SFX-34-24T-HP-XDFH

SFX-34-24T-HP-XDFH SOURCE | Alldatasheet

Document overview

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Technical content

Features

• Single Fiber, Integrated Diplexer Transceiver
• 2x10 SFF pinout supports I2C digital diagnostics
• Voice/Data FTTx ONT/ONU Applications
• Compliant to FSAN G.984.5 Specifications
• 1244 Mbps Tx, 2488 Mbps Rx Asymmetric Data Rate
• 1310 nm Tx, 1490 nm Rx
• Burst Mode Transmission
• TX Burst Mode Detection, TX_SD
• DDM TX Power
• 28 dB link budget; 20 km reach
• Compliant to IEC-60825 Class 1 laser diode
• SC/APC or SC/UPC fiber connector
• RoHS compliant
• Internal Calibration Diplexer Optical Block 1310nm Laser WDM TIA 1490 nm APD Receiver Rx Section Lim .Amp Tx Section LDD 1310nm Upstream 1490nm Downstream Rx Data Tx Data Diplexer Block Diagram

Usage of this transceiver shall adhere to the following absolute maximum ratings. Stresses beyond those in Table 1 may cause permanent damage to the unit. These are stress ratings only, and functional operation of the unit at these or any other conditions beyond those in dicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect unit reliability. Table 1 - Absolute Maximum Ratings Parameter Minimum Maximum Unit/Conditions Ambient Storage Temperature -40 85 ºC Operating Temperature* 0 -40 ºC, C-Temp ºC, I-Temp Operating Humidity Range 10% 90% non-condensing ESD Sensitivity (Human Body Model) - 1000 V Lead Soldering Temperature - 260ºC Maximum 10 sec Vcc_Rx -0.4 +4.2 V Vcc_Tx -0.4 Vcc_Rx + 1 V *Operating temp: minimum is ambient, maximum is case. Module Characteristics Table 2 - Module Characteristics Parameter Minimum Typical Maximum Unit/Conditions 1310nm Tx to 1490nm Rx Crosstalk - - -47 dB 1555nm Rx to 1490nm Isolation 30 - - dB G.984.5 Wavelength Blocking Filter (WBF), X/S dB, 1441 nm to 1450 nm dB, 1530 nm to 1539 nm dB, 1400 nm to 1441 nm dB, 1539 nm to 1625 nm Temperature Monitoring Accuracy -3 - +3 °C Voltage Monitoring Accuracy -3 - +3 % Bias Current Monitoring Accuracy -10 - +10 % Total TX and RX Supply Current - - 350 mA

Functional Characteristics The following tables list the performance specifications for the various functional blocks of the integrated optical transceiver module. Table 3 – Digital Transmitter Specifications Parameter Minimum Typical Maximum Unit Notes Operating Voltage 3.14 3.30 3.46 V Vcc referenced to GND_Tx Data Rate - 1244.16 - Mbps Average Optical Output Power, Po 0.5 - 5 dBm Output Power at Transmit Off - - -50 dBm Extinction Ratio 10 - - dB PRBS 2 -1, NRZ, 50% duty cycle Transmitter Output Eye G.984.2 Figure 3 Optical Rise and Fall Time - 250 - ps 20% to 80% Center Wavelength 1290 1330 nm Differential Input Voltage 300 - 1800 mVp-p TXD+/-. Internally DC-coupled Input Impedance, differential - 100 - Ω Common-Mode Input Voltage GND_Tx + 1.4 Vcc - (Vin/2) - 0.1 V Internally DC coupled Tx Burst Enable Time - - 12.8 ns 16 bits data @ 1244Mbps Tx Burst Disable Time - - 12.8 ns 16 bits data @ 1244Mbps Jitter Generation - - 0.2 UI 4 kHz to 10 MHz TX_BEN Input Low 0 0.8 V TX_BEN Input High 2.0 Vcc_RX V TX_SD timing “D” 1 µs See figure 3 TX_SD timing “X” 100 ns See figure 3 Ttx-sd_startup 3 S See Figure 4

