 Overview

This LSI incorporates a DSP unit and X/Y memory directly connected to the DSP unit. The SH4AL-DSP supports the DSP extended function instruction sets needed to control the DSP unit and X/Y memory. The DSP extended function instructions are divided into four groups. (1) Extended System Control Instructions for the CPU If the DSP extended function is enabled, the following extended system control instructions can be used for the CPU.

• Repeat loop control instructions and repeat loop control register access instructions are added. Looped programs can be executed efficiently by using the zero-overhead repeat control unit. For details, refer to section 6.3, CPU Extended Instructions, in the SH7722 Hardware Manual.
• Modulo addressing control instructions and control register access instructions are added. Function allows access to data with a circular structure. For details, refer to section 6.4, DSP Data Transfer Instructions, in the SH7722 Hardware Manual.
• DSP unit register access instructions are added. Some of the DSP unit registers can be used in the same way as the CPU system registers. For details, refer to section 6.4, DSP Data Transfer Instructions, in the SH7722 Hardware Manual. Note: This LSI emulates the conventional repeat control of SETRC instruction by using the extended repeat control of LDRC instruction. It changes the value of RF bits in SR register, RS and RE registers during the conventional repeat control. This specification is different from the original SH3-DSP's one. If the conventional repeat is used, then replace it to the repeat macro (REPEAT) or perform LDRS and LDRE instructions before setting the repeat count more than one cycle by SETRC instruction. The extended repeat control of LDRC instruction is highly recommended, because the conventiona l repeat control has some restrictions.

Rev. 1.00 Oct. 9, 2008 Page 64 of 336 REJ03B0272-0100 (2) Data Transfer Instructions for Data Transfers between DSP Unit and On-Chip X/Y Memory Data transfer instructions for data transfers between the DSP unit and on-chip X/Y memory are called double-data transfer instructions. Instruction codes for these double-transfer instructions are 16 bit codes like CPU instruction codes. These data transfer instructions perform data transfers between the DSP unit and on-chip X/Y memory that is directly connected to the DSP unit. These data transfer instructions can be described in combination with other DSP unit operation instructions. For details, refer to section 6.4, DSP Data Transfer Instructions, in the SH7722 Hardware Manual. (3) Data Transfer Instructions for Data Transfers between DSP Unit Registers and All Logical Address Spaces Data transfer instructions for data transfers between DSP unit registers and all logical address spaces are called single-data transfer instructions. Instruction codes for the single-transfer instructions are 16 bit codes like CPU instruction codes. These data transfer instructions performs data transfers between the DSP unit registers and all logical address spaces. For details, refer to section 6.4, DSP Data Transfer Instructions, in the SH7722 Hardware Manual. (4) DSP Unit Operation Instructions DSP unit operation instructions are called DSP data operation instructions. These instructions are provided to execute digital signal processing operations at high speed using the DSP. Instruction codes for these instructions are 32 bits. The DSP data operation instruction fields consist of two fields: field A and field B. In field A, a function for double data transfer instructions can be descried. In field B, ALU operation instructions and multiply instructions can be described. The instructions described in fields A and B can be executed in parallel. A maximum of four instructions (ALU operation, multiply, and two data transfers) can be executed in parallel. For details, refer to section 6.5, DSP Data Operation Instructions, in the SH7722 Hardware Manual. Notes: 1. 32-bit instruction codes are handled as two consecutive 16-bit instruction codes. Accordingly, 32-bit instruction codes can be assigned to a word boundary. 32-bit instruction codes must be stored in memory, address 2n and address 2n + 2, in this order, in word units. 2. In little endian, the upper and lower words must be stored in memory as data to be accessed in word units.

Rev. 1.00 Oct. 9, 2008 Page 65 of 336 REJ03B0272-0100 CPU core instruction 0000 1110 111100 111101 111110 A Field A Field A Field B Field 15 0 12 11 31 1626 25 015 Double-data transfer instruction Single-data transfer instruction DSP data operation instruction - Operand Figure 2.1 DSP Instruction Format

Rev. 1.00 Oct. 9, 2008 Page 66 of 336 REJ03B0272-0100

Section 3 Memory Management Unit (MMU) Rev. 1.00 Oct. 9, 2008 Page 67 of 336 REJ03B0272-0100 Section 3 Memory Management Unit (MMU) Note: This section contains references to the SH7722 Hardware Manual. The contents of the SH7722 Hardware Manual will be disclosed upon acceptance of a confidentiality agreement. For details, please contact a Renesas Technology sales representative. This LSI supports an 8-bit address space identifier, a 32-bit virtual address space, and a 29-bit or 32-bit physical address space. Address translation from virtual addresses to physical addresses is enabled by the memory management unit (MMU) in this LSI. The MMU performs high-speed address translation by caching user-created address translation table information in an address translation buffer (translation lookaside buffer: TLB). This LSI has four instruction TLB (ITLB) entries and 64 unified TLB (UTLB) entries. UTLB copies are stored in the ITLB by hardware. A paging system is used for address translation. It is possible to set the virtual address space access right and implement memory protection independently for privileged mode and user mode. The MMU of this LSI runs in several operating modes. In view of flag functions of the MMU, TLB compatible mode (four paging sizes with four protection bits) and TLB extended mode (eight paging sizes with six protection bits) are provided. Selection between TLB compatible mode and TLB extended mode is made by setting the relevant control register (bit ME in the MMUCR register) by software. The flag functions of the MMU are explained in parallel for both TLB compatible mode and TLB extended mode. Note: The 32-bit address extended mode is an option. For support/unsupport of this mode, see the hardware manual of the product.

Section 3 Memory Management Unit (MMU) Rev. 1.00 Oct. 9, 2008 Page 68 of 336 REJ03B0272-0100

3.1 Overview of MMU

The MMU was conceived as a means of making efficient use of physical memory. As shown in (0) in figure 3.1, when a process is smaller in size than the physical memory, the entire process can be mapped onto physical memory, but if the process increases in size to the point where it does not fit into physical memory, it becomes necessary to divide the process into smaller parts, and map the parts requiring execution onto physical memory as occasion arises ((1) in figure 3.1). Having this mapping onto physical memory executed consciously by the process itself imposes a heavy burden on the process. The virtual memory system was devised as a means of handling all physical memory mapping to reduce this burden ((2) in figure 3.1). With a virtual memory system, the size of the available virtual memory is much larger than the actual physical memory, and processes are mapped onto this virtual memory. Thus processes only have to consider their operation in virtual memory, and mapping from virtual memory to physical memory is handled by the MMU. The MMU is normally managed by the OS, and physical memory switching is carried out so as to enable the virtual memory required by a process to be mapped smoothly onto physical memory. Physical memory switching is performed via secondary storage, etc. The virtual memory system that came into being in this way works to best effect in a time sharing system (TSS) that allows a number of processes to run simultaneously ((3) in figure 3.1). Running a number of processes in a TSS did not increase efficiency since each process had to take account of physical memory mapping. Efficiency is improved and the load on each process reduced by the use of a virtual memory system ((4) in figure 3.1). In this virtual memory system, virtual memory is allocated to each process. The task of the MMU is to map a number of virtual memory areas onto physical memory in an efficient manner. It is also provided with memory protection functions to prevent a process from inadvertently accessing another process's physical memory. When address translation from virtual memory to physical memory is performed using the MMU, it may happen that the translation information has not been recorded in the MMU, or the virtual memory of a different process is accessed by mistake. In such cases, the MMU will generate an exception, change the physical memory mapping, and record the new address translation information. Although the functions of the MMU could be implemented by software alone, having address translation performed by software each time a process accessed physical memory would be very inefficient. For this reason, a buffer for address translation (the translation lookaside buffer: TLB) is provided by hardware, and frequently used address translation information is placed here. The TLB can be described as a cache for address translation information. However, unlike a cache, if address translation fails—that is, if an exceptio n occurs—switching of the address translation information is normally performed by software. Thus memory management can be performed in a flexible manner by software.

Section 3 Memory Management Unit (MMU) Rev. 1.00 Oct. 9, 2008 Page 69 of 336 REJ03B0272-0100 There are two methods by which the MMU can perform mapping from virtual memory to physical memory: the paging method, using fixed-length address translation, and the segment method, using variable-length address translation. With the paging method, the unit of translation is a fixed-size address space called a page. In the following descriptions, the address space in virtual memory is referred to as virtual address space, and the address space in physical memory as physical address space. MMU MMU Process 1 Physical Memory (1) (0) (2) (3) (4) Physical Memory Physical Memory Physical Memory Virtual Memory Virtual Memory Physical Memory Process 1 Process 1 Process 2 Process 3 Process 1 Process 1 Process 2 Process 3 Figure 3.1 Role of MMU

Section 3 Memory Management Unit (MMU) Rev. 1.00 Oct. 9, 2008 Page 70 of 336 REJ03B0272-0100

3.1.1 Address Spaces

(1) Virtual Address Space This LSI supports a 32-bit virtual address space, and can access a 4-Gbyte address space. The virtual address space is divided into a number of areas, as shown in figures 3.2 and 3.3. In privileged mode, the 4-Gbyte space from the P0 area to the P4 area can be accessed. In user mode, a 2-Gbyte space in the U0 area can be accessed. When the DSP bit in SR is 1 or the RMD bit in the on-chip memory control register (RAMCR) is 1, a 16-Mbyte space in the Uxy area can be accessed. Accessing areas other than the U0 area and Uxy area in user mode will cause an address error. When the AT bit in MMUCR is set to 1 and the MMU is enabled, the P0, P3, and U0 areas can be mapped onto any physical address space in 1-, 4-, 64-Kbyte, or 1-Mbyte page units in TLB compatible mode and in 1-, 4-, 8-, 64-, 256-Kbyte, 1-, 4-, or 64-Mbyte page units in TLB extended mode. By using an 8-bit address space identifier, the P0, P3, and U0 areas can be increased to a maximum of 256. Mapping from the virtual address space to the 29-bit physical address space is carried out using the TLB. Area 0 Area 1 Area 2 Area 3 Area 4 Area 5 Area 6 Area 7 Physical address space Address error Address error Uxy area* User mode Note: * This area exists only when DSP bit in SR = 1 or RMD bit in RAMCR = 1 Privileged mode P1 area Cacheable P0 area Cacheable P2 area Non-cacheable P3 area Cacheable P4 area Non-cacheable U0 area Cacheable H'0000 0000 H'8000 0000 H'E500 0000 H'E5FF FFFF H'FFFF FFFF H'0000 0000 H'8000 0000 H'FFFF FFFF H'A000 0000 H'C000 0000 H'E000 0000 Figure 3.2 Virtual Address Space (AT in MMUCR= 0)

Section 3 Memory Management Unit (MMU) Rev. 1.00 Oct. 9, 2008 Page 71 of 336 REJ03B0272-0100 Area 0 Area 1 Area 2 Area 3 Area 4 Area 5 Area 6 Area 7 Physical address space 256256 U0 area Cacheable Address translation possible Address error Address error P0 area Cacheable Address translation possible User modePrivileged mode P1 area Cacheable Address translation not possible P2 area Non-cacheable Address translation not possible P3 area Cacheable Address translation possible P4 area Non-cacheable Address translation not possible Uxy area* H'FFFF FFFF H'E000 0000 H'E500 0000 H'E5FF FFFF H'C000 0000 H'A000 0000 H'8000 0000 H'0000 0000 H'FFFF FFFF H'8000 0000 H'0000 0000 Note: * This area exists only when DSP bit in SR = 1 or RMD bit in RAMCR = 1 Figure 3.3 Virtual Address Space (AT in MMUCR= 1) (a) P0, P3, and U0 Areas The P0, P3, and U0 areas allow address translation using the TLB and access using the cache. When the MMU is disabled, replacing the upper 3 bits of an address with 0s gives the corresponding physical address. Whether or not the cache is used is determined by the CCR setting. When the cache is used, switching between the copy-back method and the write-through method for write accesses is specified by the WT bit in CCR. When the MMU is enabled, these areas can be mapped onto any physical address space in 1-, 4-, 64-Kbyte, or 1-Mbyte page units in TLB compatible mode and in 1-, 4-, 8-, 64-, 256-Kbyte, 1-, 4-, or 64-Mbyte page units in TLB extended mode using the TLB. When CCR is in the cache enabled state and the C bit for the corresponding page of the TLB entry is 1, accesses can be performed using the cache. When the cache is used, switching between the copy-back method and the write- through method for write accesses is specified by the WT bit of the TLB entry. When the P0, P3, and U0 areas are mapped onto the control register area which is allocated in the areas 1 and 7 in physical address space by means of the TLB, the C bit for the corresponding page must be cleared to 0.

Section 3 Memory Management Unit (MMU) Rev. 1.00 Oct. 9, 2008 Page 72 of 336 REJ03B0272-0100 (b) P1 Area The P1 area does not allow address translation using the TLB but can be accessed using the cache. Regardless of whether the MMU is enabled or disabled, clearing the upper 3 bits of an address to 0 gives the corresponding physical address. Whether or not the cache is used is determined by the CCR setting. When the cache is used, switching between the copy-back method and the write- through method for write accesses is specified by the CB bit in CCR. (c) P2 Area The P2 area does not allow address translation using the TLB and access using the cache. Regardless of whether the MMU is enabled or disabled, clearing the upper 3 bits of an address to 0 gives the corresponding physical address. (d) P4 Area The P4 area is mapped onto the internal resource. This area does not allow address translation using the TLB. This area cannot be accessed using the cache. The P4 area is shown in detail in figure 3.4.

Section 3 Memory Management Unit (MMU) Rev. 1.00 Oct. 9, 2008 Page 73 of 336 REJ03B0272-0100 H'E000 0000 H'E500 0000 H'F000 0000 H'F100 0000 H'F200 0000 H'F300 0000 H'F400 0000 H'F500 0000 H'F600 0000 H'F700 0000 H'F800 0000 H'FC00 0000 Reserved area Reserved area On-chip memory area Instruction cache address array Instruction cache data array Instruction TLB address array Instruction TLB data array Operand cache address array Operand cache data array Unified TLB address array Unified TLB data array Reserved area Control register area H'FFFF FFFF H'E5FF FFFF Figure 3.4 P4 Area

Section 3 Memory Management Unit (MMU) Rev. 1.00 Oct. 9, 2008 Page 74 of 336 REJ03B0272-0100 The area from H'F000 0000 to H'F0FF FFFF is used for direct access to the instruction cache address array. For details, see section 8.6.1, IC Address Array, in the SH7722 Hardware Manual. The area from H'F100 0000 to H'F1FF FFFF is used for direct access to the instruction cache data array. For details, see section 8.6.2, IC Data Array, in the SH7722 Hardware Manual. The area from H'F200 0000 to H'F2FF FFFF is used for direct access to the instruction TLB address array. For details, see section 7.7.1, ITLB Address Array, in the SH7722 Hardware Manual. The area from H'F300 0000 to H'F37F FFFF is used for direct access to instruction TLB data ITLB Data Array (TLB Extended Mode), in the SH7722 Hardware Manual. The area from H'F400 0000 to H'F4FF FFFF is used for direct access to the operand cache address array. For details, see section 8.6.3, OC Address Array, in the SH7722 Hardware Manual. The area from H'F500 0000 to H'F5FF FFFF is used for direct access to the operand cache data array. For details, see section 8.6.4, OC Data Array, in the SH7722 Hardware Manual. The area from H'F600 0000 to H'F60F FFFF is used for direct access to the unified TLB address array. For details, see section 7.7.4, UTLB Address Array, in the SH7722 Hardware Manual. The area from H'F700 0000 to H'F70F FFFF is used for direct access to unified TLB data array. For details, see section 7.7.5, UTLB Data Array (TLB Compatible Mode) and section 7.7.6, UTLB Data Array (TLB Extended Mode), in the SH7722 Hardware Manual. The area from H'FC00 0000 to H'FFFF FFFF is the on-chip peripheral module control register area. For details, see register descriptions in each section of the hardware manual of the product. (e) Uxy Area The Uxy area is available in user mode when the DSP bit in SR is 1 or the RMD bit in RAMCR is 1. This area is mapped to the on-chip memory of this LSI. In user mode, accessing this area when the DSP bit in SR is 0 and the RMD bit in RAMCR is 0 will cause an address error. This area does not allow address translation using the TLB and access using the cache. For details on the Uxy area, see section 9, On-Chip Memory, in the SH7722 Hardware Manual.

Section 3 Memory Management Unit (MMU) Rev. 1.00 Oct. 9, 2008 Page 75 of 336 REJ03B0272-0100 (2) Physical Address Space This LSI supports a 29-bit physical address space. The physical address space is divided into eight areas as shown in figure 3.5. Area 7 is a reserved area. For details, see the section 11, Bus State Controller (BSC). Only when area 7 in the physical address space is accessed using the TLB, addresses H'1C00 0000 to H'1FFF FFFF of area 7 are not designated as a reserved area, but are equivalent to the control register area in the P4 area in the virtual address space. H'0000 0000 H'0400 0000 H'0800 0000 H'0C00 0000 H'1000 0000 H'1400 0000 H'1800 0000 H'1C00 0000 H'1FFF FFFF Area 0 Area 1 Area 2 Area 3 Area 4 Area 5 Area 6 Area 7 (reserved area) Figure 3.5 Physical Address Space (3) Address Translation When the MMU is used, the virtual address space is divided into units called pages, and translation to physical addresses is carried out in these page units. The address translation table in external memory contains the physical addresses corresponding to virtual addresses and additional information such as memory protection codes. Fast address translation is achieved by caching the contents of the address translation table located in external memory into the TLB. Basically, the ITLB is used for instruction accesses and the UTLB for data accesses. In the event of an access to an area other than the P4 area, the accessed virtual address is translated to a physical address. If the virtual address belongs to the P1 or P2 area, the physical address is uniquely determined without accessing the TLB. If the virtual address belongs to the P0, U0, or P3 area, the TLB is searched using the virtual address, and if the virtual address is recorded in the TLB, a TLB hit is made and the corresponding physical address is read from the TLB. If the accessed virtual address is not recorded in the TLB, a TLB miss exception is generated and processing switches to the TLB miss exception handling routine. In the TLB miss exception handling routine, the address translation table in external memory is searched, and the corresponding physical address and page management information are recorded in the TLB. After the return from the exception handling routine, the instruction which caused the TLB miss exception is re-executed.

Section 3 Memory Management Unit (MMU) Rev. 1.00 Oct. 9, 2008 Page 76 of 336 REJ03B0272-0100 (4) Single Virtual Memory Mode and Multiple Virtual Memory Mode There are two virtual memory systems, single virtual memory and multiple virtual memory, either of which can be selected with the SV bit in MMUCR. In the single virtual memory system, a number of processes run simultaneously, using virtual address space on an exclusive basis, and the physical address corresponding to a particular virtual address is uniquely determined. In the multiple virtual memory system, a number of processes run while sharing the virtual address space, and particular virtual addresses may be translated into different physical addresses depending on the process. The only difference between the single virtual memory and multiple virtual memory systems in terms of operation is in the TLB address comparison method (see section 7.3.3, Address Translation Method), in the SH7722 Hardware Manual. (5) Address Space Identifier (ASID) In multiple virtual memory mode, an 8-bit address space identifier (ASID) is used to distinguish between multiple processes running simultaneously while sharing the virtual address space. Software can set the 8-bit ASID of the currently executing process in PTEH in the MMU. The TLB does not have to be purged when processes are switched by means of ASID. In single virtual memory mode, ASID is used to provide memory protection for multiple processes running simultaneously while using the virtual address space on an exclusive basis. Note: Two or more entries with the same virtual page number (VPN) but different ASID must not be set in the TLB simultaneously in single virtual memory mode.

Rev. 1.00 Oct. 9, 2008 Page 77 of 336 REJ03B0272-0100 Section 4 Caches Note: This section contains references to the SH7722 Hardware Manual. The contents of the SH7722 Hardware Manual will be disclosed upon acceptance of a confidentiality agreement. For details, please contact a Renesas Technology sales representative. This LSI has an on-chip 32-kbyte instruction cache (IC) for instructions and an on-chip 32-kbyte operand cache (OC) for data.

4.1 Features

The features of the cache are given in table 4.1. Table 4.1 Cache Features Item Instruction Cache Operand Cache Capacity 32-kbyte cache 32-kbyte cache Type 4-way set-associative, virtual address index/physical address tag 4-way set-associative, virtual address index/physical address tag Line size 32 bytes 32 bytes Entries 256 entries/way 256 entries/way Write method ⎯ Copy-back/write-through selectable Replacement method LRU (least-recently-used) algorithm LRU (least-recently-used) algorithm The operand cache of this LSI is the 4-way set-associative, each way comprising 256 cache lines. Figure 4.1 shows the configuration of the operand cache. The instruction cache is 4-way set-associative, each way comprising 256 cache lines. Figure 4.2 shows the configuration of the instruction cache. This LSI incorporates an instruction cache (IC) way-prediction scheme to reduce power consumption. In addition, the non-support detection exception register (EXPMASK) can be used to detect memory-mapped associative write functions as exceptions. For details, see section 5, Exception Handling, in the SH7722 Hardware Manual.

Rev. 1.00 Oct. 9, 2008 Page 78 of 336 REJ03B0272-0100 Comparison 31 54 2 LW0 32 bits LW1 32 bits LW2 32 bits LW3 32 bits LW4 32 bits LW5 32 bits LW6 32 bits LW7 32 bits 6 bits MMU [12:5] 255 19 bits 1 bit 1 bit Tag U V Address array (way 0 to way 3) Data array (way 0 to way3) LRU Entry selection Longword (LW) selection Virtual address Write dataRead data Hit signal (Way 0 to way 3) 12 10 0 Figure 4.1 Configuratio n of Operand Cache (OC)

Rev. 1.00 Oct. 9, 2008 Page 79 of 336 REJ03B0272-0100 31 54 2 LW0 32 bits LW1 32 bits LW2 32 bits LW3 32 bits LW4 32 bits LW5 32 bits LW6 32 bits LW7 32 bits [12:5] 255 19 bits 1 bit Tag V Address array (way 0 to way 3) Data array (way 0 to way3) Entry selection Longword (LW) selection Virtual address Read data 13 12 10 0 6 bits LRU Hit signal (Way 0 to way 3) Comparison MMU Figure 4.2 Configuration of Instruction Cache (IC)

Rev. 1.00 Oct. 9, 2008 Page 80 of 336 REJ03B0272-0100 (1) Tag Stores the upper 19 bits of the 29-bit physical address of the data line to be cached. The tag is not initialized by a power-on or manual reset. (2) V bit (validity bit) Indicates that valid data is stored in the cache line. When this bit is 1, the cache line data is valid. The V bit is initialized to 0 by a power-on reset, but retains its value in a manual reset. (3) U bit (dirty bit) The U bit is set to 1 if data is written to the cache line while the cache is being used in copy-back mode. That is, the U bit indicates a mismatch between the data in the cache line and the data in external memory. The U bit is never set to 1 while the cache is being used in write-through mode, unless it is modified by accessing the memory-mapped cache (see section 8.6, Memory-Mapped Cache Configuration), in the SH7722 Hardware Manual. The U bit is initialized to 0 by a power- on reset, but retains its value in a manual reset. (4) Data array The data field holds 32 bytes (256 bits) of data per cache line. The data array is not initialized by a power-on or manual reset. (5) LRU In a 4-way set-associative method, up to 4 items of data can be registered in the cache at each entry address. When an entry is registered, the LRU bit indicates which of the 4 ways it is to be registered in. The LRU mechanism uses 6 bits of each entry, and its usage is controlled by hardware. The LRU (least-recently-used) algorithm is used for way selection, and selects the less recently accessed way. The LRU bits are initialized to 0 by a power-on reset but not by a manual reset. The LRU bits cannot be read from or written to by software.

Rev. 1.00 Oct. 9, 2008 Page 81 of 336 REJ03B0272-0100 Section 5 On-Chip Memory This LSI includes three types of memory modules for storage of instructions and data: X/Y memory, IL memory, and U memory. The X/Y memory holds DSP-processing and other data, while the IL memory is suitable for instruction storage. The U memory can store instructions and/or data.

5.1 Features

(1) X/Y Memory

• Capacity Total X/Y memory is 16 kbytes.
• Page There are four pages. The X memory is divided into two pages (pages 0 and 1) and the Y memory is divided into two pages (pages 0 and 1).
• Memory map Both X memory and Y memory are allocated in a virtual address space, physical address space, and either an X bus address space or Y bus address space. With virtual address space, X/Y memory is allocated in the addresses shown in table 5.1. These addresses are included either in the area called P4 (when SR.MD = 1) or the area called Uxy (when SR.MD = 0 and SR.DSP = 1) according to CPU operating mode. Table 5.1 X/Y Memory Virtual Addresses Memory Size (Four Pages Total) Page 16 kbytes Page 0 of X memory H'E5007000 to H'E5007FFF Page 1 of X memory H'E5008000 to H'E5008FFF Page 0 of Y memory H'E5017000 to H'E5017FFF Page 1 of Y memory H'E5018000 to H'E5018FFF On the other hand, with physical address space, the X/Y memory is allocated in a part of area 1. When X/Y memory is accessed from the physical address space, addresses where the upper three bits of the addresses shown in table 5.1 are made 0 are used.

Rev. 1.00 Oct. 9, 2008 Page 82 of 336 REJ03B0272-0100 The X bus and Y bus address spaces are 16-bit address spaces; therefore, addresses where the respective upper sixteen bits of the X memory and Y memory addresses shown in table 5.1 are ignored are used.

• Ports Each page has four independent read/write ports and is connected to each bus. The X memory is connected to the SuperHyway bus, the cache/RAM internal bus, the X bus, and the operand bus. The Y memory is connected to the SuperHyway bus, the cache/RAM internal bus, the Y bus, and the operand bus. The operand bus is used for memory access from the virtual address space. The cache/RAM internal bus is used for memory access from the physical address space. The X bus and the Y bus are used for memory access from the X bus and Y bus address spaces. The SuperHyway bus is used for memory access from the SuperHyway bus master module. In the event of simultaneous accesses to the same page from different buses, access is processed according to priority. For the X memory, the priority order is: SuperHyway bus > cache/RAM internal bus > X bus > operand bus. For the Y memory, the priority order is: SuperHyway bus > cache/RAM internal bus > Y bus > operand bus.
• Priority order In the event of simultaneous accesses to the same page from different buses, access is processed according to priority. For X memory the priority order is: SuperHyway bus > cache/RAM internal bus > X bus > operand bus. For Y memory the priority order is: SuperHyway bus > cache/RAM internal bus > Y bus > operand bus. (2) IL Memory
• Capacity The IL memory is 4 kbytes.
• Page The IL memory is only one page.
• Memory map The IL memory is allocated to both the virtual address space and the physical address space. With virtual address space, the IL memory is allocated in the addresses shown in table 5.2. These addresses are included either in the area called P4 (when SR.MD = 1) or the area called Uxy (when SR.MD = 0 and SR.DSP = 1) according to CPU operating mode.

Rev. 1.00 Oct. 9, 2008 Page 83 of 336 REJ03B0272-0100 Table 5.2 IL Memory Addresses Memory Size Page 4 kbytes IL memory H'E520 0000 to H'E520 0FFF On the other hand, in physical address space, the IL memory is allocated in part of the area 1. When the IL memory is accessed from the physical address space, addresses where the upper three bits of the addresses shown in table 5.2 are made 0 are used.

• Ports The page has three independent read/write ports and is connected to the SuperHyway bus, the cache/RAM internal bus, and the instruction bus. The instruction bus is used for memory access from the virtual address space through instruction fetch. The cache/RAM internal bus is used when the IL memory is accessed through instruction fetch and operand access. The SuperHyway bus is used for IL memory access from the SuperHyway bus master module.
• Priority In the event of simultaneous accesses to the same page from different buses, the access requests are processed according to priority. The priority order is: SuperHyway bus > cache/RAM internal bus > instruction bus. (3) U Memory
• Capacity Total U memory is 128 kbytes.
• Methods for accessing the U memory U memory can be accessed both through cacheable access suitable for instruction fetch and random access, as well as through non-cacheable access which is optimized for sequential operand access by using the read buffer.
• Memory map U memory is allocated in the addresses shown in table 5.3 in both the virtual address space and the physical address space. The address in the virtual address space can be accessed from the P4 area (when SR.MD = 1) or from the Uxy area (when SR.MD = 0 and SR.DSP = 1) according to CPU operating mode. When this address is used, the U memory is always accessed through non-cacheable access.

Rev. 1.00 Oct. 9, 2008 Page 84 of 336 REJ03B0272-0100 The address in the physical address space can be accessed from areas U0, P0, P1 or P3. When one of these addresses is used, whether the U memory is accessed through cacheable access or non-cacheable access depends on the settings of the CCR register, the MMUCR register, and TLB. Table 5.3 U Memory Addresses Memory Size Address Space 128 kbytes Virtual address H'A55F0000 to H'A560FFFF Physical address H'055F0000 to H'0560FFFF

• Ports The U memory has three independent read/write ports and is connected to the operand bus, the cache/RAM internal bus, and the SuperHyway bus. The operand bus is used when U memory is accessed through non-cacheable operand access. The cache/RAM internal bus is used when U memory is accessed through instruction fetch and cacheable operand access. The SuperHyway bus is used for U memory access from the SuperHyway bus master module.
• Priority In the event of simultaneous access to the U memory from different buses, the access requests are processed according to priority. The priority order is: SuperHyway bus > cache/RAM internal bus > operand bus.

Section 6 Interrupt Controller (INTC) Rev. 1.00 Oct. 9, 2008 Page 85 of 336 REJ03B0272-0100 Section 6 Interrupt Controller (INTC) The interrupt controller (INTC) determines the priority of interrupt sources and controls interrupt requests to the CPU. Some INTC registers set the priority of each interrupt and interrupt requests are processed according to the user-set priority.

6.1 Features

The INTC has the following features.

• Fifteen levels of interrupt priority can be set By setting the interrupt priority registers, the priorities of on-chip pe ripheral module interrupts can be selected from 15 levels for individual request sources.
• NMI noise canceler function An NMI input-level bit indicates the NMI pin state. By reading this bit in the interrupt exception handling routine, the pin state can be checked, enabling it to be used as a noise canceler.
• NMI request masking when the block bit (BL) in the status register (SR) is set to 1 Whether to mask NMI requests when the BL bit in SR is set to 1 can be selected.
• User-mode interrupt disabling function Specifying an interrupt mask level in the user interrupt mask level register (USERIMASK) disables interrupts which are not higher in priority than the specified mask level in user mode.

Section 6 Interrupt Controller (INTC) Rev. 1.00 Oct. 9, 2008 Page 87 of 336 REJ03B0272-0100

6.2 Input/Output Pins

Table 6.1 shows the INTC pin configuration. Table 6.1 Pin Configuration Pin Name Function I/O Description NMI Nonmaskable interrupt input pin Input Input of interrupt request signal that is not maskable IRQ7 to IRQ0 IRQ7 to IRQ0 interrupt input pins Input Input of IRQ7 to IRQ0 interrupt request signals (maskable by the IMASK bit setting in SR)

Section 6 Interrupt Controller (INTC) Rev. 1.00 Oct. 9, 2008 Page 88 of 336 REJ03B0272-0100

6.3 Interrupt Sources

There are three types of interrupt sources: NMI, IRQ, and on-chip peripheral modules. Each interrupt has a priority level (16 to 0), with 1 the lowest and 16 the highest. Priority level 0 masks an interrupt, so the interrupt request is ignored.

6.3.1 NMI Interrupt

The NMI interrupt has the highest priority level of 16. When the BL bit in SR of the CPU is 0, NMI interrupts are always accepted. In sleep or standby mode, NMI interrupts are accepted regardless of the BL setting. In addition, NMI interrupts are accepted by setting the NMIB bit in ICR0 regardless of the BL setting. The NMI signal is edge-detected. The NMIE bit in ICR0 is used to select either rising or falling edge detection. After the NMIE bit in ICR0 is modified, NMI interrupts are not detected for a maximum of six bus clock cycles. NMI interrupt exception handling does not affect the interrupt mask level (IMASK) in SR.

6.3.2 IRQ Interrupts

IRQ interrupts are input from pins IRQ7 to IRQ0. When level-sensing is selected for IRQ interrupts by the IRQnS bits (n = 0 to 7) in ICR1, the pin levels must be retained until the CPU accepts the interrupts and starts interrupt handling. If an interrupt request is canceled before the CPU accepts it, the INTC holds the interrupt source until the CPU accepts another interrupt. The interrupt held in the INTC can be cleared by setting the corresponding interrupt mask bit (IMR bit in the interrupt mask register) to 1. When the INTMU bit in CPUOPM is set to 1, the interrupt mask level (IMASK) in SR is automatically modified to the level of the accepted interrupt. When the INTMU bit is cleared to 0, the IMASK value in SR is not affected by the accepted interrupt.

Section 6 Interrupt Controller (INTC) Rev. 1.00 Oct. 9, 2008 Page 89 of 336 REJ03B0272-0100

6.3.3 On-Chip Peripheral Module Interrupts

On-chip peripheral module interrupts are generated by the peripheral modules. Not every interrupt source is assigned a different interrupt vector. Sources are reflected in the interrupt event register (INTEVT). It is easy to identify sources by using the value of INTEVT as a branch offset in the exception handling routine. A priority level (from 15 to 0) can be set for each module by writing to IPRA to IPRL. When the INTMU bit in the CPUOPM is set to 1, the interrupt mask level (IMASK) in SR is automatically modified to the level of the accepted interrupt. When the INTMU bit in CPUOPM is cleared to 0, the IMASK value in SR is not affected by the accepted interrupt. The interrupt source flags and interrupt enable flags in each peripheral module must be updated only while the BL bit in SR is set to 1 or corresponding interrupt request is masked by the IMASK bit in SR, IMRs, or USERIMASK. To prevent accepting unintentional interrupts that should have been updated, read the on-chip peripheral register with the corresponding flag, wait for the priority determination time for peripheral modules shown in table 10.8 (e.g. a period required to read a register in INTC once which are driven by the peripheral module clock), and then clear the BL bit to 0 or clear the corresponding interrupt mask by changing the mask setting. Thus, the necessary interval for internal processing is ensured. To update multiple flags, after updating the last flag, read only the register that includes the last flag. If a flag is updated while the BL bit is 0, execution may branch to the interrupt handling routine with INTEVT = 0; interrupt handling may start depending on the timing relationship between flag updating and interrupt request detection in the LSI. In this case, operation can be continued without causing any problems by executing the RTE instruction.