Refer to Figure 1 which schematically describes the timing parameter definition in burst mode sequence. Figure 1 - Timing Parameter Definition in Burst Mode Sequence Table 4 – Digital Receiver Specifications Parameter Minimum Typical Maximum Unit Notes Operating Voltage 3.14 3.30 3.46 V Vcc referenced to GND_RX Data Rate - 2488.32 - Mbps Operational Wavelength Range 1480 - 1500 nm Received Optical Power -28 - -8 dBm BER≤10 -10 , PRBS 2 -1, 50% duty cycle Data Output Rise and Fall Time - 160 - ps 20% to 80% Signal Detect Assertion Level - - -31 dBm Transition during increasing light Signal Detect De-Assertion Level -45 - - dBm Transition during decreasing light Signal Detect Hysteresis 0.5 - 6 dB Differential Output Voltage 300 - 1200 mV CML output, ac coupled

Parameter Minimum Typical Maximum Unit Notes Signal Detect Output HIGH Voltage 2.4 - - V LVTTL with internal pull up resistor, IOH=400µA. Asserts HIGH when input data amplitude is above threshold. Signal Detect Output LOW Voltage - - 0.6 V LVTTL. IOL=4mA De-asserts LOW when input data amplitude is below threshold . RSSI Range -28 - -8 dBm RSSI Accuracy -3 - +3 dB Table 5 - Microcontroller Specifications Parameter Minimum Typical Maximum Unit Notes Operating Voltage 3.14 3.30 3.46 V SDA a - - - - LVTTL, open collector serial data line from the I C bus to the on board Microcontroller. 100kbps max. data rate. SCL - - - - LVTTL, open collector serial clock line from the I C bus to the on board Microcontroller. Reset hold 30 - - ms LVTTL input, internal 50kΩ pull-up. Active Low Module temperature accuracy -3 - +3 °C Digital diagnostics status monitor module’s case temperature. VCC monitor accuracy -0.1 - +0.1 V Digital diagnostics status monitor of the module’s 3.3V bias supply. a I C SDA and SCL must be open collector or open drain connections.

Recommended Interface Circuit Figure 2 commended interface circuit NOTE A: Output stage in SerDes IC is LVPECL output, R1=130ohm, R2=82ohm, R3=N.C. Output stage in SerDes IC is CML output, R1=R2=N.C., R3=100ohm.

Refer to Table 6 for a description of the function of each I/O pin. Table 6 - Module Pin Definitions Pin Number Label Definition

1 NC No User Connection

2 GND_RX Digital Rx ground

3 GND_RX Digital Rx ground

4 NC Reserved, No User Connection

5 NC Reserved, No User Connection

6 GND_RX Digital Rx Ground

7 Vcc_RX Digital Rx Vcc

8 RX_SD

Receiver signal detect output, pull up internally. LVTTL. Asserts high when input optical power level is above threshold.

9 RxD- RX data bar output, CML, AC coupled

10 RxD+ RX data output, CML, AC coupled

11 Vcc_TX Digital Tx Vcc

12 GND_TX Digital Tx Ground

13 TX_BEN Tx BEN, LVTTL Input. Active High (Logic High=TX ON, Logic Low=TX OFF) 14 TxD+ Tx data input, LVPECL or CML. Internally DC coupled. 15 TxD- Tx data bar input, LVPECL or CML. Internally DC coupled.

16 GND_TX Digital Tx Ground

17 SCL I2C Clock input

18 SDA I2C Data input/output

19 TX_Fault TX Fault Alarm, LVTTL, TX Fault state=High, TX Normal state=Low. 20 TX_SD TX Signal Detect, LVTTL, TX Active state=High. See TX_SD diagram. Internal 1KΩ pull-down. Figure 3 TX_SD timing diagram:

Figure 4 TX_SD startup timing diagram Mechanical Diagram Ttx_sd_startup Normal Undefined state TX_SD TX_VCC

EEPROM Memory Content (A0h) Addr. Field Size (Bytes) Name of Field Hex Description 0 1 Identifier 02 Module/connector soldered to motherboard 1 1 Ext. Identifier 04 MOD4 2 1 Connector 0B Optical Pigtail 3-10 8 Transceiver 00 00 00 00 00 00 00 00 11 1 Encoding 03 NRZ 12 1 BR, Nominal 0D 1.244Gbps