Section 6 Interrupt Controller (INTC) Rev. 1.00 Oct. 9, 2008 Page 90 of 336 REJ03B0272-0100

6.3.4 Interrupt Exception Handling and Priority

Tables 6.2 and 6.3 show the interrupt sources, the codes for the interrupt event register (INTEVT), and the interrupt priority. Each interrupt source is assigned to a unique INTEVT code. The start address of the exception handling routine is common for all interrupt sources. This is why, for instance, the value of INTEVT is used as an offset at the start of the exception handling routine to branch execution in order to identify the interrupt source. On-chip peripheral module interrupt priorities can be set freely between 15 and 0 for each module by using IPRA to IPRL. A reset assigns priority level 0 to the on-chip peripheral module interrupts. If the same priority level is assigned to two or more interrupt sources and interrupts from those sources occur simultaneously, their priority is determined according to the default priority indicated at the right in tables 6.2 and 6.3. Interrupt priority registers and interrupt mask registers must be updated only while the BL bit in SR is set to 1. To prevent accepting unintentional interrupts, read any interrupt priority register and then clear the BL bit to 0, which ensures the necessary interval for internal processing. Table 6.2 External Interr upt Sources and Priority Interrupt Source INTEVT Code Interrupt Priority (Initial Value) IPR (Bit Numbers) Priority within IPR Setting Range Default Priority NMI H'1C0 16 — — High IRQ0 H'600 15 to 0 (0) INTPRI00 (31 to 28) — IRQ1 H'620 15 to 0 (0) INTPRI00 (27 to 24) — IRQ2 H'640 15 to 0 (0) INTPRI00 (23 to 20) — IRQ3 H'660 15 to 0 (0) INTPRI00 (19 to 16) — IRQ4 H'680 15 to 0 (0) INTPRI00 (15 to 12) — IRQ5 H'6A0 15 to 0 (0) INTPRI00 (11 to 8) — IRQ6 H'6C0 15 to 0 (0) INTPRI00 (7 to 4) — IRQ IRQ7 H'6E0 15 to 0 (0) INTPRI00 (3 to 0) — Low

Section 6 Interrupt Controller (INTC) Rev. 1.00 Oct. 9, 2008 Page 91 of 336 REJ03B0272-0100 Table 6.3 On-Chip Peripheral Module Interrupt Sources and Priority Interrupt Source INTEVT Code Interrupt Priority (Initial Value) Corresponding IPR (Bit Numbers) Priority within IPR Setting Range Default Priority HUDI H'5E0 15 — — High ERI H'700 15 to 0 (0) High RXI H'720 15 to 0 (0) TXI H'740 15 to 0 (0) SIM TEI H'760 15 to 0 (0) IPRB (7 to 4) Low ATI H'780 15 to 0 (0) High PRI H'7A0 15 to 0 (0) RTC CUI H'7C0 15 to 0 (0) IPRI (3 to 0) Low DEI0 H'800 15 to 0 (0) High DEI1 H'820 15 to 0 (0) DEI2 H'840 15 to 0 (0) DMAC0/ DMAC1/ DMAC2/ DMAC3 DEI3 H'860 15 to 0 (0) IPRE (15 to 12) Low CEUI H'880 15 to 0 (0) High BEUI H'8A0 15 to 0 (0) VEUI H'8C0 15 to 0 (0) VIO/VOU VOUI H'8E0 15 to 0 (0) IPRE (11 to 8) Low VPU VPUI H'980 15 to 0 (0) IPRE (3 to 0) — TPU TPUI H'9A0 15 to 0 (0) IPRL (7 to 4) — USB USBI0 H'A20 15 to 0 (0) IPRF (7 to 4) — DEI4 H'B80 15 to 0 (0) High DEI5 H'BA0 15 to 0 (0) DMAC4/ DMAC5 DADERR H'BC0 15 to 0 (0) IPRF (11 to 8) Low KEYSC KEYI H'BE0 15 to 0 (0) IPRF (15 to 12) — SCIF0 H'C00 15 to 0 (0) IPRG (15 to 12) — SCIF1 H'C20 15 to 0 (0) IPRG (11 to 8) — SCIF SCIF2 H'C40 15 to 0 (0) IPRG (7 to 4) — SIOFI0 H'C80 15 to 0 (0) IPRH (15 to 12) — SIOF SIOFI1 H'CA0 15 to 0 (0) IPRH (11 to 8) — Low

Section 6 Interrupt Controller (INTC) Rev. 1.00 Oct. 9, 2008 Page 92 of 336 REJ03B0272-0100 Interrupt Source INTEVT Code Interrupt Priority (Initial Value) Corresponding IPR (Bit Numbers) Priority within IPR Setting Range Default Priority SIO SIOI H'D00 15 to 0 (0) IPRI (15 to 12) — FLSTEI H'D80 15 to 0 (0) High FLTENDI H'DA0 15 to 0 (0) FLTREQ0I H'DC0 15 to 0 (0) High FLCTL FLTREQ1I H'DE0 15 to 0 (0) IPRK (7 to 4) Low ALI0 H'E00 15 to 0 (0) High TACKI0 H'E20 15 to 0 (0) WAITI0 H'E40 15 to 0 (0) I C(0) DTEI0 H'E60 15 to 0 (0) IPRH (3 to 0) Low SDHII0 H'E80 15 to 0 (0) High SDHII1 H'EA0 15 to 0 (0) SDHII2 H'EC0 15 to 0 (0) SDHI SDHII3 H'EE0 15 to 0 (0) IPRK (3 to 0) Low CMT CMTI H'F00 15 to 0 (0) IPRF (3 to 0) — TSIF TSIFI H'F20 15 to 0 (0) IPRI (7 to 4) — SIU SIUI H'F80 15 to 0 (0) IPRJ (7 to 4) — 2DG 2DGI H'FA0 15 to 0 (0) IPRL (15 to 12) — TMU0 TUNI0 H'400 15 to 0 (0) IPRA (15 to 12) — TMU1 TUNI1 H'420 15 to 0 (0) IPRA (11 to 8) — TMU2 TUNI2 H'440 15 to 0 (0) IPRA (7 to 4) — IrDA IRDAI H'480 15 to 0 (0) IPRA (3 to 0) — JPU JPEGI H'560 15 to 0 (0) IPRB (15 to 12) — LCDC LCDCI H'580 15 to 0 (0) IPRB (11 to 8) — Low

Section 6 Interrupt Controller (INTC) Rev. 1.00 Oct. 9, 2008 Page 93 of 336 REJ03B0272-0100

6.4 Operation

6.4.1 Interrupt Sequence

The sequence of interrupt operations is described below. Figures 6.2 and 6.3 are flowcharts of the operations. 1. The interrupt request sources send interrupt request signals to the INTC. 2. The INTC selects the highest-p riority interrupt from the sent interrupt requests according to the interrupt priority registers. Lower-priority interrupts are held pending. If two of these interrupts have the same priority level or if multiple interrupts occur within a single module, the interrupt with the highest priority is selected according to tables 6.2 and 6.3. 3. The priority level of the interrupt selected by the INTC is compared with the interrupt mask level (IMASK) set in SR of the CPU. If the priority level is higher than the mask level, the INTC accepts the interrupt and sends an interrupt request signal to the CPU. 4. The CPU accepts an interrupt at a break in instructions. 5. The interrupt source code is set in the interrupt event register (INTEVT). 6. SR and program counter (PC) are saved to SSR and SPC, respectively. R15 is saved to SGR at this time. 7. The BL, MD, and RB bits in SR are set to 1. 8. Execution jumps to the start address of the interrupt exception handling routine (the sum of the value set in the vector base register (VBR) and H'0000 0600). In the exception handling routine, execution may branch with the INTEVT value used as its offset in order to identify the interrupt source. This enables execution to branch to the handling routine for the individual interrupt source. Notes: 1. When the INTMU bit in the CPU operating mode register (CPUOPM) is set to 1, the interrupt mask level (IMASK) in SR is automatically set to the level of the accepted interrupt. When the INTMU bit is cleared to 0, the IMASK value in SR is not affected by the accepted interrupt. 2. The interrupt source flag should be cleared in the interrupt handler. To ensure that an interrupt source that should have been cleared is not inadvertently accepted again, read the interrupt source flag, wait for the priority determination time for peripheral modules shown in table 6.4 (e.g. a period required to read a register in INTC once which is driven by the peripheral module clock), and then clear the BL bit or execute an RTE instruction.

Section 6 Interrupt Controller (INTC) Rev. 1.00 Oct. 9, 2008 Page 94 of 336 REJ03B0272-0100 Program execution state Interrupt generated? ICR1.MAI = 1? SR.BL = 0, sleep mode, or standby mode? Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes No No No No No No No No NMI? No YesNo Yes NMI input is low? Level 15 interrupt? No No Set interrupt source code in INTEVT Branch to exception handling routine SR.IMASK level is 14 or lower? Level 14 interrupt? Level 1 interrupt? NMI? Save SR to SSR; save PC to SPC SR.IMASK level is 13 or lower? SR.IMASK level is 0? ICR0.NMIB = 1? Figure 6.2 Interrupt Operation Flowchart (when CPUOPM.INTMU = 0)

Section 6 Interrupt Controller (INTC) Rev. 1.00 Oct. 9, 2008 Page 95 of 336 REJ03B0272-0100 Program execution state Interrupt generated? ICR1.MAI = 1? SR.BL = 0, sleep mode, or standby mode? Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes No No No No No No No No NMI? No YesNo Yes NMI input is low? Level 15 interrupt? No No Set interrupt source code in INTEVT Set SR.IMASK to accepted interrupt level Branch to exception handling routine SR.IMASK level is 14 or lower? Level 14 interrupt? Level 1 interrupt? NMI? Save SR to SSR; save PC to SPC SSR.IMASK level is 13 or lower? SR.IMASK level is 0? ICR0.NMIB = 1? Figure 6.3 Interrupt Operation Flowchart (when CPUOPM.INTMU = 1)

Section 6 Interrupt Controller (INTC) Rev. 1.00 Oct. 9, 2008 Page 96 of 336 REJ03B0272-0100

6.4.2 Multiple Interrupts

When handling multiple interrupts, an interrupt handling routine should include the following procedures: 1. To identify the interrupt source, branch to a specific interrupt handling routine for the interrupt source by using the INTEVT code as an offset. 2. Clear the interrupt source in each specific interrupt handling routine. 3. Save SSR and SPC to the stack. 4. Clear the BL bit in SR. When the INTMU bit in CPUOPM is set to 1, the interrupt mask level (IMASK) in SR is automatically modified to the level of the accepted interrupt. When the INTMU bit in CPUOPM is cleared to 0, set the IMASK bit in SR by software to the accepted interrupt level. 5. Handle the interrupt as required. 6. Set the BL bit in SR to 1. 7. Restore SSR and SPC from memory. 8. Execute the RTE instruction. When these procedures are followed in order, an interrupt of higher priority than the one being handled can be accepted if multiple interrupts occur after step 4. This reduces the interrupt response time for urgent processing.

6.4.3 Interrupt Masking by MAI Bit

Setting the MAI bit in ICR0 to 1 masks interrupts while the NMI signal is low regardless of the BL and IMASK bit settings in SR.

• Normal operation or sleep mode All interrupts are masked while the NMI signal is low. Note that only NMI interrupts due to NMI signal input occur.
• Standby mode All interrupts including NMI are masked while the NMI signal is low. While the MAI bit is set to 1, the NMI interrupt cannot be used to clear standby mode.

Section 6 Interrupt Controller (INTC) Rev. 1.00 Oct. 9, 2008 Page 97 of 336 REJ03B0272-0100

6.4.4 Interrupt Disabling Function in User Mode

Setting the interrupt mask level in USERIMASK disables interrupts having an equal or lower priority level than the specified mask level. This function can disable less-urgent interrupts in a task (such as device driver) operating in user mode to accelerate urgent processing. USERIMASK is allocated to a different 64-Kbyte page than where the other INTC registers are allocated. When accessing this register in user mode, translate the address through the MMU. In the system that uses a multitasking OS, processes that can access USERIMASK must be controlled by using memory protection functions of the MMU. When terminating the task or switching to another task, be sure to clear USERIMASK to 0 before quitting the task. If the UIMASK bits are left set to a non-zero value, interrupts which are not higher in priority than the UIMASK level are held disabled, and correct operation may not be performed (for example, the OS cannot switch tasks). A sample sequence of user-mode interrupt disabling operation is described below. 1. Classify interrupts into A and B shown below, and assign higher interrupt levels to A than B. A. Interrupts that should be accepted in the device driver (interrupts used by the OS, such as timer interrupts) B. Interrupts that should be disabled in the device driver 2. Make the MMU settings so that the a ddress space including USERIMASK can only be accessed by the device driver in which interrupts should be disabled. 3. Branch to the device driver. 4. Specify the UIMASK bits so that interrupts B are masked in the device dr iver operating in user mode. 5. Perform urgent processing in the device driver. 6. Clear the UIMASK bits to 0 to return from the device driver processing.

Section 6 Interrupt Controller (INTC) Rev. 1.00 Oct. 9, 2008 Page 98 of 336 REJ03B0272-0100

6.5 Interrupt Response Time

Table 6.4 shows the interrupt response time, which is the interval from when an interrupt request occurs until the interrupt exception handling is started and the start instruction of the exception handling routine is fetched. Table 6.4 Interrupt Response Time Number of States Item NMI IRQ Peripheral Module Remarks Priority determination time 5 Bcyc + 2 Pcyc 4 Bcyc + 2 Pcyc 5 Pcyc Wait time until the CPU finishes the current sequence S - 1 (≥ 0) × Icyc Interval from when interrupt exception handling begins (saving SR and PC) until an SuperHyway bus request is issued to fetch the start instruction of the exception handling routine

11 Icyc + 1 Scyc

Total (S + 10) Icyc +

1 Scyc + 5 Bcyc +

2 Pcyc

(S + 10) Icyc +

1 Scyc + 4 Bcyc +

(S + 10) Icyc +

1 Scyc + 5 Pcyc

Minimum 18 Icyc + S × Icyc 17 Icyc + S × Icyc 16 Icyc + S × Icyc When Icyc:Scyc:Bcyc: Pcyc = 1:1:1:1 [Legend] Icyc: Period for one CPU clock cycle Scyc: Period for one SH clock cycle Bcyc: Period for one bus clock cycle Pcyc: Period for one peripheral clock cycle S: Number of instruction execution states

Section 7 Bus State Controller (BSC) Rev. 1.00 Oct. 9, 2008 Page 99 of 336 REJ03B0272-0100 Section 7 Bus State Controller (BSC) Note: This section contains references to the SH7722 Hardware Manual. The contents of the SH7722 Hardware Manual will be disclosed upon acceptance of a confidentiality agreement. For details, please contact a Renesas Technology sales representative. The bus state controller (BSC) outputs control signals for various types of memory that is connected to the external address space and external devices. The BSC functions enable this LSI to connect directly with SRAM, burst ROM, and other memory storage devices, and external devices. SDRAM is controlled by the bus state controller for SDRAM (SBSC).

7.1 Features

The BSC has the following features: 1. External address space

• Supports totally 256 Mbytes at a maximum. The space is divided into either six or four areas as shown below. ⎯ Address map 1: Six areas of CS0, CS4, CS5A, CS5B, CS6A, and CS6B ⎯ Address map 2: Four areas of CS0, CS4, CS5, and CS6
• Can specify the normal space interface, SRAM interface with byte selection, burst ROM (clock asynchronous), or various PCMCIA interfaces for each address space
• Can select the data bus width (8, 16, or 32 bits) for each address space
• Controls insertion of wait cycle for each address space
• Controls insertion of wait cycle for each read access and write access
• Can set independent idle cycles in the continuous access for five cases: read-write (in the same space/different spaces), read-read (in the same space/different spaces), or the first cycle is a write access 2. Normal space interface
• Supports the interface that can be connected directly to SRAM 3. Burst ROM interface (clock asynchronous)
• High-speed access to ROM that has the page mode function 4. SRAM interface with byte selection
• Supports the interface that can be connected directly to SRAM with byte selection 5. PCMCIA direct-connection interfaces
• Supports the "IC memory card and I/O card interface" provided with JEIDA Ver4.2 (PCMCIA2.1)

Section 7 Bus State Controller (BSC) Rev. 1.00 Oct. 9, 2008 Page 100 of 336 REJ03B0272-0100

• Controls the insertion of wait states by the program
• Supports the bus-sizing function of the I/O bus width. (only in little endian mode.) Note: For the PCMCIA direct-connection interf aces, the BSC supports only the signals and bus protocols listed in table 7.1. Use an external circuit for the other control signals. A block diagram of the BSC is shown in figure 7.1. CMNCR CS0WCR CS6BWCR RWTCNT CS0BCR CS6BBCR Bus mastership controller Wait controller Area controller Internal master module Internal slave module Internal bus Memory controller [Legend] Module bus BSC CS0, CS4, CS5A, CS5B, CS6A, CS6B WAIT MD5, MD3 CMNCR: CSnBCR: CSnWCR: RBWTCNT: Common control register CSn space bus control register (n = 0, 4, 5A, 5B, 6A, 6B) CSn space wait control register (n = 0, 4, 5A, 5B, 6A, 6B) Reset bus wait counter . . . . . . . . . D31 to D0 A25 to A0, BS, RDWR, RD, WE3(BE3) to WE0(BE0), CE2A, CE2B, CE1A, CE1B, ICIORD, ICIOWR IOIS16 Figure 7.1 Block Diagram of BSC

Section 7 Bus State Controller (BSC) Rev. 1.00 Oct. 9, 2008 Page 101 of 336 REJ03B0272-0100

7.2 Input/Output Pins

Table 7.1 lists the BSC pin configuration. Table 7.1 Pin Configuration Name I/O Description A25 to A0 Output Address output D31 to D0 I/O Data bus BS Output Signal to indicate the start of bus cycles Asserted when normal space, burst ROM (clock asynchronous), or PCMCIA is accessed. CS0, CS4 Output Chip select CS5A/CE2A Output Chip select Activated only when address map 1 is selected Correspond to PCMCIA card select signals D15 to D8 when PCMCIA is used CS5B/CE1A Output Chip select Correspond to PCMCIA card select signals D7 to D0 when PCMCIA is used CS6A/CE2B Output Chip select Activated only when address map 1 is selected Correspond to PCMCIA card select signals D15 to D8 when PCMCIA is used CS6B/CE1B Output Chip select Correspond to PCMCIA card select signals D7 to D0 when PCMCIA is used RDWR Output Read/write signal Connected to the WE pin when SRAM with byte selection is connected RD Output Read pulse signal (read data output enable signal) Strobe signal to indicate memory read cycles when PCMCIA is used WE3(BE3)/ ICIOWR Output Byte write indication signal corresponding to D31 to D24 Connected to the byte select pin when SRAM with byte selection is connected Strobe signal to indicate the I/O write when PCMCIA is used

Section 7 Bus State Controller (BSC) Rev. 1.00 Oct. 9, 2008 Page 102 of 336 REJ03B0272-0100 Name I/O Description WE2(BE2)/ ICIORD Output Byte write indication signal corresponding to D23 to D16 Connected to the byte select pin when SRAM with byte selection is connected Strobe signal to indicate the I/O read when PCMCIA is used WE1(BE1)/ WE Output Byte write indication signal corresponding to D15 to D8 Connected to the byte select pin when SRAM with byte selection is connected Strobe signal to indicate the memory write cycles when PCMCIA is used WE0(BE0) Output Byte write indication signal corresponding to D7 to D0 Connected to the byte select pin when SRAM with byte selection is connected IOIS16 Input Signal to indicate the 16-bit I/O of PCMCIA Enabled only in little endian mode. In big endian mode, drive this pin low. WAIT Input External wait input MD5, MD3 Input MD5: Data alignment (big/little endian selectable) MD3: Bus width of area 0 (16/32 bits), HPD[47:32]/D[31:16] selectable

Section 7 Bus State Controller (BSC) Rev. 1.00 Oct. 9, 2008 Page 103 of 336 REJ03B0272-0100

7.3 Area Overview

7.3.1 Area Division

In the architecture, this LSI has 32-bit address spaces. The cache access method that is classified into P0 to P4 spaces by the upper three bits is shown. For details, see section 8, Caches, in the SH7722 Hardware Manual. The remaining 29 bits are used for division of the space into ten areas (address map 1) or eight areas (address map 2) according to the setting of the MAP bit in CMNCR. The BSC performs control for this 29-bit space. As listed in tables 11.2 and 11.3, in the SH7722 Hardware Manual, this LSI can connect eight or six physical areas to each type of memory, and it outputs chip select signals (CS0, HPCS2, HPCS3 (see section 12, Bus State Controller for SDRAM (SBSC)), CS4, CS5A, CS5B, CS6A, and CS6B) for each of them. CS0 is asserted during area 0 access. During area 5A access, CS5A is asserted when address map 1 is selected, and CS5B is asserted when address map 2 is selected.

Section 7 Bus State Controller (BSC) Rev. 1.00 Oct. 9, 2008 Page 104 of 336 REJ03B0272-0100

Section 8 Bus State Controller for SDRAM (SBSC) Rev. 1.00 Oct. 9, 2008 Page 105 of 336 REJ03B0272-0100 Section 8 Bus State Controller for SDRAM (SBSC) Note: This section contains references to the SH7722 Hardware Manual. The contents of the SH7722 Hardware Manual will be disclosed upon acceptance of a confidentiality agreement. For details, please contact a Renesas Technology sales representative. The bus state controller for SDRAM (SBSC) outputs control signals for SDRAM that is connected to the external address space. The SBSC functions enable this LSI to connect directly with SDRAM.

8.1 Features

The SBSC has the following features:

• External address space ⎯ A maximum 64 Mbytes of external address space ⎯ Can select the data bus width as 16 or 32 bits ⎯ Controls insertion of wait states according to the SDRAM specifications
• SDRAM interface ⎯ Multiplex output for row address/column address ⎯ Single read/write and burst read/write selectable ⎯ High-speed access by bank-active mode ⎯ Supports auto-refresh and self-refresh
• Write protect function ⎯ Three types of write protected area are selectable; 128 Mbits, 256 Mbits, or 512 Mbits from the start address of area 3
• Refresh function ⎯ Supports auto-refresh and self-refresh ⎯ Specifies the refresh interval using the refresh counter and clock selection ⎯ Can execute concentrated refresh by specifying the refresh count (1, 2, 4, 6, or 8) A block diagram of the SBSC is shown in figure 8.1.

Section 8 Bus State Controller for SDRAM (SBSC) Rev. 1.00 Oct. 9, 2008 Page 106 of 336 REJ03B0272-0100 Wait controller SDWCR SDPCR SDCR0 RTCSR RTCNT Comparator RTCOR MD5 HPA16 to HPA1, HPRAS, HPCAS, HPRDWR, HPDQM7 to HPDQM0, HPCKE, HPCS2, HPCS3 Memory controller Refresh controller Internal master module Internal slave module HPD63 to HPD0 SBSC PFC SBSCR Internal bus interface Internal bus [Legend] SDCR0: SDCR1: SDWCR: SDWCR2: SDPCR: RTCSR: RTCNT: RTCOR: SDWPCR: SDWRCR: BSTRCNT: SDRAM control register 0 SDRAM control register 1 SDRAM wait control register SDRAM wait control register 2 SDRAM pin control register Refresh timer control/status register Refresh timer counter Refresh time constant register SDRAM write protect control register SDRAM mode register setting control register Burst refresh count register SDWCR2 SDWPCR SDMRCR SDCR1 SDWPCR BSTRCNT Figure 8.1 Block Diagram of SBSC

Section 8 Bus State Controller for SDRAM (SBSC) Rev. 1.00 Oct. 9, 2008 Page 107 of 336 REJ03B0272-0100

8.2 Input/Output Pins

Table 8.1 lists the SBSC pin configuration. Table 8.1 Pin Configuration Name Function I/O Description HPA16 to HPA1 Address bus Output Address output HPD63 to HPD0 Data bus I/O 16-/32-/64-bit bidirectional bus HPCS2 Chip select Output Chip select signal for area 2 HPCS3 Chip select Output Chip select signal for area 3 HPRDWR Read/write Output Read/write signal pin. Connected to the WE pin of SDRAM. HPDQM7 Mask for UU data Output Byte-selection signal corresponding to D63 to D56 of SDRAM HPDQM6 Mask for UU data Output Byte-selection signal corresponding to D55 to D48 of SDRAM HPDQM5 Mask for UU data Output Byte-selection signal corresponding to D47 to D40 of SDRAM HPDQM4 Mask for UU data Output Byte-selection signal corresponding to D39 to D32 of SDRAM HPDQM3 Mask for UU data Output Byte-selection signal corresponding to D31 to D24 of SDRAM HPDQM2 Mask for UL data Output Byte-selection signal corresponding to D23 to D16 of SDRAM HPDQM1 Mask for LU data Output Byte-selection signal corresponding to D15 to D8 of SDRAM HPDQM0 Mask for LL data Output Byte-selection signal corresponding to D7 to D0 of SDRAM HPRAS Row address Output Specifies the SDRAM row address. Connected to the RAS pin of SDRAM. HPCAS Column address Output Specifies the SDRAM column address. Connected to the CAS pin of SDRAM. HPCKE Clock enable Output SDRAM clock enable signal. Connected to the CKE pin of SDRAM. HPCLK Synchronous clock Output Synchronous clock output pin MD5, MD3 Mode setting Input MD5: Data alignment (big endian or little endian selectable) MD3: Selects HPD[47:32]/D[31:16]

Section 8 Bus State Controller for SDRAM (SBSC) Rev. 1.00 Oct. 9, 2008 Page 108 of 336 REJ03B0272-0100

8.3 Area Overview

8.3.1 Address Map

The external address space of this LSI has a capacity of 384 Mbytes and is used divided into six partial spaces. Among these partial spaces, the SBSC controls area 3. Areas 0, and 4 to 6 are controlled by the BSC. The kind of memory to be connected and the data bus width are specified in each partial space. The address map for the external address space is listed in table 8.2. Table 8.2 Address Map of External Address Space Address Area Memory to be Connected Capacity H'0000 0000 to H'03FF FFFF Area 0 (BSC) Normal memory Burst ROM (asynchronous) SRAM with byte selection

64 Mbytes

H'0400 0000 to H'07FF FFFF Area 1 Internal I/O register area * H'0800 0000 to H'0BFF FFFF Area 2 (SBSC) SDRAM * H'0C00 0000 to H'0FFF FFFF Area 3 (SBSC) SDRAM * H'1000 0000 to H'13FF FFFF Area 4 (BSC) Normal memory SRAM with byte selection Burst ROM (asynchronous) H'1400 0000 to H'17FF FFFF Area 5 * (BSC) Normal memory SRAM with byte selection H'1800 0000 to H'1BFF FFFF Area 6 * (BSC) Normal memory SRAM with byte selection H'1C00 0000 to H'1FFF FFFF Area 7 Reserved area * Notes: 1. The access between DDR and SDRAM is not supported. 2. Areas 5 and 6 can each be further divided into two 32-Mbyte spaces by the BSC register settings. 3. Do not access the reserved area. If the reserved area is accessed, correct operation cannot be guaranteed.

Section 8 Bus State Controller for SDRAM (SBSC) Rev. 1.00 Oct. 9, 2008 Page 109 of 336 REJ03B0272-0100

8.3.2 Memory Bus Width

The memory bus width in this LSI can be set as 16, 32, or 64 bits by the SZ[1:0] bits in the SDRAM control registers 0 and 1 (SDCR0, SDCR1). When the width of 64 bits is specified, select HPD[47:32] while the MD3 pin is low at a power-on reset. When the width of 16 or 32 bits is specified, set the MD3 pin in accordance with the bus width in area 0. For details, see table 11.4, Correspondence between External Pin (MD3) and Bus Width, in the SH7722 Hardware Manual.

8.3.3 Data Alignment

This LSI supports the big endian and little endian methods of data alignment. The data alignment method is specified using the external pin (MD5) at a power-on reset. Table 8.3 Correspondence between Ex ternal Pin (MD5) and Endians MD5 Endian

0 Big endian

1 Little endian

Section 8 Bus State Controller for SDRAM (SBSC) Rev. 1.00 Oct. 9, 2008 Page 110 of 336 REJ03B0272-0100

Section 9 Direct Memory Access Controller (DMAC) Rev. 1.00 Oct. 9, 2008 Page 111 of 336 REJ03B0272-0100 Section 9 Direct Memory Access Controller (DMAC) This LSI includes the direct memory access controller (DMAC). The DMAC can be used in place of the CPU to perform high-speed transfers between external devices that have DACK (transfer request acknowledge signal), external memory, on-chip memory, memory-mapped external devices, and on-chip peripheral modules.

9.1 Features

• Six channels (one channel can receive an external request)
• 4-Gbyte physical address space
• Data transfer unit is selectable: Byte, word (2 bytes), longword (4 bytes), 8 bytes, 16 bytes, and 32 bytes
• Maximum transfer count: 16,777,216 transfers
• Address mode: Dual address mode
• Transfer requests: External request, on-chip peripheral module request, or auto request can be selected. The following modules can issue an on-chip peripheral module request. ⎯ SCIF0/1/2, IrDA, SIOF0/1, USB, FLCTL, SIM, SIUA/B, SDHI, and TSIF
• Selectable bus modes: Cycle steal mode (normal mode and intermittent mode) or burst mode can be selected.
• Selectable channel priority levels: The channel priority levels are selectable between fixed mode and round-robin mode.
• Interrupt request: An interrupt request can be generated to the CPU after half of the transfers ended, all transfers ended, or an address error occurred.
• External request detection: There are following four types of DREQ input detection. ⎯ Low level detection ⎯ High level detection ⎯ Rising edge detection ⎯ Falling edge detection
• Transfer request acknowledge signal: Active levels for DACK can be set independently.

Section 9 Direct Memory Access Controller (DMAC) Rev. 1.00 Oct. 9, 2008 Page 113 of 336 REJ03B0272-0100

9.2 Input/Output Pins

The external pins for the DMAC are described below. Table 9.1 lists the configuration of the pins that are connected to external bus. The DMAC has pins for one channel (channel 0) for external bus use. Table 9.1 Pin Configuration Channel Pin Name Function I/O Description DREQ0 DMA transfer request Input DMA transfer request input from external device to channel 0 DACK0 DMA transfer request acknowledge Output DMA transfer request acknowledge output from channel 0 to external device

Section 9 Direct Memory Access Controller (DMAC) Rev. 1.00 Oct. 9, 2008 Page 114 of 336 REJ03B0272-0100

Section 10 Clock Pulse Generator (CPG) Rev. 1.00 Oct. 9, 2008 Page 115 of 336 REJ03B0272-0100 Section 10 Clock Pulse Generator (CPG) Note: This section contains references to the SH7722 Hardware Manual. The contents of the SH7722 Hardware Manual will be disclosed upon acceptance of a confidentiality agreement. For details, please contact a Renesas Technology sales representative. The clock pulse generator generates the clocks used in this LSI and consists of a PLL circuit, a DLL circuit, dividers, and the associated control circuit.

10.1 Features

• Generation of the various clocks for LSI internal operations CPU clock (Iφ): Operating clock for the CPU core SH clock (SHφ): Operating clock for the SuperHyway bus U memory clock (Uφ): Operating clock for the U memory Bus clock (Bφ): Operating clock for the BSC. Operating clock for peripheral modules on the SuperHyway bus SDRAM clock (B3φ): Operating clock for the SBSC Peripheral clock (Pφ): Operating clock for peripheral modules on the HPB (peripheral bus).
• Generation of clocks for external interfaces Bus clock (CKO): Clock for the BSC bus interface (same as Bφ) SDRAM clock (HPCLK): Clock for the SDRAM interface (same as B3φ) Video clock (VIO_CKO): Clock output for cameras SIU clock A (SIUCKA): Clock for the SIU external interface SIU clock B (SIUCKB): Clock for the SIU external interface IrDA clock (IrDACK): IrDA clock output
• Frequency-change function The frequency of each clock can be changed independently by using the PLL circuit, DLL circuit, or dividers within the CPG. Frequencies are changed under software control by register settings.
• Clock mode The clock mode pin setting selects the EXTAL or RCLK input as the clock source. In addition, the PLL and DLL can be turned on or off by the clock mode pin setting after a power-on reset.
• Power-down mode control The clocks are stopped in sleep mode, software standby mode, and U-standby mode; clocks for specific modules can be stopped by using the module standby function. For details, see section 15, Reset and Power-Down Modes, in the SH7722 Hardware Manual.

Section 10 Clock Pulse Generator (CPG) Rev. 1.00 Oct. 9, 2008 Page 116 of 336 REJ03B0272-0100

10.2 Block Diagram

A block diagram of the CPG is shown in figure 10.1. PLL circuit × 1 to × 16 DLL circuit Divider 2 × 1/1 × 2/3 × 1/2 × 2/5 × 1/3 × 1/4 × 1/5 × 1/6 × 1/8 × 1/10 × 1/12 × 1/16 × 1/20 × 1/1 × 1/20 Divider 3 × 1/1 to × 1/20 Divider 1 × 1/2 HPB bus Control circuit Multiplication control FRQCR PLLCR VCLKCR Division control SCLKACR SCLKBCR IrDACLKCR Stop control DLLFRQ HPB bus interface STBCR FRQCR: PLLCR: DLLFRQ: STBCR: VCLKCR: SCLKACR: SCLKBCR: IrDACLKCR: [Legend] Frequency control register PLL control register DLL multiplication register Standby control register (For details, see section 15, Reset and Power-Down Modes, in the SH7722 Hardware Manual.) Video clock frequency control register SIU clock A frequency control register SIU clock B frequency control register IrDA clock frequency control register CPU clock (Iφ) U memory cloc k (Uφ) SH clock (SHφ) Peripheral clock (Pφ) Bus clock (Bφ) SDRAM clock (B3φ) SIU clock A (SIUCKA) SIU clock B (SIUCKB) IrDA clock (IrDACK) EXTAL RCLK VIO_CKO CKO HPCLK SIUMCKA SIUMCKB MD1 MD0 Figure 10.1 Block Diagram of CPG

Section 10 Clock Pulse Generator (CPG) Rev. 1.00 Oct. 9, 2008 Page 117 of 336 REJ03B0272-0100 The CPG blocks function as follows: (1) DLL Circuit The DLL circuit multiples the clock frequency (32.768 kHz) input from the RCLK pin. This circuit is only enabled in clock mode 3. The multiplication rate is set in the DLL multiplication register (DLLFRQ). The initial value of the multiplication rate is 824 and the generated clock is at 32.768 kHz × 824 = 27.00 MHz. (2) PLL Circuit The PLL circuit multiples, by factors from 1 to 16, the frequency of the clock input from the EXTAL pin or of the multiplied clock signal produced by the DLL circuit. The multiplication rate is set in the frequency control register (FRQCR). The PLL circuit is turned on or off by the settings of the clock mode pins or the PLL control register (PLLCR). The input clock frequency for the PLL circuit is in the range from 10 to 66 MHz. The output clock frequency is in the range from 10 to 333 MHz (when VDD = 1.25 to 1.35 V, the output frequency is in the range from 266 to 333 MHz). (3) Divider 1 Divider 1 halves the frequency of the clock input from the EXTAL pin or of the multiplied clock produced by the DLL circuit. When the PLL circuit is turned off, the clock output from divider 1 is input to dividers 2 and 3. (4) Divider 2 Divider 2 divides the frequency of the clock output from the PLL circuit or divider 1 and generates the operating clocks. The division ratio is set in the relevant frequency control register. (5) Divider 3 Divider 3 generates the video clock (VIO_CKO) by dividing the frequency of the clock output by the PLL circuit or divider 1. The division ratio is set by VCLKCR. (6) Control Circuit The control circuit controls the clock frequency according to the settings of the MD0 and MD1 pins and the frequency control registers.

Section 10 Clock Pulse Generator (CPG) Rev. 1.00 Oct. 9, 2008 Page 118 of 336 REJ03B0272-0100

10.3 Input/Output Pins

Table 10.1 lists the CPG pin configuration. Table 10.1 Pin Configuration and Functions of CPG Pin Name Function I/O Description MD0 Input Sets the clock operating mode. MD1 Input Sets the clock operating mode. MD2 Clock mode control pins Input Reserved * EXTAL Input Used as an external clock input pin. XTAL Output Reserved RCLK Input Inputs the RTC clock (32.768 kHz). * SIUMCKA Input Clock input for SIU interface SIUMCKB Clock pins Input Clock input for SIU interface CKO Bus clock output pin Output Used as a BSC interface clock output pin. HPCLK SDRAM clock output pin Output Used as a SDRAM interface clock output pin. VIO_CKO Video clock Output Used as a clock output pin for cameras. Notes: 1. Always input low level to the MD2 pin. 2. Always input RCLK in this LSI even when the DLL circuit is not used.

Section 11 Reset and Power-Down Modes Rev. 1.00 Oct. 9, 2008 Page 119 of 336 REJ03B0272-0100 Section 11 Reset and Power-Down Modes This LSI supports U-standby mode, in which low power consumption is achieved by turning off the internal power-supply to part of the chip. This LSI also supports sleep mode, software standby mode, and module standby function, in which clock supply to the LSI is controlled optimally.

11.1 Features

• Supports a variety of power-down modes, i.e. sleep, software standby, module standby, and U- standby modes.
• In U-standby mode, the RWDT, CMT, KEYSC, and RTC that operate on RCLK are operational.

11.1.1 Division of Power-Supply Areas

To realize power-down modes, this LSI is divided into the following three power-supply areas.

• Core area This area is operated by the VDD power supply and encompasses all areas other than the following two. Power consumption on standby is greatly reduced in U-standby mode by turning off the power to this area.
• Sub area This area is operated by the VDD power supply and encompasses the RWDT, CMT, KEYSC, and RTC.
• I/O area This area is operated by the V CC power supply and encompasses the I/O buffer.

Section 11 Reset and Power-Down Modes Rev. 1.00 Oct. 9, 2008 Page 120 of 336 REJ03B0272-0100

11.1.2 Types of Resets and Power-Down Modes

This LSI has the following types of power-down modes. Table 11.1 shows the state in each mode and methods for making transitions and canceling each mode.

• Sleep mode: Supply of the clock to the CPU core is stopped.
• Software standby mode: Supply of the clock is stopped throughout the LSI.
• Module standby function: The operation of modules that are not in use can be stopped under software control.
• U-standby mode: The supply of power to core areas is stopped. (A power is supplied to I/O area and sub area.) Table 11.1 States of Resets and Power-Down Modes State Power-Down Mode Transition Conditions CPG CPU Core CPU Registers On-Chip Memory On-Chip Peripheral Modules* External SDRAM Canceling Method Sleep mode Execute the SLEEP instruction with STBY = 0 and USTBY = 0 in STBCR. Operating Stopped Retained U memory continues to operate while others are stopped (contents retained) Operating Auto- refreshing
• Interrupt
• Power-on reset
• System reset Software standby mode Execute the SLEEP instruction with STBY = 1 and USTBY = 0 in STBCR. Stopped Stopped Retained Stopped (contents retained) Stopped* Self- refreshing
• IRQ, NMI, CMT, KEYSC, RTC
• Power-on reset
• System reset Module standby function Set the MSTP bit of the respective module to 1 in MSTPCR. Operating Operating or stopped Retained Specified module stopped (contents retained) Specified module stopped Auto- refreshing
• Clear the MSTP bit to

Section 11 Reset and Power-Down Modes Rev. 1.00 Oct. 9, 2008 Page 121 of 336 REJ03B0272-0100 State Power-Down Mode Transition Conditions CPG CPU Core CPU Registers On-Chip Memory On-Chip Peripheral Modules* External SDRAM Canceling Method U-standby mode Execute the SLEEP instruction with USTBY = 1 and STBY = 0 in STBCR. Stopped Stopped Not retained Not retained Stopped * Self- refreshing

• CMT, KEYSC, RTC
• Power-on reset
• System reset Power-on reset Drive the RESETP pin low. Initial state Initial state Initial state Initial state Initial state Initial state ⎯ System reset Drive the RESETA pin low. RWDT overflows. Initial state Initial state Initial state Initial state Initial state Initial state ⎯ Manual reset Generate an exception other than a user break while SR.BL = 1. Retained Initial state Initial state Initial state/retained* Initial state/retained* Auto- refreshing ⎯ Notes: 1 The on-chip peripheral modules refer to modules that are directly connected to the Super-Hyway bus or peripheral bus. 2 Modules with RCLK operation (RWDT, CMT, KEYSC, and RTC) continue to operate. 3. This depends on the module. See the sections on the individual modules.

11.2 Input/Output Pins

Table 11.2 lists the pin configuration related to resets and power-down modes. Table 11.2 Pin Configuration Pin Name Function I/O Description STATUS0 Processing state 0 Output Becomes high level in various standby modes (software standby mode and U-standby mode). RESETP Reset input pin Input This LSI enters the power-on reset state when this pin becomes low level. RESETA Reset input pin Input This LSI enters the system reset state when this pin becomes low level. RESETOUT Reset output signal Output Becomes low level while this LSI is being reset. PDSTATUS Power-down state signal Output Becomes high level when the power-supply separating region is turned off. PDSTATUS can control the supply current to the regulator.

Section 11 Reset and Power-Down Modes Rev. 1.00 Oct. 9, 2008 Page 122 of 336 REJ03B0272-0100

Section 12 RCLK Watchdog Timer (RWDT) Rev. 1.00 Oct. 9, 2008 Page 123 of 336 REJ03B0272-0100 Section 12 RCLK Watchdog Timer (RWDT) This LSI includes the RCLK watchdog timer (RWDT). The RWDT is a single-channel timer that uses a RTC clock as an input and can be used as a watchdog timer for the system monitoring. This LSI can be reset by the overflow of the counter when the value of the counter has not been updated because of a system runaway.

12.1 Features

• Can be used as a watchdog timer. A system reset is generated when the counter overflows.
• Choice of eight counter input clocks. Eight clocks (RCLK/1 to RCLK/4096) that are obtained by dividing the RCLK. Figures 12.1 shows block diagrams of the RWDT. RWTCSR RWTCNT RWDT U-standby operation region RCLK Reset control Divider Internal reset request Clock selector Peripheral bus [Legend] RWTCSR: RWTCNT: RCLK watchdog timer control/status register RCLK watchdog timer counter Figure 12.1 Block Diagram of RWDT

Section 12 RCLK Watchdog Timer (RWDT) Rev. 1.00 Oct. 9, 2008 Page 124 of 336 REJ03B0272-0100

12.2 Input/Output Pins for RWDT

Table 12.1 lists the pin configuration and functions of the RWDT. Table 12.1 RWDT Pin Configuration Pin Name Function I/O Description RCLK RTC clock Input Clock input from an external RTC

Section 13 Timer Unit (TMU) Rev. 1.00 Oct. 9, 2008 Page 125 of 336 REJ03B0272-0100 Section 13 Timer Unit (TMU) This LSI includes a three-channel 32-bit timer unit (TMU).

13.1 Features

• Each channel is provided with an auto-reload 32-bit down counter
• All channels are provided with 32-bit constant registers and 32-bit down counters that can be read or written to at any time
• All channels generate interrupt requests when the 32-bit down counter underflows (H'00000000 → H'FFFFFFFF)
• Allows selection among five counter input clocks: Pφ/4, Pφ/16, Pφ/64, Pφ/256, and Pφ/1024

Section 14 16-Bit Timer Pulse Unit (TPU) Rev. 1.00 Oct. 9, 2008 Page 127 of 336 REJ03B0272-0100 Section 14 16-Bit Timer Pulse Unit (TPU) This LSI has an on-chip 16-bit timer pulse unit (TPU) which consists of four 16-bit timer channels.

14.1 Features

• Various timer general registers TPU has a total of 16 timer general registers provided with four registers (TPU_TGRA to TPU_TGRD) for each channel. TPU_TGRA enables an output compare setting. TPU_TGRB, TPU_TGRC, and TPU_TGRD in each channel can be used as the timer counter clear registers. TPU_TGRC and TPU_TGRD can be used as the buffer registers.
• The following operation can be set for each channel: Counter clear operation: Counter clearing possible by compare match
• Buffer operation settable for each channel Automatic rewriting of output compare register possible
• One interrupt request Enabling or disabling the compare match/overflow interrupt request can be set independently for each interrupt source.
• The following output can be made from only channel 0. Waveform output at compare match: Selection of 0, 1, or toggle output PWM mode: Any PWM output duty cycle can be set

Section 14 16-Bit Timer Pulse Unit (TPU) Rev. 1.00 Oct. 9, 2008 Page 128 of 336 REJ03B0272-0100 Table 14.1 describes the TPU functions. Table 14.1 TPU Functions Item TPU: Channel 0 TPU: Channel 1 TPU: Channel 2 TPU: Channel 3 Count clock B φ/1 Bφ/4 Bφ/16 Bφ/64 Bφ/1 Bφ/4 Bφ/16 Bφ/64 Bφ/1 Bφ/4 Bφ/16 Bφ/64 Bφ/1 Bφ/4 Bφ/16 Bφ/64 General register TPU_TGR0A TPU_TGR0B TPU_TGR1A TPU_TGR1B TPU_TGR2A TPU_TGR2B TPU_TGR3A TPU_TGR3B General register/ Buffer register TPU_TGR0C TPU_TGR0D TPU_TGR1C TPU_TGR1D TPU_TGR2C TPU_TGR2D TPU_TGR3C TPU_TGR3D Output pin TPUTO Not assigned Not assigned Not assigned Counter clear function TPU_TGR compare match TPU_TGR compare match TPU_TGR compare match TPU_TGR compare match 0 output O × × × 1 output O × × × Compare match output Toggle output O × × × PWM mode O × × × Buffer mode O O O O Interrupt request 5 sources

• Compare match
• Overflow 5 sources
• Compare match
• Overflow 5 sources
• Compare match
• Overflow 5 sources
• Compare match
• Overflow

Section 14 16-Bit Timer Pulse Unit (TPU) Rev. 1.00 Oct. 9, 2008 Page 129 of 336 REJ03B0272-0100

14.2 Block Diagram

A block diagram of the TPU is shown in figure 14.1. TGRA Bφ TPUTO Bφ/1 Bφ/4 Bφ/16 Bφ/64 TGRB TGRC TGRD Clear Divider Buffer Comparator Clock selection Edge selection Counter up Output control Channel 0 Channel 1 Channel 2 Channel 3 Same configuration as channel 0 Same configuration as channel 0 Same configuration as channel 0 Figure 14.1 TPU Block Diagram

Section 14 16-Bit Timer Pulse Unit (TPU) Rev. 1.00 Oct. 9, 2008 Page 130 of 336 REJ03B0272-0100

14.3 Input/Output Pin

Table 14.2 shows the pin configuration of the TPU. Table 14.2 Pin Configuration Channel Pin Name Function I/O Description

0 TPUTO TPU output compare

Output TPU_TGR0A output compare output/ PWM output pin

Section 15 Compare Match Timer (CMT) Rev. 1.00 Oct. 9, 2008 Page 131 of 336 REJ03B0272-0100 Section 15 Compare Match Timer (CMT) This LSI includes a 32-bit compare match timer (CMT) of one channel.

15.1 Features

• 16 bits/32 bits can be selected.
• Provided with an auto-reload up counter.
• Provided with 32-bit constant registers and 32-bit up counters that can be written or read at any time.
• The CMT of this LSI can operate the counting even in U-standby mode.
• Allows selection among 3 counter input clocks: ⎯ External clock (RCLK) input: 1/8, 1/32, and 1/128
• One-shot operation and free-running operation are selectable.
• Allows selection of compare match or overflow for the interrupt source.
• Supports canceling of the standby state in U-standby mode.
• Module standby mode can be set. Figure 15.1 shows a block diagram of the CMT. Internal interrupt Internal standby cancel Peripheral bus CMSTR RCLK CMT Pre-scaler CMCNT CMCOR CMCSR Sub area Interrupt control [Legend] CMSTR: Compare match timer start register CMCSR: Compare match timer control/status register CMCNT: Compare match timer counter CMCOR: Compare match timer constant register Figure 15.1 Block Diagram of CMT

Section 15 Compare Match Timer (CMT) Rev. 1.00 Oct. 9, 2008 Page 132 of 336 REJ03B0272-0100

Section 16 Serial I/O (SIO) Rev. 1.00 Oct. 9, 2008 Page 133 of 336 REJ03B0272-0100 Section 16 Serial I/O (SIO) This LSI includes a serial I/O module (SIO).

16.1 Features

• Serial transfer 32-bit double-buffering (independent transmission/reception) Two separately settable strobe circuits Supports 7/8/9/12/14/16/17/20/24-bit I/O frame formats MSB/LSB-selectable for data transmission and reception Synchronization by either pulse or level
• Serial clock An external pin input (SIOMCK) or internal clock (Pφ) can be selected as the clock source.
• Interrupts: One type Transmission interrupt source Reception interrupt source Error interrupt source

Section 16 Serial I/O (SIO) Rev. 1.00 Oct. 9, 2008 Page 135 of 336 REJ03B0272-0100

16.2 Input/Output Pins

The pin configuration in this module is shown in table 16.1. Table 16.1 Pin Configuration Name Function I/O Description SIOTXD Transmit data Output Transmit data pin SIORXD Receive data Input Receive data pin SIOD Transmit/receive data I/O Transmit/receive data pin SIOSTRB0 Serial strobe 0 Output Synchronous signal pin, channel 0 (for transmission) SIOSTRB1 Serial strobe 1 Output Synchronous signal pin, channel 1 (for transmission) SIOSCK Serial clock Output Serial clock output pin (common to transmission and reception) SIOMCK Serial master clock Input Serial master clock input pin (Common to transmission and reception)

Section 16 Serial I/O (SIO) Rev. 1.00 Oct. 9, 2008 Page 136 of 336 REJ03B0272-0100

Section 17 Serial I/O with FIFO (SIOF) Rev. 1.00 Oct. 9, 2008 Page 137 of 336 REJ03B0272-0100 Section 17 Serial I/O with FIFO (SIOF) This LSI includes a clock-synchronized serial I/O module with FIFO (SIOF) of two channels. The SIOF can perform serial communication with a serial peripheral interface bus (SPI).

17.1 Features

• Serial transfer 16-stage 32-bit FIFOs (transmission and reception are independent of each other) Supports 8-bit data/16-bit data/16-bit stereo audio input/output MSB first for data transmission Supports a maximum of 48-kHz sampling rate Synchronization by either frame synchronization pulse or left/right channel switch Supports CODEC control data interface Connectable to linear, audio, or A-Law or μ-Law CODEC chip Supports both master and slave modes
• Serial clock An external pin input or internal clock (Pφ) can be selected as the clock source.
• Interrupts: One type
• DMA transfer Supports DMA transfer by a transfer request for transmission and reception
• SPI mode Fixed master mode can perform the full-duplex communication with the SPI slave devices continuously. Selects the falling/rising edge of the SCK as data sampling. Selects the clock phase of the SCK as a transmit timing. Possible to select three slave devices. The length of transmit/receive data is fixed to 8 bits.

Section 17 Serial I/O with FIFO (SIOF) Rev. 1.00 Oct. 9, 2008 Page 139 of 336 REJ03B0272-0100

17.2 Input/Output Pins

The pin configuration in this module is shown in table 17.1. Table 17.1 Pin Configuration Channel Pin Name Abbreviation* I/O Description SIOF0_MCK SIOFMCK Input Master clock input SIOF0_SCK (SCK) SIOFSCK (SCK) I/O* Serial clock (common to transmission/reception) SIOF0_SYNC (SS0) SIOFSYNC (SS0) I/O* Frame synchronous signal (common to transmission/reception) In SPI mode, this pin selects slave device 0. SIOF0_SS1 ( SS1) Output In SPI mode, this pin selects slave device 1. SIOF0_SS2 ( SS2) Output In SPI mode, this pin selects slave device 2. SIOF0_TXD SIOFTXD (MOSI) Output Transmit data SIOF0_RXD SIOFRXD (MISO) Input Receive data SIOF1_MCK SIOFMCK Input Master clock input SIOF1_SCK (SCK) SIOFSCK (SCK) I/O* Serial clock (common to transmission/reception) SIOF1_SYNC (SS0) SIOFSYNC (SS0) I/O* Frame synchronous signal (common to transmission/reception) In SPI mode, this pin selects slave device 0. SIOF1_SS1 ( SS1) Output In SPI mode, this pin selects slave device 1. SIOF1_SS2 ( SS2) Output In SPI mode, this pin selects slave device 2. SIOF1_TXD SIOFTXD (MOSI) Output Transmit data SIOF1_RXD SIOFRXD (MISO) Input Receive data Notes: 1. The channel number is omitted in the following descriptions, and SIOFMCK, SIOFSCK, SIOFSYNC, SIOFTXD, and SIOFRXD are used as generic terms. In SPI mode, SCK, SS0, SS1, SS2, MOSI, and MISO are used respectively. 2. In SPI mode, these pins function as output pins.

Section 17 Serial I/O with FIFO (SIOF) Rev. 1.00 Oct. 9, 2008 Page 140 of 336 REJ03B0272-0100

Section 18 Serial Communication Interface with FIFO (SCIF) Rev. 1.00 Oct. 9, 2008 Page 141 of 336 REJ03B0272-0100 Section 18 Serial Communication Interface with FIFO (SCIF) This LSI has a serial communication interface with on-chip FIFO buffers (Serial Communication Interface with FIFO: SCIF) of three channels. The SCIF can perform both asynchronous and clock synchronous serial communications. 16-stage FIFO buffers are provided for both transmission and reception, enabling fast, efficient, and continuous communication.

18.1 Features

The SCIF has the following features.

• Asynchronous mode Serial data communication is executed using an asynchronous system in which synchronization is achieved character by character. Serial data communication can be carried out with standard asynchronous communication LSIs, such as a Universal Asynchronous Receiver/Transmitter (UART) or Asynchronous Communication Interface Adapter (ACIA). There is a choice of 8 serial data communication formats. ⎯ Data length: 7 or 8 bits ⎯ Stop bit length: 1 or 2 bits ⎯ Parity: Even/odd/none ⎯ Receive error detection: Parity, framing, and overrun errors ⎯ Break detection: A break is detected when a framing error lasts for more than 1 frame length at space 0 (low level).
• Clock synchronous mode Serial data communication is synchronized with a clock. Serial data communication can be carried out with other LSIs that have a synchronous communication function. There is a single serial data communication format. ⎯ Data length: 8 bits ⎯ Receive error detection: Overrun errors

Section 18 Serial Communication Interface with FIFO (SCIF) Rev. 1.00 Oct. 9, 2008 Page 142 of 336 REJ03B0272-0100

• Full-duplex communication capability The transmitter and receiver are independent units, enabling transmission and reception to be performed simultaneously. The transmitter and receiver both have a 16-stage FIFO buffer structure, enabling continuous serial data transmission and reception.
• On-chip baud rate generator allows any bit rate to be selected.
• Choice of serial clock source: Internal clock from baud rate generator or external clock from SCIFCLK pin
• Four interrupt sources There are four interrupt sources for each channel—transmit-FIFO-data- empty, break, receive- FIFO-data-full, and receive-error—that can issue requests independently by each channel.
• The DMA controller (DMAC) can be activated to execute a data transfer by issuing a DMA transfer request in the event of a transmit-FIFO-data-empty or received DATA is in receive- FIFO.
• When not in use, the SCIF can be stopped by halting its clock supply to reduce power consumption.
• In asynchronous mode, modem control functions (SCIFRTS and SCIFCTS) are provided.
• The amount of data in the transmit/receive FIFO registers, and the number of receive errors in the receive data in the receive FIFO register, can be ascertained.
• In asynchronous mode, a timeout error (DR) can be detected during reception.

Section 18 Serial Communication Interface with FIFO (SCIF) Rev. 1.00 Oct. 9, 2008 Page 144 of 336 REJ03B0272-0100

18.2 Input/Output Pins

Table 18.1 shows the SCIF pin configuration. Table 18.1 Pin Configuration Channel Pin Name Function I/O Description SCIF0_TXD Transmit data Output Transmit data pin SCIF0_RXD Receive data Input Receive data pin SCIF0_SCK Serial clock Input/output Clock Input/output pin SCIF0_RTS Modem control Output RTS output pin SCIF0_CTS Modem control Input CTS input pin SCIF1_TXD Transmit data Output Transmit data pin SCIF1_RXD Receive data Input Receive data pin SCIF1_SCK Serial clock Input/output Clock Input/output pin SCIF1_RTS Modem control Output RTS output pin SCIF1_CTS Modem control Input CTS input pin SCIF2_TXD Transmit data Output Transmit data pin SCIF2_RXD Receive data Input Receive data pin SCIF2_SCK Serial clock Input/output Clock Input/output pin SCIF2_RTS Modem control Output RTS output pin SCIF2_CTS Modem control Input CTS input pin Notes: 1. The channel number is omitted in the following descriptions, and SCIFTXD, SCIFRXD, SCIFSCK, SCIFRTS, and SCIFCTS are used as generic terms. 2. These pins are made to function as serial pins by performing SCIF operation settings with the C/A bit in SCSMR, the TE, RE, and CKE1 bits in SCSCR, and the MCE bit in SCFCR. The SCIFCK pin can be set to be input (input valid or input ignored).

Section 19 SIM Card Module (SIM) Rev. 1.00 Oct. 9, 2008 Page 145 of 336 REJ03B0272-0100 Section 19 SIM Card Module (SIM) The smart card interface supports IC cards (smart cards) conforming to the ISO/IEC 7816-3 (Identification Card) specification.

19.1 Features

The smart card interface has the following features.

• General functions Asynchronous half-duplex transmission Protocol selectable between T = 0 and T = 1 modes Data length: 8 bits Parity bit generation and check Selectable character protection addition time N Selectable output clock cycles per etu Transmission of error signal (parity error) in receive mode when T = 0 Detection of error signal and automatic character retransmission in transmit mode when T = 0 Selectable minimum character interval of 11 etu (N = 255) when T = 1 (etu: Elementary Time Unit) Selectable direct convention/inverse convention Output clock can be fixed at high or low
• Freely selectable bit rate by on-chip baud rate generator
• Four types of interrupt source The four interrupt sources, transmit data empty, receive data full, transmit/receive error, and transmit complete, can be requested separately.
• DMA transfer Through DMA transfer requests for transmit data empty and receive data full, the direct memory access controller (DMAC) can be started and used for data transfer.
• The time waiting for the operation when T = 0, and the time waiting for a character when T = 1 can be observed.

Section 19 SIM Card Module (SIM) Rev. 1.00 Oct. 9, 2008 Page 147 of 336 REJ03B0272-0100

19.2 Input/Output Pins

The pin configuration of the smart card interface is shown in table 19.1. Table 19.1 Pin Configuration Pin Name Function I/O Description SIM_D* Smart card data I/O Smart card data input/output SIM_CLK Smart card clock Output Smart card clock output SIM_RST Smart card reset Output Smart card reset output Note: * In explaining transmit and receive operations, the transmit data and receive data sides shall be referred to as TXD and RXD, respectively.

Section 19 SIM Card Module (SIM) Rev. 1.00 Oct. 9, 2008 Page 148 of 336 REJ03B0272-0100

Section 20 IrDA Interface (IrDA) Rev. 1.00 Oct. 9, 2008 Page 149 of 336 REJ03B0272-0100 Section 20 IrDA Interface (IrDA) The IrDA interface (IrDA) performs infrared data communication conforming to IrDA standard 1.2a through an external infrared transceiver unit connected to this LSI. The IrDA includes a UART block to control data transmission and reception as well as an infrared transmit and receive (light-emit and light-receive) pulse modulator/demodulator block and a CRC engine block in front of the UART. The UART block controls serial data transmission and reception in the asynchronous mode. The infrared transmit and receive pulse modulator/demodulator block controls communication pulses and checks pulses received through infrared baseband modulation/demodulation conforming to IrDA standard 1.2a. The CRC engine block reads 8-bit input data and outputs a 16-bit CRC calculation result.

20.1 Features

The IrDA has the following UART features.

• Asynchronous serial communication ⎯ Data length: Eight bits ⎯ Stop bit: One bit ⎯ Parity bit: None
• Reception error detection: Overrun error and framing error
• Baud rate error correction: 16 decimal fractions can be selected.
• Baud rate count: Up to 65536 can be specified. The IrDA has the following infrared transmit and receive pulse modulator/demodulator features.
• Infrared transmit (light-emit) pulse width: 1-bit width × 3/16 or 1.63 μs can be selected.
• Pulse width check: An out-of-standard pulse (insufficient or excess width) can be detected.
• 1.8432-MHz clock generator ⎯ Up to 16 can be specified for the integer part of the baud rate count. ⎯ The fraction part can be selected from 16 values.

Section 20 IrDA Interface (IrDA) Rev. 1.00 Oct. 9, 2008 Page 150 of 336 REJ03B0272-0100 The IrDA has the following CRC calculation features.

• Generator polynomial: X + X + X + 1
• Data input ⎯ Input in bytes ⎯ CRC is calculated in 8-bit units starting from the lower bits.
• CRC output: 16-bit CRC is output.
• Maximum data length: 4096 bytes Figure 20.1 shows a block diagram of the IrDA. UART block UART transmit signal Infrared transmit and receive pulse modulator/demodulator block UART receive signal Clock (baud rate × 16) Infrared transmit pulse Infrared receive pulse SCLK CRC engine block IrDA interface MSFCLK_IN TXDTXD MSFCLK_OUT RXD RXD IROUT IRIN Infrared transceiver Internal data bus (IrDA) Figure 20.1 Block Diagram of IrDA

20.2 Input/Output Pins

Table 20.1 shows the IrDA pin configuration. Table 20.1 Pin Configuration Pin Name Abbreviation I/O Function IrDA_IN IRIN Input Infrared receive (light-receive) pulse input (negative logic) IrDA_OUT IROUT Output Infrared tr ansmit (light-emit) pulse output (positive logic)

C Bus Interface (IIC) Rev. 1.00 Oct. 9, 2008 Page 151 of 336 REJ03B0272-0100 Section 21 I C Bus Interface (IIC) This LSI has an I C bus interface of one channel. Each I C bus interface uses only one data line (SDA) and one clock line (SCL) to transfer data, saving board and connector space.

21.1 Features

• Start and stop conditions generated automatically
• Selection of acknowledge output levels when receiving
• Automatic loading of acknowledge bit when transmitting
• Data transfer conforming to the I C format
• Wait function A wait can be inserted by driving the SCL pin low after data transfer, excluding acknowledgement. The wait can be cleared by clearing the interrupt flag.
• I C module corresponds to single master bus only This module is always in master mode. Since the slave mode is not incorporated, operation stops with bus open during loss of arbitration in data transfer.
• Four interrupt sources ⎯ Data transfer enable ⎯ Wait state ⎯ Non-acknowledge detection ⎯ Arbitration lost (operation stops with bus open when bus conflict is detected)
• Data transfer speed ⎯ Standard mode (100 kHz) and high-speed mode (400 kHz) ⎯ SCL clock can be set by clock control register setting
• Clock synchronous processing of SCL line A hazard (spike noise) generated in the high-count period by SCL is detected as an arbitration loss. Figure 21.1 shows a block diagram of the I C bus interface.

C Bus Interface (IIC) Rev. 1.00 Oct. 9, 2008 Page 153 of 336 REJ03B0272-0100

21.2 Input/Output Pins

Table 21.1 summarizes the input/output pins used by the I C bus interface. Table 21.1 I C Bus Interface Pins Abbreviation Function I/O Description SCL (O/D) I C clock input/ output I/O I C bus clock input/output pin Equipped with the bus drive function. The output format is the NMOS open-drain. SDA (O/D) I C data input/ output I/O I C bus data input/output pin Equipped with the bus drive function. The output format is the NMOS open-drain.

C Bus Interface (IIC) Rev. 1.00 Oct. 9, 2008 Page 154 of 336 REJ03B0272-0100

Section 22 AND/NAND Flash Memory Controller (FLCTL) Rev. 1.00 Oct. 9, 2008 Page 155 of 336 REJ03B0272-0100 Section 22 AND/NAND Flash Memory Controller (FLCTL) The AND/NAND flash memory controller (FLCTL) provides interfaces for an external AND-type flash memory and NAND-type flash memory. To take measures for errors specific to flash memory, the FLCTL supports the ECC-code generation function and error detection function. For supporting the flash memory using the multiple level cell (MLC) technology, the FLCTL has an ECC circuit capable of up to four- symbol ECC-code generation, error detection, and hardware error correction pattern circuit in addition to the three-symbol ECC detection circuit incorporated in the previous-version FLCTL.

22.1 Features

(1) AND-Type Flash Memory Interface

• Interface directly connectable to AND-type flash memory
• Read or write in sector units (512 + 16 bytes) and ECC processing executed An access unit of 2048 + 64 bytes, referred to as a page, is used in some datasheets for AND- type flash memory. In this manual, an access unit of 512 + 16 bytes, referred to as a sector, is always used.
• Read or write in byte units
• Supports addresses of up to 5 bytes Note: An access unit of 512 + 16 bytes is referred to as a page in some AND-type flash memory datasheets. In this manual, however, an access unit of 512 + 16 bytes is referred to as a sector. For a product in which 2048 + 64 bytes are referred to as a page, the page is described as four sectors in this manual because 2048 + 64 bytes divided by 512 + 16 bytes (one sector) is four sectors. (2) NAND-Type Flash Memory Interface
• Interface directly connectable to NAND-type flash memory
• Read or write in sector units (512 + 16 bytes) and ECC processing executed
• Read or write in byte units
• Supports addresses of up to 5 bytes

Section 22 AND/NAND Flash Memory Controller (FLCTL) Rev. 1.00 Oct. 9, 2008 Page 156 of 336 REJ03B0272-0100 Note: An access unit of 512 + 16 bytes is referr ed to as a page in some NAND-type flash memory data sheets. In this manual, however, an access unit of 512 + 16 bytes is referred to as a sector. For a product in which 2048 + 64 bytes are referred to as a page, the page is described as four sectors in this manual because 2048 + 64 bytes divided by 512 + 16 bytes (one sector) is four sectors. (3) Access Modes The FLCTL can select one of the following two access modes.

• Command access mode: Performs an access by specifying a command to be issued from the FLCTL to flash memory, address, and data size to be input or output. Read, write, or erasure of data without ECC processing can be achieved.
• Sector access mode: Performs a read or write in physical sector units by specifying a physical sector and controls ECC-code generation and check. By specifying the number of sectors, the continuous physical sectors can be read or written.
• While using sector access mode, specify the start address of a page as a value to be set in the address register. Continuous access from an address in the middle of the page is not guaranteed. (4) Sectors and Control Codes
• A sector is comprised of 512-byte data and 16-byte control code. The 16-byte control code includes 8-byte ECC.
• When the four-symbol ECC circuit is used, 10 bytes of ECC are included.
• The position of the ECC in the control code can be specified in 4-byte units.
• When the four-symbol ECC circuit is used, the user can write data to the 0th to 5th bytes of the control area.
• User information can be written to the control code other than the ECC.