14 1 Length (9um)-km 14 20(km) 15 1 Length (9um) C8 200(100m) 16 1 Length (50um) 00 Not Support MMF 17 1 Length (62.5um) 00 Not Support MMF 18 1 Length (Copper) 00 Not Support Copper 19 1 Reserved 00 20-35 16 Vendor name 53 4F 55 52 43 45 50 48 4F 54 4F 4E 49 43 53 20 “SOURCEPHOTONICS ”(ASCⅡ) 36 1 Reserved 00 37-39 3 Vendor OUI 00 00 00 40-55 16 Vendor PN 53 46 xx 33 34 32 34 54 48 50 yy 44 46 41 20 20 “SFX3424THPYDFA” (ASCII) X=A; xx=41; X=U; xx=55; Y=C; yy=43; Y=T; yy=54; 56-59 4 Vendor Rev xx xx 20 20 ASCII(“31 30 20 20” means 1.0 Revision) 60-61 2 Wavelength 05 1E 1310nm Laser Wavelength 62 1 Reserved 00 63 1 CC_BASE xx Check sum of byte 0-62 64-65 2 Options 00 0C Rx_SD, Tx_Fault 66 1 BR, max 00 67 1 BR, min 00 68-83 16 Vendor SN xx xx xx xx xx xx xx xx xx xx xx xx xx xx xx xx ASCII 84-91 8 Date code xx xx xx xx xx xx 20 20 Year(2 bytes),Month(2 bytes), Day(2 bytes) 92 1 Diagnostic Monitoring Type Compliant with SFF-8472 V9.5 Internally Calibrated Received power measurement type -Average Power 93 1 Enhanced Options B0 Optional Alarm/warning Flags Implemented; Tx_Fault;Rx_Los 94 1 SFF-8472 Compliance 02 Diagnostics Compliance(SFF-8472 V9.5) 95 1 CC_EXT xx Check sum of byte 64-94 96-255 64 Vendor Specific

EEPROM Memory Content (A2h) Addr. Field Size (Bytes) Name of Field Hex Description 0 00 2 Temp High Alarm 64 00(I temp) 50 00(C temp) 100℃（I temp） 80℃（C temp） 2 02 2 Temp Low Alarm CE 00(I temp) F3 00(C temp) -50℃（I temp） -13℃（C temp） 4 04 2 Temp High Warning 5A 00 (I temp) 4B 00(C temp) 90℃（I temp） 75℃（C temp） 6 06 2 Temp Low Warning D8 00(I temp) F8 00(C temp) -40℃（I temp） -8℃（C temp） 8 08 2 Voltage High Alarm 8C A0 3.6V 10 0A 2 Voltage Low Alarm 75 30 3.0V 12 0C 2 Voltage High Warning 88 B8 3.5V 14 0E 2 Voltage Low Warning 79 18 3.1V 16 10 2 Bias High Alarm AF C8 90mA 18 12 2 Bias Low Alarm 00 00 0mA 20 14 2 Bias High Warning 88 B8 70mA 22 16 2 Bias Low Warning 00 00 0mA 24 18 2 TX Power High Alarm 9B 82 6dBm 26 1A 2 TX Power Low Alarm 22 D0 -0.5dBm 28 1C 2 TX Power High Warning 7B 86 5dBm 30 1E 2 TX Power Low Warning 2B D4 0.5dBm 32 20 2 RX Power High Alarm 07 CB -7dBm 34 22 2 RX Power Low Alarm 00 0F -28dBm 36 24 2 RX Power High Warning 06 30 -8dBm 38 26 2 RX Power Low Warning 00 14 -27dBm 40 28 16 Reserved 00….000 Reserved 56 38 4 RX_PWR(4) Calibration 00 00 00 00 4th order RSSI calibration coefficient 60 3C 4 RX_PWR(3) Calibration 00 00 00 00 3rd order RSSI calibration coefficient 64 40 4 RX_PWR(2) Calibration 00 00 00 00 2nd order RSSI calibration coefficient 68 44 4 RX_PWR(1) Calibration 3F 80 00 00 1st order RSSI calibration coefficient 72 48 4 RX_PWR(0) Calibration 00 00 00 00 0th order RSSI calibration coefficient 76 4C 2 TX_I(Slope) Calibration 01 00 Slope for Bias calibration 78 4E 2 TX_I(Offset) Calibration 00 00 Offset for Bias calibration 80 50 2 TX_PWR(Slope) Calibration 01 00 Slope for TX Power calibration 82 52 2 TX_PWR(Offset) Calibration 00 00 Offset for TX Power calibration 84 54 2 T(Slope) Calibration 01 00 Slope for Temperature calibration