Section 22 AND/NAND Flash Memory Controller (FLCTL) Rev. 1.00 Oct. 9, 2008 Page 157 of 336 REJ03B0272-0100 (5) Three-Symbol ECC

• 8-byte ECC code is generated and error check is performed for a sector (512-byte data + 16- byte control code). Note that the ECC code generation in the 16-byte control code and the number of bytes to be checked differ depending on the specifications.
• Error correction capability is up to three errors.
• In a write operation, an ECC code is generated for data and control code prior to the ECC. The control code following the ECC is not considered.
• In a read operation, an ECC error is checked for data and control code prior to the ECC. An ECC on the control code in the FIFO is replaced with the check result by the ECC circuit, not an ECC code read from flash memory.
• An error correction is not performed even when an ECC error occurs. Error corrections must be performed by software. (6) Four-Symbol ECC
• 80 bits (10 bytes) of ECC codes are added for a sector (512-byte data + 6-byte control code).
• Up to four errors can be detected and corrected in a random order (up to 40 bits).
• In a write operation, an ECC code is generated for data and control codes prior to the ECC.
• In a read operation, an ECC error is checked for data and control code prior to the ECC. Some part of the control area in the FIFO is used as a work area for the four-symbol ECC. Bytes 6th to 15th of the control area data that are saved are thus invalid.
• The four-symbol ECC circuit in the FLCTL can generate error correction patterns by hardware. The error correction pattern generation is executed for each sector.
• When the hardware error correction is performed, addresses indicating the error positions and error correction patterns are output. Data must be replaced by software. (7) Data Error
• When a program error or erase error occurs, the error is reflected on the error source flags. Interrupts for each source can be specified.
• When a read error occurs, an ECC in the control code is other than 0. This read error is reflected on the ECC error source flag.
• When an ECC error occurs, perform an error correction, specify another sector to be replaced, and copy the contents of the block to another sector as required.

Section 22 AND/NAND Flash Memory Controller (FLCTL) Rev. 1.00 Oct. 9, 2008 Page 158 of 336 REJ03B0272-0100 (8) Data Transfer FIFO and Data Register

• The 224-byte FLDTFIFO is incorporated for data transfer of flash memory.
• The 32-byte FLECFIFO is incorporated for data transfer of control code.
• The overrun/underrun detection flag is provided for the access from the CPU and DMA. (9) DMA Transfer
• By individually specifying the destinations of data and control code of flash memory to the DMA controller, data and control code can be sent to different areas. (10) Access Size
• Registers can be accessed in 32 bits or 8 bits. Registers must be accessed in the specified access size.
• The FIFO is accessed in 32-bit (4-byte) units. If reading/writing is performed with the number of bytes that is not a multiple of four, the fractional bytes are treated as padding data.
• When an access is performed with an illegal size, the register contents are destroyed. (11) Access Time
• The FLCTL pins operate with the clock FLCK which is generated by dividing the frequency of the peripheral clock Pφ. The division ratio can be specified by the FCKSEL bit and the QTSEL bit in the common control register (FLCMNCR).
• In NAND-type flash memory, the FSC and FWE pins operate with the FCLK. In AND-type flash memory, the FSC pin operates with the FCLK and the FWE pin operates with the FCLK. To secure the setup time, these operating frequencies must be specified within the maximum operating frequency of memory to be connected.

Section 22 AND/NAND Flash Memory Controller (FLCTL) Rev. 1.00 Oct. 9, 2008 Page 160 of 336 REJ03B0272-0100

22.2 Input/Output Pins

The pin configuration of the FLCTL is listed in table 22.1. Table 22.1 Pin Configuration Corresponding Flash Memory Pin Pin Name Function I/O NAND Type AND Type Description FCE Chip enable Output CE CE Enables flash memory connected to this LSI. NAF7 to NAF0 Data I/O pins I/O I/O7 to I/O0 I/O7 to I/O0 I/O pins for command, address, and data. FCDE Command data enable Output CLE CDE Command Latch Enable (CLE) Asserted when a command is output. Command Data Enable (CDE) Asserted when a command is output. FOE Output enable Output ALE OE Address Latch Enable (ALE) Asserted when an address is output and negated when data is input or output. Output Enable (OE) Asserted when data is input or when a status is read. FSC Serial clock Output RE SC Read Enable (RE) Reads data at the falling edge of RE. Serial Clock (SC) Inputs or outputs data synchronously with the SC. FWE Write enable Output WE WE Write Enable Flash memory latches a command, address, and data at the rising edge of WE. FRB Ready/busy Input R/B R/ B Ready/Busy Indicates ready state at high level; indicates busy state at low level. —* — — WP RES Write Protect/Reset When this pin goes low, erroneous erasure or programming at power on or off can be prevented. —* — — SE — Spare Area Enable Used to access spare area. This pin must be fixed at low in sector access mode. Note: * Not supported in this LSI.

Section 23 Realtime Clock (RTC) Rev. 1.00 Oct. 9, 2008 Page 161 of 336 REJ03B0272-0100 Section 23 Realtime Clock (RTC) This LSI has a realtime clock (RTC).

23.1 Features

• Clock and calendar functions (BCD format): Seconds, minutes, hours, date, day of the week, month, and year
• 1-Hz to 64-Hz timer (binary format) 64-Hz counter indicates the state of the RTC divider circuit between 64 Hz and 1 Hz
• Start/stop function
• 30-second adjust function
• Alarm interrupt: Frame comparison of seconds, minutes, hours, date, day of the week, month, and year can be used as conditions for the alarm interrupt
• Periodic interrupts: the interrupt cycle may be 1/256 second, 1/64 second, 1/16 second, 1/4 second, 1/2 second, 1 second, or 2 seconds
• Carry interrupt: a carry interrupt indicates when a carry occurs during a counter read
• Automatic leap year adjustment Note: This LSI does not have a separate power supply for the RTC. The RTC has the same power supply as that for input and output (VccQ and VssQ). Operating the RTC alone by shutting down the other power supplies is thus not possible.

Section 23 Realtime Clock (RTC) Rev. 1.00 Oct. 9, 2008 Page 163 of 336 REJ03B0272-0100

23.2 Input/Output Pin

Table 23.1 shows the RTC pin configuration. Table 23.1 Pin Configuration Name Abbreviation I/O Function External clock for RTC EXTAL_RTC Input Inputs the 32.768-kHz clock for RTC.

Section 23 Realtime Clock (RTC) Rev. 1.00 Oct. 9, 2008 Page 164 of 336 REJ03B0272-0100

Section 24 Video Processing Unit (VPU) Rev. 1.00 Oct. 9, 2008 Page 165 of 336 REJ03B0272-0100 Section 24 Video Processing Unit (VPU) The video processing unit (VPU) encodes and decodes bit streams conforming to the MPEG-4 standard (ISO/IEC 14496). The VPU supports the simple profile (MPEG-4SP), advanced simple profile (MPEG-4ASP), short header, and AVC baseline profile, which are specified in the MPEG-4 video standard. In this section, the simple profile, advanced simple profile, and short header are referred to as MPEG-4, and the AVC baseline profile as AVC.

24.1 Features

The VPU provides the following features.

• Dynamic timeslot method (DTME) The slot lengths of the pipeline being processed can be changed dynamically depending on the bus state. This makes it possible to maintain the minimum processing time when the volume of bus traffic is large.
• VOP encoding for MPEG-4 and AVC Images in memory are encoded for each video object plane (VOP) for MPEG-4 and for each slice for AVC, and a bit stream is generated. B-VOP encoding (bidirectional search) for MPEG and multi-reference encoding (two-plane) for AVC are supported. For AVC encoding, search in units of 1/4 pixel for an 8 × 8 block (minimum) is possible. With adaptive realtime motion estimation (ARME), the quality of motion estimation can be enhanced by expanding the search range and increasing the search count (common to MPEG-4 and AVC). With predict from original image (POI), an intra prediction mode allowing search at realtime is available (for AVC). With active skip prediction (ASP), controlling search to increase the number of skipped macroblocks improves the image quality at a low bit rate (for AVC). With custom weighted quantization (CWQ), code amount control is available for each macroblock (MB) in a plane to be encoded. When encoding a portrait, as an example, weighted codes in the center of the image can enable more detailed expression.

Section 24 Video Processing Unit (VPU) Rev. 1.00 Oct. 9, 2008 Page 166 of 336 REJ03B0272-0100

• Decoding for MPEG-4 and AVC A bit stream is read from memory. For MPEG-4, the stream data is decoded for each VOP, and for AVC, the stream data is decoded for each slice. Multiple concealment modes are supported for concealing areas and block boundaries where an error has occurred.
• Deblocking filter A deblocking filtered image can be output for both a decoded image and a local decode image when encoding.
• Video header search for MPEG-4 A bit stream is read from the memory and the next start code is detected. Table 24.1 shows the VPU basic specifications. Note that the video syntax layer to be accelerated differs for each profile in the VPU. For details, see table 24.2. Table 24.1 VPU Basic Specifications
• Decoding Applicable Standard MPEG-4 Simple Profile L2 MPEG-4 Advanced Simple Profile L3 AVC/H.264 (Baseline & Main)@L2.1 Maximum 352 × 288 (CIF) 640 × 480 (VGA) 640 × 480 (VGA) Minimum 48 × 48 48 × 48 48 × 48 Image size Unit of size Four horizontal pixels and four vertical pixels Four horizontal pixels and four vertical pixels 16 horizontal pixels and 16 vertical pixels* Bit rate 384 kbps 8 Mbps 8 Mbps Supported type I and P: VOP I, P, and B: VOP IDR, I, and P: Slice Supported format 4:2:0 4:2:0 4:2:0 General specifications Supported structure Progressive Progressive Interlace Progressive

Section 24 Video Processing Unit (VPU) Rev. 1.00 Oct. 9, 2008 Page 167 of 336 REJ03B0272-0100 Applicable Standard MPEG-4 Simple Profile L2 MPEG-4 Advanced Simple Profile L3 AVC/H.264 (Baseline & Main)@L2.1 Supported MV UMV 4MV UMV 4MV DirectB UMV 1 to 16MV Unit of MV 1/2 pixel 1/2 pixel 1/4 pixel Maximum detection range Horizontal position −2048 to +2047 Horizontal position −2048 to +2047 Horizontal position −2048 to +2047 Detection mode ⎯ ⎯ ⎯ Unit of processed blocks 8 × 8 or 16 × 16 8 × 8 or 16 × 16 4 × 4 to 16 × 16 Number of reference planes 1 2 16 ME/MC Deblocking filter Output in parallel with post- processing Output in parallel with post-processing Output to inside of loop Prediction Mode IntraDC/AC IntraDC/AC IntraDC/V/H/Diag Q/IQ Mode Type 1 or type 2 Type 1 or type 2 IntDCT + QHadamard VLC Error resilience Resync marker Data partitioning Reversible VLC (no inverse decoding) Error concealment Resync marker Data partitioning Reversible VLC (no inverse decoding) Error concealment Error concealment Others Short header vop_coded = 1 only supported ⎯ ⎯ [Legend] ME: Motion estimation MC: Motion compensation Q: Quantization IQ: Inverse quantization VLC: Variable length coding and decoding Note: * Cropping is not performed, and it is always output as a 16-pixel image.

Section 24 Video Processing Unit (VPU) Rev. 1.00 Oct. 9, 2008 Page 168 of 336 REJ03B0272-0100

• Encoding Applicable Standard MPEG-4 Simple Profile L2 MPEG-4 Advanced Simple Profile L3 AVC/H.264 (Baseline & Main)@L2.1 Maximum 352 × 288 (CIF) 640 × 480 (VGA) 640 × 480 (VGA) Minimum 48 × 48 48 × 48 48 × 48 Image size Unit of size Four horizontal pixels and four vertical pixels Four horizontal pixels and four vertical pixels Four horizontal pixels and four vertical pixels Bit rate 384 kbps 8 Mbps 8 Mbps Supported type I and P: VOP I, P, and B: VOP IDR, I, and P: Slice Supported format 4:2:0 4:2:0 4:2:0 General specifications Supported structure Progressive Progressive Progressive Supported MV UMV UMV UMV 1 to 4MV Unit of MV 1/2 pixel 1/2 pixel 1/4 pixel Maximum detection range ±32 ±32 ±32 Detection mode Tracking type Tracking type Tracking type Unit of processed blocks 16 × 16 16 × 16 8 × 8 to 16 × 16 Number of reference planes 1 2 2 ME/MC Deblocking filter ⎯ ⎯ Output to inside of loop Prediction Mode IntraDC/AC IntraDC/AC IntraDC/V/H/Diag Q/IQ Mode Type 1 or type 2 Type 1 or type 2 IntDCT + QHadamard VLC Error resilience Resync marker Data partitioning Reversible VLC Resync marker Data partitioning Reversible VLC Others Short header ⎯ ⎯ [Legend] ME: Motion estimation MC: Motion compensation Q: Quantization IQ: Inverse quantization VLC: Variable length coding and decoding

Section 24 Video Processing Unit (VPU) Rev. 1.00 Oct. 9, 2008 Page 169 of 336 REJ03B0272-0100 Table 24.2 VPU Covered Processings Units of Processing Encoding Decoding MPEG-4 ASP MPEG-4SP VOP Video packet GOB Macroblock Block VOP Video packet GOB Macroblock Block MPEG-4 AVC I-slice P-slice IDR-slice Note: Slice header cannot be encoded. I-slice P-slice IDR-slice Note: Slice header cannot be decoded. [Legend] VOP: Video object plane GOB: Group of block IDR: Instantaneous decoding refresh in raw byte sequence payload (RBSP)

Section 25 Video I/O (VIO) Rev. 1.00 Oct. 9, 2008 Page 171 of 336 REJ03B0272-0100 Section 25 Video I/O (VIO) Note: This section contains references to the SH7722 Hardware Manual. The contents of the SH7722 Hardware Manual will be disclosed upon acceptance of a confidentiality agreement. For details, please contact a Renesas Technology sales representative. This LSI incorporates a video I/O (VIO) module that can be used to perform capturing of an externally input image, format conversion of a YCbCr/RGB image, scaling, tone reduction, and blending of displays.

25.1 Features

The VIO consists of a capture engine unit (CEU), a video engine unit (VEU), and a blending engine unit (BEU). The features of each unit are listed below. (1) CEU (Capture Engine Unit) The CEU is a capture module that fetches image data externally input and transfers it to the memory. The CEU is connected to the system bus via bus bridge modules. (2) VEU (Video Engine Unit) The VEU is a module used connected to the buses via bus bridge modules. The VEU reads an image from a specified memory area, and writes it back to a specified address.

• Format conversion using the RGB ↔ YCbCr conversion function
• Scaling of an image using the filter function
• Tone reduction (quantization) to pack RGB data in 32-bit units
• Dithering for tone reduction of RGB data
• Removal of high-frequency components using the low-pass filter function
• Low-pass filter is applied to only the boundary of the blocks using the deblocking filter function
• Median filter function
• Edge enhancement of an image (enhancer function)

Section 25 Video I/O (VIO) Rev. 1.00 Oct. 9, 2008 Page 172 of 336 REJ03B0272-0100 (3) BEU (Blending Engine Unit) The BEU is a module used connected to the buses via bus bridge modules, and also connected to the VOU and the LCDC. The BEU blends three displays, and has a multiwindow function that displays four windows overlaying the blended display.

• Supports Video display
• Supports OSD (On Screen Display)
• Supports Graphic display
• Blends the three planes of Video1, Video2, and OSD/Graphic
• The three displays can be blended at desired positions.
• Any one of the three inputs can be used as the parent display.
• The location of a child display can overflow from the parent display, but the overflowed area is not output.
• Raster operation 2 function
• Multiwindow function (four windows are displayed overlaying the three blended displays)
• Selection between output to the memory, output to the VOU, output to the LCDC, and simultaneous output to the memory and VOU or LCDC

Section 25 Video I/O (VIO) Rev. 1.00 Oct. 9, 2008 Page 174 of 336 REJ03B0272-0100

25.2 Functional Overview of CEU

The CEU (Capture Engine Unit) is a capture module that fetches image data externally input and transfers it to the memory. The CEU is connected to the system bus via bus bridge modules. The functional overview of the CEU is shown in table 25.1, and the main functions and their details are shown in table 25.2. Table 25.1 Functional Overview of CEU Classification Item Function Description Note 5M pixels 2560 pixels × 1920 lines 3M pixels 2048 pixels × 1536 lines 2M pixels 1632 pixels × 1224 lines UXGA 1600 pixels × 1200 lines SXGA (1) 1280 pixels × 1024 lines SXGA (2) 1280 pixels × 960 lines XGA 1024 pixels × 768 lines SVGA 800 pixels × 600 lines VGA 640 pixels × 480 lines CIF 352 pixels × 288 lines QVGA 320 pixels × 240 lines QCIF 176 pixels × 144 lines QQVGA 160 pixels × 120 lines Connectable camera Size Sub-QCIF 128 pixels × 96 lines Horizontal: 4-pixel units Vertical: 4-line units Cb0, Y0, Cr0, Y1… Cr0, Y0, Cb0, Y1… Y0, Cb0, Y1, Cr0… YCbCr 4:2:2 8 bits Y0, Cr0, Y1, Cb0… Input format YCbCr 4:2:2 16 bits {Y0, Cr0}, {Y1, Cb0}, … Supports clock ratio of 1:1

Section 25 Video I/O (VIO) Rev. 1.00 Oct. 9, 2008 Page 175 of 336 REJ03B0272-0100 Classification Item Function Description Note Specified amount to be fetched on edges of the sync signal Connectable camera Input format Binary data Data is fetched with the horizontal sync signal as an enable signal. Written sequentially Horizontal and vertical sync signal polarities Arbitrary High-active and low-active Capture start location Arbitrary Can be specified in camera input clock units Horizontal: 1-cycle units Vertical: 1-HD (horizontal sync signal) units Number of captured pixels Arbitrary Can be specified in 4-pixel units horizontally and in 4- line units vertically Stored as a field image Interlace Both-field capture Stored as a frame image Capture: 2-VD (vertical sync signal) units One-field capture Top field or bottom field can be specified Capture: 1-VD units Memory write Output format YCbCr 4:2:2 YCbCr 4:2:0 YCbCr 4:2:0 is realized by simple skipping Strobe function Strobe control Automatic mode Emission time is controlled by the emission start counter, strobe exposed signal, or vertical sync signal Emission start = Register setting Emission stop = Strobe exposed signal Emission start = Register setting Emission stop = Register setting Emission start = Vertical sync signal Emission stop = Vertical sync signal Manual mode Emission pin is controlled by modifying the register Emission start = Modifying the register Emission stop = Clearing the register

Section 25 Video I/O (VIO) Rev. 1.00 Oct. 9, 2008 Page 176 of 336 REJ03B0272-0100 Classification Item Function Description Note No scaling or scale-down Scale-down of captured display Desired scaling factor from 1/16 to 1 (scaled-down display must not exceed VGA) Filter function Low-pass filter Removal of high-frequency components Only in the horizontal direction Display information acquisition Complexity level Acquisition of complexity level of captured display Variation of pixel values is indicated Used for MPEG-4 16-line units, 8-line units, or 1-display units can be selected Table 25.2 Main Functions of CEU and Their Details Main Function Detailed Description Image data fetch • Captures an image output from an external module and writes YCbCr data to the memory with it separated into Y data and CbCr data.

• Fetches image data other than YCbCr data, e.g. JPEG data, from an externally connected module, such as a camera, and sequentially writes the image data to the memory.
• Fetches an interlace source image in both-field units or one-field units and writes it to the memory. In both-field capture, an image can be stored in the memory as a frame image. Filter processing Performs scale-down and re moval of high-frequency components (only in the horizontal direction) for an image using internal filters. Note that the scaled-down image must not exceed VGA. The filter processing can be applied to only YCbCr input data. Display information acquisition Acquires the complexity level of the captured display and writes it to the memory. This information output at MPEG-4 encoding is useful for determining the scene change. Format conversion Converts image data input in the YCbCr 4:2:2 format into the YCbCr 4:2:0 format and writes it to the memory. Note that the conversion algorithm is simple skipping in which the chrominance component (CbCr) of the even-numbered lines is skipped. Strobe control Controls the emission signal by a register or an external signal.

Section 25 Video I/O (VIO) Rev. 1.00 Oct. 9, 2008 Page 177 of 336 REJ03B0272-0100 Figure 25.2 shows a block diagram of the CEU. Camera Filter block (FLB) Capture interface block (CIB)Strobe Data arrangement block (DAB) Register block (RGB) Write buffer block (WBB) Bus-bridge interface block (BIB) Bus bridge Figure 25.2 Block Diagram of CEU

25.3 Pin Configuration of CEU

The pin configuration of the CEU is shown in table 25.3. Table 25.3 Pin Configuration of CEU Pin Name Function I/O Description VIO_D15 to VIO_D8/ VIO_D7 to VIO_D0 VIO data bus Input Camera image data input to the VIO VIO_CLK/VIO_CLK2 VIO clock Input Camera clock input to the VIO VIO_VD/VIO_VD2 VIO vertical sync Input Camera vertical sync signal input to the VIO VIO_HD/VIO_HD2 VIO horizontal sync Input Camera horizontal sync signal input to the VIO VIO_STEM Strobe emission Output Strobe emission signal VIO_STEX Strobe exposed Input Strobe exposed signal VIO_FLD Field signal Input Field identification signal VIO_CKO Camera clock output Output Clock output to the camera

Section 25 Video I/O (VIO) Rev. 1.00 Oct. 9, 2008 Page 178 of 336 REJ03B0272-0100

Section 26 JPEG Processing Unit (JPU) Rev. 1.00 Oct. 9, 2008 Page 179 of 336 REJ03B0272-0100 Section 26 JPEG Processing Unit (JPU) The JPEG processing unit (JPU) incorporates the JPEG codec with an encoding and decoding function conforming to the JPEG baseline process, so that the JPU can encode image data and decode JPEG data quickly. For the encoding and decoding processes, frame buffers or line buffers for raster block conversion are necessary in an external buffer (such as an SDRAM) which is externally connected to the LSI.

26.1 Features

The JPU has the following features.

• Conforming specification: JPEG baseline
• Operating precision: Conforming to JPEG Part 2, ISO-IEC10918-2
• Color format: YCbCr 4:2:2 (H = 2:1:1, V = 1:1:1), YCbCr 4:2:0 (H = 2:1:1, V = 2:1:1)
• Quantization tables: Four tables
• Huffman tables: Four tables (two AC tables, two DC tables)
• Target markers: Start of image (SOI), start of frame type 0 (SOF0), start of scan (SOS), define quantization tables (DQT), define Huffman tables (DHT), define restart interval (DRI), restart (RSTm), end of image (EOI)
• Image data rate: Maximum 133 Mbytes/s (66.7 MHz operation)
• The frame buffer can be reduced from the RAM area such as the SDRAM by using line buffer mode. This mode cannot be used with some pixel clock frequencies of the camera sensor or RAM bandwidth.
• Image rotation (by 90°, 180°, or 270°) can be performed in the encoding process (only in frame buffer mode).
• In reload mode, address toggling at every transfer of a specified amount of data during stream reading and writing is supported so that the buffer capacity can be reduced.
• Processing unit: 8-byte address boundary, 4-byte data length Note that the output data size during encoding is determined by the 16-byte boundary at the end of the address.
• Processable image size: Minimum 16 (horizontal) × 16 (vertical) pixels Image is processed in 4-pixel units.

Section 27 LCD Controller (LCDC) Rev. 1.00 Oct. 9, 2008 Page 181 of 336 REJ03B0272-0100 Section 27 LCD Controller (LCDC) The LCD controller (LCDC) reads display data from an external memory or receives display data from the blend engine unit (BEU). The LCDC uses the palette memory to determine the colors according to the settings and then sends the data to the LCD module. This LCDC allows connection of TFT LCD modules that support the RGB interface or the 80-Series CPU's bus interface (SYS interface). (However, LCD modules with the NTSC/PAL type or LVDS interface cannot be connected.)

27.1 Features

The LCDC has the following features.

• Supports TFT LCD modules
• LCD module interface RGB interface (8/9/12/16/18/24-bit bus width) 80-Series CPU's bus interface (SYS interface, 8/9/12/16/18/24-bit bus width)
• SYS interface supports the following input/output mode for the main and sub LCD module Main LCD module: VSYNC input and output modes Sub LCD module: VSYNC input and output modes
• Supports 8/12/16/18/24-bpp display image data formats
• Display image data is read in continuous or one-shot mode: continuous mode where display image data is continuously read according to the refresh rate of the LCD module and one-shot mode where display image data is read at intervals of the frame rate.
• Display image data is read in full or partial screen mode: full screen mode where the size of the display image data to be read depends on the panel size of the LCD module and partial screen mode where the size of the display image data to be read depends on the size of the screen to be updated.
• Display image data can be written back to the external memory
• Each of the RGB colors can be corrected by the 256-entry, 24-bit-input/output internal color palette memory
• Supports inversion of output signals to agree with the LCD module's signal polarity
• Interrupts can be generated every frame or user-specified line
• YCbCr signals are read and converted into RGB signals for output to the LCD module

Section 27 LCD Controller (LCDC) Rev. 1.00 Oct. 9, 2008 Page 182 of 336 REJ03B0272-0100 Table 27.1 shows the LCDC functions. Table 27.1 LCDC Functions Function Remakes 8 bpp RGB 332 Input data format 12 bpp RGB 444 16 bpp RGB 565 18 bpp RGB 666 BGR 666 24 bpp RGB 888 BGR 888 YCbCr YCbCr 4:2:0, 4:2:2, 4:4:4 RGB interface RGB8 3 cycle/pixel Output data format RGB9 2 cycle/pixel RGB12a 2 cycle/pixel RGB12b 1 cycle/pixel RGB16 1 cycle/pixel RGB18 1 cycle/pixel RGB24 1 cycle/pixel SYS interface SYS8a 3 cycle/pixel SYS8b 3 cycle/pixel SYS8c 2 cycle/pixel SYS8d 2 cycle/pixel SYS9 2 cycle/pixel SYS12 2 cycle/pixel SYS16a 1 cycle/pixel SYS16b 2 cycle/pixel SYS16c 2 cycle/pixel SYS18 1 cycle/pixel SYS24 1 cycle/pixel WB8a Display data write-back WB8d WB9 WB16 WB18 WB24

• Packed format available
• Write-back operation in units of 32 bits
• Byte or word swap

Section 27 LCD Controller (LCDC) Rev. 1.00 Oct. 9, 2008 Page 183 of 336 REJ03B0272-0100 Function Remakes LCD driver interface RGB interface Interface with HSYNC and VSYNC

• Polarity inversion
• Output pulse width and position setting SYS interface 80-Series bus interface
• Support of VSYNC input/output
• Sub LCD connectable Dot clock Source clock Bus clock, peripheral clock, external clock Division ratio n/m m = 60, 54, 48, 42 1 ≤ n ≤ m/3, m/2 Interrupt User setting Interrupt generated when reading of specified lines of data is completed Frame Interrupt generated when the first pixel data of a frame starts to be output Interrupt generated when output of the last pixel data of a frame is completed VRAM read Interrupt generated when access to a frame of data in VRAM is completed Interrupt generated when access to a line of data in VRAM is completed VSYNC Interrupt generated when VSYNC is asserted Interrupt generated when VSYNC is negated Display image Image data read Image data read depending on the refresh rate of LCD module Image data read depending on the frame rate of display image Display image size Full screen Only the specified area is updated. Image data processing Each color of R, G, and B is converted using the color palette
• 256 entries
• 24-bit input/output Format conversion YCbCr to RGB YCbCr data is converted into RGB for output.

Section 27 LCD Controller (LCDC) Rev. 1.00 Oct. 9, 2008 Page 185 of 336 REJ03B0272-0100

27.2 Input/Output Pins

Table 27.2 shows the pin configuration of the LCDC. Table 27.2 Pin Configuration Name Function I/O Description LCDDON/ LCDDON2 Display on signal Output Display start signal (DON) for main LCD/display start signal (DON) for sub LCDs LCDVCPWC/ LCDVCPWC2 Power control Output Main LCD module power control (V CC)/sub LCD module power control (VCC) LCDVEPWC/ LCDVEPWC2 Power control Output Main LCD module power control (V EE)/sub LCD module power control (VEE) LCDDCK/ LCDWR Dot clock/ write strobe Output Dot clock signal (RGB interface)/write strobe signal (SYS interface) LCDVSYN Vertical sync signal Output/ I/O Vertical sync signal (VSYNC) for main LCD Output for RGB interface or I/O for SYS interface LCDVSYN2 Vertical sync signal 2 Output/ I/O Vertical sync signal (VSYNC) for sub LCD Output for RGB interface or I/O for SYS interface LCDHSYN/ LCDCS Horizontal sync signal/chip select Output Horizontal sync signal (RGB interface)/chip select signal for main LCD (SYS interface) LCDCS2 Chip select Output Chip select signal for sub LCD(SYS interface) LCDDISP/ LCDRS Display enable/ Register select Output Display enable signal (RGB interface)/register select signal (SYS interface) LCDRD Read strobe Output Read str obe signal (SYS interface) LCDD24 to LCDD0 LCD data bus Output/ I/O LCD panel data (output for RGB interface or I/O for SYS interface) LCDLCLK Input clock Input LCD source clock (external input)

Section 27 LCD Controller (LCDC) Rev. 1.00 Oct. 9, 2008 Page 186 of 336 REJ03B0272-0100

Section 28 Video Output Unit (VOU) Rev. 1.00 Oct. 9, 2008 Page 187 of 336 REJ03B0272-0100 Section 28 Video Output Unit (VOU) The video output unit (VOU) converts image data that is obtained from the blend engine unit (BEU) or memory and outputs it as ITU-R BT.601 or ITU-R BT.656 digital data. The VOU also scales up images.

28.1 Features

The VOU has the following features.

• Supported video system: NTSC
• Output digital level: Conforms to ITU-R BT.601, ITU-R BT.656
• Output interface: 16-bit Y/C interface, 8-bit multiplexed YC interface
• Output timing: 13.5 MHz in 16-bit Y/C interface, 27 MHz in 8-bit multiplexed YC interface
• Output pixel frequency: 13.5 MHz, 27 MHz
• Supported source image: sub-QCIF, QVGA, WQVGA, VGA
• Maximum destination image size: 720 × 240 per field
• Source image format: YCbCr 4:2:2, YCbCr 4:2:0, YCbCr 4:4:4, RGB
• Scaling up of images Horizontal factor: 1, 1.125, 2, 2.25, or 4 Vertical factor: 1, 2, or 4
• RGB → YCbCr conversion function: Outputs YCbCr after converting obtained RGB data
• Double-buffered register: Efficient register access through a double-buffered mechanism Note: The image is enlarged by 4 pixels in the horizontal and vertical directions.

Section 28 Video Output Unit (VOU) Rev. 1.00 Oct. 9, 2008 Page 189 of 336 REJ03B0272-0100

28.2 Pin Configuration

The VOU pin configuration is shown in table 28.1. Table 28.1 Pin Configuration Name Function I/O Description DV_CLK Pixel clock output Output Pi xel clock output (13.5 MHz, 27 MHz) DV_VSYNC Vertical sync signal Output VOU vertical sync signal output DV_HSYNC Horizontal sync signal output Output VOU horizontal sync signal output DV_D15 to DV_D8 Data output Output Upper pixel data (Y: 16-bit interface) (YC: 8-bit multiplexed YC interface) (Rec. 656 output) DV_D7 to DV_D0 Data output Output Lower pixel data (C: 16-bit interface) (H'80: 8-bit multiplexed YC interface) (H'80: Rec. 656 output) DV_CLKI Video clock input Input Video clock input pin (27 MHz)

Section 28 Video Output Unit (VOU) Rev. 1.00 Oct. 9, 2008 Page 190 of 336 REJ03B0272-0100

Section 29 TS Interface (TSIF) Rev. 1.00 Oct. 9, 2008 Page 191 of 336 REJ03B0272-0100 Section 29 TS Interface (TSIF) The transport stream interface (TSIF) is a module for receiving the MPEG2 transport stream (TS) used in one-segment broadcasting implemented as part of the digital terrestrial broadcasting services. The TSIF extracts packet data and controls PCR, which are required to decode the system layer of the MPEG2 standard.

29.1 Features

The TSIF has the following features.

• Serial data input
• Support for TS data transfer by DMA auto request
• Acquisition of TS packets ⎯ Filters 38 kinds of PIDs (Packet ID) in total (The PID values of PAT and CAT packets are fixed. For PCR, video, and audio packets, the PID values are predefined.) ⎯ Supports all valid packet receive mode (Null packet is deleted). ⎯ Supports all packet receive mode including Null packet. ⎯ Supports duplicate packet delete mode. ⎯ The endian type at the TS packet data reading can be set. ⎯ Supports the time stamp function at the TS packet data acquisition.
• TS data analysis ⎯ Detects random access indicator. ⎯ Detects discontinuity indicator. ⎯ Detects video start code and short header.
• Extraction of PCR information
• Support for system clock generation [Legend] MPEG: Moving picture expert group TS: Transport stream PID: Packet ID PAT: Program association table CAT: Conditional access table PCR: Program clock reference ES: Elementary stream

Section 29 TS Interface (TSIF) Rev. 1.00 Oct. 9, 2008 Page 193 of 336 REJ03B0272-0100

29.2 Input/Output Pins

Table 29.1 shows the pin configuration. Table 29.1 Pin Configuration Pin Name Function I/O Description TS_SDAT TS serial data Input Serial input pin of TS packet data Polarity inversion is enabled by register setting. TS_SCK TS serial clock Input Serial input clock pin Polarity inversion is enabled by register setting. The initial value is synchronized with the rising edge. TS_SDEN TS data enable Input Serial input enable signal pin Polarity inversion and On/Off setting are enabled by register setting. The initial value is On and enabled after the TS_SDEN signal is driven high. TS_SPSYNC TS data synchronization Input Byte boundary signal pin Polarity inversion is enabled by register setting. The initial value is set on a byte boundary at the rising edge. If an LSI that does not have the TS_SPSYNC signal is connected, connect the TS_SDEN signal to this pin.

Section 29 TS Interface (TSIF) Rev. 1.00 Oct. 9, 2008 Page 194 of 336 REJ03B0272-0100

Section 30 Sound Interface Unit (SIU) Rev. 1.00 Oct. 9, 2008 Page 195 of 336 REJ03B0272-0100 Section 30 Sound Interface Unit (SIU) Note: This section contains references to the SH7722 Hardware Manual. The contents of the SH7722 Hardware Manual will be disclosed upon acceptance of a confidentiality agreement. For details, please contact a Renesas Technology sales representative. The sound interface unit (SIU) is a serial interface unit with FIFO which has an interface for sound input and output to be connected with the D/A and A/D converters, and it inputs/outputs PCM data and inputs digital data conforming to the IEC60958 (SPDIF: version of December, 1999). The SIU has a DSP dedicated for filter processing, and signal processing operation of the filter application can be performed by a DSP program.

30.1 Features

The features of the SIU are listed in table 30.1.

Section 30 Sound Interface Unit (SIU) Rev. 1.00 Oct. 9, 2008 Page 196 of 336 REJ03B0272-0100 Table 30.1 SIU Functions Item Contents Details Memory • PRAM: 24 bits × 2048 words

• XRAM: 32 bits × 512 words
• YRAM: 32 bits × 512 words Operators • 24-bit × 24-bit multiplier
• 16-bit divider
• 42-bit ALU
• General operator for pointers Special instructions • Branch instruction with reference of flag at desired bit location
• Instruction to set desired bit location
• Instruction to reset desired bit location
• Maximum value search instruction
• Clipping instruction Special control • Instruction loop
• Modulo addressing
• Subroutine FIFO control On-chip FIFO control circuit DSP functions Applications • FIR filter
• IIR filter
• Equalizer
• SRC (sampling rate conversion)

Section 30 Sound Interface Unit (SIU) Rev. 1.00 Oct. 9, 2008 Page 197 of 336 REJ03B0272-0100 Item Contents Details 3-line serial output (× 2: ports A and B)

• Master mode, clock = 64, 128, 256, or 512 × fs (sampling frequency)
• Supports slave mode
• 32 or 64 bit/fs
• 16-bit front filling or end filling at 64 bit/fs
• Supports I2S (Inter IC Sound) format Output interface SPDIF output (port A) • Master mode, clock = 512 × fs
• Supports channel status and user data
• Supports only 16-bit stereo 3-line serial input (× 2: ports A and B)
• Master mode, clock = 64, 128, 256, or 512 × fs
• Supports slave mode
• 32 or 64 bit/fs
• 16-bit front filling or end filling at 64 bit/fs
• Supports I2S format Input interface SPDIF input (port A) • Master mode, clock = 512 × fs
• Supports channel status and user data
• Supports only 16-bit stereo Volume Supports digital volume Others Mixing L/R mixing

Section 30 Sound Interface Unit (SIU) Rev. 1.00 Oct. 9, 2008 Page 199 of 336 REJ03B0272-0100 The SIU operates in the following 18 blocks and four SRAMs. (1) CPUIF The CPU interface (CPUIF) is an interface that controls access to the registers and data transfer between the CPU that functions as the host and SRAM (PRAM, XRAM, YRAM, and FIFORAM0) controlled by the SIU. It is connected to the SH peripheral bus (HPB). The SIU operates according to the program written in PRAM via the CPUIF. (2) FCL The FIFO control (FCL) is a block that controls FIFOs for input/output data of ports A and B. The FCL automatically controls the FIFORAM addresses to write each FIFO data at the predetermined location and read data from the predetermined location. (3) FIFO0, FIFO1, FIFO3, and FIFO4 The FIFOs store SPDIF input/output data, 3-line serial input/output data, and sound source input data. Each FIFO has its own use as shown below.

• FIFO0: Data input from port A is temporarily stored.
• FIFO1: Data input from port B is temporarily stored.
• FIFO3: Data to be output to port A is temporarily stored.
• FIFO4: Data to be output to port B is temporarily stored. (4) IFCTL The interface control (IFCTL) controls SPDIF input/output and 3-line serial input/output, according to the settings of the host. (5) SDOA The SDOA is an interface for serial data output through port A. 3-line serial data and SPDIF data can be output. The SDOA should be mainly used to output audio stereo data. (6) SDIA The SDIA is an interface for serial data input and SPDIF data input of port A. 3-line serial data and SPDIF data can be input. The SDIA should be mainly used to input audio stereo data.

Section 30 Sound Interface Unit (SIU) Rev. 1.00 Oct. 9, 2008 Page 200 of 336 REJ03B0272-0100 (7) SDOB The SDOB is an interface for serial data output through port B. 3-line serial data can be output. The SDOB should be mainly used to output audio monaural data. (8) SDIB The SDIB is an interface for serial data input through port B. 3-line serial data can be input. The SDIB should be mainly used to input audio monaural data. (9) RLD The record level detector (RLD) monitors the input level of port A, and is capable of fetching the peak level as an absolute value. The RLD incorporates a circuit for detecting the silent period, and can set a flag if a sound equal to or lower than the specified mute level continues for the specified sampling period. (10) SPB The sound processing block (SPB) is a block that plays the center role in SIU signal processing. It accesses PRAM for programs and XRAM and YRAM for saving data to implement signal processing. The SPB incorporates a DSP that operates by the program written in PRAM, and implements signal processing such as FIR filter, IIR filter, equalizer, or SRC. (11) TMR The timer block (TMR) generates the signal to activate the SPB hardware and the timer interrupt signal issued to the TSIF module. When the SPB hardware has been activated, the TMR is normally not used, and the FIFO event activation is used instead. (12) TEST The TEST is a module that generates a reset signal for the registers in each block. (13) RAMIF The RAM interface (RAMIF) is a module that controls input/output of RAM by switching between the host and internal control. Though the sound processing block (SPB) in the SIU has the privilege to access RAM during operation, the host control signal can be used to pass the privilege to access RAM to the host (CPUIF).

Section 30 Sound Interface Unit (SIU) Rev. 1.00 Oct. 9, 2008 Page 201 of 336 REJ03B0272-0100 (14) BRGA Baud rate generator A (BRGA) supplies SIUCKA directly or after dividing it as a basic operating clock to sound input/output port A. The SIUCKA dividing ratio can be specified by a register. (15) BRGB Baud rate generator B (BRGB) supplies SIUCKB directly or after dividing it as a basic operating clock to sound input/output port B. The SIUCKB dividing ratio can be specified by a register.

30.1.1 RAM Overview

(1) PRAM PRAM is a single-port SRAM of 24 bits × 2048 words. It is used to store SIU programs consisting of 24-bit instructions, and the stored programs command the DSP in the SIU to carry out necessary signal processing. (2) XRAM and YRAM XRAM and YRAM are single-port SRAMs of 32 bits × 512 words. They store data such as audio samples or filter coefficients during processing such as filtering by the DSP in the SIU. (3) FIFORAM0 FIFORAM0 is a dual-port SRAM of 32 bits × 64 words. Unlike audio data FIFOs (FIFO0, FIFO1, FIFO3, and FIFO4) for input/output outside the LSI, they are RAM FIFOs for audio data input/output from or to the CPU. FIFORAM0 is divided into four 16-stage FIFOs; RAM port A input FIFO (FIFO5), RAM port B input FIFO (FIFO6), RAM port A output FIFO (FIFO7), and RAM port B output FIFO (FIFO8). For details, refer to section 34.4, Memory Descriptions, and section 34.8.8, FIFO Specifications, in the SH7722 Hardware Manual.

Section 30 Sound Interface Unit (SIU) Rev. 1.00 Oct. 9, 2008 Page 202 of 336 REJ03B0272-0100

30.2 Input/Output Pins

Table 30.2 shows the SIU pin configuration. Table 30.2 Pin Configuration SIU Block Pin Name Function I/O Description SIUAOLR Port A sound output L/R clock I/O* Sound output L/R clock pin (master or slave) SIUAOBT Port A sound output bit clock I/O * Sound output bit clock pin (master or slave) SIUAOSLD Port A sound output serial data Output Sound output serial data pin SIUAOSPD SPDIF output A serial data Output SPDIF serial data pin SIUAILR Port A sound input L/R clock I/O * Sound input L/R clock pin (master or slave) SIUAIBT Port A sound input bit clock I/O * Sound input bit clock pin (master or slave) SIUAISLD Port A sound input serial data Input Sound input serial data pin SIUAISPD Port A SPDIF input serial data Input SPDIF input serial data pin SIUMCKA Port A master clock input Input Master clock input pin for port A SIUA SIUFCKA Port A sampling clock output Output Sampling clock (clk_fsa) output pin for port A SIUBOLR Port B sound output L/R clock I/O* Sound output L/R clock pin (master or slave) SIUBOBT Port B sound output bit clock I/O * Sound output bit clock pin (master or slave) SIUBOSLD Port B sound output serial data Output Sound output serial data pin SIUBILR Port B sound input L/R clock I/O * Sound input L/R clock pin (master or slave) SIUBIBT Port B sound input bit clock I/O * Sound input bit clock pin (master or slave) SIUB SIUBISLD Port B sound input serial data Input Sound input serial data pin

Section 30 Sound Interface Unit (SIU) Rev. 1.00 Oct. 9, 2008 Page 203 of 336 REJ03B0272-0100 SIU Block Pin Name Function I/O Description SIUMCKB Port B master clock input Input Master clock input pin for port B SIUB SIUFCKB Port B sampling clock output Output Sampling clock (clk_fsb) output pin for port B Note: * Set to output when the master is specified or set to input when the slave is specified.

Section 30 Sound Interface Unit (SIU) Rev. 1.00 Oct. 9, 2008 Page 204 of 336 REJ03B0272-0100

Section 31 USB Function Module (USBF) Rev. 1.00 Oct. 9, 2008 Page 205 of 336 REJ03B0272-0100 Section 31 USB Function Module (USBF) This LSI has a USB function module (USBF) to support high-speed transfer and full-speed transfer of the USB 2.0 standard, and supports all transfer types of the USB standard. This module has a 4-kbyte buffer memory for data transfer, providing a maximum of eight pipes.

31.1 Features

(1) Supports USB Rev. 2.0 High-Speed

• Conforms to the Universal Serial Bus Specification Revision 2.0
• Supports high-speed transfer (480 Mbps) and full-speed transfer (12 Mbps) (2) Supports All USB Transfer Types
• Control transfers
• Bulk transfers
• Interrupt transfers (high bandwidth transfers not supported)
• Isochronous transfers (high bandwidth transfers not supported) (3) Internal Bus Interfaces
• On-chip DMA interfaces of one channel (4) Pipe Configuration
• On-chip 4-kbyte buffer memory for USB communications
• Up to eight selectable pipes (including the default control pipe)
• Programmable pipe configuration
• Endpoint numbers arbitrarily allocated to PIPE1 to PIPE7

Section 31 USB Function Module (USBF) Rev. 1.00 Oct. 9, 2008 Page 206 of 336 REJ03B0272-0100

• Transfer conditions that can be set for each pipe: PIPE0: Control transfers, continuous transfer mode, 256-byte fixed single buffer PIPE1 and PIPE2: Bulk transfers/isochronous transfers, continuous transfer mode, programmable buffer size (can be specified as up to a 1.8-kbyte double buffer) PIPE3 to PIPE5: Bulk transfers, continuous transfer mode, programmable buffer size (can be specified as up to a 1.8-kbyte double buffer) PIPE6 and PIPE7: Interrupt transfer, 64-byte fixed single buffer (5) Other Features
• Thirty-five interrupts of eight kinds Selectable interrupt notice according to the kind and the source depending on the software setting
• Automatic recognition of high-speed mode or full-speed mode through the reset handshake automatic response
• Transaction counting in DMA transfer
• Completes DMA transfer with interrupts
• Controls control transfer stage
• Device state control
• Automatic response to SET_ADDRESS request
• SOF interpolation
• Adds a zero-length packet at the end of a DMA transfer (DEZPM)
• Changes the BRDY interrupt event notice timing (BFRE)
• Automatically clears the buffer memory after reading the data of the pipe specified by the D0FIFO port (DCLRM)
• NAK setting for the response PID at the end of transfer (this module automatically recognizes the end of transfer by short packet reception or a transaction counter) (SHTNAK)
• NAK response interrupts (NRDY)

Section 31 USB Function Module (USBF) Rev. 1.00 Oct. 9, 2008 Page 207 of 336 REJ03B0272-0100 Figure 31.1 shows a block diagram of the USBF. Peripheral bus Interrupt requests DMA transfer requests Status and control registers FIFO SIE Transceiver USB function module Clock (48 MHz) SIE: Serial interface engine [Legend] DP VBUS DM Figure 31.1 Block Diagram of the USBF

31.2 Input / Output Pins

Table 31.1 shows the pin configuration of the USBF. Table 31.1 USBF Pin Configuration Pin Name Function I/O Description DP D + I/O I/O D+ I/O of the USB on-chip transceiver DM D − I/O I/O D − I/O of the USB on-chip transceiver VBUS USB power supply detection Input USB cable connection monitor pin REFRIN Reference input ⎯ Reference resistor connection pin for constant current circuit. EXTALUSB 48-MHz clock pin for USB Input XTALUSB 48-MHz clock pin for USB Output 48-MHz clock pin for USB Crystal resonator should be connected between EXTALUSB and XTALUSB. When using an external clock input, an external clock signal should be connected to EXTALSUB: and XTALUSB should be open.

Section 31 USB Function Module (USBF) Rev. 1.00 Oct. 9, 2008 Page 208 of 336 REJ03B0272-0100

Section 32 Key Scan Interface (KEYSC) Rev. 1.00 Oct. 9, 2008 Page 209 of 336 REJ03B0272-0100 Section 32 Key Scan Interface (KEYSC) This LSI has a key scan interface (KEYSC) that can set the input or output bit numbers to be programmable.

32.1 Features

• On-chip chattering elimination circuit
• Chattering elimination time can be set to be programmable
• Measures to deal with multiple key presses
• Level/edge-selectable internal interrupts
• Canceling software standby and U-standby modes by the key input (level) interrupt.
• Input or output bit numbers can be set to be programmable

Section 32 Key Scan Interface (KEYSC) Rev. 1.00 Oct. 9, 2008 Page 211 of 336 REJ03B0272-0100

32.2 Input/Output Pins

The pin configuration of the key scan interface is listed in table 32.1. Table 32.1 Pin Configuration Name Abbreviation I/O Function Input key scan interface 6 to 0 KEYIN6 to KEYIN0 Input Key scan interface for input Output key scan interface 5 to 0 KEYOUT5 to KEYOUT0 Output Key scan interface for output The KEYOUT5 and KEYOUT4 pins are multiplexed with the KEYIN5 and KEYIN6 pins respectively. Setting the KYMD1 and KYMD0 bits in the key scan control register 1 (KYCR1) selects either those functions. Table 32.2 shows the possible combinations between the KEYIN and KEYOUT pins. Table 32.2 Multiplex Pin Setting Name KYMD1 KYMD0 KEYOUT5/KEYIN5 Pin KEYOUT4/KEYIN6 Pin Key pin mode 1 0 0 Selects KEYOUT5 pin Selects KEYOUT4 pin Key pin mode 2 0 1 Selects KEYIN5 pin Selects KEYOUT4 pin Key pin mode 3 1 0 Selects KEYIN5 pin Selects KEYIN6 pin

Section 32 Key Scan Interface (KEYSC) Rev. 1.00 Oct. 9, 2008 Page 212 of 336 REJ03B0272-0100

Section 33 2D Graphics Accelerator (2DG) Rev. 1.00 Oct. 9, 2008 Page 213 of 336 REJ03B0272-0100 Section 33 2D Graphics Accelerator (2DG) The 2D graphics accelerator (2DG) supports the drawing of quadrangles and associated drawing modes. A unified memory architecture has been adopted for the 2DG; that is, a region of the external memory is used for the frame buffers.

33.1 Features

The 2DG provides the following features. (1) Figure Drawing Functions

• Rectangles and quadrangles Filling with a single color or gradations between colors Texture mapping ⎯ Methods of mapping: Magnification, minification, and repetition ⎯ Filtering: Nearest neighbor interpolation, bilinear interpolation, and average pixel methods Coordinate transformation Flipping graphics (only texture-mapped rectangles)
• Drawing horizontal straight lines Drawing with a single color or gradations between colors Texture mapping ⎯ Methods of mapping: Magnification, minification, and repetition ⎯ Filtering: Nearest neighbor interpolation, bilinear interpolation, and average pixel methods (2) Pixel Processing
• Scissor testing
• Alpha blending
• Shadowing
• Raster operation (ROP)
• Color conversion
• Color key
• Writing-mask control (3) Others
• Maximum resolution: 4096 × 4096

Section 33 2D Graphics Accelerator (2DG) Rev. 1.00 Oct. 9, 2008 Page 214 of 336 REJ03B0272-0100

Section 34 Pin Function Controller (PFC) Rev. 1.00 Oct. 9, 2008 Page 215 of 336 REJ03B0272-0100 Section 34 Pin Function Controller (PFC)

34.1 Overview

The pin function controller (PFC) consists of registers to select the functions and I/O directions of multiplexed pins. Pin functions and I/O directions can be individually selected for every pin regardless of the LSI operating mode. Table 34.1 lists the multiplexed pins of this LSI. Functions are selectable from a general port, functions 1, 2, and 3 for each pin. Functions 1, 2, and 3 can be selected by setting the corresponding bit in the port control register to B'00. Use the pin select register to select which function to use among functions 1, 2, and 3. The functions in the shaded area in the table are available immediately after a reset. The settings of the I/O buffer Hi-Z control registers A, B, and C have priorities over the setting of the port control register. Table 34.1 Multiplexed Pins General Port Function 1 (Related Module) Function 2 (Related Module) Function 3 (Related Module) PTA7 input/output VIO_D7 input (VIO) SCIF1_SCK input/output (SCIF) PTA6 input VIO_D6 input (VIO) SCIF1_RXD input (SCIF) ⎯ PTA5 input/output VIO_D5 input (VIO) SCIF1_TXD output (SCIF) ⎯ PTA4 input VIO_D4 input (VIO) ⎯ ⎯ PTA3 input VIO_D3 input (VIO) ⎯ ⎯ PTA2 input VIO_D2 input (VIO) ⎯ ⎯ PTA1 input VIO_D1 input (VIO) ⎯ ⎯ PTA0 input VIO_D0 input (VIO) LCDLCLK input (LCDC) ⎯ PTB7 input/output HPD55 input/output (SBSC) ⎯ ⎯ PTB6 input/output HPD54 input/output (SBSC) ⎯ ⎯ PTB5 input/output HPD53 input/output (SBSC) ⎯ ⎯

Section 34 Pin Function Controller (PFC) Rev. 1.00 Oct. 9, 2008 Page 216 of 336 REJ03B0272-0100 General Port Function 1 (Related Module) Function 2 (Related Module) Function 3 (Related Module) PTB4 input/output HPD52 input/output (SBSC) ⎯ ⎯ PTB3 input/output HPD51 input/output (SBSC) ⎯ ⎯ PTB2 input/output HPD50 input/output (SBSC) ⎯ ⎯ PTB1 input/output HPD49 input/output (SBSC) ⎯ ⎯ PTB0 input/output HPD48 input/output (SBSC) ⎯ ⎯ PTC7 input ⎯ ⎯ ⎯ PTC5 input IOIS16 input (BSC) ⎯ ⎯ PTC4 input/output HPDQM7 output (SBSC) ⎯ ⎯ PTC3 input/output HPDQM6 output (SBSC) ⎯ ⎯ PTC2 input/output HPDQM5 output (SBSC) ⎯ ⎯ PTC0 input/output HPDQM4 output (SBSC) ⎯ ⎯ PTD7 input SDHICD input (SDHI) ⎯ ⎯ PTD6 input/output SDHIWP input (SDHI) ⎯ ⎯ PTD5 input/output SDHID3 input/output (SDHI) ⎯ ⎯ PTD4 input/output IRQ2 input (CPU) SDHID2 input/output (SDHI) PTD3 input/output SDHID1 input/output (SDHI) ⎯ ⎯ PTD2 input/output SDHID0 input/output (SDHI) ⎯ ⎯ PTD1 input/output SDHICMD input/output (SDHI) ⎯ ⎯ PTD0 output SDHICLK output (SDHI) ⎯ ⎯ PTE7 input/output A25 output (BSC) ⎯ ⎯ PTE6 input/output A24 output (BSC) ⎯ ⎯ PTE5 input/output A23 output (BSC) ⎯ ⎯ PTE4 input/output A22 output (BSC) ⎯ ⎯ PTE1 input/output IRQ5 input (CPU) ⎯ ⎯

Section 34 Pin Function Controller (PFC) Rev. 1.00 Oct. 9, 2008 Page 217 of 336 REJ03B0272-0100 General Port Function 1 (Related Module) Function 2 (Related Module) Function 3 (Related Module) PTE0 input/output IRQ4 input (CPU) BS output (BSC) ⎯ PTF6 input/output SIOMCK input (SIO) SIUMCKB input (SIU) SIUFCKB output (SIU) PTF5 input/output SIOSCK input/output (SIO) SIUBOBT input/output (SIU) PTF4 input/output SIOSTRB1 output (SIO) SIUBOLR input/output (SIU) PTF3 input/output SIOSTRB0 output (SIO) SIUBIBT input/output (SIU) PTF2 input/output SIOD input/output (SIO) SIUBILR input/output (SIU) PTF1 input SIORXD input (SIO) SIUBISLD input (SIU) ⎯ PTF0 output SIOTXD output (SIO) SIUBOSLD output (SIU) ⎯ PTG4 output AUDSYNC output (AUD) ⎯ ⎯ PTG3 output AUDATA3 output (AUD) ⎯ ⎯ PTG2 output AUDATA2 output (AUD) ⎯ ⎯ PTG1 output AUDATA1 output (AUD) ⎯ ⎯ PTG0 output AUDATA0 output (AUD) ⎯ ⎯ PTH7 output LCDVCPWC output (LCDC) LCDVCPWC2 output (LCDC) PTH6 input/output L CDVSYN2 input/output (LCDC) DACK output (DMAC) ⎯ PTH5 input/output L CDVSYN input/output (LCDC) ⎯ ⎯ PTH4 output LCDDISP output (LCDC) LCDRS output (LCDC) ⎯ PTH3 output LCDHSYN output (LCDC) LCDCS output (LCDC) ⎯ PTH2 output LCDDON output (LCDC) LCDDON2 output (LCDC) ⎯ PTH1 input/output LCDD17 input/output (LCDC) DV_HSYNC output (VOU) ⎯ PTH0 input/output LCDD16 input/output (LCDC) DV_VSYNC output (VOU) ⎯ PTJ7 output STATUS0 output (CPG) ⎯ ⎯ PTJ6 output ⎯ ⎯ ⎯ PTJ5 output PDSTATUS output (CPG) ⎯ ⎯

Section 34 Pin Function Controller (PFC) Rev. 1.00 Oct. 9, 2008 Page 218 of 336 REJ03B0272-0100 General Port Function 1 (Related Module) Function 2 (Related Module) Function 3 (Related Module) PTJ1 input/output IRQ1 input (CPU) ⎯ ⎯ PTJ0 input/output IRQ0 input (CPU) ⎯ ⎯ PTK6 input/output SIUAILR input/output (SIU) SIOF1_SS2 output (SIOF) ⎯ PTK5 input/output SIUAIBT input/output (SIU) SIOF1_SS1 output (SIOF) ⎯ PTK4 input/output SIUAOLR input/output (SIU) SIOF1_SYNC input/output (SIOF) PTK3 input/output SIUAOBT input/output (SIU) SIOF1_SCK input/output (SIOF) PTK2 input SIUAISLD input (SIU) SIOF1_RXD input (SIOF) ⎯ PTK1 output SIUAOSLD output (SIU) SIOF1_TXD output (SIOF) ⎯ PTK0 input/output SIUMCKA input (SIU) SIOF1_MCK input (SIOF) SIUFCKA output (SIU) PTL7 input/output LCDD15 input/output (LCDC) DV_D15 output (VOU) ⎯ PTL6 input/output LCDD14 input/output (LCDC) DV_D14 output (VOU) ⎯ PTL5 input/output LCDD13 input/output (LCDC) DV_D13 output (VOU) ⎯ PTL4 input/output LCDD12 input/output (LCDC) DV_D12 output (VOU) ⎯ PTL3 input/output LCDD11 input/output (LCDC) DV_D11 output (VOU) ⎯ PTL2 input/output LCDD10 input/output (LCDC) DV_D10 output (VOU) ⎯ PTL1 input/output LCDD9 input/output (LCDC) DV_D9 output (VOU) ⎯ PTL0 input/output LCDD8 input/output (LCDC) DV_D8 output (VOU) ⎯ PTM7 input/output LCDD7 input/output (LCDC) DV_D7 output (VOU) ⎯ PTM6 input/output LCDD6 input/output (LCDC) DV_D6 output (VOU) ⎯

Section 34 Pin Function Controller (PFC) Rev. 1.00 Oct. 9, 2008 Page 219 of 336 REJ03B0272-0100 General Port Function 1 (Related Module) Function 2 (Related Module) Function 3 (Related Module) PTM5 input/output LCDD5 input/output (LCDC) DV_D5 output (VOU) ⎯ PTM4 input/output LCDD4 input/output (LCDC) DV_D4 output (VOU) ⎯ PTM3 input/output LCDD3 input/output (LCDC) DV_D3 output (VOU) ⎯ PTM2 input/output LCDD2 input/output (LCDC) DV_D2 output (VOU) ⎯ PTM1 input/output LCDD1 input/output (LCDC) DV_D1 output (VOU) ⎯ PTM0 input/output LCDD0 input/output (LCDC) DV_D0 output (VOU) ⎯ PTN7 input/output HPD63 input/output (SBSC) ⎯ ⎯ PTN6 input/output HPD62 input/output (SBSC) ⎯ ⎯ PTN5 input/output HPD61 input/output (SBSC) ⎯ ⎯ PTN4 input/output HPD60 input/output (SBSC) ⎯ ⎯ PTN3 input/output HPD59 input/output (SBSC) ⎯ ⎯ PTN2 input/output HPD58 input/output (SBSC) ⎯ ⎯ PTN1 input/output HPD57 input/output (SBSC) ⎯ ⎯ PTN0 input/output HPD56 input/output (SBSC) ⎯ ⎯ PTQ6 output SIOF0_SS2 output (SIOF) SIM_RST output (SIM) ⎯ PTQ5 input/output SIOF0_SS1 output (SIOF) TS_SPSYNC input (TSIF) ⎯ PTQ4 input/output SIOF0_SYNC input/output (SIOF) TS_SDEN input (TSIF) ⎯ PTQ3 input/output SIOF0_SCK input/output (SIOF) TS_SCK input (TSIF) ⎯

Section 34 Pin Function Controller (PFC) Rev. 1.00 Oct. 9, 2008 Page 220 of 336 REJ03B0272-0100 General Port Function 1 (Related Module) Function 2 (Related Module) Function 3 (Related Module) PTQ2 input SIOF0_RXD input (SIOF) IrDA_IN input (IrDA) TS_SDAT input (TSIF) PTQ1 output SIOF0_TXD output (SIOF) IrDA_OUT output (IrDA) SIM_CLK output (SIM) PTQ0 input/output SIOF0_MCK input (SIOF) IRQ3 input (CPU) SIM_D input/output (SIM) PTR4 output LCDRD output (LCDC) ⎯ ⎯ PTR3 output CS6B/CE1B output (BSC) LCDCS2 output (LCDC) ⎯ PTR2 input WAIT input (BSC) ⎯ ⎯ PTR1 output LCDDCK output (LCDC) LCDWR output (LCDC) ⎯ PTR0 output LCDVEPWC output (LCDC) LCDVEPWC2 output (LCDC) PTS4 input SCIF0_CTS input (SCIF) SIUAISPD input (SIU) ⎯ PTS3 output SCIF0_RTS output (SCIF) SIUAOSPD output (SIU) ⎯ PTS2 input/output SCIF0_SCK input/output (SCIF) TPUTO output (TPU) ⎯ PTS1 input SCIF0_RXD input (SCIF) ⎯ ⎯ PTS0 output SCIF0_TXD output (SCIF) ⎯ ⎯ PTT4 input/output FOE output (FLCTL) VIO_VD2 input (VIO) ⎯ PTT3 input/output FWE output (FLCTL) ⎯ ⎯ PTT2 input/output FSC output (FLCTL) ⎯ ⎯ PTT1 input DREQ0 input (DMAC) ⎯ ⎯ PTT0 output FCDE output (FLCTL) ⎯ ⎯ PTU4 input/output NAF2 input/output (FLCTL) VIO_D10 input (VIO) ⎯ PTU3 input/output NAF1 input/output (FLCTL) VIO_D9 input (VIO) ⎯ PTU2 input/output NAF0 input/output (FLCTL) VIO_D8 input (VIO) ⎯ PTU1 input FRB input (FLCTL) VIO_CLK2 input (VIO) ⎯ PTU0 input/output FCE output (FLCTL) VIO_HD2 input (VIO) ⎯ PTV4 input/output NAF7 input/output (FLCTL) VIO_D15 input (VIO) ⎯ PTV3 input/output NAF6 input/output (FLCTL) VIO_D14 input (VIO) ⎯

Section 34 Pin Function Controller (PFC) Rev. 1.00 Oct. 9, 2008 Page 221 of 336 REJ03B0272-0100 General Port Function 1 (Related Module) Function 2 (Related Module) Function 3 (Related Module) PTV2 input/output NAF5 input/output (FLCTL) VIO_D13 input (VIO) ⎯ PTV1 input/output NAF4 input/output (FLCTL) VIO_D12 input (VIO) ⎯ PTV0 input/output NAF3 input/output (FLCTL) VIO_D11 input (VIO) ⎯ PTW6 input VIO_FLD input (VIO) SCIF2_CTS input (SCIF) ⎯ PTW5 output VIO_CKO output (VIO) SCIF2_RTS output (SCIF) ⎯ PTW4 input/output VIO_STEX input (VIO) SCIF2_SCK input/output (SCIF) PTW3 input/output VIO_STEM output (VIO) SCIF2_TXD output (SCIF) ⎯ PTW2 input/output VIO_HD input (VIO) SCIF2_RXD input (SCIF) ⎯ PTW1 input/output VIO_VD input (VIO) SCIF1_CTS input (SCIF) ⎯ PTW0 input/output VIO_CLK input (VIO) SCIF1_RTS output (SCIF) ⎯ PTX6 input/output CS6A/CE2B output (BSC) ⎯ ⎯ PTX5 input/output LCDD23 output (LCDC) ⎯ ⎯ PTX4 input/output LCDD22 output (LCDC) ⎯ ⎯ PTX3 input/output LCDD21 output (LCDC) ⎯ ⎯ PTX2 input/output LCDD20 output (LCDC) ⎯ ⎯ PTX1 input/output LCDD19 output (LCDC) DV_CLKI input (VOU) ⎯ PTX0 input/output LCDD18 output (LCDC) DV_CLK output (VOU) ⎯ PTY5 input/output KEYOUT5/KEYIN5 input/output (KEY) ⎯ ⎯ PTY4 input/output KEYOUT4/KEYIN6 input/output (KEY) ⎯ ⎯ PTY3 input/output KEYOUT3 output (KEY) ⎯ ⎯ PTY2 input/output KEYOUT2 output (KEY) ⎯ ⎯ PTY1 output KEYOUT1 output (KEY) ⎯ ⎯ PTY0 input/output KEYOUT0 output (KEY) ⎯ ⎯ PTZ5 input KEYIN4 input (KEY) IRQ7 input (CPU) ⎯ PTZ4 input KEYIN3 input (KEY) ⎯ ⎯ PTZ3 input KEYIN2 input (KEY) ⎯ ⎯

Section 34 Pin Function Controller (PFC) Rev. 1.00 Oct. 9, 2008 Page 222 of 336 REJ03B0272-0100 General Port Function 1 (Related Module) Function 2 (Related Module) Function 3 (Related Module) PTZ2 input KEYIN1 input (KEY) ⎯ ⎯ PTZ1 input KEYIN0 input (KEY) IRQ6 input (CPU) ⎯ ⎯ D31 to D16 input/output (BSC)* HPD47 to HPD32 input/output (SBSC)* Note: * When the MD3 pin is low, HPD47 to HPD32 are selected. When the MD3 pin is high, D31 to D16 are selected.

Rev. 1.00 Oct. 9, 2008 Page 223 of 336 REJ03B0272-0100 Section 35 I/O Ports This LSI has twenty-three general ports (ports A to Z). All port pins are multiplexed with other pin functions, and the pin function controller (PFC) handles the selection of pin functions and pull-up MOS control. Each port has a data register which stores data for the pins.