86 56 2 T(Offset) Calibration 00 00 Offset for Temperature calibration, in units of 256ths C 88 58 2 V(Slope) Calibration 01 00 Slope for VCC calibration 90 5A 2 V(Offset) Calibration 00 00 Offset for VCC calibration 92 5C 3 Reserved 00 00 00 Reserved 95 5F 1 Checksum xx Checksum 96 60 2 Transceiver Temperature xx xx Temperature in C/256 98 62 2 Supply Voltage xx xx Vcc 100 64 2 TX Bias Current xx xx BIASMON 102 66 2 TX Optical Output Power xx xx Back facet monitor 104 68 2 RX Optical Input Power xx xx RSSI 106 6A 2 Reserved 00 00 Reserved 108 6C 2 Reserved 00 00 Reserved 110 6E.7 1bit TX_DIS State x Soft TX disable state 6E.6 1bit Soft TX Disable x Write bit that allows software disable laser output. 6E.5 1bit Reserved. 0 Reserved 6E.4 1bit Rate Select State 0 NOT SUPPORTED. 6E.3 1bit Rate Select 0 NOT SUPPORTED. 6E.2 1bit TX_FAULT x Digital state of the TX Fault Output 6E.1 1bit Rx LOS x Digital state of the Rx LOS Output 6E.0 1bit Data Ready Bar x Indicates transceiver has achieved power up and data is ready. 111 6F.7 1bit Reserved 0 Reserved 6F.6 1bit Reserved 0 Reserved 6F.5 1bit Reserved 0 Reserved 6F.4 1bit Reserved 0 Reserved 6F.3 1bit Reserved 0 Reserved 6F.2 1bit Reserved x Reserved 6F.1 1bit Reserved 0 Reserved 6F.0 1bit Reserved x Reserved 112 70.7 1bit Temperature too high alarm x Temperature too high alarm 70.6 1bit Temperature too low alarm x Temperature too low alarm 70.5 1bit VCC too high alarm x VCC too high alarm 70.4 1bit VCC too low alarm x VCC too low alarm 70.3 1bit BIASMON too high alarm x BIASMON too high alarm 70.2 1bit BIASMON too low alarm x BIASMON too low alarm 70.1 1bit TX Power too high alarm x TX Power too high alarm

70.0 1bit TX Power too low alarm x TX Power too low alarm 113 71.7 1bit RX Power too high alarm x RX Power too high alarm 71.6 1bit RX Power too low alarm x RX Power too low alarm 71.5 1bit Reserved interrupt status bit x Reserved interrupt status bit 71.4 1bit Reserved interrupt status bit x Reserved interrupt status bit 71.3 1bit Reserved interrupt status bit x Reserved interrupt status bit 71.2 1bit Reserved interrupt status bit x Reserved interrupt status bit 71.1 1bit Reserved interrupt status bit x Reserved interrupt status bit 71.0 1bit Reserved interrupt status bit x Reserved interrupt status bit 114 72 1 Reserved 00 Reserved 115 73 1 Reserved 00 Reserved 116 74.7 1bit Temperature too high warning x Temperature too high warning 74.6 1bit Temperature too low warning x Temperature too low warning 74.5 1bit VCC too high warning x VCC too high warning 74.4 1bit VCC too low warning x VCC too low warning 74.3 1bit BIASMON too high warning x BIASMON too high warning 74.2 1bit BIASMON too low warning x BIASMON too low warning 74.1 1bit TX Power too high warning x TX Power too high warning 74.0 1bit TX Power too low warning x TX Power too low warning 117 75.7 1bit RX Power too high warning x RX Power too high warning 75.6 1bit RX Power too low warning x RX Power too low warning 75.5 1bit Reserved interrupt status bit 0 Reserved interrupt status bit 75.4 1bit Reserved interrupt status bit 0 Reserved interrupt status bit 75.3 1bit Reserved interrupt status bit 0 Reserved interrupt status bit 75.2 1bit Reserved interrupt status bit 0 Reserved interrupt status bit 75.1 1bit Reserved interrupt status bit 0 Reserved interrupt status bit 75.0 1bit Reserved interrupt status bit 0 Reserved interrupt status bit 118 76 1 Reserved 00 Reserved 119 77 1 Reserved 00 Reserved 120 78 8 Vendor Specific 00 00 00 00 00 00 00 00 Vendor Specific