35.1 Port A

Port A is an input/output port with the pin configuration shown in table 35.1. The port A control register (PACR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.1 Port A Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTA7 Output Input (Pull-down on) Input (Pull-down off) PA7DT PTA6 ⎯ Input (Pull-down on) Input (Pull-down off) PA6DT PTA5 Output Input (Pull-down on) Input (Pull-down off) PA5DT PTA4 ⎯ Input (Pull-down on) Input (Pull-down off) PA4DT PTA3 ⎯ Input (Pull-down on) Input (Pull-down off) PA3DT PTA2 ⎯ Input (Pull-down on) Input (Pull-down off) PA2DT PTA1 ⎯ Input (Pull-down on) Input (Pull-down off) PA1DT PTA0 ⎯ Input (Pull-down on) Input (Pull-down off) PA0DT

Rev. 1.00 Oct. 9, 2008 Page 224 of 336 REJ03B0272-0100

35.2 Port B

Port B is an input/output port with the pin configuration shown in table 35.2. The port B control register (PBCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.2 Port B Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTB7 Output ⎯ Input (Pull-up off) PB7DT PTB6 Output ⎯ Input (Pull-up off) PB6DT PTB5 Output ⎯ Input (Pull-up off) PB5DT PTB4 Output ⎯ Input (Pull-up off) PB4DT PTB3 Output ⎯ Input (Pull-up off) PB3DT PTB2 Output ⎯ Input (Pull-up off) PB2DT PTB1 Output ⎯ Input (Pull-up off) PB1DT PTB0 Output ⎯ Input (Pull-up off) PB0DT

35.3 Port C

Port C is an input/output port with the pin configuration shown in table 35.3. The port C control register (PCCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.3 Port C Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTC7 ⎯ Input (Pull-up on) Input (Pull-up off) PC7DT PTC5 ⎯ Input (Pull-up on) Input (Pull-up off) PC5DT PTC4 Output ⎯ Input (Pull-up off) PC4DT PTC3 Output ⎯ Input (Pull-up off) PC3DT PTC2 Output ⎯ Input (Pull-up off) PC2DT PTC0 Output ⎯ Input (Pull-up off) PC0DT

Rev. 1.00 Oct. 9, 2008 Page 225 of 336 REJ03B0272-0100

35.4 Port D

Port D is an input/output port with the pin configuration shown in table 35.4. The port D control register (PDCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.4 Port D Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTD7 ⎯ Input (Pull-up on) Input (Pull-up off) PD7DT PTD6 Output Input (Pull-up on) Input (Pull-up off) PD6DT PTD5 Output Input (Pull-up on) Input (Pull-up off) PD5DT PTD4 Output Input (Pull-up on) Input (Pull-up off) PD4DT PTD3 Output Input (Pull-up on) Input (Pull-up off) PD3DT PTD2 Output Input (Pull-up on) Input (Pull-up off) PD2DT PTD1 Output Input (Pull-up on) Input (Pull-up off) PD1DT PTD0 Output ⎯ ⎯ PD0DT

35.5 Port E

Port E is an input/output port with the pin configuration shown in table 35.5. The port E control register (PECR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.5 Port E Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTE7 Output Input (Pull-down on) Input (Pull-down off) PE7DT PTE6 Output Input (Pull-down on) Input (Pull-down off) PE6DT PTE5 Output Input (Pull-down on) Input (Pull-down off) PE5DT PTE4 Output Input (Pull-down on) Input (Pull-down off) PE4DT PTE1 Output Input (Pull-up on) Input (Pull-up off) PE1DT PTE0 Output Input (Pull-up on) Input (Pull-up off) PE0DT

Rev. 1.00 Oct. 9, 2008 Page 226 of 336 REJ03B0272-0100

35.6 Port F

Port F is an input/output port with the pin configuration shown in table 35.6. The port F control register (PFCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.6 Port F Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTF6 Output Input (Pull- down on) Input (Pull- down off) PF6DT PTF5 Output Input (Pull- down on) Input (Pull- down off) PF5DT PTF4 Output Input (Pull- down on) Input (Pull- down off) PF4DT PTF3 Output Input (Pull- down on) Input (Pull- down off) PF3DT PTF2 Output Input (Pull- down on) Input (Pull- down off) PF2DT PTF1 ⎯ Input (Pull- down on) Input (Pull- down off) PF1DT PTF0 Output ⎯ ⎯ PF0DT

Rev. 1.00 Oct. 9, 2008 Page 227 of 336 REJ03B0272-0100

35.7 Port G

Port G is an input/output port with the pin configuration shown in table 35.7. The port G control register (PGCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.7 Port G Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTG4 Output ⎯ ⎯ PG4DT PTG3 Output ⎯ ⎯ PG3DT PTG2 Output ⎯ ⎯ PG2DT PTG1 Output ⎯ ⎯ PG1DT PTG0 Output ⎯ ⎯ PG0DT

35.8 Port H

Port H is an input/output port with the pin configuration shown in table 35.8. The port H control register (PHCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.8 Port H Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTH7 Output ⎯ ⎯ PH7DT PTH6 Output Input (Pull-down on) Input (Pull-down off) PH6DT PTH5 Output Input (Pull-down on) Input (Pull-down off) PH5DT PTH4 Output ⎯ ⎯ PH4DT PTH3 Output ⎯ ⎯ PH3DT PTH2 Output ⎯ ⎯ PH2DT PTH1 Output Input (Pull-down on) Input (Pull-down off) PH1DT PTH0 Output Input (Pull-down on) Input (Pull-down off) PH0DT

Rev. 1.00 Oct. 9, 2008 Page 228 of 336 REJ03B0272-0100

35.9 Port J

Port J is an input/output port with the pin configuration shown in table 35.9. The port J control register (PJCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.9 Port J Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTJ7 Output ⎯ ⎯ PJ7DT PTJ6 Output ⎯ ⎯ PJ6DT PTJ5 Output ⎯ ⎯ PJ5DT PTJ1 Output Input (Pull-up on) Input (Pull-up off) PJ1DT PTJ0 Output Input (Pull-up on) Input (Pull-up off) PJ0DT

35.10 Port K

Port K is an input/output port with the pin configuration shown in table 35.10. The port K control register (PKCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.10 Port K Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTK6 Output Input (Pull-down on) Input (Pull-down off) PK6DT PTK5 Output Input (Pull-down on) Input (Pull-down off) PK5DT PTK4 Output Input (Pull-down on) Input (Pull-down off) PK4DT PTK3 Output Input (Pull-down on) Input (Pull-down off) PK3DT PTK2 ⎯ Input (Pull-down on) Input (Pull-down off) PK2DT PTK1 Output ⎯ ⎯ PK1DT PTK0 Output Input (Pull-down on) Input (Pull-down off) PK0DT

Rev. 1.00 Oct. 9, 2008 Page 229 of 336 REJ03B0272-0100

35.11 Port L

Port L is an input/output port with the pin configuration shown in table 35.11. The port L control register (PLCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.11 Port L Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTL7 Output Input (Pull-down on) Input (Pull-down off) PL7DT PTL6 Output Input (Pull-down on) Input (Pull-down off) PL6DT PTL5 Output Input (Pull-down on) Input (Pull-down off) PL5DT PTL4 Output Input (Pull-down on) Input (Pull-down off) PL4DT PTL3 Output Input (Pull-down on) Input (Pull-down off) PL3DT PTL2 Output Input (Pull-down on) Input (Pull-down off) PL2DT PTL1 Output Input (Pull-down on) Input (Pull-down off) PL1DT PTL0 Output Input (Pull-down on) Input (Pull-down off) PL0DT

35.12 Port M

Port M is an input/output port with the pin configuration shown in table 35.12. The port M control register (PMCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.12 Port M Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTM7 Output Input (Pull-down on) Input (Pull-down off) PM7DT PTM6 Output Input (Pull-down on) Input (Pull-down off) PM6DT PTM5 Output Input (Pull-down on) Input (Pull-down off) PM5DT PTM4 Output Input (Pull-down on) Input (Pull-down off) PM4DT PTM3 Output Input (Pull-down on) Input (Pull-down off) PM3DT PTM2 Output Input (Pull-down on) Input (Pull-down off) PM2DT PTM1 Output Input (Pull-down on) Input (Pull-down off) PM1DT PTM0 Output Input (Pull-down on) Input (Pull-down off) PM0DT

Rev. 1.00 Oct. 9, 2008 Page 230 of 336 REJ03B0272-0100

35.13 Port N

Port N is an input/output port with the pin configuration shown in table 35.13. The port N control register (PNCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.13 Port N Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTN7 Output ⎯ Input (Pull-up off) PN7DT PTN6 Output ⎯ Input (Pull-up off) PN6DT PTN5 Output ⎯ Input (Pull-up off) PN5DT PTN4 Output ⎯ Input (Pull-up off) PN4DT PTN3 Output ⎯ Input (Pull-up off) PN3DT PTN2 Output ⎯ Input (Pull-up off) PN2DT PTN1 Output ⎯ Input (Pull-up off) PN1DT PTN0 Output ⎯ Input (Pull-up off) PN0DT

35.14 Port Q

Port Q is an input/output port with the pin configuration shown in table 35.14. The port Q control register (PQCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.14 Port Q Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTQ6 Output ⎯ ⎯ PQ6DT PTQ5 Output Input (Pull-down on) Input (Pull-down off) PQ5DT PTQ4 Output Input (Pull-down on) Input (Pull-down off) PQ4DT PTQ3 Output Input (Pull-down on) Input (Pull-down off) PQ3DT PTQ2 ⎯ Input (Pull-down on) Input (Pull-down off) PQ2DT PTQ1 Output ⎯ ⎯ PQ1DT PTQ0 Output Input (Pull-up on) Input (Pull-up off) PQ0DT

Rev. 1.00 Oct. 9, 2008 Page 231 of 336 REJ03B0272-0100

35.15 Port R

Port R is an input/output port with the pin configuration shown in table 35.15. The port R control register (PRCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.15 Port R Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTR4 Output ⎯ ⎯ PR4DT PTR3 Output ⎯ ⎯ PR3DT PTR2 ⎯ Input (Pull-up on) Input (Pull-up off) PR2DT PTR1 Output ⎯ ⎯ PR1DT PTR0 Output ⎯ ⎯ PR0DT

35.16 Port S

Port S is an input/output port with the pin configuration shown in table 35.16. The port S control register (PSCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.16 Port S Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTS4 ⎯ Input (Pull-down on) Input (Pull-down off) PS4DT PTS3 Output ⎯ ⎯ PS3DT PTS2 Output Input (Pull-down on) Input (Pull-down off) PS2DT PTS1 ⎯ Input (Pull-down on) Input (Pull-down off) PS1DT PTS0 Output ⎯ ⎯ PS0DT

Rev. 1.00 Oct. 9, 2008 Page 232 of 336 REJ03B0272-0100

35.17 Port T

Port T is an input/output port with the pin configuration shown in table 35.17. The port T control register (PTCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.17 Port T Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTT4 Output Input (Pull-down on) Input (Pull-down off) PT4DT PTT3 Output Input (Pull-down on) Input (Pull-down off) PT3DT PTT2 Output Input (Pull-down on) Input (Pull-down off) PT2DT PTT1 ⎯ Input (Pull-down on) Input (Pull-down off) PT1DT PTT0 Output ⎯ ⎯ PT0DT

35.18 Port U

Port U is an input/output port with the pin configuration shown in table 35.18. The port U control register (PUCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.18 Port U Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTU4 Output Input (Pull-down on) Input (Pull-down off) PU4DT PTU3 Output Input (Pull-down on) Input (Pull-down off) PU3DT PTU2 Output Input (Pull-down on) Input (Pull-down off) PU2DT PTU1 ⎯ Input (Pull-up on) Input (Pull-up off) PU1DT PTU0 Output Input (Pull-up on) Input (Pull-up off) PU0DT

Rev. 1.00 Oct. 9, 2008 Page 233 of 336 REJ03B0272-0100

35.19 Port V

Port V is an input/output port with the pin configuration shown in table 35.19. The port V control register (PVCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.19 Port V Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTV4 Output Input (Pull-down on) Input (Pull-down off) PV4DT PTV3 Output Input (Pull-down on) Input (Pull-down off) PV3DT PTV2 Output Input (Pull-down on) Input (Pull-down off) PV2DT PTV1 Output Input (Pull-down on) Input (Pull-down off) PV1DT PTV0 Output Input (Pull-down on) Input (Pull-down off) PV0DT

35.20 Port W

Port W is an input/output port with the pin configuration shown in table 35.20. The port W control register (PWCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.20 Port W Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTW6 ⎯ Input (Pull-down on) Input (Pull-down off) PW6DT PTW5 Output ⎯ ⎯ PW5DT PTW4 Output Input (Pull-down on) Input (Pull-down off) PW4DT PTW3 Output Input (Pull-down on) Input (Pull-down off) PW3DT PTW2 Output Input (Pull-down on) Input (Pull-down off) PW2DT PTW1 Output Input (Pull-down on) Input (Pull-down off) PW1DT PTW0 Output Input (Pull-down on) Input (Pull-down off) PW0DT

Rev. 1.00 Oct. 9, 2008 Page 234 of 336 REJ03B0272-0100

35.21 Port X

Port X is an input/output port with the pin configuration shown in table 35.21. The port X control register (PXCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.21 Port X Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTX6 Output Input (Pull-up on) Input (Pull-up off) PX6DT PTX5 Output Input (Pull-down on) Input (Pull-down off) PX5DT PTX4 Output Input (Pull-down on) Input (Pull-down off) PX4DT PTX3 Output Input (Pull-down on) Input (Pull-down off) PX3DT PTX2 Output Input (Pull-down on) Input (Pull-down off) PX2DT PTX1 Output Input (Pull-down on) Input (Pull-down off) PX1DT PTX0 Output Input (Pull-down on) Input (Pull-down off) PX0DT

35.22 Port Y

Port Y is an input/output port with the pin configuration shown in table 35.22. The port Y control register (PYCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.22 Port Y Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTY5 Output Input (Pull-up on) Input (Pull-up off) PY5DT PTY4 Output Input (Pull-up on) Input (Pull-up off) PY4DT PTY3 Output Input (Pull-up on) Input (Pull-up off) PY3DT PTY2 Output Input (Pull-up on) Input (Pull-up off) PY2DT PTY1 Output ⎯ ⎯ PY1DT PTY0 Output Input (Pull-up on) Input (Pull-up off) PY0DT

Rev. 1.00 Oct. 9, 2008 Page 235 of 336 REJ03B0272-0100

35.23 Port Z

Port Z is an input/output port with the pin configuration shown in table 35.23. The port Z control register (PZCR) of the PFC handles the selection of multiplexed functions and pull-up/pull-down MOS control. Table 35.23 Port Z Configuration Port Name Selectable General Port Function Corresponding Data Register Bit PTZ5 ⎯ Input (Pull-up on) Input (Pull-up off) PZ5DT PTZ4 ⎯ Input (Pull-up on) Input (Pull-up off) PZ4DT PTZ3 ⎯ Input (Pull-up on) Input (Pull-up off) PZ3DT PTZ2 ⎯ Input (Pull-up on) Input (Pull-up off) PZ2DT PTZ1 ⎯ Input (Pull-up on) Input (Pull-up off) PZ1DT

Rev. 1.00 Oct. 9, 2008 Page 236 of 336 REJ03B0272-0100

Section 36 User Break Controller (UBC) Rev. 1.00 Oct. 9, 2008 Page 237 of 336 REJ03B0272-0100 Section 36 User Break Controller (UBC) The user break controller (UBC) provides versatile functions to facilitate program debugging. These functions help to ease creation of a self-monitor/debugger, which allows easy program debugging using this LSI alone, without using the in-circuit emulator. Various break conditions can be set in the UBC: instruction fetch or read/write access of an operand, operand size, data contents, address value, and program stop timing for instruction fetch.

36.1 Features

1. The following break conditions can be set. Break channels: Two (channels 0 and 1) User break conditions can be set independently for channels 0 and 1, and can also be set as a single sequential condition for the two channels, that is, a sequential break. (Sequential break involves two cases such that the channel 0 break condition is satisfied in a certain bus cycle and then the channel 1 break condition is satisfied in a different bus cycle, and vice versa.)

• Address When 40 bits containing ASID and 32-bit address are compared with the specified value, all the ASID bits can be compared or masked. 32-bit address can be masked bit by bit, allowing the user to mask the address in desired page sizes such as lower 12 bits (4-Kbyte page) and lower 10 bits (1-Kbyte page). One address bus can be selected among three operand buses: operand address bus (SAB), X memory address bus (XAB), and Y memory address bus (YAB)
• Data 32 bits can be masked only for channel 1. One data bus can be selected among three data buses: operand data bus (SDB), X memory data bus (XDB), and Y memory data bus (YDB)
• Bus cycle The program can break either for instruction fetch (PC break) or operand access.
• Read or write access
• Operand sizes Byte, word, and longword are supported. 2. The user-designated exception handling routine for the user break condition can be executed. 3. Pre-instruction-execution or post-instruction-ex ecution can be selected as the PC break timing. 4. A maximum of 2 – 1 repetition counts can be specified as the break condition (available only for channel 1).

Section 37 User Debugging Interface (H-UDI) Rev. 1.00 Oct. 9, 2008 Page 239 of 336 REJ03B0272-0100 Section 37 User Debugging Interface (H-UDI) Note: This section contains references to the SH7722 Hardware Manual. The contents of the SH7722 Hardware Manual will be disclosed upon acceptance of a confidentiality agreement. For details, please contact a Renesas Technology sales representative. The H-UDI is a serial interface which conforms to the JTAG (IEEE 1149.4: IEEE Standard Test Access Port and Boundary-Scan Architecture) standard. The H-UDI is also used for emulator connection.

37.1 Features

The H-UDI is a serial interface which conforms to the JTAG standard. The H-UDI is also used for emulator connection. When using an emulator, H-UDI functions should not be used. Refer to the appropriate emulator users manual for the method of connecting the emulator. The H-UDI has six pins: TCK, TMS, TDI, TDO, TRST, and ASEBRK/BRKACK. The pin functions except ASEBRK/BRKACK and serial communications protocol conform to the JTAG standard. This LSI has additional six pins for emulator connection: (AUDSYNC, AUDCK, and AUDATA3 to AUDATA0). Figure 37.1 shows a block diagram of the H-UDI. The TAP (Test Access Port) controller and five registers (SDBPR, SDIR, SDDRH, SDDRL, and SDINT). SDBPR supports the JTAG bypass mode, SDIR is used for commands, SDDR is used for data, and SDINT is used for H-UDI interrupts. SDIR is directly accessed from the TDI and TDO pins. The TAP controller and control registers are initialized by driving the TRST pin low or by applying the TCK signal for five or more clock cycles with the TMS pin set to 1. This initialization sequence is independent of the reset pin for this LSI. Other circuits are initialized by a normal reset.

Section 37 User Debugging Interface (H-UDI) Rev. 1.00 Oct. 9, 2008 Page 240 of 336 REJ03B0272-0100 SDIR TCK TDO TDI TMS TRST Shift register TAP controller Decoder Peripheral bus SDINT SDDRH SDDRL Trace controller Break controller Interrupt/ reset etc ASEBRK/BRKACK SDBPR MUX AUDSYNC AUDCK AUDATA3 to AUDATA0 Figure 37.1 H-UDI Block Diagram

37.2 Input/Output Pins

Table 37.1 shows the pin configuration for the H-UDI. Table 37.1 Pin Configuration Pin Name Abbreviation I/O Function When Not in Use Clock TCK Input Functions as the serial clock input pin stipulated in the JTAG standard. Data input to the H-UDI via the TDI pin or data output via the TDO pin is performed in synchronization with this signal. Open* Mode TMS Input Mode Select Input Changing this signal in synchronization with the TCK signal determines the significance of data input via the TDI pin. Its protocol conforms to the JTAG standard (IEEE standard 1149.1). Open*

Section 37 User Debugging Interface (H-UDI) Rev. 1.00 Oct. 9, 2008 Page 241 of 336 REJ03B0272-0100 Pin Name Abbreviation I/O Function When Not in Use Reset TRST* Input H-UDI Reset Input This signal is received asynchronously with a TCK signal. Asserting this signal resets the JTAG interface circuit. When a power is supplied, the TRST pin should be asserted for a given period regardless of whether or not the JTAG function is used, which differs from the JTAG standard. Fixed to ground or connected to the RESET pin.* Data input TDI Input Data Input Data is sent to the H-UDI by changing this signal in synchronization with the TCK signal. Open* Data output TDO Output Data Output Data is read from the H-UDI in synchronization with the TCK signal. Open Emulator ASEBRK/ BRKACK I/O Pins for an emulator Open * Emulator AUDSYNC, AUDCK, AUDATA3 to AUDATA0 Output Pins for an emulator Open Notes: 1. This pin is pulled up in this LSI. When using interrupts or resets via the H-UDI or emulator, the use of external pull-up resistors will not cause any problem. 2. When using interrupts or resets via the H-UDI or emulator, the TRST pin should be designed so that it can be controlled independently and can be controlled to retain low level while the RESET pin is asserted at a power-on reset. 3. This pin should be connected to ground, the RESET, or another pin which operates in the same manner as the RESET pin. However, when connected to a ground pin, the following problem occurs. Since the TRST pin is pulled up within this LSI, a weak current flows when the pin is externally connected to a ground pin. The value of the current is determined by a resistance of the pull-up MOS for the port pin. Although this current does not affect the operation of this LSI, it consumes unnecessary power. Pulling up the TRST pin can be disabled by the pull-down control register (PULCR) of the pin function controller (PFC). For details, see section 38, Pin Function Controller (PFC), in the SH7722 Hardware Manual. The TCK clock or the CPG of this LSI should be set to ensure that the frequency of the TCK clock is less than the peripheral-clock frequency of this LSI.

Section 37 User Debugging Interface (H-UDI) Rev. 1.00 Oct. 9, 2008 Page 242 of 336 REJ03B0272-0100

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 243 of 336 REJ03B0272-0100 Section 38 Electrical Characteristics

38.1 Absolute Maximum Ratings

Table 38.1 shows the absolute maximum ratings. Table 38.1 Absolute Maximum Ratings Item Symbol Rating Unit Power supply voltage (I/O) VCCQ, DV33, AV33 −0.3 to 4.6 V Power supply voltage (Internal) VDD, VDD_PLL, VDD_DLL, DV12, AV12, UV12 −0.3 to 1.8 V Input voltage Vin –0.3 to VCCQ + 0.3 V Storage temperature T stg −55 to 125 °C Caution: Operating the chip in excess of the absolute maximum ratings may result in permanent damage.

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 244 of 336 REJ03B0272-0100

38.2 Recommended Operating Conditions

Table 38.2 lists the recommended operating conditions. The specification in this section assumes the use under the conditions of table 38.2 unless otherwise noted. Table 38.2 Recommended Operating Conditions Item Symbol Min. Typ. Max. Unit Test Conditions Operating temperature T opr −20 ⎯ 70 °C Ambient temperature Ta I/O power supply V CCQ 3.0 3.3 3.6 V Core power supply V DD 1.15 1.2/1.3 1.35 V Power supply for PLL V DD_PLL 1.15 1.2/1.3 1.35 V Power supply for DLL V DD_DLL 1.15 1.2/1.3 1.35 V USB digital 3.3- V power supply DV33 3.0 3.3 3.6 V USB digital 1.2- V power supply DV12 1.15 1.2/1.3 1.35 V USB analog 3.3- V power supply AV33 3.0 3.3 3.6 V USB analog 1.2- V power supply AV12 1.15 1.2/1.3 1.35 V Power supply voltage USB digital 1.2- V power supply UV12 1.15 1.2/1.3 1.35 V

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 245 of 336 REJ03B0272-0100

38.3 Power-On and Power-Off Order

1. Order of turning on 1.2 V power (V DD, VDD_PLL, VDD_DLL) and 3.3 V power (VCCQ) ⎯ First turn on the 3.3 V power, and then turn on the 1.2 V power. This interval is as shown in table 38.3. The system design must ensure that the states of pins or undefined period of an internal state do not cause erroneous system operation. The power settling time (trV CCQ) of the power supply voltage for VCCQ must be shorter than those of any other 3.3 V power. ⎯ First turn on the 3.3 V power, and input RCLK before turning on the 1.2 V. ⎯ Until voltage is applied to all power supplies and a low level is input to the RESETP pin, internal circuits remain unsettled, and so pin states are also undefined. The system design must ensure that these undefined states do not cause erroneous system operation. Waveforms at power-on are shown in the following figure. trVcc VccQ trVDD tPWU tUNC GND RESETP RCLK VDD (min.) voltage VDD : 1.2 V power VccQ (min.) voltage Pins status undefined Normal operation period Power-on reset state Pins status undefined Note: * Except power/GND, clock-related, and analog pins Other pins*

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 246 of 336 REJ03B0272-0100 Table 38.3 Recommended Timing in Power-On Item Symbol Time Unit VCCQ power settling time trVCCQ 300 μs Time difference between 3.3 V VCC and 1.2 V VDD at power-on tPWU 0 to 10 ms VDD power settling time trVDD ≤ 1 ms Time over which the state is undefined tUNC t PWU + trVDD + 3tRCLK ms Note: The 3.3 V power should be turned on at the same time as much as possible. The state-undefined time represents the time in which rising of each power is in transition. This ensures that the pins are in the reset state after tUNC has elapsed. 2. Power-off order ⎯ In the reverse order of power-on, first turn off the 1.2 V VDD power, then turn off the 3.3 V VCCQ power within 10 ms. This interval should be as short as possible. The system design must ensure that the states of pins or undefined period of an internal state do not cause erroneous system operation. ⎯ Pin states are undefined while only the 1.2 V VDD power is off. The system design must ensure that these undefined states do not cause erroneous system operation. tPWD GND VDD : 1.2 V power VCCQ : 3.3 V power VDD (min.) voltage Normal operation period Operation stopped Table 38.4 Recommended Timing in Power-Off Item Symbol Maximum Value Unit Time difference between the power-off of 1.2 V VDD and

3.3 V VCCQ levels

Note: The values in the table above are recommended values, so they represent guidelines rather than strict requirements.

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 247 of 336 REJ03B0272-0100

38.4 DC Characteristics

Tables 38.5, 38.6, and 38.7 list the DC characteristics. Table 38.5 DC Characteristics Item Symbol Min. Typ. Max. Unit Test Conditions MD0, MD1, MD2, MD3, MD5, MD8, TSTMD, TST, TRST, MPMD, ASEBRK/ BRKAK RESETP, NMI, RESETA, PTU0, PTX6, PTE1, PTE0, PTQ0 VIHS V CCQ × 0.8 ⎯ V CCQ + 0.3 V VBUS pin VIH 4.35 — 5.25 V Input high voltage Other input pins V IH 2.0 — V CCQ + 0.3 V MD0, MD1, MD2, MD3, MD5, MD8, TSTMD, TST, TRST, MPMD, ASEBRK/ BRKAK RESETP, NMI, RESETA, PTU0, PTX6, PTE1, PTE0, PTQ0 VILS –0.3 — V CCQ × 0.2 V Input low voltage Other input pins V IL –0.3 — 0.8 V 2.4 — — V I OH = –2 mA Output high voltage All output pins V OH VCCQ × 0.9 — — V I OH = –200 μA Output pins other than I C VOL — — 0.5 V I OL = 2 mA Output low voltage SCL and SDA pins V OL — — 0.4 V

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 248 of 336 REJ03B0272-0100 Item Symbol Min. Typ. M ax. Unit Test Conditions Squelch detection threshold input voltage (differential voltage) DP and DM pins V HSSQ 100 150 mV Input characteristics during high-speed operation Common mode input voltage range DP and DM pins VHSCM –50 500 mV Input characteristics during high-speed operation Idle state DP and DM pins VHSOI –10 10 mV Output characteristics during high-speed operation High output voltage DP and DM pins V HSOH 360 440 mV Low output voltage DP and DM pins V HSOL –10 10 mV Chirp J output voltage (differential) DP and DM pins V CHIRPJ 700 1100 mV Chirp K output voltage (differential) DP and DM pins V CHIRPK –900 –500 mV

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 249 of 336 REJ03B0272-0100 Table 38.6 DC Characteristics Item Symbol Min. Typ. Max. Unit Test Conditions ⎯ 160 320 mA V DD = 1.2 V Iφ = 266 MHz Bφ = 66 MHz B3φ = 133 MHz IDD ⎯ 220 435 mA V DD = 1.3 V Iφ = 333 MHz Bφ = 66 MHz B3φ = 133 MHz Current consumption Normal operation ICC ⎯ 120 150 mA V CCQ3 = 3.3 V Bφ = 66 MHz B3φ = 133 MHz BSC data bus width: 16 bits SBSC data bus width: 64 bits ⎯ 150 180 mA V CCQ3 = 3.3 V Bφ = 66 MHz B3φ = 133 MHz BSC data bus width: 16 bits SBSC data bus width: 32 bits IDD ⎯ 25 70 mA Sleep mode* ICC ⎯ 55 80 *: When external bus cycles other than the refresh cycle are not specified. All module stop: ON V DD = 1.2 V VCCQ = 3.3 V Bφ = 66 MHz B3φ = 133 MHz Software standby mode Istby ⎯ 2.0 12 mA Ta = 25 °C VCCQ = 3.3 V VDD = 1.2 V U-standby mode I ustby ⎯ ⎯ 60 μA Ta = 25 °C VCCQ = 3.3 V VDD = 1.2 V Input clock off

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 250 of 336 REJ03B0272-0100 Item Symbol Min. Typ. Max. Unit Test Conditions All input pins (except SBSC pins) |Iin | ⎯ ⎯ 1 Input leak current SBSC pins |I inSB | ⎯ ⎯ 3 μA V in = 0.5 to VCCQ – 0.5 V I/O, all output pins (off condition) (except SBSC pins) STI | ⎯ ⎯ 1 μA Three-state leak current SBSC pins |I inSB | ⎯ ⎯ 3 Vin = 0.5 to VCCQ – 0.5 V Pull-up/ pull-down resistance Port pins P pull 20 — 150 k Ω SBSC pins C SB — — 10 pF Pin capacitance All pins C — — 10 pF Notes: 1. Make sure to connect the V CCQ pin to the system power and the VSS pin to the system ground (0 V). 2. Current consumption values in the table are for V IHmin = VCCQ − 0.5 V and VILmax = 0.5 V with all output pins unloaded. 3. I DD is the total of current flowing through the VDD, VDD-PLL, VDD-DLL, DV12, AV12, and UV12 pins. ICC is the total of current flowing through the VCCQ, DV33, and AV33 pins. ISTBY is the total of IDD and ICC in standby mode. IUSTBY is the total of IDD and ICC in U-standby mode. Table 38.7 Permissible Output Current Values Item Symbol Min. Typ. Max. Unit Permissible output low current (per pin) I OL — — 2.0 mA Permissible output low current (total) ΣIOL — — 40 mA Permissible output high current (per pin) –I OH — — 2.0 mA Permissible output high current (total) Σ (–IOH) — — 40 mA Permissible I C output low current (SCL, SDA) IOL — — 10 mA Note: To ensure chip reliability, do not exceed the output current values given in table 38.7.

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 251 of 336 REJ03B0272-0100

38.5 AC Characteristics

The inputs of this LSI are synchronous as a rule. The setup and hold time of each input signal must be satisfied unless otherwise noted. Table 38.8 Operating Frequency Range Item Symbol Min. Typ. Max. Unit Remarks 10 — 266.7 V DD = 1.15 V to 1.30 V CPU, DSP, cache (Iφ) 10 — 333.4 V DD = 1.25 V to 1.35 V U-memory (Uφ) 10 — 133.4 SuperHyway bus (SHφ) 10 — 133.4 BSC bus (Bφ) 10 — 66.7 SBSC bus (B3φ) 10 — 133.4 Peripheral module (Pφ) 2.5 — 33.4 SIU clock A (SIUCKA) — — 33.4 SIU clock B (SIUCKB) — — 33.4 IrDA clock (IrDACK) — — 33.4 Operating frequency Video clock (VIO_CKO) f — — 66.7 MHz

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 252 of 336 REJ03B0272-0100

38.5.1 Clock Timing

Table 38.9 Clock Timing Item Symbol Min. Max. Unit Figure EXTAL clock input frequency fEX 10 66 MHz EXTAL clock input cycle time tEXcyc 15 100 ns EXTAL clock input low pulse width tEXL 4.5 ⎯ ns EXTAL clock input high pulse width tEXH 4.5 ⎯ ns EXTAL clock input rise time tEXr ⎯ 3 ns EXTAL clock input fall time tEXf ⎯ 3 ns RCLK clock input frequency fRCLK 32 33 kHz RCLK clock input cycle time tRCLKcyc 30.3 31.3 μs RCLK clock input low pulse width tRCLKL 10 ⎯ μs RCLK clock input high pulse width tRCLKH 10 ⎯ μs RCLK clock input rise time tRCLKr ⎯ 200 ns RCLK clock input fall time tRCLKf ⎯ 200 ns 38.1 CKO clock output frequency fCKO 5 66 MHz CKO clock output cycle time tCKOcyc 15 200 ns CKO clock output low pulse width tCKOL 3 ⎯ ns CKO clock output high pulse width tCKOH 3 ⎯ ns CKO clock output rise time tCKOr ⎯ 3 ns CKO clock output fall time tCKOf ⎯ 3 ns HPCLK clock output frequency fHPC 5 *

133 MHz

HPCLK clock output cycle time tHPCcyc 7.5 200 * ns HPCLK clock output low pulse width t HPCL 1 ⎯ ns HPCLK clock output high pulse width t HPCH 1 ⎯ ns HPCLK clock output rise time tHPCr ⎯ 3 ns HPCLK clock output fall time tHPCf ⎯ 3 ns 38.2 RESETP assert time tRESPW 4 ⎯ t RCLKcyc RESETOUT assert time (clock mode 0) t RESOUTM0 ⎯ 300 μs RESETOUT assert time (clock mode 1) t RESOUTM1 ⎯ 100 μs RESETOUT assert time (clock mode 3) t RESOUTM3 ⎯ 2.3 ms 38.3 to 38.5

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 255 of 336 REJ03B0272-0100 CKO tSOSM3 NMI, IRQ7 to IRQ0 Figure 38.8 Oscillation Settling Time on Return from Software Standby by NMI or IRQ (Clock Mode 3)

38.5.2 Interrupt Signal Timing

Table 38.10 Interrupt Signal Timing Item Symbol Min. Max. Unit Figure NMI setup time* t NMIS 12 — ns NMI hold time tNMIH 6 — ns IRQ7 to IRQ0 setup time* t IRQS 12 — ns IRQ7 to IRQ0 hold time tIRQH 6 — ns 38.9 Note: * NMI and IRQ7 to IRQ0 are asynchronous signals. When the setup time in the table is satisfied, a change is detected at the rising edge of the clock. When the setup time is not satisfied, a change may not be detected until the next rising edge of the clock. CKO NMI tNMIH tNMIS VIH VIL IRQ7 to IRQ0 tIRQH tIRQS VIH VIL Figure 38.9 Interrupt Signal Input Timing

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 256 of 336 REJ03B0272-0100

38.5.3 BSC Bus Timing

Table 38.11 BSC Bus Timing Condition: Ta = –20 to 70°C Item Symbol Min. Max. Unit Figure Address delay time 1 tAD1 1 15 ns 38.10 to 38.23 Address delay time 2 tAD2 1/2t cyc 1/2t cyc + 15 ns 38.19 Address setup time tAS 0 ⎯ ns 38.10 to 38.19 Address hold time tAH 0 ⎯ ns 38.11 CS delay time 1 tCSD1 1 15 ns 38.10 to 38.23 Read/write delay time 1 tRWD1 1 15 ns 38.10 to 38.23 Read strobe delay time tRSD 1/2t cyc 1/2t cyc + 15 ns 38.10 to 38.21 Read data setup time 1 tRDS1 1/2t cyc + 10 ⎯ ns 38.10 to 38.16, 38.20 to 38.23 Read data setup time 3 tRDS3 1/2t cyc + 10 ⎯ ns 38.17 to 38.19 Read data hold time 1 tRDH1 0 ⎯ ns 38.10 to 38.16, 38.20 to 38.23 Read data hold time 3 tRDH3 0 ⎯ ns 38.17 to 38.19 Write enable delay time 1 tWED1 1/2t cyc 1/2t cyc + 15 ns 38.10 to 38.18, 38.20, 38.21 Write enable delay time 2 tWED2 0 15 ns 38.16, 38.17 Write data delay time 1 tWDD1 ⎯ 15 ns 38.10 to 38.18, 38.20 to 38.23 Write data hold time 1 tWDH1 1 ⎯ ns 38.10 to 38.16, 38.20 to 38.23 WAIT setup time 1 tWTS1 1/2t cyc + 7 ⎯ ns 38.10 to 38.19 WAIT hold time 1 tWTH1 1/2t cyc + 6 ⎯ ns 38.10 to 38.19

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 257 of 336 REJ03B0272-0100 T1 T2 CKO A25 to A0 CSn RDWR RD D15 to D0 WEn D15 to D0 WAIT tAD1 tRSD tRSD tAD1 tCSD1 tAS tRWD1 tRDH1 tRWD1 tRDS1 tWDD1 tWDH1 tCSD1 tWED1 tWED1 tWTS1 tWTH1 Read Write Figure 38.10 Basic Bus Cycl e in Normal Space (No Wait)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 258 of 336 REJ03B0272-0100 tAD1 tAS tCSD1 Tw T2 tAD1 tRWD1 tRWD1 tCSD1 tRSD tRSD tAH tRDH1 tRDS1 tWED1 tWED1 tAH tWTH1 tWTS1 tWDH1tWDD1 CKO A25 to A0 CSn RDWR RD D15 to D0 WEn WAIT D15 to D0 Read Write Figure 38.11 Basic Bus Cycle in Normal Space (Software Wait 1)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 259 of 336 REJ03B0272-0100 T1 Twx T2 CKO A25 to A0 CSn RDWR RD D15 to D0 WEn D15 to D0 WAIT tAD1 tRSD tRSD tAD1 tCSD1 tAS tRWD1 tRDH1 tRWD1 tRDS1 tWDD1 tWDH1 tCSD1 tWED1 tWED1 tWTH1 tWTS1 tWTS1 tWTH1 Read Write Figure 38.12 Basic Bus Cycle in Normal Space (Asynchronous External Wait 1)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 260 of 336 REJ03B0272-0100 T1 Tw T2 Taw T1 Tw T2 CKO A25 to A0 CSn RDWR RD D15 to D0 WEn D15 to D0 WAIT tAD1 tRSD tWED1 tWED1 tWED1 tWED1 tRSD tRSD tRSD tAD1 tAD1 tAD1 tCSD1 tRWD1 tRWD1 tRDH1 tRDH1 tRWD1 tRWD1 tCSD1 tRDS1 tWTH1 tWTS1 tWTS1 tWTH1 tWDD1 tWDH1 tWDD1 tWDH1 tRDS1 tCSD1 tCSD1tAS tAS Read Write Figure 38.13 Basic Bus Cycle in Normal Space (Software Wait 1, Asynchronous External Wait Valid (WM Bit = 0), No Idle Cycle)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 261 of 336 REJ03B0272-0100 Th T1 Twx T2 Tf CKO A25 to A0 CSn RDWR RD D15 to D0 WEn D15 to D0 WAIT tAD1 tRSD tRSD tAD1 tCSD1 tRWD1 tRDH1 tRWD1 tRDS1 tWTH1 tWTS1 tWTS1 tWTH1 tWDD1 tWDH1 tCSD1 tWED1 tWED1 Read Write Figure 38.14 CS Extended Bu s Cycle in Normal Space (SW = 1 Cycle, HW = 1 Cycle, Asynchronous External Wait 1)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 262 of 336 REJ03B0272-0100 Th T1 Twx T2 Tf CKO A25 to A0 CSn WEn RDWR RD D15 to D0 RDWR D15 to D0 WAIT tAD1 tAD1 tCSD1 tWED1 tWED1 tCSD1 tWTS1 tWTH1 tWTH1 tWTS1 tRSD tRSD tRDH1 tRDS1 tRWD1 tRWD1 tWDH1tWDD1 tRWD1 tRWD1 Read Write Figure 38.15 Bus Cycle of SRAM with Byte Selection (SW = 1 Cycle, HW = 1 Cycle, Asynchronous External Wait 1, BAS = 0 (UB and LB in Write Cycle Controlled))

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 263 of 336 REJ03B0272-0100 Th T1 Twx T2 Tf CKO A25 to A0 CSn RDWR RDWR RD D15 to D0 D15 to D0 WEn WAIT tAD1 tAD1 tCSD1 tCSD1 tRWD1 tRSD tRSD tRDH1 tRDS1 tWDD1 tWDH1 tWED2 tWED2 tWTS1 tWTH1 tWTH1 tWTS1 tRWD2 tRWD2 tRWD1 Read Write Figure 38.16 SRAM Bus Cy cle with Byte Selection (SW = 1 Cycle, HW = 1 Cycle, Asynchronous External Wait 1, BAS = 1 (Write Cycle WE Control))

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 264 of 336 REJ03B0272-0100 T1 Tw Tw T2B Tw CKO A25 to A0 CSn RDWR RD D15 to D0 WEn WAIT tAD1 tAD2 tAD2 tAD2 tCSD1 tAS tCSD1 tWED2 tRSD tRSD tRDH3 tRDS3 tRDH3 tRDS3 tRWD1 tWED2 tWTH1 tWTH1 tWTS1 tWTS1 Figure 38.17 SRAM Page Mode Read Bus Cycle with Byte Selection PMD = 1, BAS = 1 (Software Wait 1, Asynchronous External Wait 1, Burst Wait 1, 2 Bursts)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 265 of 336 REJ03B0272-0100 T1 Tw Tw T2B Tw CKO A25 to A0 CSn RDWR RD D15 to D0 WEn WAIT tAD1 tAD2 tAD2 tAD2 tCSD1 tAS tCSD1 tWED1 tRSD tRSD tRDH3 tRDS3 tRDH3 tRDS3 tRWD1 tWED1 tWTH1 tWTH1 tWTS1 tWTS1 Figure 38.18 SRAM Page Mode Read Bus Cycle with Byte Selection PMD = 1, BAS = 0 (Software Wait 1, Asynchronous External Wait 1, Burst Wait 1, 2 Bursts)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 266 of 336 REJ03B0272-0100 T1 Tw Twx T2B Twb CKO A25 to A0 CSn RD/WR RD D15 to D0 WEn WAIT tAD1 tAD2 tAD2 tAD2 tCSD1 tRWD1 tAS T2B tCSD1 tRSD tRSD tRDH3 tRDS3 tRDH3 tRDS3 tWTS1 tWTH1 tWTH1 tWTS1 tRWD1 Figure 38.19 Read Bus Cycle of Burst ROM (Software Wait 1, Asynchronous External Wait 1, Burst Wait 1, 2 Bursts)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 267 of 336 REJ03B0272-0100 Tpcm1 Tpcm1w Tpcm1w Tpcm1w CKO A25 to A0 CExx RDWR RD D15 to D0 D15 to D0 WE BS tAD1 Tpcm2 tAD1 tCSD1 tCSD1 tRWD1 tRWD1 tRSD tRSD tRDS1 tRDH1 tWED1 tWED1 tWDH5 tWDH1tWDD1 tBSD tBSD Read Write Figure 38.20 PCMCIA Memory Card Interface Bus Timing

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 268 of 336 REJ03B0272-0100 Tpcm0wTpcm0 Tpcm1 Tpcm1w Tpcm1w Tpcm1w Tpcm1w CKO A25 to A0 CExx RDWR RD D15 to D0 D15 to D0 WE BS WAIT tAD1 Tpcm2 Tpcm2w tAD1 tCSD1 tCSD1 tRWD1 tRWD1 tRSD tRSD tRDS1 tRDH1 tWED1 tWED1 tWDH5 tWDH1tWDD1 tBSD tBSD tWTS1 tWTS1 tWTH1 tWTH1 Read Write Figure 38.21 PCMCIA Memory Card Interface Bus Timing (TED[3:0] = B'0010, TEH[3:0] = B'0001, Software Wait 1, Hardware Wait 1)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 269 of 336 REJ03B0272-0100 Tpci1 Tpci1w Tpci1w Tpci1w CKO A25 to A0 CExx RDWR ICIORD D15 to D0 D15 to D0 ICIOWR BS tAD1 Tpci2 tAD1 tCSD1 tCSD1 tRWD1 tRWD1 tICRSD tICRSD tRDS1 tRDH1 tICWSD tICWSD tWDH5 tWDH1tWDD1 tBSD tBSD Read Write Figure 38.22 PCMCIA I/O Card Interface Bus Timing

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 270 of 336 REJ03B0272-0100 Tpci0wTpci0 Tpci1 Tpci1w Tpci1w Tpci1w Tpci1w CKO A25 to A0 CExx RDWR ICIORD D15 to D0 D15 to D0 ICIOWR BS WAIT IOIS16 tAD1 Tpci2 Tpci2w tAD1 tCSD1 tCSD1 tRWD1 tRWD1 tICRSD tICRSD tRDS1 tRDH1 tICWSD tICWSD tWDH5 tWDH1tWDD1 tBSD tIO16H tIO16H tBSD tWTS1 tWTS1 tWTH1 tWTH1 Read Write Figure 38.23 PCMCIA I/O Card Interface Bus Timing (TED[3:0] = B'0010, TEH[3:0] = B'0001, Software Wait 1, Hardware Wait 1)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 271 of 336 REJ03B0272-0100

38.5.4 SDRAM Timing (SDRAM Bus Timing)

Table 38.12 SDRAM Bus Timing (when SBSCR = H'0044, HPCLK frequency: 133.4 MHz) Item Symbol Min. Max. Unit Figure Address delay time tHPAD 1.0 6.0 ns 38.24 to 38.42 CS delay time tHPCSD 1.0 6.0 ns 38.24 to 38.42 Read/write delay time tHPRWD 1.0 6.0 ns 38.24 to 38.42 Read data setup time tHPRDS 2.0 — ns 38.24 to 38.27, 38.32 to 38.34, 38.41, 38.42 Read data hold time tHPRDH 2.0 — ns 38.24 to 38.27, 38.32 to 38.34, 38.41, 38.42 Write data delay time tHPWDD — 6.0 ns 38.28 to 38.31, 38.35 to 38.37, 38.41, 38.42 Write data hold time tHPWHD 1.0 — ns 38.28 to 38.31, 38.35 to 38.37, 38.41, 38.42 RAS delay time tHPRASD 1.0 6.0 ns 38.24 to 38.42 CAS delay time tHPCASD 1.0 6.0 ns 38.24 to 38.42 DQM delay time tHPDQMD 1.0 6.0 ns 38.24 to 38.42 CKE delay time tHPCKED 1.0 6.0 ns 38.24 to 38.42

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 272 of 336 REJ03B0272-0100 Tr Tc Tcw Td1 HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 (High) tHPAD Row address Column address tHPAD tHPAD tHPAD READA command tHPAD tHPAD tHPCSD tHPCSD tHPRWD tHPRASD tHPRASD tHPRDH tHPRDS tHPRWD tHPRASD tHPCASD tHPCASD tHPCASD tHPDQMD tHPDQMD Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.24 Single Read Bus Cycle of SDRAM (Auto Precharge Mode, CAS Latency 2, TRCD = 1 Cycle)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 273 of 336 REJ03B0272-0100 Tr Trw Tc Tcw Td1 (High) tHPAD Row address Column address tHPAD tHPAD tHPAD READA command tHPAD tHPAD tHPCSD tHPCSD tHPRWD tHPRASD tHPRASD tHPRDH tHPRDS tHPRWD tHPRASD tHPCASD tHPCASD tHPCASD tHPDQMD tHPDQMD HPCKE HPD31 to HPD0 HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.25 Single Read Bus Cycle of SDRAM (Auto Precharge Mode, CAS Latency 2, TRCD = 2 Cycles)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 274 of 336 REJ03B0272-0100 Tr Tc1 Tc2 Td1 Tc3 Td2 Tc4 (High) tHPAD Column address 4 Row address Td3 Td4 tHPAD Column address 1 tHPAD Column address 2 tHPAD Column address 3 tHPAD tHPAD tHPAD READA command READ command tHPADtHPAD tHPAD tHPCSD tHPCSD tHPRWD tHPRASD tHPRASD tHPRDH tHPRDS tHPRDH tHPRDS tHPRDH tHPRDS tHPRDH tHPRDS tHPRWD tHPRASD tHPCASD tHPCASD tHPCASD tHPDQMD tHPDQMD HPCKE HPD31 to HPD0 HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.26 Burst Read Bus Cycle of SDRAM (Auto Precharge Mode, CAS Latency 2, TRCD = 1 Cycle)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 275 of 336 REJ03B0272-0100 Tr Tc1 Tc2 Td1 Tc3 Td2 Tc4 (High) tHPAD Row address Trw Td3 Td4 tHPAD Column address 1 tHPAD Column address 2 tHPAD tHPAD Column address 3 tHPAD tHPAD tHPAD READA command READ command tHPADtHPAD tHPCSD tHPCSD tHPRWD tHPRASD tHPRASD tHPRDH tHPRDS tHPRDH tHPRDS tHPRDH tHPRDS tHPRDH tHPRDS tHPRWD tHPRASD tHPCASD tHPCASD tHPCASD tHPDQMD tHPDQMD HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Column address 4 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.27 Burst Read Bus Cycle of SDRAM (Auto Precharge Mode, CAS Latency 2, TRCD = 2 Cycles)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 276 of 336 REJ03B0272-0100 Tr Trwl (High) tHPAD Column address Row address Tc tHPAD tHPAD tHPAD WRITA command tHPAD tHPAD tHPCSD tHPCSD tHPRWD tHPRASD tHPRASD tHPRWD tHPRWD tHPRASD tHPCASD tHPCASD tHPCASD tHPDQMD tHPDQMD tHPWDHtHPWDD HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.28 Single Write Bus Cycle of SDRAM (Auto Precharge Mode, TRWL = 2 Cycles)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 277 of 336 REJ03B0272-0100 Tr Trw (High) tHPAD Row address Trw TrwlTc tHPAD tHPAD tHPAD WRITA command tHPAD tHPAD tHPCSD tHPCSD tHPRWD tHPRASD tHPRASD tHPRWD tHPRWD tHPRASD tHPCASD tHPCASD tHPCASD tHPDQMD tHPDQMD tHPWDHtHPWDD Column address HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.29 Single Write Bus Cycle of SDRAM (Auto Precharge Mode, TRCD = 3 Cycles, TRWL = 2 Cycles)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 278 of 336 REJ03B0272-0100 Tr Tc1 Tc2 Tc3 Tc4 (High) tHPAD Column address 4 Row address Trwl tHPAD Column address 1 tHPAD Column address 2 tHPAD Column address 3 tHPAD tHPAD tHPAD WRITA command WRIT command tHPADtHPAD tHPAD tHPCSD tHPCSD tHPRWD tHPRASD tHPRASD tHPWDH tHPWDD tHPWDH tHPWDD tHPWDH tHPWDD tHPWDH tHPWDD tHPRWD tHPRASD tHPCASD tHPCASD tHPCASD tHPDQMD tHPDQMD tHPRWD HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.30 Burst Write Bus Cycle of SDRAM (Auto Precharge Mode, TRCD = 1 Cycle, TRWL = 2 Cycles)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 279 of 336 REJ03B0272-0100 Tr Tc1 Tc2 Tc3 Tc4 (High) tHPAD Row address TrwlTrw tHPAD Column address 1 tHPAD Column address 2 tHPAD Column address 3 tHPAD tHPAD tHPAD WRITA command WRIT command tHPADtHPAD tHPAD tHPCSD tHPCSD tHPRWD tHPRASD tHPRASD tHPWDH tHPWDD tHPWDH tHPWDD tHPWDH tHPWDD tHPWDH tHPWDD tHPRWD tHPRASD tHPCASD tHPCASD tHPCASD tHPDQMD tHPDQMD tHPRWD HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Column address 4 Figure 38.31 Burst Write Bus Cycle of SDRAM (Auto Precharge Mode, TRCD = 2 Cycles, TRWL = 2 Cycles)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 280 of 336 REJ03B0272-0100 Tr Tc1 Tc2 Td1 Tc3 Td2 Tc4 (High) tHPAD Column address 4 Row address Td3 Td4 Tde tHPAD tHPAD tHPAD tHPAD tHPAD tHPADtHPAD tHPAD Column address 1 Column address 2 Column address 3 READ command tHPCSD tHPCSD tHPRWD tHPRASD tHPRASD tHPRDH tHPRDS tHPRDH tHPRDS tHPRDH tHPRDS tHPRDH tHPRDS tHPRWD tHPRASD tHPCASD tHPCASD tHPCASD tHPDQMD tHPDQMD HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.32 Burst Read Bus Cycle of SDRAM (Bank Active Mode: ACTV + READ Commands, CAS Latency 2, TRCD = 1 Cycle)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 281 of 336 REJ03B0272-0100 Tc1 Tc2 Td1 Tc3 Td2 Tc4 (High) tHPAD Column address 4 Td3 Td4 tHPAD Column address 1 tHPAD Column address 2 tHPAD Column address 3 tHPAD tHPAD READ command tHPAD tHPCSD tHPCSD tHPRWD tHPRASD tHPRDH tHPRDS tHPRDH tHPRDS tHPRDH tHPRDS tHPRDH tHPRDS tHPRWD tHPRASD tHPCASD tHPCASD tHPDQMD tHPDQMD HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.33 Burst Read Bus Cycle of SDRAM (Bank Active Mode: READ Command, Same Row Address, CAS Latency 2)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 282 of 336 REJ03B0272-0100 (High) tHPAD Tr Tc1Tp Tpw Tc2 Td1 Tc3 Td2 Tc4 Td3 Td4 tHPAD Column address 1 tHPAD Column address 2 tHPAD Column address 3 tHPAD tHPAD tHPAD READ command tHPADtHPAD tHPAD tHPCSD tHPRWD tHPRDS tHPRDH tHPRDS tHPRDH tHPRDS tHPRDH tHPRDS tHPRWD tHPCASD tHPCASD tHPCASD tHPDQMD tHPDQMD tHPCSD tHPRWD tHPRASD tHPRASD tHPRASD tHPRASD tHPRASD tHPRDH Column address 4 Row address HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.34 Burst Read Bus Cycle of SDRAM (Bank Active Mode: PRE + ACTV + READ Commands, Different Row Address, CAS Latency 2, TRCD = 1 Cycle)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 283 of 336 REJ03B0272-0100 Tr Tc1 Tc2 Tc3 Tc4 (High) Column address 4 Row address tHPAD Column address 1 tHPAD Column address 2 tHPAD Column address 3 tHPAD tHPAD WRIT command tHPCSD tHPCSD tHPRWD tHPRASD tHPRASD tHPWDH tHPWDD tHPWDH tHPWDD tHPWDH tHPWDD tHPWDH tHPWDD tHPRWD tHPRASD tHPCASD tHPCASD tHPCASD tHPDQMD tHPDQMD tHPRWD HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. tHPADtHPAD tHPAD tHPAD Figure 38.35 Burst Write Bus Cycle of SDRAM (Bank Active Mode: ACTV + WRIT Commands, TRCD = 1 Cycle)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 284 of 336 REJ03B0272-0100 Tc1 Tc2 Tc3 Tc4 (High) Column address 4 tHPAD Column address 1 tHPAD Column address 2 tHPAD Column address 3 tHPAD tHPAD WRIT command tHPADtHPAD tHPCSD tHPCSD tHPWDH tHPWDD tHPWDH tHPWDD tHPWDH tHPWDD tHPWDH tHPWDD tHPRWD tHPRASDtHPRASD tHPCASD tHPCASD tHPDQMD tHPDQMD tHPRWD HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.36 Burst Write Bus Cycle of SDRAM (Single Write × 4) (Bank Active Mode: WRIT Command)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 285 of 336 REJ03B0272-0100 Tr Tc1Tp Tpw Tc2 (High) tHPAD Row address Tc3 Tc4 tHPAD Column address 1 tHPAD Column address 2 tHPAD Column address 3 tHPAD tHPAD tHPAD WRIT command tHPADtHPAD tHPAD tHPCSD tHPRWD tHPWDHtHPWDH tHPWDD tHPWDD tHPWDH tHPWDD tHPWDD tHPRWD tHPCASD tHPCASD tHPCASD tHPDQMD tHPDQMD tHPCSD tHPRWD tHPRASD tHPRASD tHPRASD tHPRASD tHPRASD tHPWDH Column address 4 tHPRWD HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.37 Burst Write Bus Cycle of SDRAM (Bank Active Mode: PRE + ACTV + WRIT Commands, TRCD = 1 Cycle)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 286 of 336 REJ03B0272-0100 Tp Tpw Trr Trc Trc (High) tHPAD Trc Trc tHPAD tHPAD tHPAD tHPADtHPAD tHPCSD tHPCSD tHPRWD tHPCSD tHPCSD tHPCSD tHPRWD tHPCASD tHPCASD tHPCASD tHPCASD tHPRASD tHPRASD tHPRASD tHPRASD tHPRASD tHPDQMD tHPDQMD (High-Z) tHPRWD HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.38 Auto Refresh Timing of SDRAM (TRP = 2 Cycles)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 287 of 336 REJ03B0272-0100 Tp Tpw Trr Trc tHPAD Trc Trc Trc Trc tHPAD tHPAD tHPAD tHPADtHPAD tHPCSD tHPCSD tHPRWD tHPCSD tHPCSD tHPCSD tHPRWD tHPCKEDtHPCKED tHPCKED tHPCASD tHPCASD tHPCASD tHPCASD tHPRASD tHPRASD tHPRASD tHPRASD tHPRASD tHPDQMD tHPDQMD (High-Z) tHPRWD HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.39 Self Refresh Timing of SDRAM (TRP = 2 Cycles)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 288 of 336 REJ03B0272-0100 Tp Tpw Trr Trc tHPAD Trr Trc Trc Tmw Tde tHPAD tHPAD tHPAD tHPCSD tHPCSD tHPRWD tHPCSD tHPCSD tHPCSD tHPCSD tHPCSD tHPCSD tHPCSD tHPRWD tCKED1 tHPCASD tHPCASD tHPCASD tHPCASD tHPCASD tHPCASD tHPRASD tHPRASD tHPRASD tHPRASD tHPRASD tHPRASD tHPRASD tHPRASD tHPRASD tHPDQMD tHPDQMD (High-Z) (High) tHPRWDtHPRWDtHPRWD tHPAD tHPAD tHPAD tHPAD HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.40 Power-On Sequence of SDRAM (Mode Write Timing, TRP = 2 Cycles)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 289 of 336 REJ03B0272-0100 Tr Tc Trwl Tr Tc Tcw Td1 tHPAD tHPAD tHPADtHPAD tHPAD tHPAD tHPCSD tHPAD tHPAD tHPCSD tHPRASD tHPCASD tHPCASD tHPCASD tHPRASD tHPRASDtHPRASD tHPADtHPAD tHPAD tHPDQMD tHPCKED tHPCSD tHPDQMD tHPRWD tHPRWD tHPCASD tHPDQMD tHPCKED tHPRDH tHPRWD tHPCSD tHPDQMD tHPWDD tHPRDStHPWDH Row address Column address Column address Row address WRITA command READA command HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.41 Write to Read Bus Cycle in Power-Down Mode of SDRAM (Auto Precharge Mode, TRCD = 1 Cycle, TRP = 1 Cycle, TRWL = 1 Cycle)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 290 of 336 REJ03B0272-0100 Tr Tc Tcw Td1 Tr Tc Trwl tHPAD tHPAD tHPAD tHPAD tHPAD tHPAD tHPAD tHPCSD tHPAD tHPAD tHPADtHPAD tHPAD tHPCSD tHPAD tHPRASD tHPCASD tHPCASD tHPCASD tHPRASD tHPRASDtHPRASD tHPDQMD tHPCKED tHPCSD tHPDQMD tHPRWD tHPRWD tHPCASD tHPDQMD tHPCKED tHPWDH tHPRWD tHPCASD tHPRASD tHPCSD tHPDQMD tHPRDS tHPWDDtHPRDH Row address Row address READA command WRITA command Column address Column address HPCLK HPA16 to HPA1 HPA12, HPA11* HPCS3 HPRDWR HPRAS HPCAS HPDQMn HPCKE HPD31 to HPD0 Note: * An address pin to be connected to pin A10 of SDRAM. Figure 38.42 Read to Write Bus Cycle in Power-Down Mode of SDRAM (Auto Precharge Mode, TRCD = 1 Cycle, TRP = 1 Cycle, TRWL = 1 Cycle)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 291 of 336 REJ03B0272-0100

38.5.5 I/O Port Signal Timing

Table 38.13 I/O Port Signal Timing Item Symbol Min. Max. Unit Figure Output data delay time tPORTD — 17 Input data setup time tPORTS 17 — Input data hold time tPORTH 10 — ns 38.43 tPORTS CKO tPORTH tPORTD Ports 7 to 0 (Read) Ports 7 to 0 (Write) Figure 38.43 I/O Port Timing

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 292 of 336 REJ03B0272-0100

38.5.6 DMAC Module Signal Timing

Table 38.14 DMAC Module Signal Timing Item Symbol Min. Max. Unit Figure DREQ setup time tDREQS 8 — DREQ hold time tDREQH 8 — 38.44 DACK delay time tDACD — 15 ns 38.45 tDREQS tDREQH CKO DREQ0 Figure 38.44 DREQ Input Timing (DREQ Low Level Detected) CKO DACKn tDACD tDACD Figure 38.45 DACK Output Timing

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 293 of 336 REJ03B0272-0100

38.5.7 SIM Module Signal Timing

Table 38.15 SIM Module Signal Timing Item Symbol Min. Max. Unit Figure SIM_CLK clock cycle tSMCYC 2/t pcyc 16/t pcyc ns SIM_CLK clock high level width t SMCWH 0.4 × tSMCYC ⎯ ns SIM_CLK clock low level width t SMCWL 0.4 × tSMCYC ⎯ ns SIM_RST reset output delay time t SMRD ⎯ 20 ns 38.46 Note: tpcyc is a cycle time of a peripheral clock (Pφ). tSMCWH tSMCWL tSMRD tSMRD tSMCYC SIM_CLK SIM_RST Figure 38.46 SIM Module Signal Timing

38.5.8 TPU Module Signal Timing

Table 38.16 TPU Module Signal Timing Item Symbol Min. Max. Unit Figure Output data delay time tTOD ⎯ 15 ns 38.47 CKO tTOD TPUTO Figure 38.47 TPU Output Timing

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 294 of 336 REJ03B0272-0100

38.5.9 SIO Module Signal Timing

Table 38.17 SIO Module Signal Timing Item Symbol Min. Max. Unit Figure SIOMCK clock cycle tSOMCYC 2 × tpcyc ⎯ ns 38.48 SIOMCK clock high level width t SOMWH 0.4 × tSOMCYC ⎯ ns 38.48 SIOMCK clock low level width t SOMWL 0.4 × tSOMCYC ⎯ ns 38.48 SIOSCK clock cycle tSOCYC 2 × tpcyc ⎯ ns 38.49 SIOSCK clock high level width t SOWH 0.4 × tSOCYC ⎯ ns 38.49 SIOSCK clock low level width t SOWL 0.4 × tSOCYC ⎯ ns 38.49 SIOSTRB output delay time t SOSD ⎯ 20 ns 38.49 to 38.52 SIOTXD output data delay time t SOTDD ⎯ 20 ns 38.49 to 38.52 SIORXD input data setup time t SORDS 20 ⎯ ns 38.49 to 38.52 SIORXD input data hold time t SORDH 20 ⎯ ns 38.49 to 38.52 Note: tpcyc is a cycle time of a peripheral clock (Pφ). SIOMCK tSOMCYC tSOMWH tSOMWL Figure 38.48 SIOMCK Input Timing

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 297 of 336 REJ03B0272-0100

38.5.10 SIOF Module Signal Timing

Table 38.18 SIOF Module Signal Timing Item Symbol Min. Max. Unit Figure SIOFMCK clock input cycle time t MCYC t pcyc* ⎯ ns 38.53 SIOFMCK input high level width t MWH 0.4 × tMCYC ⎯ ns 38.53 SIOFMCK input low level width t MWL 0.4 × tMCYC ⎯ ns 38.53 SIOFSCK clock cycle time t SICYC t pcyc* ⎯ ns 38.54 to 38.58 SIOFSCK output high level width t SWHO 0.4 × tSICYC ⎯ ns 38.54 to 38.57 SIOFSCK output low level width t SWLO 0.4 × tSICYC ⎯ ns 38.54 to 38.57 SIOFSYNC output delay time t FSD ⎯ 20 ns 38.54 to 38.57 SIOFSCK input high level width t SWHI 0.4 × tSICYC ⎯ ns 38.58 SIOFSCK input low level width t SWLI 0.4 × tSICYC ⎯ ns 38.58 SIOFSYNC input setup time t FSS 20 ⎯ ns 38.58 SIOFSYNC input hold time t FSH 20 ⎯ ns 38.58 SIOFTXD output delay time t STDD ⎯ 20 ns 38.54 to 38.58 SIOFRXD input setup time t SRDS 20 ⎯ ns 38.54 to 38.58 SIOFRXD input hold time tSRDH 20 ⎯ ns 38.54 to 38.58 Slave select setup time tSSS t SICYC/2 × n* −20 ⎯ ns 38.59, 38.60 Slave select hold time tSSH t SICYC/2 × n* ⎯ ns 38.59, 38.60 Notes: 1. tpcyc is a cycle time of a peripheral clock (Pφ). 2. t SICYC/2 × n is defined according to bits SSAST[1:0] in SPICR. tMWH tMWL tMCYC SIOFMCK Figure 38.53 SIOFMCLK Input Timing

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 301 of 336 REJ03B0272-0100 tSSS tSSH tSRDS tSRDH SIOFSCK (CPOL = 0) SIOFSCK (CPOL = 1) SIOFTXD SIOFRXD SIOFSSn/SIOFSYNC MSB MSB LSB LSB tSTDD Figure 38.60 SIOF Transm ission/Reception Timing (SPI Mode, CPHA = B'1, SSAST[1:0] = B'01)

38.5.11 SCIF Module Signal Timing

Table 38.19 SCIF Module Signal Timing (Asynchronous Mode) Item Symbol Min. Max. Unit Figure SCIF input clock cycle tSCYC 4 × tpcyc — SCIF input clock high level width t SCWH 0.4 × tSCYC — SCIF input clock low level width t SCWL 0.4 × tSCYC — ns 38.61 Note: t pcyc is a cycle time of a peripheral clock (Pφ).

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 303 of 336 REJ03B0272-0100 38.5.12 I C Module Signal Timing Table 38.21 SDA and SCL Bus Line Characteristics for I C Bus Device Normal Mode High-Speed Mode Item Symbol Min. Max. Min. Max. Unit Figure SCL clock frequency fSCL 0 100 0 400 kHz Hold time (after repeat START condition, first clock pulse is generated) tHD;STA 4.0 ⎯ 0.6 ⎯ μs Low period in SCL clock tLOW 4.7 ⎯ 1.3 ⎯ μs High period in SCL clock tHIGH 4.0 ⎯ 0.6 ⎯ μs Setup time for repeat START condition tSU;STA 4.7 ⎯ 0.6 ⎯ μs Data hold time: for I C bus device t HD;DAT ⎯ 3.45 ⎯ 0.9 μs Data setup time tSU;DAT 250 ⎯ 100 ⎯ ns SDA and SCL signal rise time t r ⎯ 1000 ⎯ 300 ns SDA and SCL signal fall time t f ⎯ 300 ⎯ 300 ns Setup time for STOP condition t SU;STO 4.0 ⎯ 0.6 ⎯ μs Bus free time between STOP and START conditions t BUF 4.7 ⎯ 1.3 ⎯ μs Noise margin at low level of each connected device (including hysteresis) V nL 0.1 × VCCQ ⎯ 0.1 × VCCQ ⎯ V Noise margin at high level of each connected device (including hysteresis) VnH 0.2 × VCCQ ⎯ 0.2 × VCCQ ⎯ V 38.63 Notes: 1. All values are referenced at V CCQ × 0.3 and VCCQ × 0.7 levels. 2. To satisfy the I C-bus specification, pull-up resistors (Rp) with the appropriate resistance must be included depending on the total of bus capacitive load of each line. 3. Relationship between pull-up resistance and total capacitive load of the I C bus.