Ordering Information

Table 7 - Ordering Information Connector Temperature Range Digital Diagnostic RoHS status Design Revision SF X -34-24T-HP- X D F H A = APC C = Commercial Temp (0 to 70°C) D = Diagnostic RoHS complient, lead free solder U = UPC T = Industrial Temp (-40 to 85°C) Example: SFA-34-24T-HP-CDFH = Transceiver with APC connector, C-Temp, Diagnostic. Table 8 - Device Handling/ESD Protection The devices are static sensitive and may easily be damaged if care is not taken during handling. The following handling practic es are recommended. 1 Devices should be handled on benches with conductive and grounding surfaces. 2 All personnel, test equipment and tools shall be grounded. 3 Do not handle the devices by their leads. 4 Store devices in protective foam or carriers.

5 Avoid the use of non-conductive plastics, rubber, or silk in the area where the devices are handled

6 All modules shall be packaged in materials that are anti -static to protect against adverse electrical environments. Avoid applications of any voltage higher than maximum rated voltages to this part. For proper operation, any VIN or VOUT should be constrained to the range GND ≤ (VIN or VOUT) ≤ VCC. Unused inputs must always be tied to an appropriate logic voltage (e.g. either GND or VCC). Unused outputs must be left open.

Handling Precautions: This device is susceptible to damage as a result of electrostatic discharge (ESD). A static free environm ent is highly recommended. Follow guidelines according to proper ESD procedures. Laser Safety: Radiation emitted by laser devices can be dangerous to human eyes. Avoid eye exposure to direct or indirect radiation. Legal Notice IMPORTANT NOTICE! All information contained in this document is subject to change without notice, at Source Photonics’ sole and absolute discretion. Source Photonics warrants performance of its products to current specifications only in accordance with the company’s standard one-year warranty; however, specifications designated as “preliminary” are given to describe components only, and Source Photonics expressly disclaims any and all warranties for said products, including express, implied, and statutory warranties, warranties of merchantability, fitness for a particular purpose, and non- infringement of proprietary rights. Please refer to the company’s Terms and Conditions of Sale for further warranty information. Source Photonics assumes no liability for applications assistance, customer product design, software performance, or infringement of patents, services, or intellectual property described herein. No license, either express or implied, is granted under any patent right, copyright, or intellectual property right, and Source Photonics makes no representations or warranties that the product(s) described herein are free from patent, copyright, or intellectual property rights. Products described in this document are NOT intended for use in implantation or other life support applications where m alfunction may result in injury or death to persons. Source Photonics customers using or selling products for use in such applications do so at their ow n risk and agree to fully defend and indemnify Source Photonics for any damages resulting from such use or sale. © Copyright Source Photonics, Inc. 2007~2008 All Rights Reserved. All information contained in this document is subject to change without notice. The products descr ibed in this document are NOT intended for use in implantation or other life support applications where malfunction may result in injury or death to persons. The information contained in this document does not affect or change Source Photonics product specifications or warranties. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of Source Photonics or third parties. All information contained in this document was obtained in specific environments, and is presented as an illustration. The results obtained in other operating environments may vary. THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN ”AS IS” BASIS. In no event will Source Photonics be liable for damages arising directly from any use of the information contained in this document. Contact S OURCE PHOTONICS 20550 NORDHOFF ST. CHATSWORTH, CA 91311 sales@sourcephotonics.com Tel: 818-773-9044 Fax: 818-576-9486 Or visit our website: http://www.sourcephotonics.com