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 304 of 336 REJ03B0272-0100 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 20 40 6030 50 70 80 90 100 20 40 60 8030 50 70 90 100 (1) When SCL = 100 kHz Total of bus capacitive load (pF) (2) When SCL = 400 kHz Total of bus capacitive load (pF) Pull-up resistance Rp (kΩ) Pull-up resistance Rp (kΩ) Maximum value of Rp Minimum value of Rp Maximum value of Rp Minimum value of Rp * A hold time of at least 300 ns is internally assured for the SDA signal (relative to V IHmin of the SCL signal). The state of the SDA signal is stabilized on falling edges of the SCL signal. tLOW VCC × 0.3 VCC × 0.7 tHD; STA tHD;DAT tr tf tSU; DAT tHIGH tSU; STA tHD; STA tSU; STO tBUF tSP VnH tf tr VnL SCL SDA SS r P S Figure 38.63 Device Timing Definition on I C Bus

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 305 of 336 REJ03B0272-0100

38.5.13 FLCTL Module Signal Timing

Table 38.22 AND-Type Flash Memory Interface Timing Item Symbol Min. Max. Unit Figure Command issue setup time t ACDS 2 × tfcyc − 10 ⎯ ns Command issue hold time tACDH 2 × tfcyc − 10 ⎯ ns 38.64, 38.68 Data output setup time tADOS t fcyc − 10 ⎯ ns Data output hold time tADOH t fcyc − 10 ⎯ ns 38.64, 38.65, 38.68 Data output setup time 2 tADOS2 0.5 × tfcyc − 10 ⎯ ns Data output hold time 2 tADOH2 0.5 × tfcyc − 10 ⎯ ns 38.67 FWE cycle time t ACWC 2 × tfcyc − 5 ⎯ ns 38.65 FWE low pulse width t AWP t fcyc − 5 ⎯ ns 38.64, 38.65, 38.68 FWE high pulse width t AWPH t fcyc − 5 ⎯ ns Command to address transition time t ACAS 4 × tfcyc ⎯ ns 38.65 Address to data read transition time t AADDR 32 × tpcyc ⎯ ns Address to ready/busy transition time t AADRB ⎯ 35 × tpcyc ns Ready/busy to data read transition time t ARBDR t fcyc ⎯ ns Data read setup time tADRS t fcyc − 10 ⎯ ns 38.66 FSC cycle time tASCC t fcyc − 5 ⎯ ns FSC high pulse width tASP 0.5 × tfcyc − 5 ⎯ ns FSC low pulse width tASPL 0.5 × tfcyc − 5 ⎯ ns 38.66, 38.67 Read data setup time tARDS 24 ⎯ ns Read data hold time tARDH 5 ⎯ ns 38.67, 38.68 Address to data write transition time t AADDW 32 × tPCYC ⎯ ns Data write setup time tADWS 4.5 × tfcyc + tpcyc − 10 ⎯ ns 38.67 FSC to FOE hold time tASOH 2 × tfcyc − 10 ⎯ ns 38.66 Note: t fcyc indicates the period of one cycle of the FCLK. tpcyc indicates the period of one cycle of the peripheral clock (Pφ).

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 308 of 336 REJ03B0272-0100 tADOS tACDS tAWP tACDH tADOH (Low) (Low) (High) FCE FCDE FOE FWE FSC NAF7 to NAF0 FRB tARDS tARDH Command Status Figure 38.68 Status Read Timing of AND-Type Flash Memory

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 309 of 336 REJ03B0272-0100 Table 38.23 NAND-Type Flash Memory Interface Timing Item Symbol Min. Max. Unit Figure Command output setup time t NCDS 2 × tfcyc − 10 ⎯ ns Command output hold time tNCDH 1.5 × tfcyc − 5 ⎯ ns 38.69, 38.73 Data output setup time tNDOS 0.5 × tfcyc − 5 ⎯ ns Data output hold time tNDOH 0.5 × tfcyc − 10 ⎯ ns 38.69, 38.70, 38.72, 38.73 Command to address transition time 1 t NCDAD1 1.5 × tfcyc − 10 ⎯ ns 38.69, 38.70 Command to address transition time 2 t NCDAD2 2 × tfcyc − 10 ⎯ ns 38.70 FWE cycle time t NWC t fcyc − 5 ⎯ ns 38.70, 38.72 FWE low pulse width t NWP 0.5 × tfcyc − 5 ⎯ ns 38.69, 38.70, 38.72, 38.73 FWE high pulse width t NWH 0.5 × tfcyc − 5 ⎯ ns 38.70, 38.72 Address to ready/busy transition time t NADRB ⎯ 32 × tpcyc ns 38.70, 38.71 Ready/busy to data read transition time 1 t NRBDR1 1.5 × tfcyc ⎯ ns Ready/busy to data read transition time 2 t NRBDR2 32 × tpcyc ⎯ ns FSC cycle time tNSCC t fcyc − 5 ⎯ ns 38.71 FSC low pulse width tNSP 0.5 × tfcyc − 5 ⎯ ns 38.71, 38.73 FSC high pulse width tNSPH 0.5 × tfcyc − 5 ⎯ ns 38.71 Read data setup time tNRDS 24 ⎯ ns Read data hold time tNRDH 5 ⎯ ns 38.71, 38.73 Data write setup time tNDWS 32 × tpcyc ⎯ ns 38.72 Command to status read transition time t NCDSR 4 × tfcyc ⎯ ns Command output off to status read transition time t NCDFSR 3.5 × tfcyc ⎯ ns Status read setup time tNSTS 2.5 × tfcyc ⎯ ns 38.73 Note: t fcyc indicates the period of one cycle of the FCLK. tpcyc indicates the period of one cycle of the peripheral clock (Pφ).

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 312 of 336 REJ03B0272-0100 tNDOS tNCDS tNWP tNCDH tNSTS tNCDFSR tNDOH (Low) (High) FCE FCDE FOE FWE FSC NAF7 to NAF0 FRB (Low) tNRDS tNSPtNCDSR tNRDH Command Status Figure 38.73 Status Read Timing of NAND-Type Flash Memory

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 313 of 336 REJ03B0272-0100

38.5.14 VIO Module Signal Timing

Table 38.24 VIO Module Signal Timing Item Symbol Min. Max. Unit Figure Vertical sync (VIO_VD) setup time tVVDS 10 ⎯ ns Vertical sync (VIO_VD) hold time tVVDH 10 ⎯ ns Horizontal sync (VIO_HD) setup time t VHDS 10 ⎯ ns Horizontal sync (VIO_HD) hold time tVHDH 10 ⎯ ns Capture image data (VIO_D) setup time t VDTS 10 ⎯ ns Capture image data (VIO_D) hold time t VDTH 10 ⎯ ns Camera clock cycle tVCYC t bcyc* ⎯ ns Camera clock high width tVHW 0.4 × tVcyc ⎯ ns Camera clock low width tVLW 0.4 × tVcyc ⎯ ns Field identification signal (VIO_FLD) setup time t VFDS 10 ⎯ ns Field identification signal (VIO_FLD) hold time t VFDH 10 ⎯ ns 38.74 Note: * t bcyc is a cycle time of an internal bus clock (Bφ). tVHDH tVCYC tVHW tVLW tVHDS tVVDH tVVDS tVDTH tVDTS VIO_CLK VIO_HD VIO_VD tVFDH tVFDS VIO_FLD VIO_D15 to VIO_D0 Data Figure 38.74 VIO Module Signal Timing

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 314 of 336 REJ03B0272-0100

38.5.15 LCDC Module Signal Timing

Table 38.25 LCDC Module Signal Timing Item Symbol Min. Max. Unit Figure Clock (LCDDCK) cycle time tLCC 30 ⎯ ns Clock (LCDLCLK) cycle time tLCLC 1/fB φ ⎯ ns Clock (LCDDCK) high pulse time tLCHW 9 ⎯ ns Clock (LCDDCK) low pulse time tLCLW 9 ⎯ ns Data (LCDD) delay time tLDD −12 12 ns Display enable (LCDDISP) delay time tLID −12 12 ns Horizontal sync signal (LCDHSYN) delay time t LHD −12 12 ns Vertical sync signal (LCDVSYN) delay time t LVD −12 12 ns 38.75 Chip select signal (LCDCS, LCDCS2) SYS interface command delay time tLSYSCSD ⎯ 22 ns Write strobe signal (LCDDCK) SYS interface command delay time tLSYSWRD ⎯ 22 ns Register select signal (LCDDISP) SYS interface command delay time t LSYSRSD ⎯ 22 ns Data (LCDD) SYS interface command write data delay time t LSYSDD ⎯ 22 ns 38.76 Read strobe signal (LCDRD) SYS interface command delay time tLSYSRDD ⎯ 22 ns Data (LCDD) SYS interface read data setup time t LSYSRDS 10 ⎯ ns Data (LCDD) SYS interface read data hold time t LSYSRDH 5 ⎯ ns Read write signal (LCDVCPWC) SYS interface command delay time t LSYSRDWRD −12 12 ns 38.77 Write strobe signal (LCDWR) SYS interface data cycle time tLSYSDWRC 30 ⎯ ns Write strobe signal (LCDWR) SYS interface data high pulse time tLSYSDWRHW 9 ⎯ ns 38.78

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 315 of 336 REJ03B0272-0100 Item Symbol Min. Max. Unit Figure Write strobe signal (LCDWR) SYS interface data low pulse time tLSYSDWRLW 9 ⎯ ns Write strobe signal (LCDWR) SYS interface data address setup time tLSYSDAS 1 tLSYSDWRC − 12 1 tLSYSDWRC + 12 ns Write strobe signal (LCDWR) SYS interface data address hold time* tLSYSDAH 1 tLSYSDWRHW − 12 1 tLSYSDWRHW + 12 ns Data (LCDD) SYS interface data delay time t LSYSDDD −12 12 ns 38.78 Input vertical sync signal (LCDVSYN, LCDVSYN2) setup time tLVIS 10 ⎯ ns Input vertical sync signal (LCDVSYN, LCDVSYN2) hold time t LVIH 5 ⎯ ns 38.79 Note: * The minimum value of t LSYSDAH is one unit of tLSYSDWRHW. tLSYSDWRHW can be arbitrarily set by LCDDCKPATxR (x = 1 to 4). tLDD tLCHW tLCLW tLCC LCDD17 to LCDD0 LCDDCK LCDDISP LCDRD LCDHSYN LCDVSYN tLID tLRDD tLHD tLVD 0.8Vcc 0.2Vcc Figure 38.75 LCDC AC Characteristics

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 318 of 336 REJ03B0272-0100

38.5.16 VOU Module Signal Timing

Table 38.26 VOU Module Signal Timing Item Symbol Min. Typ. Max. Unit Figure Output clock frequency f px1 13.5 ⎯ 27 MHz Output clock cycle t pxcyc1 37 ⎯ 74.1 ns Output clock high width t pxwH1 14 ⎯ ⎯ ns Output clock low width t pxwL1 14 ⎯ ⎯ ns Output data delay time t pxd1 −4 ⎯ 4 ns 38.80 Output clock frequency 2 f px2 13.5 ⎯ 27 MHz Output clock cycle 2 t pxcyc2 37 ⎯ 74.1 ns Output clock high width 2 t pxwH2 14 ⎯ ⎯ ns Output clock low width 2 t pxwL2 14 ⎯ ⎯ ns Output data delay time 2 t pxd2 −4 ⎯ 4 ns 38.81 DV_CLK tpxd1 tpxwH1 tpxcyc1 tpxwL1 DV_HSYNC DV_VSYNC DV_D15 to DV_D0 Figure 38.80 VOU AC Charac teristics (VOUCR.CKPL = 0) DV_CLK tpxd2 tpxwH2 tpxcyc2 tpxwL2 DV_HSYNC DV_VSYNC DV_D15 to DV_D0 Figure 38.81 VOU AC Charac teristics (VOUCR.CKPL = 1)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 319 of 336 REJ03B0272-0100

38.5.17 TSIF Module Signal Timing

Table 38.27 TSIF Module Signal Timing Item Symbol Min. Max. Unit Figure Bφ ≥ 40 MHz t TSCYC 25 ⎯ ns TSIF input clock cycle Bφ < 40 MHz t TSCYC t bcyc* ⎯ ns TSIF input clock high width tTSHW 0.4 × tTSCYC ⎯ ns TSIF input clock low width tTSLW 0.4 × tTSCYC ⎯ ns TSIF input data setup time tTSDTS 5 ⎯ ns TSIF input data hold time tTSDTH 5 ⎯ ns TSIF input data enable signal setup time t TSDES 5 ⎯ ns TSIF input data enable signal hold time t TSDEH 5 ⎯ ns TSIF input data sync signal setup time t TSSYS 5 ⎯ ns TSIF input data sync signal hold time t TSSYH 5 ⎯ ns 38.82 Note: * t bcyc is a cycle time of an internal bus clock (Bφ). tTSCYC tTSLW tTSDEH tTSHW tTSDTS tTSDTH tTSDES TS_SCK TS_SDAT TS_SDEN tTSSYHtTSSYS TS_SPSYNC Figure 38.82 TSIF Module Signal Timing (TSCTLR.TSDATP = 0, TSCTLR.TSCLKP = 1, TSCTLR.TSVLDP = 0, TSCTLR.PSYCP = 0)

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 320 of 336 REJ03B0272-0100

38.5.18 SIU Module Signal Timing

Table 38.28 SIU Module Signal Timing Item Symbol Min. Max. Unit Figure SIUMCK clock input cycle time t SIUMCYC 40 ⎯ ns SIUMCK input high width tSIUMWH 0.4 × tSIUMCYC ⎯ ns SIUMCK input low width tSIUMWL 0.4 × tSIUMCYC ⎯ ns 38.84 SIU_BT clock cycle time tSIUSICYC 300 ⎯ ns SIU_BT output high width tSIUSWHO 0.4 × tSIUSICYC ⎯ ns SIU_BT output low width tSIUSWLO 0.4 × tSIUSICYC ⎯ ns SIU_LR output delay time tSIUFSD — 20 ns SIU_BT input high width tSIUSWHI 0.4 × tSIUSICYC ⎯ ns SIU_BT input low width tSIUSWLI 0.4 × tSIUSICYC ⎯ ns SIU_SLD output delay time t SIUSTDD — 20 ns SIU_SLD input setup time tSIUSRDS 20 ⎯ ns SIU_SLD input hold time tSIUSRDH 20 ⎯ ns 38.83 tSIUSICYC tSIUSWHOtSIUSWLO tSIUSTDD tSIUSTDDtSIUSTDD tSIUSTDD tSIUSRDS tSIUSRDH tSIUFSD tSIUFSD SIUAOLR SIUAILR SIUBOLR SIUBILR SIUAOBT SIUAIBT SIUBOBT SIUBIBT SIUAOSLD SIUBOSLD SIUAISLD SIUBISLD tSIUSWHItSIUSWLI Figure 38.83 SIU Transmission Timing

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 321 of 336 REJ03B0272-0100 tSIUMWH tSIUMWL tSIUMCYC SIUMCKA, SIUMCKB Figure 38.84 SIUMCK Input Timing

38.5.19 USB Transceiver Timing (Full-Speed)

Table 38.29 USB Transcei ver Timing (Full-Speed) Item Symbol Min. Max. Unit Test Condition Rising time tr 4 20 ns Data signal: 10% of amplitude → 90% CL = 50 pF Falling time tf 4 20 ns Data signal: 90% of amplitude → 10% CL = 50 pF Ratio of rising time to falling time t r/tf 90 111.1 % Output signal crossover voltage 1.3 2.0 V CL = 50 pF Output driver resistance* Z DRU 28 44 Ω Note: This transceiver timing is a timing at full-speed.

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 322 of 336 REJ03B0272-0100 RL = 15 kΩ CL GND VDD DM DP RL = 15 kΩ CL 1. tr and tf are determined by the time taken for the trasitions between 10% and 90% of amplitude. 2. The electrostatic capacitance, CL, includes the stray capacitance of the wiring connection and the input capacitance of the probe. Test element Notes: Figure 38.85 Test Circuit fo r USB Transceiver (Full-Speed)

38.5.20 KEYSC Module Signal Timing

Table 38.30 KEYSC Module Signal Timing Item Symbol Min. Max. Unit Figure KEYIN input setup time tKEYINS 15 ⎯ ns KEYIN input hold time tKEYINH 15 ⎯ ns 38.85 KEYOUT delay time tKEYOUTD ⎯ 15 ns 38.86 RCLK KEYIN6 to KEYIN0 tKEYINS tKEYINH Note: KEYIN is an asynchronous signal. When the setup time in this figure is satisfied, a change is detected at the rising edge of the clock. When the setup time is not satisfied, a change may not be detected until the next rising edge of the clock. Figure 38.86 KEYIN Input Timing

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 323 of 336 REJ03B0272-0100 RCLK KEYOUT5 to KEYOUT0 tKEYOUTD Figure 38.87 KEYOUT Output Timing

38.5.21 AC Characteristic Test Conditions

2• I/O signal reference level:

• Input pulse level: Vss to VCCQ
• Input rise and fall times: 1 ns IOL IOH CL VREF LSI output pin Reference voltage of output load switch Notes: CL is the total value that includes the capacitance of measurement instruments, and is set as follows for each pin: 30 pF: CKO, CS0, CS2 to CS6B 50 pF: All other pins I OL = 0.2 mA, IOH = −0.2 mA Figure 38.88 Output Load Circuit

Section 38 Electrical Characteristics Rev. 1.00 Oct. 9, 2008 Page 324 of 336 REJ03B0272-0100

Rev. 1.00 Oct. 9, 2008 Page 325 of 336 REJ03B0272-0100 Appendix

Rev. 1.00 Oct. 9, 2008 Page 326 of 336 REJ03B0272-0100 A. Pin States in Reset and Power-Down States Category Pin Name During Reset* After Reset* Sleep Software Standby U-Standby * EXTAL I I I I I RCLK I I I I I Clock XTAL O O O O O MD2 to MD0 I I I I I MD3 I I I I I MD5 I I I I I MD8 I I I I I TST I I I I I Operating mode control TSTMD I I I I I RESETA I I I I I RESETOUT L H O O O RESETP I I I I I PDSTATUS L O L L H System control STATUS0 L O L H H IRQ1, IRQ0 ⎯ ⎯ I I I IRQ2 ⎯ ⎯ I I I IRQ5 to IRQ3 ⎯ ⎯ I I I IRQ6 ⎯ ⎯ I I I IRQ7 ⎯ ⎯ I I I Interrupt NMI I I I I I A25 to A0 L O O O/Z * O/Z * D31 to D0 Z Z Z/I/O Z Z BS ⎯ ⎯ O H/Z * H/Z * CKO O O O O/Z * O/Z * CS0 H O O H/Z * H/Z * CS4 H O O H/Z * H/Z * BSC CS5A H O O H/Z * H/Z *

Rev. 1.00 Oct. 9, 2008 Page 327 of 336 REJ03B0272-0100 Category Pin Name During Reset* After Reset* Sleep Software Standby U-Standby* CS5B H O O H/Z * H/Z * CS6A ⎯ ⎯ O H/Z * H/Z * CS6B H O O H/Z * H/Z * RD H O O H/Z * H/Z * RDWR H O O H/Z * H/Z * WE3 to WE0 H O O H/Z * H/Z * WAIT IU IU IU IU IU BSC IOIS16 I I I Z Z HPA16 to HPA1 L O O O/Z * O/Z * HPD63 to HPD0 Z Z Z/I/O Z Z HPCS2 H O O O/Z * O/Z * HPCS3 H O O O/Z * O/Z * HPCAS H O O O/Z * O/Z * HPRAS H O O O/Z * O/Z * HPCKE O O O O/Z * O/Z * HPCLK O O O O/Z * O/Z * HPCLKR O O O O/Z * O/Z * HPCLKD O O O O/Z * O/Z * HPDQM7 to HPDQM0 H O O O/Z* O/Z * SBSC (SDRAM bus) HPRDWR H O O O/Z * O/Z * DACK0 ⎯ ⎯ O O O DMAC DREQ0 ⎯ ⎯ I Z Z TPU TPUTO ⎯ ⎯ O O O SIOD ⎯ ⎯ Z/I/O * Z/I/O * Z/I/O * SIOMCK ⎯ ⎯ I Z Z SIORXD ⎯ ⎯ I Z Z SIOSCK ⎯ ⎯ O O O SIOSTRB0, SIOSTRB1 ⎯ ⎯ O O O SIO SIOTXD ⎯ ⎯ O Z/O* Z/O *

Rev. 1.00 Oct. 9, 2008 Page 328 of 336 REJ03B0272-0100 Category Pin Name During Reset* After Reset* Sleep Software Standby U-Standby* SIOF0_MCK, SIOF1_MCK ⎯ ⎯ I Z Z SIOF0_RXD, SIOF1_RXD ⎯ ⎯ I Z Z SIOF0_SCK, SIOF1_SCK ⎯ ⎯ O/I* O/Z * O/Z * SIOF0_SS1, SIOF1_SS1 ⎯ ⎯ O O O SIOF0_SS2, SIOF1_SS2 ⎯ ⎯ O O O SIOF0_SYNC, SIOF1_SYNC ⎯ ⎯ O/I* O/Z * O/Z * SIOF SIOF0_TXD, SIOF1_TXD ⎯ ⎯ O O O SCIF0_CTS, SCIF1_CTS, SCIF2_CTS ⎯ ⎯ I Z Z SCIF0_RTS, SCIF1_RTS, SCIF2_RTS ⎯ ⎯ O Z Z SCIF0_RXD, SCIF1_RXD, SCIF2_RXD ⎯ ⎯ I Z Z SCIF0_SCK, SCIF1_SCK, SCIF2_SCK ⎯ ⎯ I Z Z SCIF SCIF0_TXD, SCIF1_TXD, SCIF2_TXD ⎯ ⎯ O Z Z SIM_CLK ⎯ ⎯ O O O SIM_D ⎯ ⎯ I/O Z Z SIM SIM_RST ⎯ ⎯ O O O IrDA_IN ⎯ ⎯ I Z Z IrDA IrDA_OUT ⎯ ⎯ O O O SCL Z Z I/O Z Z IIC SDA Z Z I/O Z Z

Rev. 1.00 Oct. 9, 2008 Page 329 of 336 REJ03B0272-0100 Category Pin Name During Reset* After Reset* Sleep Software Standby U-Standby* FCDE ⎯ ⎯ O O/Z * O/Z * FCE ⎯ ⎯ O O O FOE ⎯ ⎯ O O O FRB ⎯ ⎯ I Z Z FSC ⎯ ⎯ O O O FWE ⎯ ⎯ O O O FLCTL NAF7 to NAF0 ⎯ ⎯ Z/I/O Z Z VIO_CKO ⎯ ⎯ O O O VIO_CLK ⎯ ⎯ I Z Z VIO_CLK2 ⎯ ⎯ I Z Z VIO_D15 to VIO_D0 ⎯ ⎯ I Z Z VIO_FLD ⎯ ⎯ I Z Z VIO_HD ⎯ ⎯ I Z Z VIO_HD2 ⎯ ⎯ I Z Z VIO_STEM ⎯ ⎯ O O O VIO_STEX ⎯ ⎯ I Z Z VIO_VD ⎯ ⎯ I Z Z VIO VIO_VD2 ⎯ ⎯ I Z Z DV_CLK ⎯ ⎯ O O O DV_CLKI ⎯ ⎯ I Z Z DV_D15 to DV_D0 ⎯ ⎯ O O O DV_HSYNC ⎯ ⎯ O O O VOU DV_VSYNC ⎯ ⎯ O O O LCDLCLK ⎯ ⎯ I Z Z LCDCS ⎯ ⎯ O O O LCDCS2 ⎯ ⎯ O O O LCDD23 to LCDD0 ⎯ ⎯ O/I O/Z O/Z LCDDCK ⎯ ⎯ O O O LCDDISP ⎯ ⎯ O O O LCDDON, LCDDON2 ⎯ ⎯ O O O LCDC LCDHSYN ⎯ ⎯ O O O

Rev. 1.00 Oct. 9, 2008 Page 330 of 336 REJ03B0272-0100 Category Pin Name During Reset* After Reset* Sleep Software Standby U-Standby* LCDRD ⎯ ⎯ O O O LCDRS ⎯ ⎯ O O O LCDVCPWC/ LCDVCPWC2 ⎯ ⎯ O O O LCDVEPWC/ LCDVEPWC2 ⎯ ⎯ O O O LCDVSYN, LCDVSYN2 ⎯ ⎯ O/Z * O/Z * O/Z * LCDC LCDWR ⎯ ⎯ O O O TS_SCK ⎯ ⎯ I Z Z TS_SDAT ⎯ ⎯ I Z Z TS_SDEN ⎯ ⎯ I Z Z TSIF TS_SPSYNC ⎯ ⎯ I Z Z SIUAIBT, SIUBIBT ⎯ ⎯ I/O* Z/O * Z/O * SIUAILR, SIUBILR ⎯ ⎯ I/O* Z/O * Z/O * SIUAISLD, SIUBISLD ⎯ ⎯ I Z Z SIUAISPD ⎯ ⎯ I Z Z SIUAOBT, SIUBOBT ⎯ ⎯ I/O* Z/O * Z/O * SIUAOLR, SIUBOLR ⎯ ⎯ I/O* Z/O * Z/O * SIUAOSLD, SIUBOSLD ⎯ ⎯ O O O SIUAOSPD ⎯ ⎯ O O O SIUFCKA, SIUFCKB ⎯ ⎯ O O O SIU SIUMCKA, SIUMCKB ⎯ ⎯ I Z Z DM L L Z/I/O Z Z DP H H Z/I/O Z Z VBUS I I I I I EXTALUSB I I I I I USB XTALUSB O O O O O

Rev. 1.00 Oct. 9, 2008 Page 331 of 336 REJ03B0272-0100 Category Pin Name During Reset* After Reset* Sleep Software Standby U-Standby* KEYIN1, KEYIN0 ⎯ ⎯ IU IU IU KEYIN4 to KEYIN2 ⎯ ⎯ IU IU IU KEYOUT3 to KEYOUT0 ⎯ ⎯ Z/O * Z/O * Z/O * KEYOUT4/IN6 ⎯ ⎯ Z/I/O * Z/I/O * Z/I/O * KEYSC KEYOUT5/IN5 ⎯ ⎯ Z/I/O * Z/I/O * Z/I/O * SDHICD ⎯ ⎯ I Z Z SDHIWP ⎯ ⎯ I Z Z SDHID3 to SDHID0 ⎯ ⎯ I/O Z Z SDHICLK ⎯ ⎯ O Z Z SDHI SDHICMD ⎯ ⎯ I/O Z Z TCK IU IU IU IU IU TDI IU IU IU IU IU TDO Z/O Z/O Z/O* Z/O * Z/O * TMS IU IU IU IU IU TRST IU IU IU * IU * IU * ASEBRK/BRKAK IU/OU* IU/OU * IU/OU * IU/OU * IU/OU * H-UDI MPMD IU IU IU IU IU AUDATA3 to AUDATA0 ⎯ ⎯ O O O AUDCK O O O O O AUD AUDSYNC ⎯ ⎯ O O O Port A PTA7 to PTA0 ZD ID P K K Port B PTB7 to PTB0 ⎯ ⎯ P K K PTC4 to PTC2, PTC0 ⎯ ⎯ P K K PTC5 ⎯ ⎯ P K K Port C PTC7 ZU IU P K K PTD0 L O P K K PTD1 ZU IU P K K PTD5 to PTD2 ZU I P K K PTD6 ZU IU P K K Port D PTD7 ZU IU P K K

Rev. 1.00 Oct. 9, 2008 Page 332 of 336 REJ03B0272-0100 Category Pin Name During Reset* After Reset* Sleep Software Standby U-Standby* PTE1, PTE0 ZU IU P K K Port E PTE7 to PTE4 ⎯ ⎯ P K K PTF0 L O P K K PTF1 ZD ID P K K Port F PTF6 to PTF2 ZD ID P K K Port G PTG4 to PTG0 L O P K K PTH1, PTH0 ZD ID P K K PTH4 to PTH2 L O P K K PTH6, PTH5 ZD ID P K K Port H PTH7 L O P K K PTJ1, PTJ0 ZU IU P K K PTJ5 ⎯ ⎯ P K K PTJ6 L O P K K Port J PTJ7 ⎯ ⎯ P K K PTK0 ZD ID P K K PTK1 L O P K K PTK2 ZD ID P K K Port K PTK6 to PTK3 ZD ID P K K Port L PTL7 to PTL0 ZD ID P K K Port M PTM7 to PTM0 ZD ID P K K Port N PTN7 to PTN0 ⎯ ⎯ P K K PTQ0 ZU IU P K K PTQ1 L O P K K PTQ2 ZD ID P K K PTQ5 to PTQ3 ZD ID P K K Port Q PTQ6 L O P K K PTR1, PTR0 L O P K K PTR2 ⎯ ⎯ P K K PTR3 ⎯ ⎯ P K K Port R PTR4 L O P K K

Rev. 1.00 Oct. 9, 2008 Page 333 of 336 REJ03B0272-0100 Category Pin Name During Reset* After Reset* Sleep Software Standby U-Standby* PTS0 L O P K K PTS1 ZD ID P K K PTS2 ZD ID P K K PTS3 L O P K K Port S PTS4 ZD ID P K K PTT0 L O P K K PTT1 ZD ID P K K Port T PTT4 to PTT2 ZD ID P K K PTU0 Z Z P K K PTU1 Z Z P K K Port U PTU4 to PTU2 ZD ID P K K Port V PTV4 to PTV0 ZD ID P K K PTW0 ZD ID P K K PTW4 to PTW1 ZD ID P K K PTW5 L O P K K Port W PTW6 ZD ID P K K PTX5 to PTX0 ZD ID P K K Port X PTX6 ZU IU P K K PTY0 Z Z P K K PTY1 Z Z P K K Port Y PTY5 to PTY2 Z Z P K K PTZ2, PTZ1 ZU Z P K K Port Z PTZ5 to PTZ3 Z Z P K K [Legend] I: Input (pull-up/pull-down MOS off) IU: Input (pull-up MOS on) ID: Input (pull-down MOS on) H: High-level output L: Low-level output O: Output OU: Output (pull-up MOS on) P: Port function (whether pins are inputs or outputs, or are pulled up or down, depends on the register settings)

Rev. 1.00 Oct. 9, 2008 Page 334 of 336 REJ03B0272-0100 K: Port state retained (fixed to input, output buffer state retained, pull-up/pull-down states retained) Z: High impedance (fixed to input, output buffer off, pull-up/pull-down MOS off) ZU: Pull-up state (fixed to input, output buffer off, pull-up MOS on) ZD: Pull-down state (fixed to input, output buffer off, pull-down MOS on) /: Default state on the left side of a slash (/) ⎯: Not selected for the initial function Notes: 1. Period when RESETOUT is asserted after RESETP is negated. 2. After RESETOUT is negated. 3. Z or H/L depending on the HIZMEM and HIZCNT bits in the CMNCR register of BSC. 4. Z or H/L depending on the HIZSTB bit in the SDPCR register of SBSC. 5. Depends on the register setting. 6. Depends on the TAP controller state when MPMD = H. However, the state is on the right side of a slash (/) when MPMD = L. 7. Able to switch between pull-up MOS on/off, depending on the PULCR register setting. 8. Switching the I/O by the register setting by I/O with pull-up when MPMD = L. Input when TRST = L. Always input when MPMD = H. 9. On return from U-standby, the states of pins other than clock control and system control pins are temporarily undefined. The period over which the states are undefined is the following periods at maximum: the system reset asserting period and the DLL/PLL oscillation settling times.

Rev. 1.00 Oct. 9, 2008 Page 335 of 336 REJ03B0272-0100 B. Package Dimensions 264810 14 12 16 18 20 22 24 B D F H K M P T V Y AD AB A C E G J L N R U W AE AC AA

0.20 S B

21.00

0.20 S A

B 0.15 21.00 (Index) 0.80 4 × 449 × φ 0.50 ± 0.05 0.40 ± 0.05

1.9 Max

0.10 S 0.20 0.90 0.90 S A 0.80 φ 0.08 M SBA Unit : mm Package Code JEDEC JEITA Mass PRBG0449GA-A 1.4g 1 375911 15 13 17 19 21 23 25 Figure B.1 Package Dimensions (BGA 449)

Rev. 1.00 Oct. 9, 2008 Page 336 of 336 REJ03B0272-0100 23 19 21 1715 11 139 7 5 3 1 AC AA W U R N L J G E A C AD AB Y V T P M K H F B D

0.2 S B

13.0

0.2 S A

B 0.15 13.0 0.50 4 × 417 × φ 0.30 ± 0.05 0.25 ± 0.05

1.55 Max

0.08 S S0.2 0.75 0.75 S A 0.50 φ 0.05 M SBA Unit : mm Package Code JEDEC JEITA Mass 0.45g 24 21 18 20 1614 10 128 6 4 2 Figure B.2 Package Dimensions (LFBGA 417)

Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan http://www.renesas.com Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2377-3473 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Renesas Technology Singapore Pte. Ltd.

1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632

Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 RENESAS SALES OFFICES Colophon 6.2

REJ03B0272-01001753, Shimonumabe, Nakahara-ku, Kawasaki-shi , Kanagawa 211-8668 Japan SH7722 Data Sheet